CN104385112A - Grinder - Google Patents
Grinder Download PDFInfo
- Publication number
- CN104385112A CN104385112A CN201410610877.2A CN201410610877A CN104385112A CN 104385112 A CN104385112 A CN 104385112A CN 201410610877 A CN201410610877 A CN 201410610877A CN 104385112 A CN104385112 A CN 104385112A
- Authority
- CN
- China
- Prior art keywords
- fixed underpan
- milling bar
- rotating shaft
- grinder
- briquetting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention discloses a grinder. The grinder comprises a fixed chassis, wherein a rotating shaft is arranged on the fixed chassis, the bottom end of the rotating shaft is in transmission connection with an output of a driving motor, the top end of the rotating shaft is fixedly connected with the bottom face of the fixed chassis, the rotating shaft can drive the fixed chassis to rotate in the forward direction, a grinding pad is arranged on the top face of the fixed chassis, a grinding rod is arranged at one side of the surface of the fixed chassis, a pressing block is arranged at the bottom of the grinding rod, a grinding groove is formed in the pressing block, a silicon wafer is mounted in the grinding groove and is located between the pressing block and the fixed chassis, and a micromotor which is used for driving the grinding rod to do reverse rotation is arranged on the end face of the bottom end of the grinding rod. According to the grinder, through arranging the driving motor and the micromotor which are in opposite rotation, the grinding efficiency is increased.
Description
Technical field
The present invention relates to chemical machinery field, specifically, be related specifically to a kind of grinder.
Background technology
Grinder is the grinding machine ground surface of the work with the lap tool coating or embed abrasive material.Be mainly used in the high precision plane in grinding work-piece, inside and outside circle cylinder, taper seat, sphere, flank and other profiles.The main Types of grinder has disc grinder, rotary shaft grinder and various special grinder.Existing grinder exists that working (machining) efficiency is low, processing cost is high, machining accuracy and the shortcoming such as crudy is unstable, and this seriously constrains development and the popularization of grinder.
Summary of the invention
The object of the invention is to for deficiency of the prior art, provide a kind of grinder, to solve the problem.
Technical problem solved by the invention can realize by the following technical solutions:
Grinder, comprise fixed underpan, described fixed underpan is provided with rotating shaft, the bottom of described rotating shaft and the output of drive motors are in transmission connection, the top of rotating shaft is fixedly connected with the bottom surface of fixed underpan, and fixed underpan can be with to rotate forward, the end face of fixed underpan is provided with grinding pad, milling bar is provided with in the side on the surface of fixed underpan, the bottom of described milling bar is provided with briquetting, briquetting is provided with grinding groove, in described grinding groove, silicon wafer is installed, silicon wafer is between briquetting and fixed underpan, the end face of described milling bar bottom is provided with the micro machine reversely rotated for driving milling bar to do.
Preferably, described briquetting is installed on milling bar by the through hole that intermediate position is offered, and is provided with elastic washer on the inner walls of the via, and described briquetting is moved by the friction of elastic washer and milling bar and fixed on milling bar.
Preferably, the top of described fixing rotating disk is provided with mozzle, and this mozzle is used for end face lapping liquid being delivered to fixing rotating disk.
Compared with prior art, beneficial effect of the present invention is as follows:
Structure is simple, designing ingenious, by arranging counter-rotational drive motors and micro machine, improve grinding efficiency.
Accompanying drawing explanation
Fig. 1 is the structural representation of grinder of the present invention.
Number in the figure illustrates: fixed underpan 1, rotating shaft 2, grinding pad 3, milling bar 4, briquetting 5, silicon wafer 6, mozzle 7.
Detailed description of the invention
The technological means realized for making the present invention, creation characteristic, reaching object and effect is easy to understand, below in conjunction with detailed description of the invention, setting forth the present invention further.
See Fig. 1, grinder of the present invention, comprise fixed underpan 1, described fixed underpan 1 is provided with rotating shaft 2, the described bottom of rotating shaft 2 and the output of drive motors are in transmission connection, the top of rotating shaft 2 is fixedly connected with the bottom surface of fixed underpan 1, and fixed underpan 1 can be with to rotate forward, the end face of fixed underpan 1 is provided with grinding pad 3, milling bar 4 is provided with in the side on the surface of fixed underpan 1, the bottom of described milling bar 4 is provided with briquetting 5, briquetting 5 is provided with grinding groove, silicon wafer 6 is installed in described grinding groove, silicon wafer 6 is between briquetting 5 and fixed underpan 1, the end face of described milling bar 4 bottom is provided with for driving milling bar 4 to make the micro machine reversely rotated.
