CN104372314A - Condenser brass tube chemical nickel plating method - Google Patents
Condenser brass tube chemical nickel plating method Download PDFInfo
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- CN104372314A CN104372314A CN201310349594.2A CN201310349594A CN104372314A CN 104372314 A CN104372314 A CN 104372314A CN 201310349594 A CN201310349594 A CN 201310349594A CN 104372314 A CN104372314 A CN 104372314A
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- copper tube
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
- C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/18—Electroplating using modulated, pulsed or reversing current
Abstract
The invention relates to a condenser brass tube chemical nickel plating method. The method comprises the following steps: washing a condenser brass tube to remove the grease; washing the degreased condenser brass tube by acid; making a chemical nickel plating solution be in a work state, then placing the acid-washed condenser brass tube into the chemical nickel plating solution, connecting the solution to a pulse direct current (DC) power supply immediately, maintaining for 1 to 3 minutes to carry out chemical nickel electroplating by taking the condenser brass tube as the negative electrode and the stainless steel as the positive electrode; cutting off the pulse DC power supply after bubbles are uniformly released from the surface of the condenser brass tube, removing the stainless steel (positive electrode); maintaining the pH value, temperature, nickel ion concentration, and reductant concentration and temperature of the chemical nickel plating solution so as to carry on precipitating nickel on the surface of the condenser brass tube so as to obtain a condenser brass tube with a nickel layer; washing the brass tube by water, and drying. The provided method can form a dense nickel layer on the surface of a condenser brass tube so as to greatly improve the corrosion resistant performance of the brass tube.
Description
Technical field
The present invention relates to a kind of copper tube in coalescer chemical nickel plating method, belong to metallic substance electroless plating techniques field.
Background technology
The burn into leakage problem of condenser copper tube, the anticorrosion difficult problem that each power plant faces for a long time always, each state is all in the design of condenser in recent years, tubing select the manufacturing process with pipe, water quality regulation and control in operation, and prevent the aspects such as the measure of corrosion from having made large quantifier elimination, make significant headway, but the damage that current condenser is in operation is still quite serious, and does not thoroughly solve all the time.Finding one that condenser tube materials and cooling water quality can be made to adapt, the simple again and terms of settlement of economy, is that each power plant needs badly.
Selecting properly condenser tube materials prevents burn into from revealing, and ensures the prefered method of condenser safe and reliable operation, but condenser institute uses the solidity to corrosion of tubing and economy to be all worth discussing at present.Conventional condenser tube materials can divide following four classes: brass, cupronickel, stainless steel and titanium, and these four kinds of tubing in use have certain limitation.In all tubing of condenser, although brazed copper tube price inexpensively, its damage frequency is maximum, and common etch state has erosion, spot corrosion and stress corrosion crack.In fresh water and seawater, the overall performance of cupronickel is more better than brass, but also occurs that some damage, mainly spot corrosion and erosion in seawater application.Spot corrosion and the erosion of vapour side blow are the primary damage types that Against Condenser Stainless Steel Tube occurs.Although the most of etching problems run in plant condenser environment, titanium material all can not occur, and in the condenser of copper alloy tube plate and titanium pipe, tube sheet can run into galvanic corrosion, and galvanic protection can slow down galvanic corrosion, but overprotection may cause titanium pipe pipe end to inhale hydrogen.Although rear three kinds of tubing solidity to corrosions are run well than brass, the price of its costliness constrains promoting the use of of these tubing.In view of the limitation of above-mentioned various tubing, the damage that current condenser tube is in operation is still quite serious, and does not thoroughly solve all the time.The advantage that chemical nickel plating is unique, makes us be hopeful to obtain not only safety but also economic condenser tube materials.
