CN104347280A - Continuous heat treating device and method for heat treatment of chips by means of continuous heat treating device - Google Patents
Continuous heat treating device and method for heat treatment of chips by means of continuous heat treating device Download PDFInfo
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- CN104347280A CN104347280A CN201310656907.9A CN201310656907A CN104347280A CN 104347280 A CN104347280 A CN 104347280A CN 201310656907 A CN201310656907 A CN 201310656907A CN 104347280 A CN104347280 A CN 104347280A
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Abstract
The invention provides a continuous heat treating device and a method for heat treatment of chips by means of the continuous heat treating device. The continuous heat treating device comprises a framework; a continuous heating furnace formed in the framework and provided with a hollow part; rollers formed under the continuous heating furnace; barrels which move along a direction under the action of the rollers; and a heating member formed on one side of the continuous heating furnace.
Description
This application claims the rights and interests of the 10-2013-0092971 korean patent application submitted in Korean Intellectual Property Office on August 6th, 2013, the open of this application is contained in this by reference.
Technical field
The disclosure relate to a kind of can the apparatus for continous heat treatment of the multiple chip of continuous heat and a kind of method utilizing this apparatus for continous heat treatment heat treatment chip.
Background technology
Recently, the mancarried device microminaturization of such as cellular phone, tablet PC (PC) or camera etc. has been made and ultralightization.
In such mancarried device, employ various types of assembly, especially multiple capacitor and inductor etc.
In order to make multilayer ceramic electronic component have microsize and ultra-high capacity, in multilayer ceramic electronic component, usually increasing area and the number thereof of internal electrode, thus can electrical characteristics be guaranteed.
Especially, when the thickness reducing outer electrode does not above change whole chip size multilayer ceramic electronic component to be arranged on printed circuit board (PCB) (PCB), can be increased the quantity of stacking internal electrode by the thickness of the reduction of outer electrode, this is conducive to designing the capacitance level of the multilayer ceramic electronic component of such as multilayer ceramic capacitor etc.
Structure according to the multilayer ceramic electronic component of correlation technique will be described.Comprise the internal electrode utilizing the granuloplastic dielectric layer of ceramic dielectric powders and utilize internal electrode paste to be formed on the dielectric layer according to the multilayer ceramic electronic component of correlation technique, and be there is the polylayer forest formed by stacking dielectric layer.
More particularly, dielectric layer is formed by making ceramic dielectric powders particle, organic binder bond and organic solvent etc. be mixed with each other to prepare slip and slip is formed as sheet.
The internal electrode paste come for the preparation of forming internal electrode is dispersed in organic binder bond and organic solvent etc. by making the metal powder granulates of such as nickel by powder particle etc.
Polylayer forest is formed, suppress, fire and cuts, thus produce chip.
Outer electrode be arranged on chip its on multiple part of side surface of exposed inner electrode and two end surfaces.Here, outer electrode is formed by copper (Cu) usually.
Usually, in order to form outer electrode, copper (Cu) powder particle is used as conductive powder particle, and mixes with the organic carrier used in frit, binder resin and organic solvent, with the electroconductive paste for the preparation of outer electrode.
After being used for the electroconductive paste of outer electrode to the end surfaces coating of chip, fire chip to form outer electrode.
But in multilayer ceramic capacitor in normally used copper (Cu) outer electrode, when the thickness of outer electrode reduces, the insufficient total amount of solids content, make the feature deterioration in the bight covering chip, and the density of outer electrode significantly reduces.
Therefore, in order to address these problems, developed the technology using electrically conductive polymer resin.
When using electrically conductive polymer resin, compared with the situation of formation copper (Cu) outer electrode according to correlation technique, improve moisture-proof reliability.
The degree of adhesion of electrically conductive polymer resin is lower than the degree of adhesion of normally used copper (Cu) outer electrode.But, can be assigned to improve the bonding of electrically conductive polymer resin by the one-tenth changing curing time or electrically conductive polymer resin.
