CN103333462B - High-flexibility epoxy resin composition with interpenetrating network structure and preparation method thereof - Google Patents
High-flexibility epoxy resin composition with interpenetrating network structure and preparation method thereof Download PDFInfo
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- CN103333462B CN103333462B CN201310246972.4A CN201310246972A CN103333462B CN 103333462 B CN103333462 B CN 103333462B CN 201310246972 A CN201310246972 A CN 201310246972A CN 103333462 B CN103333462 B CN 103333462B
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Abstract
The invention provides a high-flexibility epoxy resin composition with an interpenetrating network structure and a preparation method thereof, being applicable to the field of electronic packaging materials. The epoxy resin composition is powdery and comprises an epoxy resin, a high-flexibility epoxy resin with an interpenetrating network structure, a curing agent and other composite materials, wherein the epoxy resin composition comprises the following components in parts by mass: 10-30 parts of epoxy resin, 20-40 parts of high-flexibility epoxy resin with the interpenetrating network structure, 3-10 parts of curing agent, 0.05-0.3 part of curing accelerator and 30-60 parts of inorganic filler. The related epoxy resin composition has extremely high flexibility and is applied to the field of the electronic packaging materials, and the hot and cold impact resistance of the electronic packaging materials can be greatly improved.
Description
Technical field
The invention belongs to electronic package material field, relate to one and there is inierpeneirating network structure high-flexibility composition epoxy resin and preparation method thereof.
Background technology
Epoxy resin is one of most widely used matrix resin in polymer matrix composite, polycondensation is carried out and obtained product by having the compound of epoxy group(ing) and multi-hydroxy or polyol compound, there is excellent cohesiveness, chemical resistance, electrical insulation properties, mechanical property, and be easy to processing, shrinking percentage is low, coefficient of linear expansion is little and the advantage such as with low cost, is widely used in the encapsulation of the electronic devices and components such as voltage dependent resistor, ceramic condenser, diode, triode.
But because the toughness of pure epoxy resin is not enough, cause curing material crisp, the defect such as easily to crack, cannot be used for the encapsulation that cold-hot impact requires higher electronic devices and components, its application receives larger restriction.Based on this, Chinese scholars has carried out a large amount of study on the modification work to epoxy resin, summarize many method for toughening: expanded polystyrene veneer is epoxy resin toughened, liquid crystalline polymers is epoxy resin toughened as adopted, core-shell Polymer toughening epoxy resin etc., ipn technology is applied to the toughness reinforcing of epoxy resin by the present invention, because ipn technology can solve five requirements that toughening material must meet for electronic package material well: (1) toughening material is used for electronic package material, excellent stability in storage must be possessed; (2) toughening material is used for electronic package material, must ensure that electronic package material possesses excellent electrical property; (3) toughening material and epoxy resin have good consistency and can fully disperse in the epoxy; (4) toughening material is easy to process, makes modification be easy to carry out; Toughening material and epoxy resin mixing cured after, must ensure that electronic package material possesses excellent process based prediction model.
Interpenetrating polymer networks (IPN) is blend polymer or the polymer alloy of a class uniqueness of being tangled by network interpenetrating by two or more polymkeric substance and being formed.IPN is distinctive forces mutual tolerance interaction energy to make two kinds of performance differences very large or have the stable combination of the polymer formation of difference in functionality, thus realizes performance complement between component; The structural form features such as simultaneously the special cells shape structure of IPN, interface IPN, two-phase be continuous, make again them in performance or functionally have special synergy.Preparation method, it is close to graft copolymerization blending method, has inorganic chemistry to take into consideration from alternate, then close to mechanical blending method, therefore, can IPN be considered as with chemical method realize mechanical blend.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art part, provide one to have inierpeneirating network structure high-flexibility composition epoxy resin and preparation method thereof, to meet the requirement of electronic package material to resistance to sudden cooling.
The technical scheme that the present invention realizes object is:
One has inierpeneirating network structure high-flexibility composition epoxy resin, and it forms component and mass fraction is respectively:
Wherein, the preparation method of the High-flexibility epoxy resin of inierpeneirating network structure is as follows:
(1) in reaction vessel, add epoxy resin II, be warming up to 120 ~ 150 DEG C, vacuum tightness <-0.08MPa, stir 0.5-1.5h, extract the cut in epoxy resin II out;
(2) to adding polyvinyl butyral acetal, polyphenol and catalyzer except in the epoxy resin II of cut, mix, be slowly warming up to 140 ~ 150 DEG C, reaction 2-4h, again temperature is risen to 160 ~ 180 DEG C, reaction 1-3h, when the actual equivalent of reaction system reaches 95% of theoretical equivalence, vacuumizes, vacuum tightness-0.05 ~ 0Mpa, vacuumize 20 ~ 30min, stopped reaction, reaction process adopts nitrogen protection;
(3) discharging, through cooling compressing tablet, obtains the High-flexibility epoxy resin with inierpeneirating network structure.
