CN104400877A - Density board manufacturing method - Google Patents
Density board manufacturing method Download PDFInfo
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- CN104400877A CN104400877A CN201410557852.0A CN201410557852A CN104400877A CN 104400877 A CN104400877 A CN 104400877A CN 201410557852 A CN201410557852 A CN 201410557852A CN 104400877 A CN104400877 A CN 104400877A
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- Prior art keywords
- slab
- substrate layer
- density board
- layer
- board
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
- B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
- B27N3/06—Making particle boards or fibreboards, with preformed covering layers, the particles or fibres being compressed with the layers to a board in one single pressing operation
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- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Wood Science & Technology (AREA)
- Forests & Forestry (AREA)
- Laminated Bodies (AREA)
Abstract
The invention provides a density board manufacturing method. The density board manufacturing method comprises the following steps: A) preparing wood or plant raw materials into dry fibers; B) laying the fiber materials in step A to form a first board blank, then laying a glass fiber reticular fabric on the first board blank, and laying a second board blank on the glass fiber reticular fabric; C) hot-pressing the integral board blank obtained in step B to complete the manufacturing of the density board. The density board manufacturing method provided by the invention has the advantages that the comprehensive performance of artificial fiber boards can be greatly improved and the production cost can be reduced.
Description
Technical field
The present invention relates to a kind of manufacture method of wood-based plate, particularly a kind of manufacture method of medium-density plate.
Background technology
Fiberboard has another name called density board, is with wood fibre or other plant cellulose fiber for raw material, applies the wood-based plate that Lauxite or other adhesive be suitable for are made.Development Fibreboard Production is the effective way of timber resources comprehensive utilization.The shortcoming of fiberboard because producing expansive force difference, bow warping is out of shape after moisture absorption; Hard plate material surface is hard, nail nail difficulty, poor water resistance.Along with domestic construction decoration marked and furniture manufacturing industry are to the growth of beaver board demand, in order to improve the combination property of beaver board, also there is a lot of method, such as, Chinese patent CN2320409Y just provides and a kind ofly arranges glass fabric to improve the technical scheme of MOR and elastic modelling quantity at fiberboard upper and lower surface, but, as Chinese patent CN2320409Y, the existing technical scheme improving beaver board is all after beaver board creates often, final products are obtained as raw material secondary operations using beaver board, therefore there is production cost high, the problems such as complex procedures.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of manufacture method of density board, to reduce or to avoid problem noted earlier.
Specifically, the invention provides a kind of manufacture method of density board, described density board comprises the first substrate layer, second substrate layer of integrated hot pressing formed, enhancement Layer is provided with between described first substrate layer and described second substrate layer, described first substrate layer and described second substrate layer material are wood fibre or string, described enhancement Layer comprises fiberglass reticular fabric, and it comprises the steps
Steps A, makes dried fibres by wooden or plant material;
Step B, the fibre material in steps A is used to lay ground floor slab, then on described first time slab, fiberglass reticular fabric is laid, on described fiberglass reticular fabric, lay second layer slab again, described ground floor slab and described second layer slab tundish clip the overall slab of described fiberglass reticular formation of fabrics;
Step C, the described overall slab completed by step B carries out hot pressing, completes the manufacture of described density board.
The present invention proposes a kind of manufacture method of density board, it is compounded in beaver board by nested for the enhancement Layer be made up of fiberglass reticular fabric, also just can in staple fibre board manufacturing process, fiberglass reticular fabric is laid in advance between two-layer slab, and then by hot pressing, two-layer slab and fiberglass reticular fabric are complex as a whole, thus only need use production line can produce described density board, greatly can improve the combination property of beaver board and can production cost be reduced.
Accompanying drawing explanation
The following drawings is only intended to schematically illustrate the present invention and explain, not delimit the scope of the invention.Wherein,
Fig. 1 display be the structural representation of density board manufactured by the method for a specific embodiment of the present invention;
The manufacturing theory schematic diagram that Fig. 2 is the density board shown in Fig. 1.
Detailed description of the invention
In order to there be understanding clearly to technical characteristic of the present invention, object and effect, now contrast accompanying drawing and the specific embodiment of the present invention is described.Wherein, identical parts adopt identical label.
