CN104356996A - High-curing rate ultraviolet light curing modified adhesive for circuit boards - Google Patents
High-curing rate ultraviolet light curing modified adhesive for circuit boards Download PDFInfo
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- CN104356996A CN104356996A CN201410583825.0A CN201410583825A CN104356996A CN 104356996 A CN104356996 A CN 104356996A CN 201410583825 A CN201410583825 A CN 201410583825A CN 104356996 A CN104356996 A CN 104356996A
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Abstract
The invention relates to the technical field of glue, particularly to a high-curing rate ultraviolet light curing modified adhesive for circuit boards. The high-curing rate ultraviolet light curing modified adhesive for circuit boards is prepared from the following raw materials in parts by weight: 50-60 parts of home-made tri-functional urethane acrylate, 1-2 parts of pigments, 2-5 parts of a photo-polymerization initiator, 10-20 parts of a reactive diluent and 1-5 parts of a coupling agent. The home-made tri-functional urethane acrylate is capable of strengthening the photo reactivity, increasing the crosslinking intensity and shortening the photo-curing time, and the auxiliaries such as the coupling agent and the like are capable of increasing the toughness and the shearing strength, so that the high-curing rate ultraviolet light curing modified adhesive for circuit boards shows relatively high comprehensive performance.
Description
Technical field
The present invention relates to glue technical field, particularly relate to a kind of high solidification rate circuit card ultraviolet light polymerization modified adhesive.
Background technology
In recent years, along with people are to the raising day by day of environmental requirement, the development of solvent-free expediting setting type resin is progressively paid attention to.Ultraviolet photo-curing cementing agent significantly can reduce the volatilizable organism of VOC() content, and by solidifying immediately after ultraviolet light irradiation during room temperature.Therefore, compared with traditional tackiness agent, ultraviolet photo-curing cementing agent has the advantages such as pollution-free, quick solidifying, is a kind of environmentally friendly tackiness agent, and has been widely used in the fields such as optics, electronics, medical treatment, automobile and precision instruments.
Urethane acrylate is one of important matrix resin of curing field, wherein containing ammonia ester bond, multiple hydrogen bond can be formed between macromolecular chain, be that cured article has that wear resistance is excellent, snappiness good, elongation at break is high, resistance to active drug is strong, resistant of high or low temperature is excellent, shock-resistance and to all good plurality of advantages of base material sticking power, and the solvent of the finished product is few, environmental protection low toxicity, solidification is convenient and energy-saving and cost-reducing.Therefore, urethane acrylate develops rapidly in curable adhesive, and is widely used in the multiple fields such as circuit board fabrication, electronic devices and components assembling and bonding fiber.But now most of urethane acrylate class ultraviolet photo-curing cementing agents on the market to utilize in polyisocyanates hydroxyl in isocyanate group and polyvalent alcohol to translate, and utilize the acrylate of hydroxyl to introduce photolytic activity group, prepared tackiness agent has the shortcomings such as the active low and rate of polymerization of complex process, photopolymerization reaction is slower, and often in the curing process occurs the incomplete phenomenon of solidification.
Summary of the invention
The present invention is directed to above-mentioned background technology, a kind of high solidification rate circuit card ultraviolet light polymerization modified adhesive is provided.
For realizing the object of the invention, the technical solution used in the present invention is as follows:
A kind of high solidification rate circuit card ultraviolet light polymerization modified adhesive, is characterized in that: count by weight, is prepared from by following raw material: self-control trifunctional urethane acrylate: 50 ~ 60 parts; Pigment: 1 ~ 2 part; Photoepolymerizationinitiater initiater: 2 ~ 5 parts; Reactive thinner: 10 ~ 20 parts; Coupling agent: 1 ~ 5 part;
Described self-control trifunctional urethane acrylate is prepared from by following steps: hexamethylene diisocyanate trimer and Propylene glycol monoacrylate, dibutyl tin laurate, Resorcinol are mixed and heated to 50 ~ 70 DEG C, continues 1 ~ 3h, to obtain final product.
Further, described one high solidification rate circuit card ultraviolet light polymerization modified adhesive is counted by weight, is prepared from by following raw material: self-control trifunctional urethane acrylate: 55 parts; Pigment: 1 part; Photoepolymerizationinitiater initiater: 5 parts; Reactive thinner: 15 parts; Coupling agent: 3 parts.