Usually, when electrically conductive polymer resin, utilize box type furnace to perform curing operation.
But, when box type furnace, owing to performing curing operation in the confined space, because this reducing workability, and need considerable time to make electrically conductive polymer resin be cooled to room temperature after making electrically conductive polymer resin solidification.
In addition, in order to use box type furnace, need the beamhouse operation of the installation product required for the curing operation in box type furnace, this needs considerable time.
Therefore, the apparatus and method that can be easy to heat-treat the chip using conducting polymer to form outer electrode are thereon needed.
Relate art literature (patent documentation 1) below relates to the infrared heating equipment for electrostatic spraying powder coating.
[relate art literature]
(patent documentation 1) 10-0863012 Korean Patent
Summary of the invention
One side of the present disclosure can provide a kind of can the apparatus for continous heat treatment of the multiple chip of continuous heat and a kind of method utilizing its heat treatment chip.
According to one side of the present disclosure, a kind of apparatus for continous heat treatment can comprise: framework; Continuous furnace, is formed in the frame and has hollow bulb; Roller bearing, is formed in the bottom of continuous furnace; Bucket, moves along a direction under the effect of roller bearing; And heater, be formed on the side of continuous furnace.
Described apparatus for continous heat treatment can also comprise: multiple chip, to be embedded in bucket and to have the outer electrode utilizing conducting polymer to be formed.
Bucket can move along a direction while rotation.
The translational speed of bucket can be 10mm/min.
Continuous furnace can comprise first paragraph in the direction of movement to the 3rd section, and the temperature of second segment can maintain 200 DEG C to 270 DEG C.
The temperature of first paragraph can rise to 200 DEG C to 270 DEG C along moving direction from room temperature.
The temperature of the 3rd section can decline along moving direction.
According to another aspect of the present disclosure, a kind of method of heat treatment chip can comprise the steps: on multiple chip, utilize conducting polymer to form outer electrode; Chip is embedded in bucket; Bucket is arranged on roller bearing; Make bucket along heat treatment chip while a direction movement utilizing roller bearing; And extract chip from bucket.
In the step of heat treatment chip, bucket can move along a direction while rotation.
In the step of heat treatment chip, the translational speed of bucket can be 10mm/min.
In the step of heat treatment chip, heat treatment temperature can comprise the temperature along the first paragraph of moving direction to the 3rd section, and the temperature of second segment can maintain 200 DEG C to 270 DEG C.
The temperature of first paragraph can rise to 200 DEG C to 270 DEG C along moving direction from room temperature.
The temperature of the 3rd section can decline along moving direction.
Accompanying drawing explanation
The following detailed description of carrying out in conjunction with the drawings, more clearly will understand above and other aspect of the present disclosure, other advantages of characteristic sum, in the accompanying drawings:
Fig. 1 is the schematic cross sectional views of the apparatus for continous heat treatment according to disclosure exemplary embodiment;
Fig. 2 illustrates the curve chart depending on the heat treatment temperature of each section in apparatus for continous heat treatment according to disclosure exemplary embodiment; And
Fig. 3 is the indicative flowchart of the method for heat treatment chip according to another exemplary embodiment of the disclosure.
Embodiment
Exemplary embodiment of the present disclosure is described in detail now with reference to accompanying drawing.
Fig. 1 is the schematic cross sectional views of the apparatus for continous heat treatment according to disclosure exemplary embodiment.
The structure of the apparatus for continous heat treatment according to disclosure exemplary embodiment is described with reference to Fig. 1.Framework 10 can be comprised according to the apparatus for continous heat treatment of disclosure exemplary embodiment, be formed in framework 10 and have the continuous furnace 20 of hollow bulb, the roller bearing 30 be formed in the bottom of continuous furnace 20, under the effect of roller bearing 30 along the bucket 40 of a direction movement and the heater 50 that is formed in the top of continuous furnace 20.
Framework 10 can be formed by iron material, and wherein, framework 10 corresponds to the framework according to the apparatus for continous heat treatment of disclosure exemplary embodiment.