Wherein, described each constituent mass number is:
And described epoxy resin I requires that softening temperature is 60 ~ 130 DEG C, epoxy equivalent (weight) is 400 ~ 1300g/eq, comprises diglycidyl ether type epoxy resin, glycidyl ester type epoxy resin, preferred bisphenol A type epoxy resin.
And described inierpeneirating network structure high-flexibility epoxy resin, epoxy equivalent (weight) scope is 400 ~ 1300g/eq, and softening point range is 60 ~ 130 DEG C.
And the epoxy equivalent (weight) scope 170 ~ 1000g/eq of the epoxy resin II in described inierpeneirating network structure high-flexibility epoxy resin, comprises at least one in bisphenol A type epoxy resin and bisphenol f type epoxy resin; The polyvinyl alcohol hydroxy radical content scope of described polyvinyl butyral acetal is 11 ~ 27wt%, and polyvinyl butyral acetal base content range is 69 ~ 88wt%, and vinyl acetate between to for plastic base content range is 1 ~ 4wt%, and glass transition temperature Tg scope is 60 ~ 70 DEG C; Described polyphenol is at least one in dihydroxyphenyl propane, Bisphenol F; Described catalyzer is the wherein one of tetramethyl ammonium chloride, triphenyl phosphorus, methyltriphenylphospbromide bromide phosphorus, Ethyltriphenylphosphonium brimide.
And described solidifying agent is at least one in organic acid or anhydrides.
And described curing catalyst is any one in imidazoles, imidazolines, trialkyl phosphorus, quaternary ammonium salt, quaternary phosphine salt, organic ureas.
And described mineral filler is at least one in silica flour, talcum powder, calcium carbonate, mica powder, and median size is between 1 ~ 50 micron.
Advantage of the present invention and positively effect as follows:
Simple, the condition of the synthesis technique of inierpeneirating network structure high-flexibility epoxy resin provided by the invention be easy to control, administration measure, in building-up process, non-volatile part generates, and the feature of environmental protection is strong.
(2) the polyvinyl butyral acetal and epoxy resin with high toughening effect are carried out physical blending by the present invention, obtained have inierpeneirating network structure high-flexibility epoxy resin and for composition epoxy resin, thus obtain there is high flexile epoxy resin combination, and this composition epoxy resin is used for electronic package material, thus increase substantially the cold-hot impact of electronic package material.
Embodiment
Below in conjunction with specific embodiment, the invention will be further described, and following examples are descriptive, is not determinate, can not limit protection scope of the present invention with this.
In the epoxy resin I that the present invention uses, epoxy resin II I, II is for marking clear use, does not have particular meaning.
Embodiment 1:
There is a preparation method for inierpeneirating network structure high-flexibility composition epoxy resin, as follows:
The High-flexibility epoxy resin A of epoxy resin I, inierpeneirating network structure, solidifying agent, curing catalyst and mineral filler are carried out pre-mixing by mass fraction proportioning, and the time of pre-mixing is 5 ~ 20min, rotating speed 500 ~ 1000r/min; Then melting mixing is extruded (extrusion temperature 70 ~ 150 DEG C, forcing machine rotating speed 1500 ~ 3000r/min, rate of feeding 900 ~ 2400r/min), then carries out pulverizing and sieving obtaining described composition epoxy resin.
Wherein, the synthetic method of the High-flexibility epoxy resin A of inierpeneirating network structure:
(1) in the 1L four-hole boiling flask that heating jacket, agitator, thermometer, distillation column and prolong are housed, add South Asia, 648gNPEL127E(Taiwan, bisphenol A type epoxy resin, epoxy equivalent (weight) 176 ~ 184g/eq), be warming up to about 130 DEG C, open vacuum pump, vacuum tightness <-0.08MPa, stir 0.5 hour, close vacuum pump;
(2) add 109.2g polyvinyl butyral acetal PVB, 205.2g dihydroxyphenyl propane and 0.74g Ethyltriphenylphosphonium brimide, nitrogen protection, mixes; Slowly be warming up to 140 ~ 150 DEG C, reaction 2-4h, then temperature is risen to 160 ~ 180 DEG C, reaction 1-3h, when the actual equivalent of reaction system reaches 95% of theoretical equivalence, open vacuum pump, vacuum tightness-0.05 ~ 0Mpa, vacuumizes 25min, stopped reaction;
Polyvinyl butyral acetal PVB design parameter is: polyvinyl alcohol hydroxy radical content is 21wt%, and polyvinyl butyral acetal base content range is 78wt%, and vinyl acetate between to for plastic base content range is 1wt%, and glass transition temperature Tg scope is 63 DEG C.
