CN104364904B - For launching the Light emitting diode component and method of desired beam pattern - Google Patents

For launching the Light emitting diode component and method of desired beam pattern Download PDF

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Publication number
CN104364904B
CN104364904B CN201280073778.4A CN201280073778A CN104364904B CN 104364904 B CN104364904 B CN 104364904B CN 201280073778 A CN201280073778 A CN 201280073778A CN 104364904 B CN104364904 B CN 104364904B
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Prior art keywords
optical element
lens
led chip
base station
array
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CN201280073778.4A
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CN104364904A (en
Inventor
关有长
克雷格·威廉·哈汀
朱文岳
莫泰蔺
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Kerui Led Co
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Cree Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/233—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating a spot light distribution, e.g. for substitution of reflector lamps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/0083—Array of reflectors for a cluster of light sources, e.g. arrangement of multiple light sources in one plane
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape

Abstract

Disclose photophore part and correlation technique with improved light extraction.In one embodiment, photophore part (10) may include base station (14), at least one light-emitting diode chip for backlight unit (12) being arranged on base station (14) and the lens (16) being arranged in a part for light-emitting diode chip for backlight unit (12).Lens (16) may include optical element (22).Optical element (22) can be configured as influenceing the light output from least one light-emitting diode chip for backlight unit (12).

Description

For launching the Light emitting diode component and method of desired beam pattern
Technical field
Content disclosed herein relates generally to light emitting diode (LED) part and method.It is more specifically, disclosed herein Content be related to LED element and the method for improved light extraction.
Background technology
Light emitting diode (LED) or LED chip are to convert electric energy to the solid-state devices of light.LED chip can be utilized In photophore part with it is various illumination application in different light color and light pattern are provided.For example, photophore part can quilt For in various LED bulbs and lamp applications, and develop into white heat, fluorescence and metal halide high intensity and put The alternative of electric (HID) illumination application.
The Conventional luminescent device part used in bulb and lamp applications is positioned on substrate in the form of an array with reference to (i) Discrete LED encapsulation piece (for example, LED chip of encapsulation), or (ii) are located on substrate and are sealed in close under single lens The LED chip array of encapsulation.The problem of relevant with first method, is included with encapsulating LED core with independent before being assembled on substrate Piece relevant increased time and cost.Using compact package LED chip array second method easily by light extraction problem Influence because adjacent LED chip and/or the bonding wire relevant with adjacent LED chip can stop light.In addition, using single It is difficult that individual lens extract correct or desired beam pattern from the LED chip array of compact package.With legacy device Another relevant shortcoming is that while that non-circular or square shape array is preferred in many applications and manufacturing process Or it is desired, but it for bulb application is not optimal that non-circular or square shape LED chip array, which produces, The non-circular or square beam pattern changed.Therefore, reduce relevant with discrete LED encapsulation piece the step of being time-consuming and expensive And improve the light extraction of photophore part and the beam pattern of photophore part for maintaining or pre- more than given part Current cost and expection and desired optical property become even more important.
Although the availability of various photophore parts in the market, however it remains to improved efficiency and light extraction Part and method demand.It is same that there are still obtain simplified beam pattern shaping and obtained from LED chip desired The part of beam pattern and the demand of method.
The content of the invention
According to present disclosure, it is provided herein and describe for the photophore part that produces desired beam pattern and Method.Improved light extraction can be presented in element described herein and method, and is applied to various applications, it may for example comprise all Such as bulb and light fixture product and/or personal, industrial and business the illumination application of application.Therefore, the purpose of the disclosure Be to provide on the one hand by the optical cover (optical dome) that individually positions from single LED chip extract light simultaneously from by with It is set to and the beam pattern of intended shape is produced in the LED chip array different from desired beam pattern so as to improve light extraction Photophore part and method.
These and other purposes of the disclosure can be will become apparent from by disclosure herein at least fully Or realized partially by content disclosed herein.
Brief description of the drawings
In the remainder of this specification, more specifically illustrated including for people in the art with reference to refer to the attached drawing It is the comprehensive and disclosure that can be realized of this subject content of optimal mode for member, wherein：
Fig. 1 is the top view of the embodiment of photophore part in light of the disclosure herein；
Fig. 2A and Fig. 2 B are the top perspectives of emitter element in light of the disclosure herein；
Fig. 3 is the side view of emitter element in light of the disclosure herein；
Fig. 4 A to Fig. 4 H are the schematic diagrames of photophore part in light of the disclosure herein；
Fig. 5 A and Fig. 5 B are the sectional views of the part of photophore part in light of the disclosure herein；
Fig. 6 A to Fig. 6 C are the side views of the LED chip in photophore part in light of the disclosure herein；
Fig. 7 is the schematic diagram of photophore part in light of the disclosure herein；And
Fig. 8 A and Fig. 8 B are the perspective views for the illuminating product that can be combined with photophore part in light of the disclosure herein.
Embodiment
Content disclosed herein is related to (including can for example have LED core with launching light for improved light extraction The beam pattern of the different shape of the shape or structure of chip arrays) light emitting diode (LED) part and method.Optical cover and One or more optical elements can be used for from LED chip array of different shapes or arrangement the beam pattern for creating intended shape Case.The possible aspect or embodiment of content herein, the one or more of the disclosure will be hereinafter referred in detail Example is shown in figure.It is to illustrate subject content not as limitation to provide each example.In fact, as an implementation The feature that a part for mode shows or described can be used for another embodiment to produce further embodiment.Purport These modifications and variations are covered in disclosed and imagination content.
As shown in each of FIG., for illustrative purposes, structure or partial some sizes are tied relative to other Structure or part are exaggerated and are therefore provided to show the general structure of the present invention.In addition, with reference to formation in other structures, part On structure or part come describe the present invention various aspects.As the skilled person will appreciate, to forming " " Another structure or part " on " or the reference of structure of " top " consider that other structure, part or both can be mediate.It is right Formed " " another structure or part " on " it is herein without intermediate structure or partial structure or partial reference Be described as " directly existing " structure or part " on " formed.Similarly, when element is referred to as " connection ", " attachment " or " coupling Connect " to another element when, it can directly connect, be attached or coupled to another element or intermediary element may be present. On the contrary, when element is referred to as " being directly connected to ", " directly attachment " or is " directly coupled " to another element, then in being not present Between element.
In addition, it is used herein such as " on ", " top ", " top ", " top ", " bottom " or " bottom " it is relative Term describes a structure as illustrated either part and another structure or partial relation.It will be understood that such as " on ", " top ", " top ", " top ", the relative terms of " bottom " or " bottom " are intended to include the side except described in figure The different azimuth of part outside position.For example, if the part in figure is reversed, it is described as " " other structures or part Either part is now positioned to " " other structures or part " lower section " to the structure of " top ".Similarly, if portion in figure Part relative axle rotation, be then described as " " other structures or part " top " structure or part will be oriented to " immediately " its His structure either part or " " other structures or partial " left side ".Throughout in full, identical label represents identical member Part.
One or more elements are not present unless expressly stated, otherwise term "comprising" used herein, " comprising " with And " having " should be construed to be not excluded for the existing open term of one or more elements.
