CN104360581A - Photosensitive macromolecular material - Google Patents
Photosensitive macromolecular material Download PDFInfo
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- CN104360581A CN104360581A CN201410591021.5A CN201410591021A CN104360581A CN 104360581 A CN104360581 A CN 104360581A CN 201410591021 A CN201410591021 A CN 201410591021A CN 104360581 A CN104360581 A CN 104360581A
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- photosensitive
- macromolecular material
- polyisocyanates
- epoxy resin
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Abstract
The invention discloses a photosensitive macromolecular material which comprises the following raw materials in parts by weight: 40-60 parts of polyurethane acrylate, 10-15 parts of polyisocyanates, 15-20 parts of diacetone acrylamide, 5-10 parts of polybutadiene epoxy resin, 1-3 parts of a photoinitiator, 1-5 parts of dimethicone and 5-10 parts of organic compounds. The material disclosed by the invention is excellent in stability, is long-term photosensitive to keep the original photosensitive effect, is capable of remarkably improving the heat resistance, the weather fastness and the chemical resistance and greatly reducing the production cost of the product, and is wide in practicability.
Description
Technical field
The present invention relates to a kind of macromolecular material, be specially our photosensitive macromolecular material.
Background technology
Photosensitive material refers to a kind of semiconductor material with light sensitive characteristic, is therefore referred to as again light-guide material or photosensitive semiconductor.Photosensitive material conventional on current duplicating machine has: organic photo conductor drum (OPC), amorphous silicon photosensitive drums, cadmium sulfide photosensitive drums and selenium photosensitive drums.Photosensitive material is used to often in photograph in addition.Photosensitive material is the general name of the materials such as film, film and the printing paper used in taking a picture.Photosensitive material is generally divided into black and white photosensitive material and the large class of color sensitive material two.In illumination, film and television production, can photochemical transformations be carried out under all kinds of effect at light used in plate making field and reach the material of request for utilization.
Photosensitive polymer material is highly sensitive, and resolution is high, and diffraction efficiency is high, and processing is simple, is a kind of more satisfactory macromolecular material.In current technology, photosensitive material is comparatively single, and stability is poor, and after reaching certain photosensitive rate, its photosensitive effect will reduce a lot, and heat-resisting, weathering, the performance such as water-fast are all poor.
Therefore, for the problems referred to above, the present invention proposes a kind of new technical scheme.
Summary of the invention
The object of this invention is to provide a kind of stability strong, the photosensitive macromolecular material of good physical performance.
The present invention is achieved through the following technical solutions:
A kind of photosensitive macromolecular material, comprise the raw material composition of following parts by weight: 40 ~ 60 parts, polyurethane acroleic acid fat, polyisocyanates 10 ~ 15 parts, diacetone acrylamide 15 ~ 20 parts, polybutadiene epoxy resin 5 ~ 10 parts, light trigger 1 ~ 3 part, dimethyl silicon oil 1 ~ 5 part, organic compound 5 ~ 10 parts.
Further, described light draws the potpourri that agent is diazo salt, diaryl group iodized salt and triaryl sulfonium salts wherein one or more.
Further, described organic compound is organic azide.
The invention has the beneficial effects as follows: material settling out performance proposed by the invention is excellent, can be photosensitive for a long time and keep its photosensitive effect originally, and heat-resisting, weathering, chemical-resistance increase significantly, greatly reduce the production cost of product, practicality is extensive simultaneously.
Embodiment
In order to clearly explain the problem to be solved in the present invention expressly, below in conjunction with embodiment, the present invention is described further.
Embodiment 1
A kind of photosensitive macromolecular material, is characterized in that: the raw material composition comprising following parts by weight: 40 parts, polyurethane acroleic acid fat, polyisocyanates 10 parts, diacetone acrylamide 15 parts, polybutadiene epoxy resin 5 parts, diazo salt 1 part, dimethyl silicon oil 1 part, organic azide 5 parts.
Embodiment 2
A kind of photosensitive macromolecular material, is characterized in that: the raw material composition comprising following parts by weight: 50 parts, polyurethane acroleic acid fat, polyisocyanates 12 parts, diacetone acrylamide 18 parts, polybutadiene epoxy resin 8 parts, diazo salt 2 parts, dimethyl silicon oil 3 parts, organic azide 8 parts.
Embodiment 3
A kind of photosensitive macromolecular material, is characterized in that: the raw material composition comprising following parts by weight: 60 parts, polyurethane acroleic acid fat, polyisocyanates 15 parts, diacetone acrylamide 20 parts, polybutadiene epoxy resin 10 parts, diazo salt 3 parts, dimethyl silicon oil 5 parts, organic azide 10 parts.
Material settling out performance proposed by the invention is excellent, can be photosensitive for a long time and keep its photosensitive effect originally, and heat-resisting, weathering, chemical-resistance increase significantly, and greatly reduce the production cost of product, practicality is extensive simultaneously.
The above is only embodiments of the invention, is not restriction the present invention being made to any other form, and any amendment done according to technical spirit of the present invention or equivalent variations, still belong to the present invention's scope required for protection.
Claims (3)
1. a photosensitive macromolecular material, it is characterized in that: the raw material composition comprising following parts by weight: 40 ~ 60 parts, polyurethane acroleic acid fat, polyisocyanates 10 ~ 15 parts, diacetone acrylamide 15 ~ 20 parts, polybutadiene epoxy resin 5 ~ 10 parts, light trigger 1 ~ 3 part, dimethyl silicon oil 1 ~ 5 part, organic compound 5 ~ 10 parts.
2. a kind of photosensitive high score material according to claim 1, is characterized in that: described light draws the potpourri that agent is diazo salt, diaryl group iodized salt and triaryl sulfonium salts wherein one or more.
3. a kind of photosensitive macromolecular material according to claim 1, is characterized in that: described organic compound is organic azide.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201410591021.5A CN104360581A (en) | 2014-10-29 | 2014-10-29 | Photosensitive macromolecular material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201410591021.5A CN104360581A (en) | 2014-10-29 | 2014-10-29 | Photosensitive macromolecular material |
Publications (1)
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CN104360581A true CN104360581A (en) | 2015-02-18 |
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CN201410591021.5A Pending CN104360581A (en) | 2014-10-29 | 2014-10-29 | Photosensitive macromolecular material |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112457765A (en) * | 2020-11-19 | 2021-03-09 | 湖南哲龙科技有限公司 | Solvent-free photoelectric semiconductor coating formula |
-
2014
- 2014-10-29 CN CN201410591021.5A patent/CN104360581A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112457765A (en) * | 2020-11-19 | 2021-03-09 | 湖南哲龙科技有限公司 | Solvent-free photoelectric semiconductor coating formula |
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Legal Events
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C06 | Publication | ||
PB01 | Publication | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150218 |
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WD01 | Invention patent application deemed withdrawn after publication |