Fig. 1 display be the structural representation of density board manufactured by the method for a specific embodiment of the present invention, shown in Figure 1, the invention provides a kind of manufacture method of density board, described density board comprises the first substrate layer 1, second substrate layer 2 of integrated hot pressing formed, enhancement Layer 3 is provided with between described first substrate layer 1 and described second substrate layer 2, described first substrate layer 1 is wood fibre or string with the material of described second substrate layer 2, described enhancement Layer 3 comprises fiberglass reticular fabric, described method comprises the steps
Steps A, makes dried fibres by wooden or plant material;
In the present invention, first utilize existing technique by wooden or plant material by chipping-screening machine-washing-defibrator-glue compounding and applying-drying after make dried fibres.
Step B, uses the fibre material in steps A to lay ground floor slab, then on described first time slab, lays fiberglass reticular fabric, then lay second layer slab on described fiberglass reticular fabric;
Described enhancement Layer 3 due to described density board is arranged between described first substrate layer 1 and described second substrate layer 2, therefore, the present invention and the maximum difference of prior art are also just, prior art is all first slab is made fiberboard, and then at fibreboard surface by reinforcement material in the mode compounds such as hot pressing.And density board provided by the invention, the described enhancement Layer 3 of its inside is in board making process, with described first substrate layer 1 and described second substrate layer 2 integrated hot pressing formed.That is to say, when slab is laid, in steps A, the fibre blank of output is laid at twice.
First, lay the blank for the formation of described second substrate layer 2, i.e. ground floor slab, then stop toppling over blank, lay described fiberglass reticular fabric at the blank for the formation of described second substrate layer 2, then continue on described fiberglass reticular fabric, to lay the blank for the formation of described first substrate layer 1, i.e. second layer slab, so far, the laying of overall slab is completed.
The thickness of described ground floor slab and described second layer slab can be laid according to the thickness of final described first substrate layer 1 and described second substrate layer 2.Described first substrate layer 1 is greater than 3mm with the thickness of described second substrate layer 2, can ensure like this in hot pressing recombination process, slab for the formation of described first substrate layer 1 and described second substrate layer 2 can be good at being complex as a whole with the fiberglass reticular fabric forming described enhancement Layer 3, and bonding firmly.
In order to ensure that described fiberglass reticular fabric can utilize the composite joint of the adhesive glue in the fibre blank of steps A output and described first substrate layer 1 and described second substrate layer 2 enough tight, described fiberglass reticular fabric can be the ready-made hollow reticulated woven by glass fiber, and use geotextiles bound edge in its surrounding, such as, the manufacturing theory schematic diagram that Fig. 2 is the density board shown in Fig. 1, solid line represents described fiberglass reticular fabric, in figure, dotted line represents the size of overall slab, shown in Figure 2, the longitudinal size of described overall slab is L1, lateral dimension is W1, the longitudinal size of described fiberglass reticular fabric is L2, lateral dimension is W2, the size of mesh opening size of described fiberglass reticular fabric can be 5x5-10x10mm, the width W 3 of described geotextiles bound edge can be 8-15mm, the size of described fiberglass reticular fabric is greater than the size of described overall slab in the longitudinal direction of described overall slab direction of transfer, that is to say that L2 is greater than L1, be less than the size of described overall slab in the horizontal, that is to say that W2 is less than W1, so just can ensure that described overall slab is in transport process, both sides can not have described fiberglass reticular fabric to spill, also would not blank be caused to be scattered before carrying out hot pressing.The width W 3 of described geotextiles bound edge can be 8-15mm, utilize described geotextiles bound edge, the glass fiber being woven into described fiberglass reticular fabric can be made in process of deployment to keep size, can not be misplaced distortion, and, when laying described fiberglass reticular fabric, can, so that geotextiles bound edge described in holder, avoid causing damage to the grid of described fiberglass reticular fabric.The geotextiles bound edge of described fiberglass reticular fabric also can be compound in described density board, but due to its width less, therefore can't bring impact to the performance of described density board.Described fiberglass reticular fabric stretches out the part of described overall slab in the vertical, only needs to excise after described density board is made.
Step C, the overall slab completed by step B carries out hot pressing, completes the manufacture of described density board.