But copper and copper alloy is as non-catalytic metal, because electropotential is just, directly can not carry out chemical nickel plating, belong to chemical nickel plating Difficult to plate substrates, need trigger or just can carry out chemical nickel plating after catalytic treatment.And traditional treatment process not only cost is high, complex process, not easy care, and activation solution also has impact to chemical plating fluid, although and nickel preplating activation method can prevent metal ion pollution chemical plating fluid, for complex-shaped workpiece be difficult to obtain pre-nickel plating, and pre-treating technology is still more complicated, so that the production time is long, and efficiency is low, and cost is higher.
Summary of the invention
For solving the problems of the technologies described above, the object of the present invention is to provide a kind of chemical nickel plating method being applicable to copper tube in coalescer, adopt the method can form the nickel layer of even compact on the surface of brazed copper tube, this nickel layer has good Corrosion Protection, further, the method has the advantages that technique is simple, cost is low.
For achieving the above object, the invention provides a kind of copper tube in coalescer chemical nickel plating method, it comprises the following steps:
Cleaning by degreasing: cleaning by degreasing is carried out to copper tube in coalescer;
Pickling: pickling is carried out to the copper tube in coalescer through cleaning by degreasing;
Chemical nickel plating under pulse direct current intervention: make chemical nickel-plating solution in running order, copper tube in coalescer through overpickling is put into chemical nickel-plating solution, demand working pulse dc power also keeps 1-3 minute, take copper tube in coalescer as negative electrode, stainless steel carries out chemical nickel plating for anode; Turn-off pulse direct supply after observation copper tube in coalescer surface has uniform bubble to discharge, removes the stainless steel as anode;
Chemical nickel plating: maintain the pH value of chemical nickel-plating solution, temperature, nickel ion and reductant concentration and stablize, makes chemical Ni-plating layer continue at copper tube in coalescer surface deposition, obtains the copper tube in coalescer with nickel layer;
Aftertreatment: wash the copper tube in coalescer with nickel layer, dries, completes the chemical nickel plating process for copper tube in coalescer.
In above-mentioned chemical nickel plating method, after removing the stainless steel as anode, in electroless nickel step, after nickel layer reaches pre-determined thickness, stop chemical nickel plating.
In above-mentioned chemical nickel plating method, cleaning by degreasing can be carried out by electroless plating oil removing cleaning way conveniently, preferably, cleaning by degreasing adopts cleaning alkali lye to carry out reaching better cleaning performance, and this cleaning alkali lye has following composition, to clean the volumeter with alkali lye: sodium hydroxide 15-20g/L, sodium carbonate 15-30g/L, sodium phosphate 15-30g/L, Sodium dodecylbenzene sulfonate 2g/L, surplus is water.In cleaning by degreasing process, its temperature may be controlled to 20-60 DEG C, and the time may be controlled to 1 minute.
In above-mentioned chemical nickel plating method, preferably, pickling employing concentration is that the hydrochloric acid of 10wt% carries out, and at room temperature cleans 1-2 minute.
In above-mentioned chemical nickel plating method, the process of nickel plating can adopt conventional chemical nickel plating equipment to carry out, and the detection of chemical nickel-plating solution composition and supplementary adjustment can be controlled by corresponding equipment, stablizes to make nickel ion and reductant concentration, to this, can carry out in a conventional manner.
In above-mentioned chemical nickel plating method, preferably, the chemical nickel-plating solution adopted has following composition, volumeter with this chemical nickel-plating solution: soluble nickel salt 20-30g/L, complexing agent 15-20g/L, hypophosphite reductive agent 20-30g/L, stablizer 2-5mg/L, pH value buffer reagent and pH value regulator, surplus are the pH value 4.4-4.8 of water, this chemical nickel-plating solution.The consumption of pH value buffer reagent and pH value regulator is as the criterion to make the pH value of this chemical nickel-plating solution reach 4.4-4.8.In above-mentioned chemical nickel-plating solution, the soluble nickel salt adopted can be single nickel salt; The complexing agent adopted is citric acid, and the hypophosphite reductive agent adopted can be inferior sodium phosphate; The pH value buffer reagent adopted can be sodium-acetate, and pH value regulator can be the NaOH aqueous solution of concentration 5wt%; The stablizer adopted can be the KI aqueous solution of concentration 0.001g/L.