It may include according to the photophore part of embodiment described herein based on III-V nitride (for example, nitridation Gallium (GaN)) LED chip or laser.The manufacture of LED chip and laser is commonly known and only simple herein Describe.LED chip or laser can make on growth substrate (for example, carborundum (SiC) substrate), such as by northern Caro The Cree Inc. manufactures in Lai Na states Durham cities and the device of sale.Other growth substrates are also contemplated herein, for example, it is but unlimited In sapphire, silicon (Si) and GaN.In an aspect, SiC substrate/layer can be 4H polytype of silicon carbide substrate/layer.However, Other SiC polytype of silicon carbide substrates/layer, such as 3C, 6H and 15R can also be used.Suitable SiC substrate can be from as the present invention Assignee Durham, N.C Cree companies obtain, and for producing the method for this substrate in scientific literature and more Individual commonly assigned United States Patent (USP) (includes but not limited to United States Patent (USP) No.Re.34,861；U.S. Patent number No.4,946,547 And U.S. Patent number No.5,200,022) in be set forth, entire contents are incorporated herein by reference.Also examine herein Consider any other suitable growth substrate.
As it is used in the present context, term " group III-nitride " refers in the III of nitrogen and the periodic table of elements (usually Aluminium (Al), gallium (Ga) and indium (In)) one or more of the semiconducting compound that is formed between element.The term is also refer to two Member, ternary and quaternary compound (such as GaN, AlGaN and AlInGaN).Group-III element can be combined with nitrogen to form binary (example Such as GaN), ternary (such as AlGaN) and quaternary (such as AlInGaN) compound.These compounds can have wherein one mole The empirical formula that is combined with one mole altogether of group-III element of nitrogen.Therefore, such as AlxGa1-xN, wherein 1>x>0, frequent quilt For describing these compounds.Technology for the epitaxial growth of group III-nitride has preferably developed, and appropriate Reported in scientific literature.
Although the various embodiments of LED chip disclosed herein may include growth substrate, those skilled in the art will Understand the crystal epitaxy substrate that can remove the epitaxial layer that growth thereon includes LED chip, and independent epitaxial layer can quilt It is installed on the replacement carrier substrate or substrate with different from original substrate hot, electric, structures and/or optical characteristics. Content described herein is not limited to the structure with crystal epitaxy substrate, and can be original from its with its epitaxial layers Growth substrate removes and is bonded to the structure combined use for substituting carrier substrate.
For example, the LED chip based on group III-nitride according to some embodiments of the present invention can be in growth substrate Made on (for example, Si, SiC or sapphire substrate), (have at least two in the phase homonymy of LED chip to provide horizontal device Individual electrical contact) or vertical devices (there is electrical contact in the opposite side of LED chip).In addition, growth substrate can be in LED core It is retained in LED chip or is removed after piece manufacture (for example, by etches, being ground, polishing).For example, growth substrate It can be removed with the thickness of LED chip caused by reduction and/or reduce electric by the forward direction (forward) of vertical LED chip Pressure.For example, horizontal device (with or without growth substrate) can be bond (for example, using solder) to or be welded to load Flip-chip on structure base board or printed circuit board (PCB) (PCB).Vertical devices (with or without growth substrate) can have weldering Material is bonded to carrier substrate, installation pad either PCB the first terminal (such as anode or negative electrode) and is welded to carrier base Plate, electrical equipment either PCB Second terminal (for example, relative anode or negative electrode).Vertical and horizontal LED chip structure Example is in the Edmond of Bergmann etc. U.S. Publication No.2008/0258130 and September in 2010 distribution on the 7th etc. the U.S. Patent No.7, discuss by way of example in 791,061, entire contents are incorporated herein by reference.
One or more LED chips can be coated with one or more fluorophor at least in part.Fluorophor is absorbable to be come from A part of light of LED chip simultaneously launches the light of different wave length, so as to which the transmitting of photophore part is every from LED chip and fluorophor The combination of the light of one.In one embodiment, photoemissive combination of the photophore part transmitting from LED chip and fluorophor The caused light for being considered as white light.In one embodiment according to the present invention, white luminous device part can be by transmitting blueness The LED chip of the light of spectrum forms with absorbing the fluorophor of some blue lights and the light for launching yellow wave spectrum again.The part therefore can Transmitting is by blue light and the white light combination of gold-tinted.In other embodiments, such as in United States Patent (USP) No.7, described in 213,940, LED chip launches the non-white light combination of blue light and gold-tinted.The LED chip of transmitting feux rouges is further contemplated herein or is absorbed LED light and the LED chip for launching the fluorophor covering of feux rouges.
Many different methods can be used to be coated with fluorophor for LED chip, be all " Wafer Level Phosphor in topic Coating Method and Devices Fabricated Utilizing Method (wafer level phosphor coating process and profit With this method make device) " U.S. Patent Application No. sequence number 11/656,759 and 11/899,790 in describe one kind Suitable method, and be hereby incorporated by both by quoting.Other appropriate methods for being used to be coated with one or more LED chips In entitled " the Phosphor Coating Systems and Methods for Light of distribution on November 15th, 2011 Emitting Structures and Packaged Light Emitting Diodes Including Phosphor Coating (the phosphor coated system and method including phosphor coated for being used for ray structure and encapsulating light emitting diode) " U.S. Patents Serial numbers 8,058,088 in and entitled " Systems and Methods for Application of Optical Materials to Optical Elements (are used for system and side of the optical material to the application of optical element Method) " U.S. Patent Application Serial Number 12/717,048 continuation application in be described, entire contents are passed through into reference With reference to herein.Other methods of such as electrophoretic deposition (EPD) can also be used to be coated with, such as in entitled " Close Loop in LED chip Electrophoretic Deposition of Semiconductor Devices (the closed-loop path electrophoresis of semiconductor devices Deposition) " U.S. Patent Application Serial Number 11/473, the suitable method of EPD described in 089, equally entire contents are led to Reference is crossed to be hereby incorporated by.It should be understood that can also have the LED of multiple different colors according to the photophore part of the present invention and method Chip, wherein one or more LED chips can launch white light.
Fig. 1 to Fig. 7 is shown according to disclosed herein and description the photophore part of this theme and the implementation of method Mode.Fig. 8 A and Fig. 8 B show the illuminating product that can combine the photophore part according to this theme, including but not limited to bulb With ligthing paraphernalia (for example, small spotlight, " cover (can) " lamp etc.).Fig. 1 is the vertical view for the photophore part for being generally designated as 10 Figure.Fig. 2A and Fig. 2 B are the top perspectives of the embodiment of emitter element, and Fig. 3 is the side view of emitter element. Fig. 2 B are the different embodiments for the photophore part for being generally designated as 15.A difference between emitter element 10 and 15 is It is arranged in the introducing of base station 25 among the one or more between one or more LED chips 12 and substrate or base station 14.Hair Light device part 10 and 15 may include at least one solid-state (solid state) transmitter, such as LED chip 12.Photophore part 10 and 15 may include more than one LED chip, for example, two, three or more than three LED chips 12, such as herein The LED chip of description.In an aspect, the array of LED chip 12 can with chip on board (CoB) structure setting in substrate or On base station 14.For example, Yuan that CoB structures were issued on October 26th, 2010 etc. United States Patent (USP) No.821, in 023 and It is described in the Keller that on April 30th, 2009 announces etc. U.S. Patent application No.2009/0108281, both are total to It is same to assign and combined entire contents herein by quoting.
