CN1043971C - Process and apparatus for resin impregnation of a porous web - Google Patents
Process and apparatus for resin impregnation of a porous web Download PDFInfo
- Publication number
- CN1043971C CN1043971C CN94194688A CN94194688A CN1043971C CN 1043971 C CN1043971 C CN 1043971C CN 94194688 A CN94194688 A CN 94194688A CN 94194688 A CN94194688 A CN 94194688A CN 1043971 C CN1043971 C CN 1043971C
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- resin
- applicator roll
- section
- thermosetting resin
- net
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B15/00—Pretreatment of the material to be shaped, not covered by groups B29B7/00 - B29B13/00
- B29B15/08—Pretreatment of the material to be shaped, not covered by groups B29B7/00 - B29B13/00 of reinforcements or fillers
- B29B15/10—Coating or impregnating independently of the moulding or shaping step
- B29B15/12—Coating or impregnating independently of the moulding or shaping step of reinforcements of indefinite length
- B29B15/122—Coating or impregnating independently of the moulding or shaping step of reinforcements of indefinite length with a matrix in liquid form, e.g. as melt, solution or latex
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/04—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
- B29C70/28—Shaping operations therefor
- B29C70/40—Shaping or impregnating by compression not applied
- B29C70/50—Shaping or impregnating by compression not applied for producing articles of indefinite length, e.g. prepregs, sheet moulding compounds [SMC] or cross moulding compounds [XMC]
- B29C70/504—Shaping or impregnating by compression not applied for producing articles of indefinite length, e.g. prepregs, sheet moulding compounds [SMC] or cross moulding compounds [XMC] using rollers or pressure bands
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
- B29C2035/0822—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using IR radiation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2063/00—Use of EP, i.e. epoxy resins or derivatives thereof, as moulding material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2101/00—Use of unspecified macromolecular compounds as moulding material
- B29K2101/10—Thermosetting resins
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/06—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts
- B29K2105/08—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts of continuous length, e.g. cords, rovings, mats, fabrics, strands or yarns
- B29K2105/0854—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts of continuous length, e.g. cords, rovings, mats, fabrics, strands or yarns in the form of a non-woven mat
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2309/00—Use of inorganic materials not provided for in groups B29K2303/00 - B29K2307/00, as reinforcement
- B29K2309/08—Glass
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Composite Materials (AREA)
- Reinforced Plastic Materials (AREA)
Abstract
A process and an apparatus are disclosed for impregnating a porous web with a thermosettable resin. The process involves the use of resin application means comprising a rotating roller (4) on which is deposited a liquid-form thermosettable resin in essentially uncured state, passing a porous web in countercurrent contact with the thermosettable resin so as to transfer the thermosettable resin into the porous web, exposing the resin-containing porous substrate to an elevated temperature lower than that maintained for partial cure; and passing the resin-containing fibrous web to a heating zone to partially cure the resin and form a prepreg. The process is particularly suited for application of a solventless resin formulation to a glass web in the preparation of a prepreg for an electrical laminate. The apparatus includes resin application means comprising a rotating roller (4); means for applying a liquid-form thermosettable resin onto the rotatable roller; means for advancing, in a countercurrent direction with respect to the direction of motion of the roller, a fibrous web (2) to the roller and in contact with the thermosettable resin thereon and thence to a resin cure zone; and means between the rotatable roller and the resin cure zone (14) to apply heat to the resin-containing substrate.
Description
The present invention relates to thermosetting resin dipping porous net.In specific embodiment, the present invention relates to method and apparatus with solvent-free aathermoset resin system impregnated glass fiber base material.
The manufacturing of cured thermosetting circuit board substrate starts from liquid thermosetting resin system impregnated glass fiber base material.Then " preimpregnation materials and parts " are made in the base material part curing of resin dipping.The preimpregnation materials and parts of one group of stratiform are depressed heating adding, resin is solidified fully and make hard laminate, it is as the substrate of circuit board.
Though existing various thermosetting resins, as at room temperature being the low-molecular-weight epoxy resin of liquid, but now circuit board requires to use at room temperature the high performance resin system as solid or thick liquid, and with resin to be coated on the base material in fusion form or the solution form.But the processing thermosetting resin is difficult under molten condition, because make the required high temperature of resin fusion can make the resin premature setting, makes resin poor to " infiltration " of base material, i.e. saturation deficit.