Continuous furnace 20 can be equipped with to framework 10.
Continuous furnace 20 can have cylindrical or rectangular column shape and have hollow bulb, makes the inside of continuous furnace 20 can be empty.
Continuous furnace 20 can comprise formation thermal insulation layer on its outer surface, and wherein, thermal insulation layer comprises heat insulator.
Thermal insulation layer can prevent the outside of heat from the internal discharge of continuous furnace 20 to continuous furnace 20.In addition, thermal insulation layer can prevent extraneous air to be introduced in the inside of continuous furnace 20.
Continuous furnace 20 can have entrance I and outlet O.
Roller bearing 30 can be formed with in the bottom of continuous furnace 20.
Roller bearing 30 can rotate under the effect of drive part 60 in the lower part being formed at framework 10.
More particularly, roller bearing 30 can be connected to drive part 60 by belt or chain etc., thus rotates along a direction when drive part 60 runs.
Roller bearing 30 can utilize and the polymer of resistance to 300 DEG C or higher temperature can be formed as having cylinder form.
In addition, roller bearing 30 can also be formed with jagged gear shape.
The schematic cross sectional views of roller bearing 30 and bucket 40 has been shown in the zoomed-in view of Fig. 1.
With reference to the zoomed-in view of Fig. 1, roller bearing 30 can be provided with bucket 40.
Bucket 40 can be formed as being empty cylinder form therein, if necessary also can comprise the jagged wheel on surface disposed thereon and lower surface.
Bucket 40 can be moved along a direction by roller bearing 30.
Such as, when roller bearing 30 is rotated in a clockwise direction, bucket 40 can move from left to right.
Also have cylinder form because bucket 40 is similar to roller bearing 30, therefore when roller bearing 30 is rotated in a clockwise direction, bucket 40 can rotate in the counterclockwise direction while a direction movement.
The multiple chips be heat-treated can be embedded in bucket 40.
That is, because bucket 40 is rotating while a direction movement, the position being therefore embedded in the multiple chips in bucket 40 can change according to the movement of bucket 40.
Therefore, when multiple chip is through preventing the phenomenon only applying heat along a direction during continuous furnace 20, the multiple chip of heat treatment is equably made it possible to.
When roller bearing 30 has toothed wheel shape and bucket 40 also comprises the toothed wheel on surface disposed thereon and lower surface, the toothed wheel of roller bearing 30 and the toothed wheel of bucket 40 can be engaged with each other.
That is, due under the state that is engaged with each other at the toothed wheel of roller bearing 30 and the toothed wheel of bucket 40, bucket 40 moves under the effect of roller bearing 30, and therefore bucket 40 can move while rotation.
Suitably can control the quantity of the quantity of the toothed wheel of roller bearing 30 and the toothed wheel of bucket 40, thus bucket 40 can move along a direction.
Bucket 40 can move with the speed of 10mm/ minute in continuous furnace 20.
Apparatus for continous heat treatment according to disclosure exemplary embodiment can also comprise air injection device 70.
Air injection device 70 can by air Injection to continuous furnace 20 to control air atmosphere.
That is, air injection device 70 can make multiple air tank be connected to each other, to control the air atmosphere in continuous furnace 20.
Such as, air injection device 70 can inject the inert gas of such as argon gas, and if the words of necessity can inject oxygen or nitrogen etc.
For the situation of multi-layered type ceramic electronic assembly, in heat treatment process, air can make the internal electrode oxidation be formed in ceramic dielectric layers.
Therefore, air injection device 70 can control the air atmosphere in continuous furnace 20, to prevent internal electrode oxidized.
Continuous furnace 20 can have formation heater 50 on one side thereof.
More particularly, heater 50 can be formed in the top of continuous furnace 20.
Heater 50 can be used as the thermal source applying heat to continuous furnace 20.
Heater 50 can utilize resistive conductor to be formed.Selectively, the device injecting high temperature air can be used as heater 50.