It is to be noted, described briquetting 5 is installed on milling bar 4 by the through hole that intermediate position is offered, be provided with elastic washer on the inner walls of the via, described briquetting 5 is moved by the friction of elastic washer and milling bar 4 and is fixed on milling bar 4, by adopting this kind of structural design, achieve fixing silicon wafer 6.
In addition, the top of described fixing rotating disk is provided with mozzle 7, and this mozzle 7 is for being delivered to the end face of fixing rotating disk by lapping liquid.
More than show and describe general principle of the present invention and principal character and advantage of the present invention.The technical staff of the industry should understand; the present invention is not restricted to the described embodiments; what describe in above-described embodiment and description just illustrates principle of the present invention; without departing from the spirit and scope of the present invention; the present invention also has various changes and modifications, and these changes and improvements all fall in the claimed scope of the invention.Application claims protection domain is defined by appending claims and equivalent thereof.
Claims (3)
1. a grinder, it is characterized in that: comprise fixed underpan, described fixed underpan is provided with rotating shaft, the bottom of described rotating shaft and the output of drive motors are in transmission connection, the top of rotating shaft is fixedly connected with the bottom surface of fixed underpan, and fixed underpan can be with to rotate forward, the end face of fixed underpan is provided with grinding pad, milling bar is provided with in the side on the surface of fixed underpan, the bottom of described milling bar is provided with briquetting, briquetting is provided with grinding groove, in described grinding groove, silicon wafer is installed, silicon wafer is between briquetting and fixed underpan, the end face of described milling bar bottom is provided with the micro machine reversely rotated for driving milling bar to do.
2. grinder according to claim 1, it is characterized in that: described briquetting is installed on milling bar by the through hole that intermediate position is offered, be provided with elastic washer on the inner walls of the via, described briquetting is moved by the friction of elastic washer and milling bar and is fixed on milling bar.
3. grinder according to claim 1, is characterized in that: the top of described fixing rotating disk is provided with mozzle, and this mozzle is used for end face lapping liquid being delivered to fixing rotating disk.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410610877.2A CN104385112A (en) | 2014-11-04 | 2014-11-04 | Grinder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410610877.2A CN104385112A (en) | 2014-11-04 | 2014-11-04 | Grinder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104385112A true CN104385112A (en) | 2015-03-04 |
Family
ID=52603119
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410610877.2A Pending CN104385112A (en) | 2014-11-04 | 2014-11-04 | Grinder |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104385112A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105397596A (en) * | 2015-10-21 | 2016-03-16 | 无锡清杨机械制造有限公司 | Mechanical grinding equipment |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0859399A2 (en) * | 1997-02-13 | 1998-08-19 | Integrated Process Equipment Corp. | Semiconductor wafer polishing apparatus with a flexible carrier plate |
| GB2345013A (en) * | 1998-06-19 | 2000-06-28 | Nec Corp | Substrate polishing |
| US20050181708A1 (en) * | 2004-02-17 | 2005-08-18 | Infineon Technologies Richmond, Lp. | Removal of embedded particles during chemical mechanical polishing |
| CN204321820U (en) * | 2014-11-04 | 2015-05-13 | 无锡市华明化工有限公司 | A kind of grinder |
-
2014
- 2014-11-04 CN CN201410610877.2A patent/CN104385112A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0859399A2 (en) * | 1997-02-13 | 1998-08-19 | Integrated Process Equipment Corp. | Semiconductor wafer polishing apparatus with a flexible carrier plate |
| GB2345013A (en) * | 1998-06-19 | 2000-06-28 | Nec Corp | Substrate polishing |
| US20050181708A1 (en) * | 2004-02-17 | 2005-08-18 | Infineon Technologies Richmond, Lp. | Removal of embedded particles during chemical mechanical polishing |
| CN204321820U (en) * | 2014-11-04 | 2015-05-13 | 无锡市华明化工有限公司 | A kind of grinder |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105397596A (en) * | 2015-10-21 | 2016-03-16 | 无锡清杨机械制造有限公司 | Mechanical grinding equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150304 |