In above-mentioned chemical nickel plating method, preferably, in the nickel process in the nickel process under pulse direct current intervention and after removing stainless steel anode, the temperature of chemical nickel plating controls as 84-90 DEG C.
In above-mentioned chemical nickel plating method, preferably, in the nickel process under pulse direct current is intervened, the voltage of pulse dc power is 1.5-5V, and pulse-repetition is 500-1000Hz, and the dutycycle of pulse power connecting and disconnecting is 20:80.
In above-mentioned chemical nickel plating method, preferably, in last handling process, the temperature of oven dry is 60-70 DEG C, and the time is 30-60 minute.
The chemical nickel plating method of copper tube in coalescer provided by the present invention can carry out according to following concrete steps:
(1) cleaning by degreasing: adopt cleaning alkali lye to carry out cleaning by degreasing to copper tube in coalescer, cleaning temperature is 20-60 DEG C, time is 1 minute, this cleaning alkali lye has following composition (to clean the volumeter with alkali lye): sodium hydroxide 15-20g/L, sodium carbonate 15-30g/L, sodium phosphate 15-30g/L, Sodium dodecylbenzene sulfonate 2g/L, surplus is water.
(2) pickling: at room temperature, the hydrochloric acid utilizing concentration to be 10wt% carries out the pickling of 1-2 minute to the copper tube in coalescer through cleaning by degreasing.
(3) chemical nickel plating under pulse direct current intervention: first make chemical nickel-plating solution in running order, pH value is 4.4-4.8, temperature is 84-90 DEG C, when copper pipe being put into chemical nickel-plating solution, demand working pulse dc power carries out the process of 1-3 minute, copper pipe is as negative electrode, and stainless steel is as anode, and the voltage of the pulse power is 1.5-5V, pulse-repetition is 500-1000Hz, and the dutycycle of pulse power connecting and disconnecting is 20:80; Observing copper pipe surface has uniform bubble to discharge rear turn-off pulse direct supply, removes stainless steel anode; The composition of above-mentioned chemical nickel-plating solution comprises (volumeter with this chemical nickel-plating solution): soluble nickel salt (single nickel salt) 20-30g/L, complexing agent (citric acid) 15-20g/L, hypophosphite reductive agent 20-30g/L, stablizer (concentration is the KI aqueous solution of 0.001g/L) 2-5mg/L, pH value buffer reagent (sodium-acetate) pH value buffer reagent (concentration is the NaOH solution of 5wt%), surplus is water, and pH value buffer reagent pH value buffer reagent is used for the pH value of solution to be adjusted to 4.4-4.8.By adopting this processing mode that coating and brazed copper tube matrix can be made to combine closely, and make matrix surface form fine and close nickel layer, thus there is good Corrosion Protection.
(4) chemical nickel plating: maintain the pH value of chemical nickel-plating solution, temperature, nickel ion and reductant concentration and stablize, chemical Ni-plating layer is continued at brazed copper tube surface deposition, just can form densification, even, good with basal body binding force protective coating in copper pipe surface, stop chemical nickel plating when the thickness of nickel layer reaches pre-determined thickness.
(5) aftertreatment: wash the copper tube in coalescer with nickel layer, dry, bake out temperature is 60-70 DEG C, and the time is 30-60 minute, completes the chemical nickel plating process for copper tube in coalescer.
Present invention also offers a kind of copper tube in coalescer, its surface has the nickel layer be made up of aforesaid method.Preferably, this nickel layer is made up of nickel and phosphorus, and the mass ratio of the two is 98:2.
Chemical nickel plating method provided by the present invention can form fine and close nickel layer on the surface of copper tube in coalescer, can improve the erosion resistance of brazed copper tube well, and chemical nickel plating method operation provided by the present invention is fairly simple, and cost is also lower.