Heater 50 can make each section of the inside of continuous furnace 20 on the length direction of continuous furnace 20, have different temperature.
As shown in fig. 1, continuous furnace 20 can be divided into first paragraph, second segment and the 3rd section in their length direction, heater 50 can change the heat of the applying in each section, has different temperature to make each section of the inside of continuous furnace 20 on the length direction of continuous furnace 20.
Therefore, because bucket 40 moves in continuous furnace 20, therefore can heat-treat the multiple chips be embedded in bucket 40 at different temperature.
More particularly, the temperature of each section has been shown in Fig. 2.
Fig. 2 illustrates the curve chart depending on the heat treatment temperature of each section in apparatus for continous heat treatment according to disclosure exemplary embodiment.
When utilizing the apparatus for continous heat treatment according to disclosure exemplary embodiment, can multiple chips with the outer electrode utilizing conducting polymer to be formed be heat-treated.
More particularly, can perform to multiple chips with the outer electrode utilizing conducting polymer to be formed the technique making the outer electrode hot curing utilizing conducting polymer to be formed.
The hot curing non-reactive group referred in polymer reacts because of heating to form network structure, thus makes polymer change over insoluble and not molten state from initial heated plastic state.
In order to perform hot curing as above, as shown in Figure 2, the temperature of second segment can be made to maintain in the scope of 200 DEG C to 270 DEG C according to the apparatus for continous heat treatment of disclosure exemplary embodiment.
The temperature of second segment can be controlled by the displacement controlling bucket 40 according to the apparatus for continous heat treatment of disclosure exemplary embodiment.
As shown in Figure 2, first paragraph can be configured such that temperature rises to the temperature of 200 DEG C to 270 DEG C from room temperature.
In addition, as shown in Figure 2, the 3rd section of end that can be configured such that temperature becomes towards the 3rd section in continuous furnace 20 reduces to drop to room temperature.
Usually, when utilizing box type furnace to make conducting polymer hot curing, may need to make conducting polymer be cooled to room temperature for a long time.
But, owing to making bucket 40 perform cooling according to the apparatus for continous heat treatment of disclosure exemplary embodiment while a direction movement in continuous furnace 20, therefore can most conducting polymer be made to cool the half of the time of needs in the method for conducting polymer hot curing utilizing box type furnace to make the time decreased being used for cooling conducting polymer needs.
In addition, because multiple chip described above is embedded in bucket 40, therefore can omit as arranged in metallic mesh in box type furnace and the technique of loading.
When utilizing box type furnace to perform hot curing, because multiple chip should load at predetermined intervals, making to perform heat treatment equably, therefore can need a very long time.But, according to exemplary embodiment of the present disclosure, due to the technique of loading multiple chip can be omitted, therefore can boost productivity.
Therefore, when utilizing box type furnace, can heat treatment 750,000 chip the time periods of every 12 hours.But, when utilizing the apparatus for continous heat treatment according to disclosure exemplary embodiment, can the time period heat treatment 27,000 of every 12 hours, 000 chip.
Fig. 3 is the indicative flowchart of the method for heat treatment chip according to another exemplary embodiment of the disclosure.
The method of heat treatment chip is described with reference to Fig. 3.
With reference to Fig. 3, the method according to the heat treatment chip of another exemplary embodiment of the disclosure can comprise: on multiple chip, utilize conducting polymer to form outer electrode (S110); Chip is embedded in (S120) in bucket; Bucket is arranged on (S130) on roller bearing; Utilizing roller bearing, bucket is heat-treated (S140) while a direction movement to chip; And extract chip (S150) from bucket.
In order to describe the method for the heat treatment chip according to another exemplary embodiment of the disclosure in detail, the method manufacturing multilayer ceramic electronic component will be described.
Although will describe the method manufacturing multilayer ceramic capacitor by way of example, the disclosure is not limited thereto.