The commercial run that is used to make the preimpregnation materials and parts now be organic solution with resin with resin-coating to base material.Solwution method must comprise such one usually with the partly solidified step of carrying out of resin, in this step,, solvent is removed from the preimpregnation materials and parts by solvent is heated to volatilization temperature.But this method has many shortcomings: at first, it need handle or discharge organic volatile.Secondly, solvent volatilizees from uncured resin and may produce cavity and inhomogeneities in the preimpregnation materials and parts and then in the laminate that solidifies.In addition, remove solvent step and need a large amount of time.
Having proposed a kind of method, to be used for that solventfree resin is coated to glass fibre online, this method comprise with solventfree resin deposit to the rotation applicator roll on, and make the glass fiber mesh and the resin of deposition reverse contact by the rotation applicator roll so that resin transfer on the net, then through optional second applicator roll that resin-coating is arrived the reverse side of net, deliver to bringing-up section, make resin partly solidified.This method is open in EP476752.Hope is removed second applicator roll under the condition of not damaging product appearance and quality.
So, the purpose of this invention is to provide a kind of method and apparatus with thermosetting resin impregnation of fibers base material.One concrete aspect, the purpose of this invention is to provide the method for simplifying and the cheap apparatus of the solvent-free aathermoset resin system impregnated glass fiber of a kind of usefulness base material.
So, the present invention relates to a kind of method of flooding the porous net with thermosetting resin by following steps, uncured liquid form thermosetting resin is deposited on the rotation applicator roll; Make the porous net with described roller on the reverse mode that contacts of described resin pass through so that thermosetting resin is transferred on the porous substrate; Make the porous base that contains resin just by the section of being heating and curing, make resin partly solidified.This method is characterised in that, only uses a single rotation applicator roll and resiniferous porous substrate by solidifying before the section, is exposed to greater than 100 ℃ under the high temperature less than this curings section maximum temperature earlier.
In exemplary embodiments of the present invention, a kind of like this method with thermosetting resin dipping porous net is provided, this method comprises: the resin-coating equipment that has only a rotation applicator roll is provided; The liquid form thermosetting resin prescription that will contain uncured basically thermosetting resin deposits on the rotation applicator roll; Make the porous net to pass through, so that the thermosetting resin prescription is transferred on the porous substrate with the thermosetting resin of rotation on the applicator roll reverse mode that contacts of filling a prescription; Resiniferous fiber base material is exposed at least 100 ℃ to the high temperature less than the maximum temperature of solidifying section; And make resiniferous fiber base material by solidifying section, make resin partly solidified and make the preimpregnation materials and parts that contain fiber base material and partly solidified thermosetting resin.
According to the present invention, also provide a kind of and flood the device that the porous net prepares the preimpregnation materials and parts with thermosetting resin, this device comprises: (a) single rotation applicator roll; (b) make the thermosetting resin of controlled amounts liquid form deposit to equipment on the described rotation applicator roll; (c) section of being heating and curing; (d) the porous net is fed to thermosetting resin on the described rotation applicator roll and contacts, be fed to the equipment of resin solidification section then; It is characterized in that, (e) behind the described rotation applicator roll and described resin solidification section before firing equipment.
The present invention is for providing a kind of technology of suitable simple and inexpensive with the thermosetting resin impregnation of fibers base material of liquid form.This method is particularly suitable for preparing the preimpregnation materials and parts that finally are used for electrical laminated plate with solventfree resin system impregnated glass fiber net.The purpose of resin-coating method of the present invention is the abundant infiltration that reaches base material, so that does not use second applicator roll to make resin-coating arrive the reverse side of base material, from but make high-quality cured layer pressing plate more economically.
In resin-coating method of the present invention, with the hot solids thermoplastic resin-impregnated fibers base material of liquid form.Though the inventive method useable solvents base resin is implemented, for method of the present invention, preferred resin system is the resin system that does not contain organic solvent, as water-based resin system or solventfree resin system.For the solventfree resin system, can at room temperature there be low viscous thermosetting resin to reach liquid form by using, perhaps thermosetting resin is heated to such temperature, reach the enough low viscosity of abundant infiltration base material.Certainly be under one situation of back, resin system (thermosetting resin and any curing component that uses with it) must be without any the curing of significance degree in the time range of base material dipping process under its melt temperature.