LED chip 12 can be arranged to array and/or subarray.Lens 16 can be superimposed upon at least with array or subarray In one LED chip 12.Array and/or subarray described herein may include any number of LED chip 12, with from luminous Device part 10 and 15 provides desired light output.For example, photophore part 10 and 15 may include comprising at least four LED chip, extremely Few 5 LED chips, at least six LED chip, at least seven LED chip, at least eight LED chip, at least nine LED chip, at least 10 LED chips, at least LED array of 12 LED chips or at least 20 LED chips (for example, with reference to Fig. 4 A to Fig. 4 H). As previously described less array or bigger array are equally possible, for example, photophore part 10 and 15 may be used also Include the array of the LED chip 12 of at least 30,40 or 50 or more.For the purpose illustrated, only in Fig. 1 into Fig. 3 Show 8 LED chips 12.
LED chip 12 may include any suitable chip size and/or shape (such as square or rectangular shape). In one side, LED chip 12 may include to have approximately equal to less than 1000 μm sizes (for example, 1000 × 1000 μm2) or The square chips on larger sized side.LED chip 12 may include generally square shaped chip, has and is less than about 1000 μm any scope or subrange size side, for example, about 900 × 900 μm2Chip；About 700 × 700 μm2's Chip；About 600 × 600 μm2Chip；About 500 × 500 μm2Chip；About 400 × 400 μm2Chip；About 300 ×300μm2Chip；About 200 × 200 μm2Chip；Or about 100 × 100 μm2Chip.Multiple LED chips 12 can It is used in photophore part 10 and 15.In an aspect, each LED chip 12 can be of the same size.In other sides In face, one or more LED chips 12 can include different sizes.LED chip 12 may also comprise the rectangle of any suitable dimension Chip.
It is that LED chip 12 as described in this article may include to be used alone and/or combined with fluorophor or illuminator It (is such as mainly white, blueness, blue-green, green to use together to launch the light of a variety of colors, color dot or wave-length coverage Color, yellow, amber or red light) soild state transmitter.In an aspect, photophore part 10 and 15 may include one The LED chip 12 of individual or multiple predominantly bluenesss, wherein when LED chip is illuminated, can excite and be arranged in LED chip 12 Yellow phosphor is (for example, fluorophor can be directly arranged at LED chip 12 at least in part and/or be arranged in LED chip 12 In a part for photophore part 10 and 15, such as it is arranged on lens 16), so as to which LED chip 12 includes Lan Zhuanhuang (blue Shifted yellow) (BSY) chip.In an alternate embodiment, predominantly red LED chip 12 may include herein Described in emitter element in and can be used alone and/or with BSY chip portfolios use.In an aspect, red LED Chip 12 can also be alternatively disposed at fluorophor, sealant and/or the lens 16 with luminescent coating to be come with mixing below Produce warm white light output.Photophore part 10 and 15 may include to be configured as exciting yellow, red and/or green phosphor extremely A few LED chip 12, the phosphor are directly arranged in LED chip 12 and/or are directly arranged at one of emitter element On point, for example, yellow, red or green phosphor can arrange in a part for lens 16 or in produce cold and/or warm white Light output.In further embodiment, part 10 and 15 may include more than one LED chip 12, such as multiple LED cores The array of piece 12 and/or LED chip 12.Each chip in the array of multiple LED chips 12 or LED chip 12 may include About the same wavelength (for example, from the select wavelength of identical target wavelength range).In an alternate embodiment, it is more At least the first LED chip 12 of individual LED chip may include the wavelength (example different from least the second LED chip of multiple LED chips Such as, at least the first LED chip 12 can be picked out from the target wavelength range different from least one other LED chip 12).
Referring still to Fig. 1 to Fig. 3 and as described above, one or more LED chips 12 may include any required chi Very little, structure, construction and/or shape, and may include any of LED chip.When electric signal or electric current are via any conjunction When suitable surfaces for attachment (such as surfaces for attachment 18) is delivered to emitter element, LED chip 12 can be illuminated.For example, electric current can It is delivered to what can be electrically connected via pad, solder, crimping (crimping) or other attachment methods with surfaces for attachment 18 One or more conductor wire (not shown), to induce current into part 10 and 15.Surfaces for attachment 18 may include to be expressed as "+" With the negative electrodes terminal of "-" symbol (for example, anode and negative electrode to), and it may include pad, electric connector or be used for It is electrically connected to the region of the exposure conductive material of external power source (not shown).In an aspect, LED chip 12 includes following structure Make：The bottom of chip includes being used for and the Part I of base station 14 is electric and/or hot linked anode, and the top bag of chip Include for the negative electrode bond pad being electrically connected via the Part II of bonding wire and base station 14 (for example, showing and retouching in fig. 5 The vertical devices stated).In other side, LED chip 12 may include to be constructed as below：The side of LED chip or part bag Anode and negative electrode are included, so as to which bonding wire can be unnecessary (for example, the horizontal device for showing and describing in figure 5b).Herein The top surface or a part that further contemplate in LED chip 12 include the horizontal device of anode and negative electrode, wherein, negative electrode and anode can divide Other bonding wire is connected to a part (for example, considering the horizontal LED chip 12 with two bonding wires herein) for base station 14.From attachment The electric current that surface 18 enters and leaves part 10 and 15 can then enter and leave one or more LED chips 12, so that core Piece is illuminated.
Base station 14 may include monolithic (monolithic) substrate, for example, printed circuit board (PCB) (PCB), metal cored printed circuits Plate (MCPCB), the dielectric substrate based on FR-4 or circuit board, ceramic substrate, laminated substrate, flexible circuit, external circuit or Person can install and/or be attached thereon any other suitable base station or substrate of the illuminating device of such as LED chip.For example, Base station 14 may include sandwich layer 42 and dielectric layer 44 (referring to Fig. 5 A and Fig. 5 B).For the purpose illustrated, base station 14 may include MCPCB (for example, can by Chanhassan, MN Bergquist companies obtain and manufacture those).But can be used it is any suitable Base station 14.Sandwich layer 42 (Fig. 5 A and Fig. 5 B) may include conductive metal layer (for example, copper (Cu) or aluminium (Al)).(Fig. 5 A of dielectric layer 44 With Fig. 5 B) may include electric insulation but the material of heat transfer, to help the radiating by base station 14.In alternative embodiments In, base station 14 may include ceramic (such as alumina, aluminium nitride, silicon, sapphire, carborundum) or high polymer material (such as polyamides Amine, polyester).As Fig. 2 B further show that part 15 may include the LED being attached on middle base station 25 simultaneously with described in below Chip 12 and lens 16.Middle base station 25 then could attach on base station 14.
Base station 14 may include the conductive for allowing LED chip 12 to be electrically connected with surfaces for attachment 18, so as to work as part 10 When receiving the electric signal or electric current from external electrical component (such as conductor wire (not shown)) with 15, LED chip 12 illuminates. LED chip 12 can be used it is suitable or it is known attachment material and method be attached to base station 14, for example, solder attachment, in advance Formed attachment, solder flux or fluxless it is co-melting attachment, epoxy silicone attachment, metal epoxy attachment, hot compression attachment and/ Or its combination.One or more test points 19 can be located in a part for base station 14 with the electric of test emitter part 10 and 15 And/or thermal property.For example, when being detected using any suitable temperature sensor (not shown), test point 19 can allow The thermal property of test component.