First, can prepare to comprise dielectric layer and be arranged to the first internal electrode facing with each other and the ceramic body of the second internal electrode, wherein, dielectric layer is between the first internal electrode and the second internal electrode.
Dielectric layer can, by by applying slip on a carrier film and making slip dry and some μm of preparation thick ceramic green sheets are formed, wherein, utilize basket type sand mill to pass through to make such as barium titanate (BaTiO
3) powder particle of powder particle etc. and ceramic additive, organic solvent, plasticizer, binding agent and dispersant form slip.
Then, can by electroconductive paste to be dispersed on raw cook and to make scraper plate move along a direction interior electrode layer being formed and formed by electroconductive paste.
Here, electroconductive paste can be formed by least one in precious metal material, nickel (Ni) and the copper (Cu) of such as silver (Ag), plumbous (Pb) or platinum (Pt) etc., or can be formed by the mixture of at least two kinds in precious metal material, nickel (Ni) and the copper (Cu) of such as silver (Ag), plumbous (Pb) or platinum (Pt) etc.
After forming interior electrode layer as mentioned above, raw cook can be made to be separated with carrier film, multiple raw cook can be stacked into and to overlap each other, thus form raw cook polylayer forest.
Then, raw cook polylayer forest can be suppressed at high temperature under high pressure, then cut raw cook polylayer forest by cutting technique with predetermined size, thus produce chip.
The chip of manufacture described above can have the internal electrode exposure surface thereon utilizing electroconductive paste to be formed.
Can chip its on exposed inner electrode surface on form the first outer electrode and the second outer electrode, thus be electrically connected to internal electrode.
Outer electrode can be arranged on chip its on expose have the side surface of internal electrode part and two end surfaces on.Here, outer electrode can be formed by copper (Cu) usually.
According to correlation technique, in order to form outer electrode, copper (Cu) powder particle can be used as conductive powder particle and can mix with the organic carrier used in frit, binder resin and organic solvent, with the electroconductive paste for the preparation of outer electrode.
After the end surfaces of conducting paste to chip that outer electrode will be used for, chip can be fired to form outer electrode.
But, usually be used in the copper in multilayer ceramic capacitor (Cu) outer electrode, when reducing the thickness of outer electrode, the absolute magnitude of solids content is not enough, thus the feature deterioration in the bight of covering chip may be made, and significantly may reduce the density of outer electrode.
Therefore, in order to address these problems, electrically conductive polymer resin can be utilized to form outer electrode.
That is, the metal dust of such as silver (Ag) powder with excellent conductivity type can be disperseed in epoxide polymer resin, with the electroconductive paste for the preparation of outer electrode.
In fluoropolymer resin, disperse scheduled volume or more to measure have superior electrical conductivity such as silver material, the metal powder granulates be included in fluoropolymer resin can be electrically connected to each other.
Therefore, when the fluoropolymer resin prepared by method as above is applied to film, fluoropolymer resin can have conductivity.
That is, conducting polymer can have the feature of the characteristic sum conductivity of polymer.
Owing to being used as the epoxy resin of fluoropolymer resin, there are very high viscosity and degree of adhesion etc., therefore its can be adhered to very by force chip its on the surface of exposed inner electrode.
In addition, because epoxy resin has high viscosity, even if therefore when using epoxy resin that outer electrode is formed as film, the bight of chip also can have predetermined thickness.
That is, when using electrically conductive polymer resin, with form the situation of copper (Cu) outer electrode according to correlation technique compared with, moisture-proof reliability can be improved.
The conducting paste for outer electrode using conducting polymer prepare can there be is the surface (S110) of internal electrode to its upper exposure of chip.
Then, in order to make conducting polymer solidify, need to perform heat treatment to conducting polymer.
Therefore, multiple chips with the outer electrode utilizing conducting polymer to be formed can be incorporated in the bucket 40 according to the apparatus for continous heat treatment of disclosure exemplary embodiment (S120).
When the multiple chip bucket 40 embedded within it is injected into (S130) in the entrance I of continuous furnace 20, bucket 40 can move along a direction under the effect of roller bearing 30 in the bottom being formed in continuous furnace 20.