Further, described reactive thinner is 1,6 hexanediol diacrylate or dipentaerythritol five acrylate.
Further, described Photoepolymerizationinitiater initiater is 2,4,6-trimethylbenzoyl-diphenyl phosphorus oxide, 2,2 '-diethoxy acetophenone or said mixture.
Further, described coupling agent is 3-Trimethoxy silane propyl acrylate.
Present invention also offers a kind of making method of above-mentioned a kind of high solidification rate circuit card ultraviolet light polymerization modified adhesive, comprise the following steps: trifunctional urethane acrylate, pigment, reactive thinner, coupling agent will be made by oneself, abundant mixing is also heated to 30 ~ 50 DEG C of stirring 10 ~ 30min, add Photoepolymerizationinitiater initiater again, stir, then leave standstill cooling and get final product.
The invention provides a kind of high solidification rate circuit card ultraviolet light polymerization modified adhesive, beneficial effect is as follows:
A kind of high solidification rate circuit card ultraviolet light polymerization modified adhesive of the present invention, because Light Curing is actually the crosslinking curing process of photoresponse group, the present invention makes the photoresponse group double bond that trifunctional urethane acrylate can provide more by oneself, reactive behavior strengthens, cross-linking density increases gradually, so the set time of tackiness agent shortens.Add the auxiliary agents such as coupling agent simultaneously and increase snappiness and shearing resistance, make this tackiness agent show higher over-all properties.
Embodiment
Below in conjunction with embodiment, the present invention will be further described.
Embodiment 1:
Described one high solidification rate circuit card ultraviolet light polymerization modified adhesive is counted by weight, is prepared from by following raw material: self-control trifunctional urethane acrylate: 55 parts; Pigment: 1 part; 2,4,6-trimethylbenzoyl-diphenyl phosphorus oxide: 5 parts; 1,6 hexanediol diacrylate: 15 parts; 3-Trimethoxy silane propyl acrylate: 3 parts.
Described self-control trifunctional urethane acrylate is prepared from by following steps: hexamethylene diisocyanate trimer and Propylene glycol monoacrylate, dibutyl tin laurate, Resorcinol are mixed and heated to 50 ~ 70 DEG C, continues 1 ~ 3h, to obtain final product.
Trifunctional urethane acrylate, pigment, 1 will be made by oneself, 6-hexanediyl ester, 3-Trimethoxy silane propyl acrylate, abundant mixing is also heated to 30 DEG C of stirring 10min, add 2 again, 4,6-trimethylbenzoyl-diphenyl phosphorus oxide, stirs, and then leaves standstill cooling and namely obtains a kind of high solidification rate circuit card ultraviolet light polymerization modified adhesive.
Embodiment 2:
Described one high solidification rate circuit card ultraviolet light polymerization modified adhesive is counted by weight, is prepared from by following raw material: self-control trifunctional urethane acrylate: 60 parts; Pigment: 2 parts; 2,2 '-diethoxy acetophenone: 4 parts; Dipentaerythritol five acrylate: 18 parts; 3-Trimethoxy silane propyl acrylate: 5 parts.
Described self-control trifunctional urethane acrylate is prepared from by following steps: hexamethylene diisocyanate trimer and Propylene glycol monoacrylate, dibutyl tin laurate, Resorcinol are mixed and heated to 50 ~ 70 DEG C, continues 1 ~ 3h, to obtain final product.
Trifunctional urethane acrylate, pigment, dipentaerythritol five acrylate, 3-Trimethoxy silane propyl acrylate will be made by oneself, abundant mixing is also heated to 50 DEG C of stirring 30min, add 2 again, 2 '-diethoxy acetophenone, stir, then leave standstill cooling and namely obtain a kind of high solidification rate circuit card ultraviolet light polymerization modified adhesive.