Accompanying drawing explanation
Fig. 1 is HSn70-1A brazed copper tube and the corrosion potential time history plot of HSn70-1A brazed copper tube in recirculated water with nickel layer.
Fig. 2 is HSn70-1A brazed copper tube and HSn70-1A brazed copper tube even Galvanic Current graphic representation connect in recirculated water with nickel layer.
Fig. 3 is HSn70-1A brazed copper tube, 316L stainless steel tube and have the anodic polarization curves figure of HSn70-1A brazed copper tube in recirculated water of nickel layer.
Fig. 4 to Fig. 6 is respectively the Nyquist figure that HSn70-1A brazed copper tube, 316L stainless steel tube and the HSn70-1A brazed copper tube with nickel layer record in water-cycling-media.
Fig. 7 a and Fig. 7 b is respectively HSn70-1A brazed copper tube and soaks front in the seawater and soak the SEM surface topography map after 7 days in the seawater.
Fig. 8 a and Fig. 8 b is respectively the HSn70-1A brazed copper tube with nickel layer and soaks front in the seawater and soak the SEM surface topography map after 7 days in the seawater.
Embodiment
In order to there be understanding clearly to technical characteristic of the present invention, object and beneficial effect, referring now to Figure of description, following detailed description is carried out to technical scheme of the present invention, but can not be interpreted as to of the present invention can the restriction of practical range.
Embodiment 1
Present embodiments provide a kind of chemical nickel plating method of copper tube in coalescer, it carries out chemical nickel plating on the surface of HSn70-1A brazed copper tube, specifically carries out according to following steps:
(1) cleaning by degreasing: adopt cleaning alkali lye to carry out cleaning by degreasing to HSn70-1A brazed copper tube, cleaning temperature is 20-60 DEG C, time is 1 minute, this cleaning alkali lye has following composition (to clean the volumeter with alkali lye): sodium hydroxide 18g/L, sodium carbonate 25g/L, sodium phosphate 25g/L, Sodium dodecylbenzene sulfonate 2g/L, surplus is water.
(2) pickling: at room temperature, the hydrochloric acid utilizing concentration to be 10wt% carries out the pickling of 1-2 minute to the HSn70-1A brazed copper tube through cleaning by degreasing.
(3) chemical nickel plating under pulse direct current intervention: first make chemical nickel-plating solution in running order, pH value is 4.4-4.8, temperature is 84-90 DEG C, when copper pipe being put into chemical nickel-plating solution, demand working pulse dc power carries out the process of 3 minutes, HSn70-1A brazed copper tube is as negative electrode, and stainless steel is as anode, and the voltage of the pulse power is 4V, pulse-repetition is 1000Hz, and the dutycycle of pulse power connecting and disconnecting is 20:80; Observing copper pipe surface has uniform bubble to discharge rear turn-off pulse direct supply, removes stainless steel anode; The composition of above-mentioned chemical nickel-plating solution comprises (volumeter with this chemical nickel-plating solution): the amount that single nickel salt 30g/L, citric acid 20g/L, inferior sodium phosphate 30g/L, concentration are the KI aqueous solution 5mg/L of 0.001g/L, sodium-acetate and concentration are the NaOH solution of 5wt% is as the criterion so that the pH value of solution is adjusted to 4.4-4.8, and surplus is water.
(4) chemical nickel plating: maintain the pH value of chemical nickel-plating solution, temperature, nickel ion and reductant concentration and stablize, chemical Ni-plating layer is continued at brazed copper tube surface deposition, just can form densification, even, good with basal body binding force protective coating in copper pipe surface.
(5) aftertreatment: wash the HSn70-1A brazed copper tube with nickel layer, dry, bake out temperature is 60-70 DEG C, and the time is 30-60 minute, completes the chemical nickel plating process for HSn70-1A brazed copper tube.
Draw by detecting, the thickness of the nickel layer formed on HSn70-1A brazed copper tube surface is 24 μm, and in this nickel layer, the mass ratio of nickel and phosphorus is 98:2.