Bucket can be made while a direction movement to perform the step (S140) of heat-treating chip utilizing roller bearing.
That is, along with bucket 40 moves along a direction in continuous furnace 20, bucket 40 sequentially can pass first paragraph, second segment and the 3rd section.
As mentioned above, continuous furnace 20 can have the heater 50 in the portion of being formed thereon, and wherein, heater 50 determines the temperature of first to the 3rd section divided along the length direction of continuous furnace 20.
As shown in Figure 2, the temperature being applied to bucket 40 can raise through during first paragraph gradually at bucket 40.
Then, when bucket 40 is through second segment, bucket 40 can maintain the temperature of 200 DEG C to 270 DEG C.
That is, the conducting polymer be formed in bucket 40 on chip can be cured in second segment.
At bucket 40 through after second segment, the temperature being applied to bucket 40 can reduce gradually while bucket 40 is through the 3rd section.
But patent documentation 1 does not openly utilize lens type bucket.
In addition, patent documentation 1 does not have open as made the method for the outer electrode solidification utilizing conducting polymer to be formed within the context of the present disclosure by the temperature changing each section along its length.
When using the laser heating processing unit according to disclosure exemplary embodiment, the time for making conducting polymer cool needs can be reduced in Technology for Heating Processing in the related for making conducting polymer cool the only about half of of the time needed.
Therefore, compared with correlation technique, the method according to the heat treatment chip of another exemplary embodiment of the disclosure can improve productivity ratio significantly.
In the method for the heat treatment chip according to another embodiment embodiment of the disclosure, owing to utilizing roller bearing 30, bucket 40 is moved along a direction, therefore, when roller bearing 30 is rotated in a clockwise direction, bucket 40 can move along a direction while rotating in the counterclockwise direction.
Utilizing in the method for box type furnace heat treatment chip according to correlation technique, due to the characteristic of box type furnace, cause the temperature being applied to chip can change according to the position of loading chip.
Therefore, when a large amount of chip of heat treatment, the heat treatment temperature being positioned at the chip at center is different from each other with the heat treatment temperature being positioned at the chip being close to heater, thus the characteristic of chip is uneven.
But in the method for the heat treatment chip according to another exemplary embodiment of the disclosure, owing to using the apparatus for continous heat treatment according to disclosure exemplary embodiment, therefore chip can during heating treatment rotate continuously in bucket 40.
That is, because bucket 40 moves along a direction while rotation, therefore can heat-treat the chip be embedded in bucket 40 while the position changing bucket 40 continuously.
Therefore, the phenomenon only applying heat along a direction can be prevented, and the phenomenon as produced deviation in the characteristic of chip when using box type furnace can be prevented.
Therefore, when using the method according to the heat treatment chip of another exemplary embodiment of the disclosure, productivity ratio can be made compared with correlation technique to increase significantly, and can prevent the characteristic aspect of the chip manufactured from producing deviation.
As set forth above, use the apparatus for continous heat treatment according to disclosure exemplary embodiment, therefore can reduce the time required for outer electrode solidification making to utilize conducting polymer to be formed.
Decrease the time made required for outer electrode solidification, the productivity ratio of chip therefore can be made to increase significantly.
Although illustrate and describe exemplary embodiment above, for those skilled in the art it will be clear that, can make when not departing from the spirit and scope of the present disclosure that claim limits amendment and distortion.
Claims (13)
1. an apparatus for continous heat treatment, described apparatus for continous heat treatment comprises:
Framework;
Continuous furnace, is formed in the frame and has hollow bulb;
Roller bearing, is formed in the bottom of continuous furnace;
Bucket, moves along a direction under the effect of roller bearing; And
Heater, is formed on the side of continuous furnace.
2. apparatus for continous heat treatment as claimed in claim 1, described apparatus for continous heat treatment also comprises: multiple chip, to be embedded in bucket and to have the outer electrode utilizing conducting polymer to be formed.