(3) discharging, after cooling compressing tablet, can obtain inierpeneirating network structure high-flexibility epoxy resin, in light yellow clear shape.
The epoxy equivalent (weight) of this epoxy resin A is 540g/eq, and softening temperature is 73 DEG C.
Embodiment 2:
There is a preparation method for inierpeneirating network structure high-flexibility composition epoxy resin, as follows:
The High-flexibility epoxy resin B of epoxy resin I, inierpeneirating network structure, solidifying agent, curing catalyst and mineral filler are carried out pre-mixing by mass fraction proportioning, and the time of pre-mixing is 5 ~ 20min, rotating speed 500 ~ 1000r/min; Then melting mixing is extruded (extrusion temperature 70 ~ 150 DEG C, forcing machine rotating speed 1500 ~ 3000r/min, rate of feeding 900 ~ 2400r/min), then carries out pulverizing and sieving obtaining described composition epoxy resin.
Wherein, the synthetic method of the High-flexibility epoxy resin B of inierpeneirating network structure:
(1) in the 1L four-hole boiling flask that heating jacket, agitator, thermometer, distillation column and prolong are housed, add South Asia, 504gNPEL127E(Taiwan, bisphenol A type epoxy resin, epoxy equivalent (weight) 176 ~ 184g/eq), be warming up to about 130 DEG C, open vacuum pump, vacuum tightness <-0.08MPa, stir 0.5 hour, close vacuum pump;
(2) add 140g polyvinyl butyral acetal PVB, 191.52g dihydroxyphenyl propane and 0.7g Ethyltriphenylphosphonium brimide, nitrogen protection, mixes; Slowly be warming up to 140 ~ 150 DEG C, reaction 2-4h, then temperature is risen to 160 ~ 180 DEG C, reaction 1-3h, when the actual equivalent of reaction system reaches 95% of theoretical equivalence, open vacuum pump, vacuum tightness-0.05 ~ 0Mpa, vacuumizes 25min, stopped reaction;
Polyvinyl butyral acetal PVB design parameter is: polyvinyl alcohol hydroxy radical content is 21wt%, and polyvinyl butyral acetal base content range is 78wt%, and vinyl acetate between to for plastic base content range is 1wt%, and glass transition temperature Tg scope is 63 DEG C.
(3) discharging, after cooling compressing tablet, can obtain inierpeneirating network structure high-flexibility epoxy resin, in light yellow clear shape.
The epoxy equivalent (weight) of this epoxy resin B is 740g/eq, and softening temperature is 95 DEG C.
Comparative example:
Epoxy resin I, solidifying agent, curing catalyst and mineral filler are carried out pre-mixing by mass fraction proportioning, and the time of pre-mixing is 5 ~ 20min, rotating speed 500 ~ 1000r/min; Then melting mixing is extruded (extrusion temperature 70 ~ 150 DEG C, forcing machine rotating speed 1500 ~ 3000r/min, rate of feeding 900 ~ 2400r/min), then carries out pulverizing and sieving.
The proportioning of three groups of example composition components and the performance of coating curing thing as shown in table 1.
The performance of table 1 epoxy composite component proportion and coating curing thing
Form components description as follows:
Described epoxy resin I requires that softening temperature is 60 ~ 130 DEG C, epoxy equivalent (weight) is 400 ~ 1300g/eq, comprises diglycidyl ether type epoxy resin, glycidyl ester type epoxy resin, preferred bisphenol A type epoxy resin, accounts for 10 ~ 30 mass parts of encapsulating material total amount.
Described inierpeneirating network structure high-flexibility epoxy resin, epoxy equivalent (weight) scope is 400 ~ 1300g/eq, and softening point range is 60 ~ 130 DEG C, accounts for 20 ~ 40 mass parts of encapsulating material total amount.
Involved solidifying agent is at least one in organic acid or anhydrides, accounts for 3 ~ 10 mass parts of encapsulating material total amount.
Involved curing catalyst is any one in imidazoles, imidazolines, trialkyl phosphorus, quaternary ammonium salt, quaternary phosphine salt, organic ureas, accounts for 0.05 ~ 0.3 mass parts of encapsulating material total amount.