Electrochemical measuring method is adopted to test the galvanic corrosion of HSn70-1A brazed copper tube in water-cycling-media with nickel layer of HSn70-1A brazed copper tube, 316L stainless steel tube and embodiment 1, dynamic potential scanning, linear polarization and alternating-current impedance, the solidity to corrosion of pipe in water-cycling-media of comprehensive evaluation and more above-mentioned different materials.
In order to evaluate the erosion resistance of nickel-plated brass pipe further, HSn70-1A brazed copper tube, 316L stainless steel tube and the HSn70-1A brazed copper tube polarization resistance in the seawater with nickel layer are tested, and adopt SEM to observe HSn70-1A brazed copper tube and there is the HSn70-1A brazed copper tube erosion profile in the seawater of nickel layer, test Seawater used and be taken from Qinhuangdao power plant cooled with seawater water.
1, test medium
(1) recirculated cooling water takes from the recirculated water of lower Xiahuayuan Power, and its composition is in table 1.
Table 1
| Ion | Content |
| K ++Na + | 6.53mmol/L |
| Ca 2++Mg 2+ | 14.98mmol/L |
| SO 4 2- | 7.47mmol/L |
| Cl - | 3.33mmol/L |
| CO 3 2-+HCO 3 - | 9.55mmol/L |
| NO 3 - | 0.81mmol/L |
| PO 4 3- | 0.063mmol/L |
| pH | 8.68 |
(2) test Seawater used and be taken from Qinhuangdao power plant cooled with seawater water.
2, material is tested
Experiment material is respectively HSn70-1A brazed copper tube, 316L stainless steel tube and has the HSn70-1A brazed copper tube of nickel layer, and thickness of coating is 24 μm.
3, electro-chemical test carries out in three-electrode system, cuts down one section of HSn70-1A brazed copper tube, 316L stainless steel tube respectively and has the HSn70-1A brazed copper tube of nickel layer, after epoxy encapsulation, leave inside pipe wall area and be about 1cm
2sample be working electrode, saturated calomel electrode and Graphite Electrodes are respectively reference electrode and supporting electrode.Testing tool comprises M273 potentiostat, M5210 lock-in amplifier, Powersine ac impedance measurement software and Zsimpwin Analysis of Equivalent Circuit software.Ac impedance measurement carries out under open circuit potential (Ecorr), and test frequency is 100kHz-0.01Hz.The potential range of linear polarization test is ± 10mv, and scanning speed is 1mv/s.The take-off potential of dynamic potential scanning is corrosion potential, and scanning speed is 1mv/s.
4, test result
(1) in circulating cooling water medium
Fig. 1 is HSn70-1A brazed copper tube and the corrosion potential time history plot of HSn70-1A brazed copper tube in recirculated water with nickel layer.As can be seen from Figure 1; the corrosion potential with the HSn70-1A brazed copper tube of nickel layer about exceeds 180mv than the current potential of HSn70-1A brazed copper tube; when this illustrates that the HSn70-1A brazed copper tube overlay coating with nickel layer is imperfect; the brazed copper tube matrix at its surface imperfection position and nickel layer can form galvanic corrosion galvanic cell; the brazed copper tube body material of current potential calibration is negative electrode; the nickel layer that current potential is comparatively born is anode; even if therefore the coating on brazed copper tube surface is imperfect; also can not cause the local corrosion of body material, the position without coating obtains galvanic protection.And owing to defining the galvanic cell of little negative electrode, large anode, this corrosion galvanic cell can't cause the obvious destruction of the coating as anode.Fig. 2 is HSn70-1A brazed copper tube and HSn70-1A brazed copper tube even Galvanic Current graphic representation connect in recirculated water with nickel layer, galvanizing corrosion test electrode is that homalographic compares 1:1, test-results also shows that nickel plated copper pipe is anode, and the anodic current that it flows through is about 260 μ A.