Referring still to Fig. 1 to Fig. 3, at least one LED chip 12 may be arranged on base station 14 and under lens 16.Each lens 16 may include lens mount 20, and it can be formed with chip on board (CoB) structure and be directly attached to one or more base stations On 14 surface.Lens mount 20 as further described herein can also be attached to base station 14 indirectly.It is in addition, one or more LED chip 12 can be placed in below each lens 16.In an aspect, each lens 16 may include liquid curing silicones material Either (such as methyl or phenyl seal any sealant material (encapsulant material) for material, epoxide resin material Agent material).Known technique can be used to mould and cured lens material.Lens 16 and lens mount 20 may include to be used to produce Any suitable shape of desired light output.For example, lens 16 may include there is substantially circular lens bottom as shown Hemispherical (dome) shape of seat 20, or alternately, the lens of the base of corresponding any other shape are considered, for example, right Should have substantially square, rhombus, ellipse, symmetrical and/or asymmetric lens mount 20 lens.
Lens 16 and lens mount 20 can be formed directly and/or indirectly on the top surface of base station 14, and may be arranged to In a few LED chip 12.The array of lens 16 can be molded and/or be placed on the array of corresponding LED chip 12.Lens 16 can provide the environment and/or mechanical protection to photophore part 10 and 15.It should be noted that new transmitter described herein Part can be related to new lens 16 and can combined in an aspect, for example, each lens 16 can be with being generally designated as 22 One or more new optical elements 22 it is associated.As being described further herein, each optical element 22 can be with The expansion extended from lens 16, or each optical element 22 can it is associated with lens 16 without extending from lens 16 or Person is attached to lens 16.Optical element 22 may include elongated portion or component, such as but be not limited to, can be with each lens 16 It is integrally formed, is individually formed and arranges or can even is that the method that both are combined with each lens 16.For example, light Learning element 22 may include at least Part I 24A and selectable Part II 24B, each part can from lens 16 outwards and Extend along a part for lens mount 20.For illustrative purposes, in the optical element 22 associated with each lens 16 Part (for example, first and second part 24A and 24B) as two is shown, but further contemplates optical element tool herein There is the optical element more or less than two parts.Such as in an aspect, as shown in Fig. 7 and described in, optics member Part 22 may include the single elongated portion with single serpentine track.
Part I 24A and Part II 24B may include the elongate member of the part extension approximately along lens mount 20, So that the part of their direct contact lens bases 20 or what is be such as described further herein cause they and lens mount 20 or LED chip separate or it is spaced apart.Each optical element 22 can be elongated and the structure of spill or configuration, is adapted Be configured to such as the influence in the desired manner being described further herein and reflected light.Can respectively in Part I 24A and Layout angle α between Part II 24B.In an aspect, angle [alpha] may include about 45 ° or bigger angle, such as greatly About 50 ° or bigger, about 60 ° or bigger, about 70 ° or the bigger or angle more than 80 °.In other side, angle [alpha] It may include about 90 ° or bigger angle, such as about 95 ° or bigger, about 100 ° or bigger, about 110 ° or bigger, big About 120 ° or the bigger or angle more than 150 °.
In addition, Part I 24A and Part II 24B can extend over the region of its contact lens base 20 so that one Individual, more than one or all optical element 22 (in an aspect but being not limited to) is than associated lens (such as Lens 16) diameter it is longer.In other side, Part I 24A and Part II 24B can be not extended past its contact thoroughly The region of mirror base 20 so that one, more than one or all optical element 22 (in an aspect but being not limited to) Diameter than associated lens (such as lens 16) is shorter.In an aspect, the part 24A and 24B of optical element 22 The total length longer than the length (for example, diameter of lens mount 20) of each lens 16 can be extended to along base station 14.Optics Element 22 may extend to about 1mm or longer, about about 2mm or longer, about 4mm or longer, about 6mm or longer, 8mm Or longer, about 10mm or longer, or the length L more than about 10mm.In an aspect, optical element 22 may extend to greatly About 6.2mm or 6.3mm total length L.Because the component that optical element 22 may include to extend and bend, length L can be wrapped Include the measurement of the actual range between Part I 24A and Part II 24B as shown end, rather than whole curve Length.Lens 16 may include substantially circular lens mount 20, and the lens mount, which has, is less than about 2mm (for example, 0.5mm Or 1mm), about 2mm or longer, about 3mm or longer, about 4mm or longer or the diameter more than about 5mm.One In individual aspect, lens 16 include about 4.5mm diameter.Lens diameter (for example, diameter of lens mount 20) is considered herein Length L and length any combinations.
Part I 24A and Part II 24B may include length essentially identical as shown, or Part I 24A It is longer than another with one of Part II 24B.Part I 24A and Part II 24B may include essentially symmetrical structure Part (for example, relative lens 16 are symmetrically positioned), its can with but not necessarily relative lens 16 formed mirror image.Equally examine herein Consider Part I 24A and Part II 24B asymmetric, non-mirror-image arrangement.Optical element 22 can be in adjoining position directly It is arranged proximate to lens 16 and can be oriented so that each optical element 22 is also arranged to adjacent to or close to base station 14 Edge.In an aspect, each optical element 22 may be arranged between the edge of LED chip 12 and base station 14.
It should be noted that the Part I 24A and Part II 24B of optical element 22 may include general curved, protrusion or The recessed part of person, its configuration that can be generally a C-shaped as shown are slightly bent inwardly toward each other, or alternative Ground can in any direction or orientation bending is to produce any desired light output.In an aspect, one or more optics Element 22 can be tangentially aligned relative to lens 16 so that its a little or at least a portion at contact lens base 20.Optics Element 22 can with but not necessarily contact lens base 20.In further embodiment, each optical element 22 can more than Contact lens mount 20 associated with it and corresponding at the point of one or part.Part I 24A and Part II 24B can (offset) angle, θ is offset from the opening position of the tangential contact lens 16 of optical element 22 or lens mount 20.That is, Part I 24A and Part II 24B can be relative to circular lens mount shape at an angle.In an aspect, Part I 24A and Part II 24B can offset about 2 degree or bigger of angle, θ from the opening position of the tangential contact lens base 20 of optical element 22. In other side, lens component 24A and 24B can be offset about from the opening position of the tangential contact lens base 20 of optical element 22 5 ° or bigger, about 10 ° or bigger, about 15 ° or bigger, about 25 ° or bigger, about 30 ° or bigger, about 45 ° or more The big or angle, θ more than 45 °.In some aspects, optical element 22 can be from the tangential contact lens base 20 of optical element 22 Opening position skew is up to any angle, θ for including about 90 °.
Referring still to Fig. 1 to Fig. 3, one or more parts (such as Part I 24A and Part II 24B) can be with lens 16 are integrally formed, for example, via identical mould and/or with being formed in the identical molding process of lens 16.That is, half is formed The mould of sphere lenses 16 can integrate with the mould or mould part for forming optical element 22.In other side, the A part of 24A and Part II 24B can be individually formed from lens 16 (for example, via different moulds and/or in different moulds Formed in step processed).In an aspect, each optical element 22 may include with the identical material of lens 16, for example, modeling system With selectable constitutes of silicones material.In other side, each optical element 22 may include the material different from lens 16, For example, glass or plastic material.Each lens 16 and optical element 22 may include optically transparent material.In other side, A part for lens 16 and optical element 22 may include to be coated with or be laminated with one or more fluorophor or illuminator layers Trnaslucent materials, and/or including opaque material.As shown in Figure 3, Part I 24A and Part II 24B may include substantially For semicircle or bending cross sectional shape and the upper surface of circle.