Can be with reference to figure 1 explanation resin-coating method of the present invention and device, base material 2 (is generally any short fiber, felt or woven porous material, be preferably woven glass fiber mesh) to send to from conveying equipment 1, conveying equipment generally includes and be used for automatic equipment that net is sent under selected speed and institute's network selection tension force.Fleece can be chosen wantonly by for example infrared heater heating before being fed to the resin-coating section.Guide device 3 is installed makes net be sent to resin-coating roller 4 with certain contact angle α radian.Angle α can be with the total structural change of coating scheme, but usually in 30-180 degree scope, preferred 90-150 degree, and 120-150 degree most preferably, so that make resin waste minimum, and that the heat from the roller to the base material is transmitted is maximum.Rotation roller 4 is delivered to liquid resin film 5 basal plane of the reverse net that passes through 2.Applicator roll 4 remains under such temperature, and resin molding 5 is remained under the liquid form that does not solidify basically.This temperature changes with resin, but usually in 50-250 ℃ of scope, preferred 100-200 ℃.The speed that tension force when making rotary speed, the net 2 contact pressure resin films 5 of applicator roll 4 and net 2 are fed to applicator roll is coordinated mutually, so that make Wondertek arrive good infiltration.These specification requirements can be with the variations such as heating efficiency of resin system, net materials type and B-staging unit, downstream.Usually, the rotary speed of applicator roll 4 in the 70-160% of network speed scope, the 100-140% of preferred network speed; The tension force of net 2 usually in 0.4536-1.3608kg (1-3 pound)/2.540cm (liner inch) scope, preferred 0.6804-0.9072kg/2.540cm (1.5-2.0PLI); And the feed rate of resin-coating section is crossed in 0.04064-1.016m/s (8-200ft/min) scope by Netcom, preferred 0.127-0.635m/s (the about 125ft/min of 25-).
By the resin delivery device that is shown nozzle 7 here resin molding 5 is coated on the applicator roll 4, nozzle 7 can be coated to the liquid resin of controlled amounts on the surface of revolution of applicator roll.Nozzle 7 can carry the equipment of the resin of liquid form to link to each other in room temperature or under heating up with any continuously.To under different volumetric rate, carry out resin transfer, synchronous with the speed of mobile network, so that, make the time of staying in the resin transfer system the shortest simultaneously with the resin transfer of predetermined on the net.Resin delivery device for example can comprise static mixing machine, the dynamic mixer that the outlet of temperature control links to each other with nozzle 7 or mix squeezer.
Use measuring equipment with resin delivery device 7, so that control is transported to the quantity of online liquid resin, measuring equipment here is shown decides crack roller 8 between the contact point that is installed in nozzle 7 and resin molding 5 and sends net to.Decide crack roller 8 and be preferably one and roller than minor diameter arranged than applicator roll 4, with respect to the applicator roll counter-rotating, its rotary speed in network speed 1-50% scope, preferred 8-35%.Optional scraper plate 10 can be installed, to prevent that resin from refluxing from coated side, by with the pitch deposition face with decide the crack roller and install forward with respect to applicator roll 4, promptly with the angle β of horizontal radius less than 90 °, so that prevent that by gravity resin from counterclockwise flowing down also and can reach such result from being coated with roller.The slit of deciding between crack roller 8 and the applicator roll 4 by careful setting under first kind of situation that is controlled at of resin-coating speed on the net reaches, to obtain uniform thickness.Secondly, the rotary speed of applicator roll matches with network speed, with resin molding is transferred to mobile on the net.In addition, because do not need film-traying roll to control contacting of mobile net and applicator roll, therefore need control net tension force to guarantee the stable operation of resin-coating process.
Optional resin is removed equipment 9 (scraper plate shown here) and is used for removing at resin molding 5 and sending between the net 2 after the contact from applicator roll, such cull by before 360 ° of rotations of roller on roller residual any resin.Resin is removed equipment and is preferably mounted at roller and the porous net place that sends to, thus at net with before applicator roll contacts, make that directly to deposit to porous from any resin that contacts with scraper plate online.
Resiniferous net 6 is fed to by bringing-up section 11 and solidifies section 14, is subjected to the thermal source effect at the resiniferous net of bringing-up section, is shown infrared heater 13 here.Thermal source reduces to minimum most preferably near the resin-coating face so that make from the online heat loss of resin dipping.Heating steps impels resin to flow in net or by net in the middle of this, also can increase mobile by the net of resin pickup and vertical direction are 45 ° at the most (preferably 20-40 °).