Involved mineral filler is at least one in silica flour, talcum powder, calcium carbonate, mica powder.The median size of these mineral fillers is between 1 ~ 50 micron.When median size is less, easily cause resin combination viscosity to rise, cause its packaging process to be deteriorated; And when median size is larger, can cause again resin and filler distribution uneven, thus have influence on its physical and mechanical properties.The addition of this mineral filler accounts for 30 ~ 60 mass parts of composition epoxy resin gross weight.
The involved synthetic method with the High-flexibility epoxy resin of inierpeneirating network structure, step is as follows:
(1) in reaction vessel, add epoxy resin II, be warming up to 120 ~ 150 DEG C, vacuum tightness <-0.08MPa, stir 0.5-1.5h, extract the cut in epoxy resin out;
(2) to adding polyvinyl butyral acetal, polyphenol and catalyzer except in the epoxy resin of cut, mix, be slowly warming up to 140 ~ 150 DEG C, reaction 2-4h, again temperature is risen to 160 ~ 180 DEG C, reaction 1-3h, when the actual equivalent of reaction system reaches 95% of theoretical equivalence, vacuumizes, vacuum tightness-0.05 ~ 0Mpa, vacuumize 20 ~ 30min, stopped reaction, reaction process adopts nitrogen protection;
(3) discharging, through cooling compressing tablet, obtains the High-flexibility epoxy resin with inierpeneirating network structure.
Wherein, described each constituent mass number is:
The epoxy equivalent (weight) scope 160 ~ 1000g/eq of the epoxy resin II in described inierpeneirating network structure high-flexibility epoxy resin, comprises at least one in bisphenol A type epoxy resin and bisphenol f type epoxy resin; The polyvinyl alcohol hydroxy radical content scope of described polyvinyl butyral acetal is 11 ~ 27wt%, and polyvinyl butyral acetal base content range is 69 ~ 88wt%, and vinyl acetate between to for plastic base content range is 1 ~ 4wt%, and glass transition temperature Tg scope is 60 ~ 70 DEG C; Described polyphenol is at least one in dihydroxyphenyl propane, Bisphenol F; Described catalyzer is the wherein one of tetramethyl ammonium chloride, triphenyl phosphorus, methyltriphenylphospbromide bromide phosphorus, Ethyltriphenylphosphonium brimide.
The using method of this inierpeneirating network structure high-flexibility composition epoxy resin:
By in 160 ± 10 DEG C of baking ovens the electronic devices and components such as voltage dependent resistor, ceramic condenser of preheating 30min to immerse in previously prepared powder powder (composition epoxy resin provided by the invention), then be put in 160 DEG C ± 10 baking ovens and solidify 1 ~ 2h.
Testing performance index method involved in the present invention is as follows:
(1) the mensuration of epoxy equivalent (weight): according to ISO3001-1978 " mensuration of plastics-epoxy compounds-epoxy equivalent (weight) ";
(2) softening temperature: measure according to the method described in GB12007.6-89 " epoxy resin softening point measurement method ring and ball method ";
(3) cold-hot impact
That the destructive test that ftractures is occurred in the environment of high temperature and low temperature successively alternation to the coating of electronic devices and components; The design temperature of high temperature and time length all can require to set according to difference, and low temperature is also like this; The resistance to high temperature of coating and a low temperature, be called a circulation; The cycle index of coating before cracking is more, and its cold-hot impact property is better.
Cold-hot impact condition involved in the present invention: high temperature is set as+125 DEG C, and low temperature is set as-40 DEG C, and a high temperature and a low temperature continuous time are 30min, voltage dependent resistor magnetic sheet used, diameter 20 Φ, often organizes experiment 10 prints.
Claims (8)
1. there is an inierpeneirating network structure high-flexibility composition epoxy resin, it is characterized in that: it forms component and mass fraction is respectively:
Wherein, the preparation method of the High-flexibility epoxy resin of inierpeneirating network structure is as follows:
(1) in reaction vessel, add epoxy resin II, be warming up to 120 ~ 150 DEG C, vacuum tightness <-0.08MPa, stir 0.5-1.5h, extract the cut in epoxy resin II out;
(2) to adding polyvinyl butyral acetal, polyphenol and catalyzer except in the epoxy resin II of cut, mix, be warming up to 140 ~ 150 DEG C, reaction 2-4h, again temperature is risen to 160 ~ 180 DEG C, reaction 1-3h, when the actual equivalent of reaction system reaches 95% of theoretical equivalence, vacuumizes, vacuum tightness-0.05 ~ 0Mpa, vacuumize 20 ~ 30min, stopped reaction, reaction process adopts nitrogen protection;
(3) discharging, through cooling compressing tablet, obtains the High-flexibility epoxy resin with inierpeneirating network structure.