Claims (6)
1. a high solidification rate circuit card ultraviolet light polymerization modified adhesive, is characterized in that: count by weight, is prepared from by following raw material: self-control trifunctional urethane acrylate: 50 ~ 60 parts; Pigment: 1 ~ 2 part; Photoepolymerizationinitiater initiater: 2 ~ 5 parts; Reactive thinner: 10 ~ 20 parts; Coupling agent: 1 ~ 5 part;
Described self-control trifunctional urethane acrylate is prepared from by following steps: hexamethylene diisocyanate trimer and Propylene glycol monoacrylate, dibutyl tin laurate, Resorcinol are mixed and heated to 50 ~ 70 DEG C, continues 1 ~ 3h, to obtain final product.
2. one according to claim 1 high solidification rate circuit card ultraviolet light polymerization modified adhesive, it is characterized in that: described one high solidification rate circuit card ultraviolet light polymerization modified adhesive is counted by weight, is prepared from by following raw material: self-control trifunctional urethane acrylate: 55 parts; Pigment: 1 part; Photoepolymerizationinitiater initiater: 5 parts; Reactive thinner: 15 parts; Coupling agent: 3 parts.
3. one according to claim 1 high solidification rate circuit card ultraviolet light polymerization modified adhesive, is characterized in that: described reactive thinner is 1,6 hexanediol diacrylate or dipentaerythritol five acrylate.
4. one according to claim 1 high solidification rate circuit card ultraviolet light polymerization modified adhesive, it is characterized in that: described Photoepolymerizationinitiater initiater is 2,4,6-trimethylbenzoyl-diphenyl phosphorus oxide, 2,2 '-diethoxy acetophenone or said mixture.
5. one according to claim 1 high solidification rate circuit card ultraviolet light polymerization modified adhesive, is characterized in that: described coupling agent is 3-Trimethoxy silane propyl acrylate.
6. one according to claim 1 high solidification rate circuit card ultraviolet light polymerization modified adhesive, it is characterized in that: the making method of described a kind of high solidification rate circuit card ultraviolet light polymerization modified adhesive, comprise the following steps: trifunctional urethane acrylate, pigment, reactive thinner, coupling agent will be made by oneself, abundant mixing is also heated to 30 ~ 50 DEG C of stirring 10 ~ 30min, add Photoepolymerizationinitiater initiater again, stir, then leave standstill cooling and get final product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410583825.0A CN104356996A (en) | 2014-10-28 | 2014-10-28 | High-curing rate ultraviolet light curing modified adhesive for circuit boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410583825.0A CN104356996A (en) | 2014-10-28 | 2014-10-28 | High-curing rate ultraviolet light curing modified adhesive for circuit boards |
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| CN104356996A true CN104356996A (en) | 2015-02-18 |
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| CN201410583825.0A Pending CN104356996A (en) | 2014-10-28 | 2014-10-28 | High-curing rate ultraviolet light curing modified adhesive for circuit boards |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108359053A (en) * | 2018-02-01 | 2018-08-03 | 中国科学院福建物质结构研究所 | A kind of compositions of ultraviolet curing type and its preparation method and application |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997040115A1 (en) * | 1996-04-25 | 1997-10-30 | Nippon Kayaku Kabushiki Kaisha | Ultraviolet-curing adhesive composition and article |
| CN103436213A (en) * | 2013-09-09 | 2013-12-11 | 烟台德邦科技有限公司 | Ultraviolet-curing type optical resin adhesive and preparation method thereof |
-
2014
- 2014-10-28 CN CN201410583825.0A patent/CN104356996A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997040115A1 (en) * | 1996-04-25 | 1997-10-30 | Nippon Kayaku Kabushiki Kaisha | Ultraviolet-curing adhesive composition and article |
| CN103436213A (en) * | 2013-09-09 | 2013-12-11 | 烟台德邦科技有限公司 | Ultraviolet-curing type optical resin adhesive and preparation method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 张银钟等: "UV固化三官能度PUA胶粘剂的合成及其性能研究", 《中国胶粘剂》 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108359053A (en) * | 2018-02-01 | 2018-08-03 | 中国科学院福建物质结构研究所 | A kind of compositions of ultraviolet curing type and its preparation method and application |
| CN108359053B (en) * | 2018-02-01 | 2019-12-24 | 中国科学院福建物质结构研究所 | Ultraviolet curing composition and preparation method and application thereof |
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Application publication date: 20150218 |
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