The common available Fig. 2 of prepreg process of the present invention describes.The Autonet that fleece 43 usefulness are fit to is sent system 42 to and is transported to resin-coating section 44, and this system has the measurement device of control feed rate and net tension force.The net tension control apparatus is known in this specialty.For example, separating winding up roller 41 can have lock with front end dancer rools combination, and its keeps intending going into to be in the predetermined net tension force into the unit of leading between dancer rools and the resin-coating section.Equally, can keep the downstream net tension force that is fit to by the dancer rools that the speed that makes the variable-ratio that is in the bringing-up section downstream decide the diameter roller is slowed down.
Fleece is sent to by resin-coating section 44, and here the resin-coating segment table is shown and is vertically oriented, and wherein when liquid resin applied with the method that describes in detail above, net passed through by controlled speed with usually up direction.Coated segment 44 comprises resin delivery device, the blender that has resin to mix with curing system remains on required temperature control of required viscosity and as heat loss and the thermal source that flow of raising resin by netting that is used to reduce from the net of impregnating resin described herein with resin system.Optional minor diameter conditioning roller can be used to promote after the resin-coating and infiltrate net before solidifying.
The net 45 that resin is saturated is fed to from the resin-coating section and solidifies section 46, and wherein the Netcom that resin is saturated crosses to be exposed in thermal source such as convection furnace or the infrared heater and heats, and resin is solidified in the situation lower part of not gelling, and this process is called " B-staging ".The temperature of the bringing-up section before solidifying section is usually less than in certain system solidifies the temperature that section is kept, and is at least 100 ℃ usually, and preferred 100-200 ℃, most preferably 130-160 ℃.(because the heat loss between thermal source and the resiniferous net, thermal source itself can be operated being higher than under the given temperature of bringing-up section).The temperature of solidifying section changes with resin system and required resin solidification degree, but usually in 120-250 ℃ of scope, preferred 150-230 ℃.The net that resin is saturated will be subjected to being enough to reaching the B-staging of required state of cure time and handle, and 15% curable groups such as epoxy radicals are solidified, and preferably at the most 10%, more preferably at the most 5%, the time is generally 10s to 8min.Net is sent to from resin solidification section 46 with the form of preimpregnation materials and parts 47, and twists on the draw roll 48, so that store, can directly send in lamination on the other hand.
By being handled to make resin solidification and make the preimpregnation materials and parts force together into laminar structure, one group of stratiform preimpregnation materials and parts makes laminate.Laminate can have been chosen one or more layers conductive material such as copper wantonly.Lamination is generally time 30min to 4hr, preferred 1-2hr, temperature 160-300 ℃, preferred 170-200 ℃, pressure 3.516-35.16kgf/cm
2(50-500psi).Laminate can choose that heating 16hr comes " solidify the back " under 200-230 ℃, normal pressure wantonly, to improve hot property.
The lamination composition that contains epoxy resin will contain curing agent.The effective curing agent that becomes known for epoxy resin for example comprises amine, acids, anhydrides, phenols and imidazoles.Also referring to EP476752.At present the preferred consolidation agent of best lamination performance is provided is the phenol degree of functionality greater than 1.75 phenolic compounds for epoxy composite.Preferred phenol curing agent is to react the phenolic aldehyde that makes by dihydric phenol such as resorcinol or bisphenol-A and formaldehyde in acid solution to dye clearly.The preferred clear colorable resin curing agent of phenolic aldehyde is that bisphenol-A dyes clearly, and its each phenolic group heavily be 600-500, and preferred 60-300, each molecule be on average greater than 2 phenolic hydroxyl groups, preferably 3-5 phenolic hydroxyl group.Such phenol dyes clearly and can buy from Shell International Chemical Company by trade name EPIKURE DX-175 (EPIKURE is a trade mark).Phenol dyes the quantity of curing agent in composition clearly should make epoxy resin cure, usually whenever amount epoxy resin has stoichiometry 0.75-1.25 equivalent phenol to dye curing agent clearly.Percentage is by weight pressed total restatement of epoxy resin and curing agent, and the consumption of curing agent is generally 10-70% (weight), preferred 15-50% (weight), most preferably 15-40% (weight).For fire-retardant application, curing agent can be the mixture of the phenolic curing agent of phenolic resin curative and bromination.In order to accelerate in the composition the faster curing of resin Composition and/or more to solidify under the low temperature, can use optional curing accelerator.