Optical element 22 individually as well as collectively can advantageously improve light extraction, for example, by from non-circular LED chip Array (such as CoB arrays either non-CoB arrays) produces circular beam pattern or by from being arranged to be different from desired light The LED chip array of the configuration of beam pattern produces the beam pattern of any desired shape.As previously discussed, the one of traditional element Individual shortcoming is that square either non-circular LED chip array can produce square or non-circular light beam.Because with square The other shapes of array of generation is compared in tube core (die) attachment of array configuration, which with bonding wire LED chip, more to save the time, so example Come the method for producing the novel of circular beam pattern and simplifying can be favourable such as by using optical element 22.Such as at this Show and describe in text by combine new optical element 22, be configured as either being arranged as square or non-circular battle array The LED chip 12 of row can advantageously improve light output by producing suitable for bulb or the circular beam pattern of lamp applications. For example, one or more optical elements 22 may be arranged on base station 14, to meet toroidal by manipulating light transmitting come from LED The circular light beam of reality is produced in the quadrate array of chip 12.As further described herein, other shapes of beam pattern Case and other LED chip structures are also possible.
In an aspect, the Part I 24A and Part II 24B of optical element 22 can be by making light from optical element 22 reflections manipulate the light beam launched by LED chip 12 so that caused light pattern is consistent with circular portion 24A and 24B, with Substantive circular light beam is collectively form between relative optical element 22.It should be noted that optical element 22 makes quadrate array LED chip 12 can produce circular light beam in-between.Because optics member can be disposed about in the LED chip array of any shape Part 22 is to produce the light beam of any desired shape, so can be from the LED chip for being arranged to be different from it is expected the structure of beam pattern The beam pattern of any desired shape is produced in array.Optical element 22 may be arranged so that they LED chip array it (for example, external margin along the array of LED chip 12) is between LED chip 12 and the outermost edges of base station 14 outside.
Fig. 2 B show the photophore part 15 with more than one base station.At least one LED chip 12, lens 16 and Optical element 22 can be arranged on middle base station 25 with CoB structures or CoB arrays.In an aspect, chip 12, lens 16 and element 22 array in each LED chip 12, lens 16 and optical element 22 may be arranged at one or more intermediate bases Platform 25 it is multiple on.As shown, one or more middle base stations 25 can be spaced apart, to help the selection for optical element 22 Property alignment optical element 22 on arrow A selectivity rotate.Base station 25 may include single led chip 12, list among each Individual lens 16 and single optical element 22, or more than one LED chip 12, more than one lens 16 and more than one Individual optical element 22.Middle base station 25 than the compartment of terrain that is shown in figure closer to or than shown in further point From.
Lens 16 and optical element can be directly attached on middle base station 25 with CoB arrays.Middle base station 25 may include Any material, and can optionally conductive and/or Heat Conduction Material.In an aspect, middle base station 25 may include metal, Ceramics, polymer or the composite that can be used alone and/or be applied in combination with other materials.Middle base station 25 may include list Layer material or material more than one layer and/or the layer being made up of one or more layers metal, ceramics, dielectric and/or polymeric material Laminated structure.Photophore part 15 may include single base station 14, and the base station 14 is pacified except the LED chip 12 as in part 10 Also there are wherein one or more middle base stations 25 may be arranged at LED chip 12 and base station 14 outside the region being attached on base station 14 Part between region.In other side, element 15 may include the list being disposed thereon with base station 25 among n altogether Individual base station 14, wherein, n is equal to the quantity of LED chip 12.Therefore, n middle base station 25 may be arranged at n LED core altogether altogether Between piece 12 and single monolithic base station 14.In further, base station 25 can have and be disposed thereon among single monolithic Multiple LED chips 12 (for example, array of LED chip 12), and it may be arranged on single monolithic base station 14 in turn.This Any suitable configuration is considered in text.
In an aspect, middle base station 25 may include the monolithic base station being arranged on base station 14.Middle base station 25 can be through Base station 14 is attached or is bonded to by any suitable binding material or layered product.As shown in fig. 2b by arrow A, one Individual or multiple middle base stations 25 can be configured as rotating or being adapted to any position to base station 14, so as to which optical element 22 can By the positioning of selectivity or configuration in any desired orientation on base station 14.Wherein, more than one centre has been used Base station 25, base station 25 may include any shape.Base station 25 may include identical shape among each, or base station 25 can be not Same shape.For illustrative purposes, the middle base station 25 of have substantially square shape is shown, however, also examining herein Consider any other shape (such as substantially circular, rectangle, symmetrical and/or asymmetrically shape).Middle base station 25 can with but It is not necessarily to be of similar shape.Middle base station of different shapes is used for example, be can be combined in part 15 on base station 14 25。
Photophore part 10 and 15 can further comprise being generally designated as 26 at least one opening or hole, and it can be by cloth It is set to through or at least partially through base station 14, to help part being attached to external substrate or surface.For example, one Or multiple attachment components (such as screw) can be inserted by least one hole 26, photophore part 10 and 15 is fixed to another One component, structure or substrate.In an aspect, as shown in Fig. 8 A and 8B, one or more attachment components will can be sent out Light device part 10 and 15 is fixed to the surface of bulb or lamp applications.
Fig. 4 A to Fig. 4 H show placement and the shape of LED chip array and subarray of the various LED chips on base station 14 Shape, wherein, optical element 22 can be used for carrying out shaping to light.Thus, beam shaping can be arranged by producing substantially Central places The desired structure 30 (such as circular light beam) of light between relative optical element 22 advantageously improves photophore part 10 With 15 light extraction, so as to by making it be more suitable for bulb or lamp applications improve the light extraction of photophore part 10 and 15 With it is luminous.In an aspect, photophore part 10 and 15 may include for the LED chip array generation from any desired shape The optical element 22 of the light beam of any desired shape.For example, in Figure 4 A, numeral 1 to 8 schematically shows placement or cloth It is set to eight LED chips of quadrate array.Optical element 22 (Fig. 1 to Fig. 3) may be arranged at array nearby (for example, LED chip Between the edge of base station 14), with by curved from the part of optical element 22 the partial offset angle, θ of lens 16 (its relative to) Folding, bending and/or reflected light are basically to produce round-shaped beam pattern or light beam in the array of square shape 30.Beam pattern also can be between by Part I 24A and Part II 24B angle [alpha] influenceed (referring to Fig. 1 to Fig. 3).For Each for the one or more optical elements 22 arranged near LED chip array, angle [alpha] can be identical, or multiple At least first angle α of first optical element 22 of optical element may differ from the second optical element 22 of multiple optical elements At least second angle α.LED chip array may be arranged on square base station 14.However, herein consider base station 14 it is any its Its shape.For example, dotted line 28 in Figure 4 A schematically shows circular base station that can be used herein.