3. apparatus for continous heat treatment as claimed in claim 1, wherein, bucket moves along a direction while rotation.
4. apparatus for continous heat treatment as claimed in claim 1, wherein, the translational speed of bucket is 10mm/min.
5. apparatus for continous heat treatment as claimed in claim 1, wherein, continuous furnace comprises first paragraph in the direction of movement to the 3rd section, and
The temperature of second segment maintains 200 DEG C to 270 DEG C.
6. apparatus for continous heat treatment as claimed in claim 5, wherein, the temperature of first paragraph rises to 200 DEG C to 270 DEG C along moving direction from room temperature.
7. apparatus for continous heat treatment as claimed in claim 5, wherein, the temperature of the 3rd section declines along moving direction.
8. a method for heat treatment chip, described method comprises the steps:
Multiple chip utilize conducting polymer form outer electrode;
Chip is embedded in bucket;
Bucket is arranged on roller bearing;
Make bucket along heat treatment chip while a direction movement utilizing roller bearing; And
Chip is extracted from bucket.
9. method as claimed in claim 8, wherein, in the step of heat treatment chip, bucket moves along a direction while rotation.
10. method as claimed in claim 8, wherein, in the step of heat treatment chip, the translational speed of bucket is 10mm/min.
11. methods as claimed in claim 8, wherein, in the step of heat treatment chip, heat treatment temperature comprises the temperature along the first paragraph of moving direction to the 3rd section, and
The temperature of second segment maintains 200 DEG C to 270 DEG C.
12. methods as claimed in claim 11, wherein, the temperature of first paragraph rises to 200 DEG C to 270 DEG C along moving direction from room temperature.
13. methods as claimed in claim 11, wherein, the temperature of the 3rd section declines along moving direction.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2013-0092971 | 2013-08-06 | ||
| KR20130092971 | 2013-08-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104347280A true CN104347280A (en) | 2015-02-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310656907.9A Pending CN104347280A (en) | 2013-08-06 | 2013-12-06 | Continuous heat treating device and method for heat treatment of chips by means of continuous heat treating device |
Country Status (1)
| Country | Link |
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| CN (1) | CN104347280A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110937629A (en) * | 2019-12-07 | 2020-03-31 | 西北有色金属研究院 | Method for preparing Bi-2212 precursor powder by inclined rotary sintering method |
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| JP2002147963A (en) * | 2000-08-30 | 2002-05-22 | Tokai Konetsu Kogyo Co Ltd | Push off type tunnel furnace and bed plate and pad used in tunnel furnace |
| JP2005315461A (en) * | 2004-04-27 | 2005-11-10 | Pioneer Electronic Corp | Heat treatment apparatus and heat treatment method |
| CN1933080A (en) * | 2006-04-04 | 2007-03-21 | 乐金电子（南京）等离子有限公司 | Heat processing device for plasma display panel production |
| KR100863012B1 (en) * | 2007-05-21 | 2008-10-13 | 한국전기연구원 | Infrared ray heating apparatus for electrostatic spray coating of power paint |
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| CN2235955Y (en) * | 1994-09-12 | 1996-09-25 | 机械工业部第四设计研究院 | Rotary conveying mechanism for cylindrical work piece |
| JP2002147963A (en) * | 2000-08-30 | 2002-05-22 | Tokai Konetsu Kogyo Co Ltd | Push off type tunnel furnace and bed plate and pad used in tunnel furnace |
| JP2005315461A (en) * | 2004-04-27 | 2005-11-10 | Pioneer Electronic Corp | Heat treatment apparatus and heat treatment method |
| CN1933080A (en) * | 2006-04-04 | 2007-03-21 | 乐金电子（南京）等离子有限公司 | Heat processing device for plasma display panel production |
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| CN110937629A (en) * | 2019-12-07 | 2020-03-31 | 西北有色金属研究院 | Method for preparing Bi-2212 precursor powder by inclined rotary sintering method |
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