The present invention proposes a kind of manufacture method of density board, it is compounded in beaver board by nested for the enhancement Layer be made up of fiberglass reticular fabric, also just can in staple fibre board manufacturing process, fiberglass reticular fabric is laid in advance between two-layer slab, and then by hot pressing, two-layer slab and fiberglass reticular fabric are complex as a whole, thus only need use production line can produce described density board, greatly can improve the combination property of beaver board and can production cost be reduced.
Although it will be appreciated by those skilled in the art that the present invention is described according to the mode of multiple embodiment, not each embodiment only comprises an independently technical scheme.So describe in description be only used to clear for the purpose of; description should integrally be understood by those skilled in the art, and regards technical scheme involved in each embodiment as the mode that mutually can be combined into different embodiment to understand protection scope of the present invention.
The foregoing is only the schematic detailed description of the invention of the present invention, and be not used to limit scope of the present invention.Any those skilled in the art, the equivalent variations done under the prerequisite not departing from design of the present invention and principle, amendment and combination, all should belong to the scope of protection of the invention.
Claims (1)
1. the manufacture method of a density board, it is characterized in that, described density board comprises the first substrate layer, second substrate layer of integrated hot pressing formed, enhancement Layer is provided with between described first substrate layer and described second substrate layer, described first substrate layer and described second substrate layer material are wood fibre or string, described enhancement Layer comprises fiberglass reticular fabric, and it comprises the steps
Steps A, makes dried fibres by wooden or plant material;
Step B, the fibre material in steps A is used to lay ground floor slab, then on described first time slab, fiberglass reticular fabric is laid, on described fiberglass reticular fabric, lay second layer slab again, described ground floor slab and described second layer slab tundish clip the overall slab of described fiberglass reticular formation of fabrics;
Step C, the overall slab completed by step B carries out hot pressing, completes the manufacture of described density board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410557852.0A CN104400877A (en) | 2014-10-20 | 2014-10-20 | Density board manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410557852.0A CN104400877A (en) | 2014-10-20 | 2014-10-20 | Density board manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104400877A true CN104400877A (en) | 2015-03-11 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410557852.0A Pending CN104400877A (en) | 2014-10-20 | 2014-10-20 | Density board manufacturing method |
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| CN (1) | CN104400877A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2320409Y (en) * | 1997-07-24 | 1999-05-26 | 黑龙江省林产工业研究所 | Fibre-reinforced resin artificial board |
| JP2002061378A (en) * | 2000-08-22 | 2002-02-28 | Bridgestone Corp | Laminated finishing material |
| WO2012149634A1 (en) * | 2011-05-02 | 2012-11-08 | D Abbadie D Arrast Michel-Arnaud | Cross-laminated timber panel |
| KR20130066139A (en) * | 2011-12-12 | 2013-06-20 | 한양소재 주식회사 | Synthesis wood use for natural fiber and method thereof |
| CN203472231U (en) * | 2013-09-04 | 2014-03-12 | 赵东顺 | Novel density board |
| CN203611510U (en) * | 2013-11-14 | 2014-05-28 | 浙江得威德环保科技有限公司 | Composite board |
-
2014
- 2014-10-20 CN CN201410557852.0A patent/CN104400877A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2320409Y (en) * | 1997-07-24 | 1999-05-26 | 黑龙江省林产工业研究所 | Fibre-reinforced resin artificial board |
| JP2002061378A (en) * | 2000-08-22 | 2002-02-28 | Bridgestone Corp | Laminated finishing material |
| WO2012149634A1 (en) * | 2011-05-02 | 2012-11-08 | D Abbadie D Arrast Michel-Arnaud | Cross-laminated timber panel |
| KR20130066139A (en) * | 2011-12-12 | 2013-06-20 | 한양소재 주식회사 | Synthesis wood use for natural fiber and method thereof |
| CN203472231U (en) * | 2013-09-04 | 2014-03-12 | 赵东顺 | Novel density board |
| CN203611510U (en) * | 2013-11-14 | 2014-05-28 | 浙江得威德环保科技有限公司 | Composite board |
Non-Patent Citations (2)
| Title |
|---|
| 张双保等: "玻璃纤维增强三倍体毛白杨木质(纤维)复合材料的研究", 《北京林业大学学报》 * |
| 王国超: "玻纤增强纤维板的研究", 《新型建筑材料》 * |
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Application publication date: 20150311 |
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| RJ01 | Rejection of invention patent application after publication |