Fig. 4 B show the arrangement of two LED chips.Numeral 1 and 2 corresponds to two LED chips, wherein, optical element 22 (Fig. 1 to Fig. 3) may be arranged at LED nearby and for producing substantially circular structure from the non-circular arrangement of LED chip Light beam 30.Arrow in Fig. 4 B, Fig. 4 C and Fig. 4 E to Fig. 4 G represent optical element 22 part (for example, part 24A and Possible position, bending and/or orientation 24B).For example, in figure 4b, optical element 22 (Fig. 1) may include to exist along arrow The part that extends in length and/or becoming as shown in by arrow are angled to be produced from the LED chip of non-circular arrangement Circular light beam 30.In addition, optical element 22 (Fig. 1) may include the part of the bending such as represented by arrow, with from non-circular cloth Circular light beam 30 is produced in the LED chip put.The part (for example, 24A and 24B in Fig. 1) of optical element 22 can have identical Length or different length.Angle [alpha] (Fig. 1) between the part of optical element 22 near LED chip 1 may also differ from being located at The angle [alpha] of optical element near LED chip 2.
Fig. 4 C show the triangular arrangement or array of LED chip.Numeral 1 to 3, which corresponds to, may be disposed to essentially triangle Three LED chips of the LED array of shape, wherein optical element 22 (Fig. 1 to Fig. 3) may be arranged near LED, and be used for from non- Circular light beam 30 is produced in circular array.As shown in by arrow, the optical element 22 near LED 2 and LED 3 (Fig. 1) can have longer part (for example, as shown in by longer arrow) to provide circular photo structure in one direction Or wave beam.Fig. 4 D show the quadrate array at least four LED chips that may be arranged on base station 14, wherein optical element 22 (Fig. 1 to Fig. 3) can be used for producing circular light beam 30.Similarly, Fig. 4 E to Fig. 4 H are shown with various non circular shape arrangements The arrangement or array of five, six and seven LED chips on base station 14, wherein optical element 22 (Fig. 1 to Fig. 3) can be used for Produce the circular configuration or wave beam 30 of light.The various placements of the LED chip in each array shown in Fig. 4 A to Fig. 4 H or Person, which arranges, represents that the different optical elements 22 (Fig. 1) near different corresponding LED chips may include different angle [alpha]s (for example, not all angle is identical), to produce circular beam from non-circular array, or produce any other intended shape Wave beam.For example, the LED chip (for example, LED 1 in Fig. 4 E) of corner can have with another LED chip (for example, Fig. 4 E In LED4) differently angled optical element 22, jointly to produce circular light beam, or the light of any desired shape.
Fig. 4 G show two subarrays of LED chip, for example, the first subarray of the LED chip of corresponding numeral 1 to 3 And the second subarray of the chip of corresponding numeral 4 to 6.Each subarray subarray may include the shape being generally triangular, The global shape of LED chip 1 to 6 includes non-circular elongate hexagonal shape.(the Fig. 1 to figure of optical element 22 is considered herein 3) can be used for producing circular light beam 30 from any non-circular shape or array of LED chip.Optical element 22 (Fig. 1 to Fig. 3) Available for the part reflected light from one or more bendings with curved surface, thus from any symmetric shape of LED chip Array and/or LED chip any asymmetric either asymmetrically shape array in produce circular configuration light or light beam 30.As shown in Fig. 4 A to Fig. 4 H, LED chip may be disposed to first shape or the first array structure, and jointly from LED The light beam 30 of chip array output may include the second shape or beam pattern, wherein, the second shape or beam pattern are different In first shape or the first array structure.
Fig. 5 A and Fig. 5 B show the section along the part of the photophore parts intercepted of the line 5A/5B-5A/5B in Fig. 1 Figure.Fig. 5 A are a parts for the photophore part for being generally designated as 40.Base station 14 may include single substrate, and single substrate, which has, to be used In carry electric current and diffusion the hot multiple interior layers or circuit from emitter element.In an aspect, base station 14 can Including conductive and/or heat conduction sandwich layer 42 (for example, such as Cu or Al metal level).Base station 14 can further comprise dielectric layer 36, its can electric insulation but heat conduction, to help base station 14 to radiate.Base station 14 can further comprise one or more LED chips 12 conductive mounting surfaces 46 that can be attached thereon via known tube core attachment technique and/or material or layer.A side In face, installation surface 46 includes Cu layers or Cu regions, such as Cu electrodeposited coatings or Cu layers of foil.LED chip 12 can be with electric trace (electrical trace) 48 is electrically connected.Electric trace 48 may include Cu layers or Cu paper tinsels.Base station 14 can further and can Selection includes one or more layers solder resist material 50 (it can be white to reflect the light from part 40).In one aspect In, LED chip 12 can be electrically connected via the exposed region of bonding wire 52 and electric trace 48.Conductive mounting surface 46 and electric trace 48 Can be electrically connected with least one surfaces for attachment 18 (Fig. 1), and by the electric current from external power source be delivered to LED chip 12 with It is illuminated it.
Fig. 5 A further show placement of the LED chip 12 relative to lens 16.Such as and in an aspect, lens 16 can Including the center line C at the center for essentially corresponding to LED chip 12.Center line C can with but differ and be set to the maximum height of lens 16. I.e. lens 16 may include it is not hemispheric cross sectional shape, and can have disalignment C height.When the base of LED chip 12 Maximizing light extraction when being centrally disposed in 16 lower section of lens on this, however, as shown in Fig. 6 A, LED chip 12 can deviate Center line C and/or more than one chip 12 may be arranged at the lower section of lens 16.As previously described, may include can be straight for lens 16 It is connected to the lens mount 20 of base station so that LED chip 12 and lens 16 include CoB structures.Lens 16 may include to be essentially Cheese or hemispheric shape, and can be corresponding with the lens mount of circle.
Fig. 5 B show a part for the photophore part for being generally designated as 60.Part 60 may include there is horizontal tectonics LED chip 62, the wherein bottom of LED chip 62 include being used for the anode being electrically connected with more than one conductive mounting surface 46 And negative electrode.Meanwhile conductive mounting surface 46 may include (referring to Fig. 1, to be not shown) with corresponding positive pole/negative electrode surfaces for attachment 18 Positive pole/negative electrode pair of electrical connection.Electric current can be delivered to part from external power source (not shown) via surfaces for attachment 18 (Fig. 1) 60.Surfaces for attachment 18 (Fig. 1) can be along the internal electrically conductive layer or path being arranged in base station 14 and the electricity of conductive mounting surface 46 Gas connects.
Fig. 5 B also show the placement of LED chip 62, and LED chip 62 can be relative to the center line C Central places cloth of lens 16 Put.For example, LED chip 12 can be arranged at diverse location relative to lens 16, such as about center line C of lens 16 lower section (wherein lens 16 are in maximum height).The center C of lens 16 can with but the not necessarily summit with lens 16 or maximum height Point is identical.Part described herein may include multiple optical lenses 16, wherein, each lens 16 are placed in the battle array of LED chip 12 On at least one LED chip 12 of row.There can be n lens 16 altogether, wherein, n is equal to the number of the LED chip 12 in array Amount.Alternatively, lens n quantity can be less than the quantity of the LED chip 12 in array.Such as, it is contemplated that one or more LED Chip 12 can not be located under lens 16.In this case, lens n quantity is less than the quantity of LED chip 12.Equally at this In the case of kind, optical element 22 (Fig. 1) can be between unlapped LED chip 12 and the outermost edge of base station 14.