Fig. 3 is HSn70-1A brazed copper tube, 316L stainless steel tube and have the anodic polarization curves figure of HSn70-1A brazed copper tube in recirculated water of nickel layer, as can be seen from Figure 3,316L stainless steel tube is much wider than the passivation region of HSn70-1A brazed copper tube with the passivation region of the HSn70-1A brazed copper tube with nickel layer, and it is much smaller to tie up blunt electric current.
Fig. 4 to Fig. 6 is respectively the Nyquist figure that HSn70-1A brazed copper tube, 316L stainless steel tube and the HSn70-1A brazed copper tube with nickel layer record in water-cycling-media, list the result adopting Zsimpwin software each impedance spectrum to be fitted to analysis in table 2, in table 2, also list the polarization resistance value that linear polarization method records.As can be seen from two kinds of Electrochemical results given in table 2, in water-cycling-media, the solidity to corrosion with the HSn70-1A brazed copper tube of nickel layer is better than its body material brazed copper tube itself far away, and its solidity to corrosion is close to stainless solidity to corrosion.
(2) in Seawater
The polarization resistance value recorded after the HSn70-1A brazed copper tube listing HSn70-1A brazed copper tube, 316L stainless steel in table 3 and have a nickel layer soaks 7 days in the seawater, the Rp value of HSn70-1A brazed copper tube is only 3.2K Ω, and there is the Rp value of the HSn70-1A brazed copper tube of nickel layer for 353K Ω, this illustrates that the solidity to corrosion in Seawater with the HSn70-1A brazed copper tube of nickel layer is better than HSn70-1A brazed copper tube far away.Fig. 7 a and Fig. 7 b be respectively HSn70-1A brazed copper tube soak in the seawater before and soak the SEM surface topography map after 7 days in the seawater, Fig. 8 a and Fig. 8 b be respectively the HSn70-1A brazed copper tube with nickel layer soak in the seawater before and soak the SEM surface topography map after 7 days in the seawater.As can be seen from above-mentioned figure, soak after 7 days in the seawater, HSn70-1A brazed copper tube there occurs very serious corrosion, and the nickel layer with the HSn70-1A brazed copper tube of nickel layer almost stands intact.
Table 2 reacts and transmits resistance and Linear Polarization Resistance value (K Ω)
| 316L stainless steel | HSn70-1A | Nickel plating inside pipe wall | |
| Rp | 957.5 | 156.7 | 1092 |
| Rt | 2301 | 95.06 | 853.5 |
Table 3 three kinds of inside pipe wall Linear Polarization Resistance values (K Ω)
| HSn70-1A | Nickel plating inside pipe wall | 316L | |
| Rp | 3.2 | 353 | 580 |
As can be seen from above-mentioned test and contrast:
(1) nickel layer containing nickel phosphorus that chemical nickel plating obtains has excellent solidity to corrosion, and the corrosion resistance nature with the copper tube in coalescer of nickel layer is good.
(2) in given water-cycling-media; relative to brazed copper tube base material; chemical nickel plating is anodic coating; it is anode in corrosion galvanic cell; and base material is negative electrode is protected; therefore the brazed copper tube with nickel layer provided by the invention in use, even if coating is imperfect, also can not cause the local corrosion of body material.
(3) at given water-cycling-media, the solidity to corrosion with the brazed copper tube of nickel layer is better than the solidity to corrosion of brazed copper tube far away, and its solidity to corrosion is close to stainless solidity to corrosion.
(4) solidity to corrosion in Seawater with the brazed copper tube of nickel layer is better than HSn70-1A brazed copper tube far away.
Claims (10)
1. a copper tube in coalescer chemical nickel plating method, it comprises the following steps:
Cleaning by degreasing is carried out to copper tube in coalescer;
Pickling is carried out to the copper tube in coalescer through cleaning by degreasing;
Make chemical nickel-plating solution in running order, the copper tube in coalescer through overpickling is put into chemical nickel-plating solution, demand working pulse dc power also keeps 1-3 minute, with described copper tube in coalescer be negative electrode, stainless steel carries out chemical nickel plating for anode; When observe copper tube in coalescer surface have uniform bubble discharge after turn-off pulse direct supply, remove the stainless steel as anode;
Maintain the pH value of chemical nickel-plating solution, temperature, nickel ion and reductant concentration to stablize, chemical Ni-plating layer is continued at copper tube in coalescer surface deposition, obtains the copper tube in coalescer with nickel layer;
The copper tube in coalescer with nickel layer is washed, dried.