Wherein, the mass fraction of described each component is:
The softening temperature of described epoxy resin I is 60 ~ 130 DEG C, epoxy equivalent (weight) is 400 ~ 1300g/eq;
Described epoxy resin II comprises at least one in bisphenol A type epoxy resin and bisphenol f type epoxy resin.
2. according to claim 1 have inierpeneirating network structure high-flexibility composition epoxy resin, it is characterized in that: described epoxy resin I comprises diglycidyl ether type epoxy resin, glycidyl ester type epoxy resin.
3. according to claim 1 have inierpeneirating network structure high-flexibility composition epoxy resin, it is characterized in that: the epoxy equivalent (weight) scope of described inierpeneirating network structure high-flexibility epoxy resin is 400 ~ 1300g/eq, and softening point range is 60 ~ 130 DEG C.
4. according to claim 1 have inierpeneirating network structure high-flexibility composition epoxy resin, it is characterized in that: the polyvinyl alcohol hydroxy radical content scope of described polyvinyl butyral acetal is 11 ~ 27wt%, polyvinyl butyral acetal base content range is 69 ~ 88wt%, vinyl acetate between to for plastic base content range is 1 ~ 4wt%, and glass transition temperature Tg scope is 60 ~ 70 DEG C;
Described polyphenol is at least one in dihydroxyphenyl propane, Bisphenol F;
Described catalyzer is the wherein one of tetramethyl ammonium chloride, triphenyl phosphorus, methyltriphenylphospbromide bromide phosphorus, Ethyltriphenylphosphonium brimide.
5. according to claim 1 have inierpeneirating network structure high-flexibility composition epoxy resin, it is characterized in that: described solidifying agent is at least one in organic acid or anhydrides.
6. according to claim 1 have inierpeneirating network structure high-flexibility composition epoxy resin, it is characterized in that: described curing catalyst is any one in imidazoles, imidazolines, trialkyl phosphorus, quaternary ammonium salt, quaternary phosphine salt, organic ureas.
7. according to claim 1 have inierpeneirating network structure high-flexibility composition epoxy resin, it is characterized in that: described mineral filler is at least one in silica flour, talcum powder, calcium carbonate, mica powder, and median size is at 1 ~ 50 micron.
8. prepare a method as claimed in claim 1 with inierpeneirating network structure high-flexibility composition epoxy resin, it is characterized in that:
Epoxy resin I, inierpeneirating network structure high-flexibility epoxy resin, solidifying agent, curing catalyst and mineral filler are carried out pre-mixing by mass fraction proportioning, and the time of pre-mixing is 5 ~ 20min, rotating speed 500 ~ 1000r/min; Then melting mixing is extruded, wherein extrusion temperature 70 ~ 150 DEG C, forcing machine rotating speed 1500 ~ 3000r/min, rate of feeding 900 ~ 2400r/min, then carries out pulverizing and sieving obtaining described composition epoxy resin.
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| CN106146804B (en) * | 2016-07-29 | 2018-10-19 | 广东工业大学 | A kind of photo-curable silicone/epoxy resin composite material and its preparation method and application |
| CN106398460A (en) * | 2016-08-30 | 2017-02-15 | 天津凯华绝缘材料股份有限公司 | High-weather-resistance and high-flexibility epoxy resin composition and preparation method thereof |
| CN106833401A (en) * | 2017-01-22 | 2017-06-13 | 广西玉林市禹力音响配件有限公司 | A kind of loudspeaker glue special and preparation method thereof |
| CN106957512A (en) * | 2017-03-30 | 2017-07-18 | 厦门迈拓宝电子有限公司 | Insulating heat-conductive glued membrane and preparation method thereof |
| CN108129641A (en) * | 2017-12-26 | 2018-06-08 | 上海美东生物材料股份有限公司 | A kind of preparation method of flexible-epoxy |
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| CN102675886A (en) * | 2012-05-07 | 2012-09-19 | 湖北大学 | Fiber-reinforced epoxy asphalt material and preparation method thereof |
| CN102863876A (en) * | 2012-09-06 | 2013-01-09 | 中科院广州化学有限公司 | Organic silicon modified epoxy floor paint and preparation method and application thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102675886A (en) * | 2012-05-07 | 2012-09-19 | 湖北大学 | Fiber-reinforced epoxy asphalt material and preparation method thereof |
| CN102863876A (en) * | 2012-09-06 | 2013-01-09 | 中科院广州化学有限公司 | Organic silicon modified epoxy floor paint and preparation method and application thereof |
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