The more than one LED chip 12 that Fig. 6 A are shown in which such as to be specified by chip 12 with dotted line can be located under lens 16 The photophore part 70 of side.Here, provide only a LED chip 12, chip 12 equally can be along by solid line and shown in phantom Any orientation is located at the lower section of lens 16.For example, here, only seal a LED chip 12 in each hemisphere or lens 16, should One LED chip 12 can be relative to the off-center placements of center line C such as shown in broken lines, to make peak emission when needed Characteristic deviation.The luminous pattern of single led chip 12 also or can further pass through optical element 22 and optical element 22 Part I 24A and Part II 24B position and/or angle is offset.As previously described, optical element 22 may be arranged at Between the external margin of LED chip 12 and base station 14 so that light beam can be internally reflected towards the center of base station 14, be suitable to producing The circular light beam of bulb, light fixture or the application of other illuminating products.
As shown in Fig. 6 A to Fig. 6 C, optical element 22 may include the thickness for being approximately equal to or greater than LED chip 12 Height H.For illustrative purpose, optical element 22 is shown as the height H of the thickness with more than LED chip 12；If however, If it is expected, height H can also be substantially equal to the thickness of chip.Optical element 22 with height H can by integrally inward towards Off-centring or reflected light to base station 14 influence the light output from LED chip 12 to help to produce essentially similar round Or round-shaped beam pattern.It should be noted that the light with circular beam pattern can produce from non-round LED chip array 12 It is raw.In addition, according to part described herein and lens, can be produced from the LED chip array of any shape has any ripple The light of beam pattern form.For example, LED chip array may include first shape, and light beam may include the second shape, wherein, the One shape and the second shape differ.
Fig. 6 B show another embodiment for the photophore part for being generally designated as 80.In this embodiment, LED Chip 12 may be arranged on the first base station 82 not extended below optical element 22.For example, the first base station 82 may include that LED is sealed The main body of piece installing so that the array of LED chip 12 is formed by discrete LED encapsulation piece rather than CoB structures.In an embodiment In, LED chip 12 may be mounted to the first base station 82, and the first base station 82 can be installed on base station 14 in turn, so that LED chip 12 are arranged on base station 14 indirectly.In an aspect, the first base station 82 may include any suitable material, and can be Conductive and/or heat conduction or non-conductive and/or non-conductive.In an aspect, the first base station 82 may include there is internal dissipate The plastic body of backing and the electric component physically, electrically to be communicated for the part with base station 14 with heat.Other In aspect, the first base station 82 may include ceramic material, such as LTCC (LTCC) material, HTCC (HTCC) Material, alumina, aluminium nitride (AlN), aluminum oxide (Al2O3), glass and/or aluminium sheet material.In other side, the first base station 82 It may include plastic material, such as polyimides (PI), polyamide (PA), polyphthalamide (PPA), liquid crystal polymer Or silicones (LCP).First base station 82 may include any suitably sized and/or shape, for example, have substantially square, square Shape, circle, ellipse, rule, irregular or asymmetrical shape.Any suitable material can be used in LED chip 12 And/or technology is (for example, solder attachment, pre-formed attachment, solder flux or the co-melting attachment of fluxless, epoxy silicone attachment, metal Epoxy resin attachment, hot compression attachment and/or its combination) carry out tube core attachment, directly to electrically connect the LED chip in packaging part 12。
Fig. 6 C show another embodiment of photophore part 85.As shown in Figure 6 C, as previously shown in fig. 2b With description, LED chip 12, lens 16 and optical element 22 can be arranged on middle base station 25.In an aspect, thoroughly Mirror 16 can be directly attached to middle base station 25 with CoB arrays.Middle base station 25 may include any conductive and/or Heat Conduction Material. Middle base station 25 equally may also comprise non-conductive or non-conducting material.Middle base station 25 can allow optionally to position one or Multiple optical elements 22, to produce desired beam pattern or shape.
Fig. 7 is the schematic diagram for the photophore part for being generally designated as 90.In this embodiment, relative to being represented by dotted lines Center arrangement the and round-shaped beam pattern P position of optical element 22 can more clearly distinguish because lens 16 It has been removed so that can be seen that " track (footprint) " of optical element 22.Optical element 22 can as shown and lens 16 are spaced apart and/or are used in the case of no lens 16.As shown, the bending of optical element 22 can will come from LED core The inwardly center throw of base station 14 or the reflection of the light of piece 12, thus produce suitable for the basic of bulb and/or lamp applications For similar round or the beam pattern P of circle.It is contemplated that optical element 22 can also be arranged so that beam pattern can be in base station Produce and (such as, produced from the edge of part 90, turning or side in the region of off-center or non-central arrangement on 14 Light).As shown in Figure 7, round-shaped beam pattern P can be from the array (not shown) of substantially square lens 16 Produced in (it includes the optical element 22 from its extension).Optical element 22 can directly from lens 16 extend (not shown) and/or Separate and (shown in foregoing figures) with lens 16.When optical element 22 and lens 16 separate, optical element 22 may be arranged at Between the outermost edge of corresponding lens 16 and base station 14, and in the corresponding (not shown) of LED chip 12 and base station 14 most Between outward flange.
Element described herein may include any suitably sized.In an aspect, base station 14 may include wherein every Individual side is about 50mm or smaller square.In other side, base station 14 may include wherein each side be about 25mm or Smaller square.In further, base station 14 may include that wherein each side is about 10mm or smaller square. It is same to consider rectangle and circular base station 14 herein.Base station 14 may include any suitable thickness, for example, base station 14 can wrap Include about 5mm or less, about 1mm or the less or thickness less than about 1mm.The array of LED chip 12 may include to appoint Meaning interval is come the LED chip 12 that separates, for example, LED chip 12 can be spaced apart about 20mm or less, about 10mm or more Less, about 7mm or less, about 5mm or less or less than 5mm, and may depend on the size of LED chip.
Fig. 8 A and Fig. 8 B, which are shown, can combine photophore part 10,15 and any other as shown and described herein Embodiment luminous product.Consider any number of luminous application and product；Only schematic purpose is not as limit System, shows the bulb for being generally designated as 100 and the ligthing paraphernalia for being generally designated as 110.Such as Fig. 8 A, show in phantom luminous Device part 10 may be incorporated in LED bulb 100.For example, the holding member 102 or scattered that base station 14 may be arranged in bulb 100 In hot component.In an aspect, base station 14 can be fixed or make to be screwed on holding member 102.As previously retouched State, emitter element 10 may include the one or more LED chips 12 being arranged in quadrate array (Fig. 1) on base station 14 Array.Each LED chip 12 (Fig. 1) may be arranged at the lower section of lens 16, and lens 16, which have, to be directly attached and be arranged in CoB structures Lens mount 20 (Fig. 1) on base station 14.For example, the LED chip 12 (Fig. 1) arranged with quadrate array can be minimized advantageously Tube core is attached and bonding wire step, but the conventional beam pattern from quadrate array transmitting is not applied for bulb and carried out excellent Change.It should be noted that the part of the optical element 22 described herein including novelty can produce predetermined beam pattern, such as can be more Suitable for the circular beam pattern of some luminous applications, and it can advantageously improve the light hair of LED luminaires (such as bulb 100) Penetrate.
Likewise, Fig. 8 B show the ligthing paraphernalia 110 with reference to photophore part 10.Ligthing paraphernalia 110 may include individual People, business and the small spotlight or " cover " lamp that use in industrial light application.Photophore part 10 may be arranged at installation base On plate or surface 112, and can be via the non-circular battle array for being arranged in LED chip 12 (it is arranged in the lower section of respective lens 16) (Fig. 1) outside one or more optical elements 22 are arranged advantageously to produce improved round-shaped beam pattern.