Aathermoset resin system must design in some specification requirement scope of resin-coating procedure parameter requirement.Resin formula does not make to the base material under the temperature of resin solidification in resin-coating in required time must be liquid.Resin system must have enough low viscosity, makes Wondertek arrive good infiltration or saturated, and does not use film-traying roll in application point.But in case resin system is coated on the base material, it just must have sufficiently high viscosity, and it is dripped from network in that resiniferous Wondertek is unlikely before the bringing-up section.Viscosity is in 0.05-1.0PaS (0.5-10P) scope, and the resin formula of preferred 0.05-0.6PaS (0.5-6P) is best suited for.At present preferred resin system be have WPE be the bisphenol-A of 175-190 diglycidyl ether, WPE is arranged is the diglycidyl ether, the mixture that phenolic aldehyde dyes curing agent and glyoxal ethyline accelerator clearly of bromination of the bisphenol-A of 310-350 and bromine content 30-50%.
Method of the present invention can be chosen wantonly with such thermosetting resin prescription and implement: it contains organic solvent or diluent, and its quantity can effectively reduce the viscosity of system, so that processing.Polar organic solvent is to be fit to as ketone, alcohols and glycol ether.The boiling point of selected solvent is usually less than 160 ℃.For epoxy resin, preferred solvent is ketone such as acetone, MEK and methyl iso-butyl ketone (MIBK), and the solvent mixture of they and alkylene glycol ether such as propylene glycol monomethyl ether.The ratio of solid constituent can have bigger variation in composition, depends on the quantity of other components and the application of composition, but the solvent in solvent substrate system accounts for the 15-50% (weight) of prescription total amount usually.
Embodiment 1
Carried out an experiment with method of the present invention; To estimate between resin-coating and the partly solidified step of prepreg process, the base material of resin dipping is exposed to the influence in the infra-red heat.To be coated to the glass fiber mesh of wide 1.27m (50 ") based on the solventfree resin system of the diglycidyl ether of bisphenol-A, and use usually applicator roll structure as shown in Figure 1, the net contact angle is 135 °, and the applicator roll temperature is 127 ℃.The back side of the net of resin dipping is by remaining on the infrared heater under 370 ℃, from the center 7.62cm of 30.48cm * 30.48cm (12 " * 12 ") infrared heater (3 ").Wang center directly is exposed in the infra-red heat like this, simultaneously Wang seamed edge (the about 45.72cm in every limit (18 ")) directly be not exposed to and pine for.The infrared heated side (1.27m (50 ") of net) then by and be in 149 ℃ last polishing roll with 3.81cm (1.5 ") (diameter) and contact.Observational network is found, is exposed to the face flash of light of infra-red heat, and that the seamed edge of net be it seems is unglazed, and this point explanation has required bigger osmosis at infrared exposure district resin.
Claims (8)
1. one kind by the method for following steps with thermosetting resin dipping porous net: will uncured liquid form thermosetting resin deposit to and rotate on the applicator roll; The porous net is passed through, so that thermosetting resin is transferred to porous is online with reverse contact of described resin on the described rotation applicator roll; Make the porous substrate that contains resin by the section of being heating and curing, make resin partly solidified, it is characterized in that, only use a single rotation applicator roll and resiniferous porous substrate being exposed to before the section greater than 100 ℃ and being lower than under the high temperature between the described maximum temperature of solidifying the section maintenance by solidifying.
2. according to the process of claim 1 wherein that high temperature remains in 100-200 ℃ the temperature range, remain in 120-250 ℃ the temperature range and solidify section.
3. according to the method for claim 1 or 2, wherein provide this high temperature with at least one infrared heater.
4. according to the process of claim 1 wherein that porous substrate is a glass fiber mesh.
5. according to the process of claim 1 wherein that thermosetting resin is an epoxy resin.
6. device with thermosetting resin dipping porous net (2), this device comprises:
(a) a single rotation applicator roll (4);
(b) the liquid form solvent-free thermal thermosetting resin of controlled amounts is deposited to equipment on the described rotation applicator roll (4);
(c) bringing-up section (11);
(d) the porous net is sent to described rotation applicator roll on reverse contact of thermosetting resin, arrive the equipment that solidifies section (14) then; It is characterized in that
At least one infrared heater (13) be installed in behind the described rotation applicator roll and described curings section before.
7. according to the device of claim 6, wherein said firing equipment is installed near described rotation applicator roll.