2. copper tube in coalescer chemical nickel plating method according to claim 1, wherein, described cleaning by degreasing adopts the cleaning alkali lye with following composition to carry out, volumeter with described cleaning alkali lye: sodium hydroxide 15-20g/L, sodium carbonate 15-30g/L, sodium phosphate 15-30g/L, Sodium dodecylbenzene sulfonate 2g/L, surplus is water;
The temperature of described cleaning by degreasing is 20-60 DEG C, and the time is 1 minute.
3. copper tube in coalescer chemical nickel plating method according to claim 1, wherein, described pickling employing concentration is that the hydrochloric acid of 10wt% carries out, and at room temperature cleans 1-2 minute.
4. copper tube in coalescer chemical nickel plating method according to claim 1, wherein, described chemical nickel-plating solution has following composition, the volumeter with described chemical nickel-plating solution:
Soluble nickel salt 20-30g/L, complexing agent 15-20g/L, hypophosphite reductive agent 20-30g/L, stablizer 2-5mg/L, pH value buffer reagent and pH value regulator, surplus are the pH value 4.4-4.8 of water, described chemical nickel-plating solution.
5. copper tube in coalescer chemical nickel plating method according to claim 4, wherein, described soluble nickel salt is single nickel salt;
Described complexing agent is citric acid;
Described hypophosphite reductive agent is inferior sodium phosphate;
Described pH value buffer reagent is sodium-acetate, and described pH value regulator is the NaOH aqueous solution of concentration 5wt%;
Described stablizer is the KI aqueous solution of concentration 0.001g/L.
6. copper tube in coalescer chemical nickel plating method according to claim 1 or 5, wherein, in described nickel process, the temperature of chemical nickel plating controls as 84-90 DEG C.
7. copper tube in coalescer chemical nickel plating method according to claim 1, wherein, the voltage of described pulse dc power is 1.5-5V, and pulse-repetition is 500-1000Hz, and the dutycycle of pulse power connecting and disconnecting is 20:80.
8. copper tube in coalescer chemical nickel plating method according to claim 1, wherein, the temperature of described oven dry is 60-70 DEG C, and the time is 30-60 minute.
9. a copper tube in coalescer, its surface has the nickel layer be made up of the copper tube in coalescer chemical nickel plating method described in any one of claim 1-8.
10. copper tube in coalescer according to claim 9, wherein, described nickel layer is made up of nickel and phosphorus, and the mass ratio of the two is 98:2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310349594.2A CN104372314A (en) | 2013-08-12 | 2013-08-12 | Condenser brass tube chemical nickel plating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310349594.2A CN104372314A (en) | 2013-08-12 | 2013-08-12 | Condenser brass tube chemical nickel plating method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104372314A true CN104372314A (en) | 2015-02-25 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112813469A (en) * | 2020-12-30 | 2021-05-18 | 遵义智通金属表面技术处理有限公司 | Nanocrystalline deposition method for copper alloy and steel matrix |
| CN112981380A (en) * | 2021-02-04 | 2021-06-18 | 佛山市赫丹莱环保科技有限公司 | Chemical corrosion prevention process for copper pipe |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112813469A (en) * | 2020-12-30 | 2021-05-18 | 遵义智通金属表面技术处理有限公司 | Nanocrystalline deposition method for copper alloy and steel matrix |
| CN112981380A (en) * | 2021-02-04 | 2021-06-18 | 佛山市赫丹莱环保科技有限公司 | Chemical corrosion prevention process for copper pipe |
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