Shown in the figure and disclosure described above embodiment is can be within the scope of the appended claims The example for the multiple embodiments made.It is contemplated that novel photophore part and making with improved light extraction Its method may include except specifically disclosed various configurations in addition to those.Equally it is contemplated that use disclosed herein In provide improve light extraction and desired beam pattern novel lens equally may include except institute it is specifically disclosed those Outside various configurations.

Claims (55)

1. a kind of photophore part, including：
Base station；
At least one luminescence chip, it is arranged on the base station；
Lens, it is arranged at least one luminescence chip；And
Optical element, it is associated with the lens, wherein, the optical element is configured as influenceing from the luminescence chip Light output, wherein, the optical element is the length of diameters elongated and with more than the lens.
2. photophore part according to claim 1, wherein, the optical element includes 4 millimeters (mm) or longer length Degree.
3. photophore part according to claim 1, wherein, the optical element includes 6 millimeters (mm) or longer length Degree.
4. photophore part according to claim 1, wherein, the optical element is thin including the first elongated portion and second Long part.
5. photophore part according to claim 4, wherein, first elongated portion and second elongated portion to Inside bend toward each other.
6. photophore part according to claim 5, wherein, in first elongated portion and second elongated portion Between 90 ° or bigger of angle be present.
7. photophore part according to claim 6, wherein, in first elongated portion and second elongated portion Between 100 ° or bigger of angle be present.
8. photophore part according to claim 6, wherein, in first elongated portion and second elongated portion Between 120 ° or bigger of angle be present.
9. photophore part according to claim 1, wherein, the optical element contacts at least one of the lens Point.
10. photophore part according to claim 1, wherein, the optical element includes molded silicone material.
11. photophore part according to claim 1, wherein, the optical element includes plastic material.
12. photophore part according to claim 1, wherein, at least one luminescence chip includes at least one hair Optical diode (LED) chip.
13. photophore part according to claim 12, wherein, the optical element is included more than described at least one The height of the thickness of LED chip.
14. photophore part according to claim 13, wherein, at least one LED chip includes LED chip battle array Row.
15. photophore part according to claim 14, wherein, the LED chip array includes the LED of non-circular shape Chip array.
16. photophore part according to claim 15, wherein, the LED chip array includes the LED of square shape Chip array.
17. photophore part according to claim 16, including multiple optical elements, and wherein, the optical element It is configured as influenceing the light output of the LED chip array from the square shape to produce round-shaped beam pattern.
18. photophore part according to claim 1, wherein, the luminescence chip is pacified with chip on board (CoB) structure It is attached on the base station.
19. photophore part according to claim 1, wherein, the luminescence chip is indirectly mounted on the base station.
A kind of 20. bulb, with reference to photophore part according to claim 1.
A kind of 21. light fixture, with reference to photophore part according to claim 1.
22. a kind of method for setting photophore part, methods described include：
Base station is set；
At least one luminescence chip is attached to the surface of the base station；
Lens are set at least one luminescence chip；And
The optical element for being configured as influenceing the light output from the luminescence chip is set, wherein the optical element is elongated And with more than the lens diameter length.
23. according to the method for claim 22, including set the optics with 4 millimeters (mm) or longer length first Part.
24. according to the method for claim 22, wherein, the optical element contacts at least a portion of the lens.
25. according to the method for claim 22, wherein, the optical element has the first elongated portion and the second elongate portion Point.
26. according to the method for claim 25, including set wherein described first elongated portion thin relative to described second The optical element of long part at an angle.
27. according to the method for claim 26, wherein, it the angle ranging from 90 ° or bigger.
28. according to the method for claim 26, wherein, it the angle ranging from 100 ° or bigger.
29. according to the method for claim 26, wherein, it the angle ranging from 120 ° or bigger.
30. according to the method for claim 22, wherein, the lens are set to include from liquid curing silicone material, ring Oxygen resin material or sealant material mould the lens and the optical element.
31. according to the method for claim 22, wherein, at least one luminescence chip is set to include setting at least one Light emitting diode (LED) chip.
32. according to the method for claim 31, include the height of thickness of the setting with more than at least one LED chip The optical element of degree.
33. according to the method for claim 31, wherein, at least one LED chip is set to include setting LED chip array.
34. according to the method for claim 33, wherein, the LED chip array is set to include setting non-circular shape LED chip array.
35. according to the method for claim 34, wherein, the LED chip array is set to include setting square shape LED chip array.
36. according to the method for claim 35, further comprise multiple optical elements, and by from multiple described The light that optical element reflection is launched by the LED chip, produce to be at least from the LED chip array of the square shape and justify The beam pattern of shape shape.
37. a kind of lens, including：
Lens mount, there is diameter；
Elongated optical element, extend from the lens mount；And
The elongated optical element has the length of the diameter more than the lens mount,
Wherein, the lens are arranged at least one luminescence chip and the optical element is configured as influenceing Light output from the luminescence chip.
38. the lens according to claim 37, wherein, the length of the optical element is 4 millimeters (mm) or longer.
39. the lens according to claim 37, wherein, the length of the optical element is 6 millimeters (mm) or longer.
40. the lens according to claim 37, wherein, the optical element includes the first elongated portion and the second elongate portion Point.
41. lens according to claim 40, wherein, first elongated portion and second elongated portion inward towards Bend to each other.
42. lens according to claim 40, wherein, between first elongated portion and second elongated portion In the presence of 90 ° or bigger of angle.
43. the lens according to claim 37, wherein, the optical element includes molded silicone material.
44. the lens according to claim 37, wherein, the optical element includes plastic material.
45. a kind of photophore part, including the lens according to claim 37, wherein, the lens are arranged at least one On individual light emitting diode (LED) chip.
46. photophore part according to claim 45, wherein, the optical element is included more than described at least one The height of the thickness of LED chip.
47. a kind of photophore part, including：
Base station；
Luminescence chip array, it is arranged on the base station, the array is arranged with the first array structure；
Lens, it is arranged on the luminescence chip；And
Optical element, it is associated with the lens, and be configured as influence the light output from the luminescence chip, so as to Launch beam pattern different from the shape of first array structure, wherein, the optical element is elongated and bent.
48. photophore part according to claim 47, wherein, first array structure is non-circular.
49. photophore part according to claim 48, wherein, the beam pattern is circular.
50. photophore part according to claim 47, wherein, each optical element includes Part I and second Part.
51. photophore part according to claim 50, wherein, the Part I is relative to the Part II into one Individual angle.
52. photophore part according to claim 47, wherein, the optical element is arranged in positions institute for selectivity State on the middle base station of optical element.
53. a kind of method for producing desired beam pattern from photophore part, methods described includes：
Photophore part is set, and the photophore part includes：
Base station；
Luminescence chip array, it is arranged on the base station, the array is arranged with the first array structure；
Lens, it is arranged on the luminescence chip；And
Optical element, it is associated with the lens, wherein, the optical element is elongated and bent；And
From the luminescence chip array with different from the beam pattern of first array structure transmitting light.
54. method according to claim 53, including one or more optical elements are optionally positioned to produce The beam pattern.
55. method according to claim 53, wherein, first array structure is square and the beam pattern Case is circular.
CN201280073778.4A 2012-04-06 2012-04-06 For launching the Light emitting diode component and method of desired beam pattern Active CN104364904B (en)

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