8. according to the device of claim 6, wherein said liquid form solvent-free thermal thermosetting resin depositing device is that the nozzle that links to each other with dynamic mixer is gone up in operation.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US17508093A | 1993-12-29 | 1993-12-29 | |
| US08/175,080 | 1993-12-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1139398A CN1139398A (en) | 1997-01-01 |
| CN1043971C true CN1043971C (en) | 1999-07-07 |
Family
ID=22638793
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN94194688A Expired - Fee Related CN1043971C (en) | 1993-12-29 | 1994-12-27 | Process and apparatus for resin impregnation of a porous web |
Country Status (8)
| Country | Link |
|---|---|
| EP (1) | EP0737126A1 (en) |
| JP (1) | JPH09507174A (en) |
| KR (1) | KR100362096B1 (en) |
| CN (1) | CN1043971C (en) |
| AU (1) | AU1415395A (en) |
| CA (1) | CA2180131A1 (en) |
| MY (1) | MY118735A (en) |
| WO (1) | WO1995017999A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3336911B2 (en) * | 1996-06-20 | 2002-10-21 | 松下電工株式会社 | Prepreg manufacturing method and apparatus |
| US6245383B1 (en) | 1998-11-25 | 2001-06-12 | Matsushita Electric Works, Ltd. | Method for manufacturing prepreg in which reinforcing substrate is impregnated with thermosetting matrix resin |
| DE10113125A1 (en) | 2001-03-17 | 2002-09-19 | Kermi Gmbh | Radiator with a central valve set |
| KR100466233B1 (en) * | 2001-12-28 | 2005-01-14 | 한국타이어 주식회사 | Apparatus for Control Amount of Rubber Bank |
| FR2882681B1 (en) * | 2005-03-03 | 2009-11-20 | Coriolis Composites | FIBER APPLICATION HEAD AND CORRESPONDING MACHINE |
| JP6588298B2 (en) | 2015-10-14 | 2019-10-09 | 美津濃株式会社 | Tow prepreg manufacturing apparatus and tow prepreg manufacturing method |
| CN110418707B (en) * | 2017-03-13 | 2022-05-03 | 赫克塞尔合成有限公司 | Method and apparatus for impregnating reinforcement material |
| CN111775366B (en) * | 2020-07-10 | 2021-04-27 | 江苏奇一科技有限公司 | Preparation method and equipment of unidirectional continuous fiber reinforced thermoplastic composite material |
| EP3964339B1 (en) | 2020-07-10 | 2024-01-03 | Jiangsu Qiyi Technology Co., Ltd | Method and device for preparing unidirectional continuous fiber reinforced thermoplastic composite material |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2012623A (en) * | 1978-01-17 | 1979-08-01 | Secr Defence | Impregnating filamentary material |
| EP0476752A1 (en) * | 1990-09-17 | 1992-03-25 | Shell Internationale Researchmaatschappij B.V. | Process and apparatus for resin impregnation of a fibrous substrate |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL289083A (en) * |
-
1994
- 1994-12-19 MY MYPI94003402A patent/MY118735A/en unknown
- 1994-12-27 CA CA002180131A patent/CA2180131A1/en not_active Abandoned
- 1994-12-27 KR KR1019960703496A patent/KR100362096B1/en not_active IP Right Cessation
- 1994-12-27 AU AU14153/95A patent/AU1415395A/en not_active Abandoned
- 1994-12-27 JP JP7517783A patent/JPH09507174A/en active Pending
- 1994-12-27 CN CN94194688A patent/CN1043971C/en not_active Expired - Fee Related
- 1994-12-27 WO PCT/EP1994/004326 patent/WO1995017999A1/en not_active Application Discontinuation
- 1994-12-27 EP EP95905601A patent/EP0737126A1/en not_active Withdrawn
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2012623A (en) * | 1978-01-17 | 1979-08-01 | Secr Defence | Impregnating filamentary material |
| EP0476752A1 (en) * | 1990-09-17 | 1992-03-25 | Shell Internationale Researchmaatschappij B.V. | Process and apparatus for resin impregnation of a fibrous substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1139398A (en) | 1997-01-01 |
| AU1415395A (en) | 1995-07-17 |
| MY118735A (en) | 2005-01-31 |
| KR100362096B1 (en) | 2003-02-11 |
| CA2180131A1 (en) | 1995-07-06 |
| EP0737126A1 (en) | 1996-10-16 |
| WO1995017999A1 (en) | 1995-07-06 |
| JPH09507174A (en) | 1997-07-22 |
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