CN104344258A - LED lamp - Google Patents
LED lamp Download PDFInfo
- Publication number
- CN104344258A CN104344258A CN201410522886.6A CN201410522886A CN104344258A CN 104344258 A CN104344258 A CN 104344258A CN 201410522886 A CN201410522886 A CN 201410522886A CN 104344258 A CN104344258 A CN 104344258A
- Authority
- CN
- China
- Prior art keywords
- heat
- led
- heating column
- conducting glue
- mounting structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
- F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
Abstract
The invention relates to an LED lamp. The LED lamp comprises a radiating fin, wherein an aluminum substrate is arranged above the radiating fin; heat-conducting glue is arranged above the aluminum substrate; a heat-conducting column is arranged above the heat-conducting glue; an LED mounting structure is arranged above the heat-conducting column; an LED chip is arranged on the LED mounting structure; a transparent casing is arranged above the LED chip; a closed structure is formed by the transparent casing and a base; the LED chip mounting structure, the heat-conducting column, the heat-conducting glue, the aluminum substrate and the radiating fin are connected through a heat-conducting passage. The LED lamp is simple in structure, energy-saving and environment-friendly, and a radiating structure is designed, so that the service life of an LED can be greatly prolonged.
Description
Technical field
The present invention relates to semiconductor illumination device, particularly relate to a kind of LED.
Background technology
LED illumination has three advantages main: energy-saving and environmental protection, green illumination.This makes LED become one of light source of new generation world today substituting conventional light source.In the LED course of work, owing to being PN junction work, LED chip has fever phenomenon and produces, so must carry out heat dissipation design for this situation.
The heat that LED illumination lamp luminescence produces afterwards conducts mainly through LED-baseplate and the heat abstractor be arranged on LED.And good heat dissipation design significantly can extend the service life of LED, therefore the performance of heat dissipation design to LED light source plays vital effect.
Summary of the invention
Technical problem to be solved by this invention is to provide that a kind of structure is simple, energy-saving and environmental protection, and is designed with cooling mechanism, the LED that can significantly extend the service life of LED.
The technical scheme that the present invention solves the problems of the technologies described above is as follows: a kind of LED, comprise fin, aluminium base is provided with above described fin, heat-conducting glue is provided with above described aluminium base, heating column is provided with above described heat-conducting glue, LED mounting structure is provided with above described heating column, described LED mounting structure is provided with LED chip, transparent outer cover is provided with above described LED chip, described transparent outer cover and pedestal form enclosed construction, and described LED chip mounting structure, heating column, heat-conducting glue, aluminium base, fin are connected by passage of heat.
Described LED chip mounting structure, heating column, heat-conducting glue, aluminium base, fin are connected by passage of heat, when LED uses, heat realizes heat radiation through passage of heat, wherein realize first time heat radiation through heating column, realize heat radiation for the second time through heat-conducting glue, realize third time heat radiation, finally arrival fin through aluminium base and realize dispelling the heat completely.
On the basis of technique scheme, the present invention can also do following improvement.
Further, described heating column, through pedestal, for heating column and the inner conducting of LED, realizes the outer transmission of heat.
Further, described heat-conducting glue, between heating column and pedestal, there is space, spread out of by space for the heat that heating column, heat-conducting glue are outwards transmitted.
Further, described transparent outer cover is epoxy package, and described epoxy package hardness is large, transmission effects good, and under the prerequisite not affecting LED luminous intensity, the protection LED internal structure that can be conducive to, is clashed into by the external world and damage.
The invention has the beneficial effects as follows: structure is simple, energy-saving and environmental protection, and is designed with cooling mechanism, significantly can extend the service life of LED.
Accompanying drawing explanation
Fig. 1 is a kind of LED lamp structure schematic diagram of the present invention;
In accompanying drawing, the list of parts representated by each label is as follows: 1, fin, and 2, aluminium base, 3, heat-conducting glue, 4, pedestal, 5, heating column, 6, LED chip, 7, LED chip mounting structure, 8, transparent outer cover, 9, passage of heat.
Detailed description of the invention
Be described principle of the present invention and feature below in conjunction with accompanying drawing, example, only for explaining the present invention, is not intended to limit scope of the present invention.
As shown in Figure 1, a kind of LED, comprise fin 1, aluminium base 2 is provided with above described fin 1, heat-conducting glue 3 is provided with above described aluminium base 2, heating column 5 is provided with above described heat-conducting glue 3, LED mounting structure 7 is provided with above described heating column 5, described LED mounting structure 7 is provided with LED chip 6, transparent outer cover 8 is provided with above described LED chip 6, described transparent outer cover 8 forms enclosed construction with pedestal 4, and described LED chip mounting structure 7, heating column 5, heat-conducting glue 3, aluminium base 2, fin 1 are connected by passage of heat 9.
Described LED chip mounting structure 7, heating column 5, heat-conducting glue 3, aluminium base 2, fin 1 are connected by passage of heat 9, when LED uses, heat realizes heat radiation through passage of heat 9, wherein realize first time heat radiation through heating column 5, realize heat radiation for the second time through heat-conducting glue 3, realize third time heat radiation, finally arrival fin 1 through aluminium base 2 and realize dispelling the heat completely.
Described heating column 5, through pedestal 4, for the inner conducting of heating column 5 and LED, realizes the outer transmission of heat; Described heat-conducting glue 3, between heating column 5 and pedestal 4, there is space, spread out of by space for the heat that heating column 5, heat-conducting glue 3 are outwards transmitted; Described transparent outer cover 8 is epoxy package, and described epoxy package hardness is large, transmission effects good, and under the prerequisite not affecting LED luminous intensity, the protection LED internal structure that can be conducive to, is clashed into by the external world and damage.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (4)
1. the present invention relates to a kind of LED, it is characterized in that, comprise fin, aluminium base is provided with above described fin, heat-conducting glue is provided with above described aluminium base, heating column is provided with above described heat-conducting glue, LED mounting structure is provided with above described heating column, described LED mounting structure is provided with LED chip, transparent outer cover is provided with above described LED chip, described transparent outer cover and pedestal form enclosed construction, and described LED chip mounting structure, heating column, heat-conducting glue, aluminium base, fin are connected by passage of heat.
2. a kind of LED according to claim 1, is characterized in that, described heating column is through pedestal.
3. a kind of LED according to claim 1, is characterized in that, described heat-conducting glue, has space between heating column and pedestal.
4. a kind of LED according to claim 1, it is characterized in that, described transparent outer cover is epoxy package.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410522886.6A CN104344258A (en) | 2014-09-30 | 2014-09-30 | LED lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410522886.6A CN104344258A (en) | 2014-09-30 | 2014-09-30 | LED lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104344258A true CN104344258A (en) | 2015-02-11 |
Family
ID=52500452
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410522886.6A Pending CN104344258A (en) | 2014-09-30 | 2014-09-30 | LED lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104344258A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106895370A (en) * | 2017-03-08 | 2017-06-27 | 何联菲 | A kind of decorative lamp fixing device with heat sinking function |
-
2014
- 2014-09-30 CN CN201410522886.6A patent/CN104344258A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106895370A (en) * | 2017-03-08 | 2017-06-27 | 何联菲 | A kind of decorative lamp fixing device with heat sinking function |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150211 |
|
| WD01 | Invention patent application deemed withdrawn after publication |