CN203784875U - Heat dissipation structure of LED (Light Emitting Diode) light source board for down lamp - Google Patents
Heat dissipation structure of LED (Light Emitting Diode) light source board for down lamp Download PDFInfo
- Publication number
- CN203784875U CN203784875U CN201420031938.5U CN201420031938U CN203784875U CN 203784875 U CN203784875 U CN 203784875U CN 201420031938 U CN201420031938 U CN 201420031938U CN 203784875 U CN203784875 U CN 203784875U
- Authority
- CN
- China
- Prior art keywords
- light source
- led
- down lamp
- led light
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000017525 heat dissipation Effects 0.000 title abstract 5
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 24
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 22
- 238000010079 rubber tapping Methods 0.000 claims abstract description 6
- 239000004411 aluminium Substances 0.000 claims description 18
- 238000004020 luminiscence type Methods 0.000 claims description 10
- 239000007787 solid Substances 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 150000001398 aluminium Chemical class 0.000 claims description 2
- 230000003287 optical effect Effects 0.000 abstract description 3
- 239000000758 substrate Substances 0.000 abstract 6
- 230000004907 flux Effects 0.000 abstract 1
- 230000002035 prolonged effect Effects 0.000 abstract 1
- 239000006185 dispersion Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Landscapes
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The utility model relates to a heat dissipation structure of an LED (Light Emitting Diode) light source board for a down lamp. The heat dissipation structure comprises an LED light source board, wherein the LED light source board comprises an aluminum substrate and a high-power or medium-power LED light-emitting chip, and the aluminum substrate is a large-area aluminum substrate; the size of the aluminum substrate corresponds to the size of the inner top surface of a shell of the down lamp, and the aluminum substrate clings to the inner top surface by a self-tapping screw in a fixed way; the LED light-emitting chip is closely arranged on the front surface of the aluminum substrate by a single chip way. The heat dissipation structure provided by the utility model has the advantages of simple structure, large heat conduction area, good heat conduction channel, and strong heat dissipation capacity, the life of the LED down lamp is greatly prolonged, the service cost is reduced, and the optical effect that the large luminous flux is generated in a small area can be achieved, so that the lamp is stable and reliable.
Description
Technical field
The utility model relates to LED field of light fittings, relates in particular to a kind of Down lamp LED light source plate radiator structure.
Background technology
LED light source plate is the critical piece of LED Down lamp, is also the main pyrotoxin of LED Down lamp, and the life-span of LED Down lamp is had to larger impact.
The heat dispersion of traditional LED Down lamp is not strong, has reduced greatly the life-span of LED Down lamp, and use cost is provided.
Utility model content
Based on this, for above-mentioned technical problem, provide a kind of Down lamp LED light source plate radiator structure.
For solving the problems of the technologies described above, the utility model adopts following technical scheme:
A kind of Down lamp LED light source plate radiator structure, comprise LED light source plate, described LED light source plate comprises the LED luminescence chip of aluminium base and high-power or middle power, described aluminium base is large area aluminium base, its size is corresponding with the size of the inner top surface of Down lamp housing, this aluminium base is close to and is fixed on described inner top surface by tapping screw, and described LED luminescence chip is located at the front of described aluminium base in single chips solid matter mode.
Described aluminium base front does not arrange that LED luminescence chip parts transversely is equipped with Copper Foil.
The utility model is simple in structure, and heat transfer area is large, has good thermal conduction path, and heat-sinking capability is strong, has greatly improved the life-span of LED Down lamp, has reduced use cost, and can produce the optical effect that large light is logical at small size, makes light fixture reliable and stable.
Brief description of the drawings
Be elaborated below in conjunction with the drawings and specific embodiments the utility model:
Fig. 1 is structural representation of the present utility model;
Fig. 2 is the structural representation of LED light source plate of the present utility model.
Detailed description of the invention
As shown in Figure 1 and Figure 2, a kind of Down lamp LED light source plate radiator structure, comprises LED light source plate 110.
LED light source plate 110 comprises the LED luminescence chip of aluminium base 111 and high-power or middle power.
Wherein, aluminium base 111 is large area aluminium base, and its size is corresponding with the size of the inner top surface of Down lamp housing 120, and it is close on the inner top surface that is fixed on Down lamp housing 120 by tapping screw.
LED luminescence chip is located at the front of aluminium base 111 in single chips solid matter mode.
Large-area aluminium base 111 is close to fixing and the concentrated of middle power or great power LED by tapping screw and Down lamp housing 120 and is arranged, and can effectively improve the heat-sinking capability of LED light source plate 110.
In order to strengthen heat dispersion, aluminium base 111 fronts do not arrange that the parts transversely of LED luminescence chip is equipped with Copper Foil 112, increase heat transfer area, after compressing by tapping screw, form good thermal conduction path, coordinate the LED luminescence chip with single chips solid matter, can produce the optical effect that large light is logical at small size, make light fixture reliable and stable.
But, those of ordinary skill in the art will be appreciated that, above embodiment is only for the utility model is described, and be not used as restriction of the present utility model, as long as within the scope of connotation of the present utility model, variation, modification to the above embodiment all will drop within the scope of claims of the present utility model.
Claims (2)
1. a Down lamp LED light source plate radiator structure, it is characterized in that, comprise LED light source plate, described LED light source plate comprises the LED luminescence chip of aluminium base and high-power or middle power, described aluminium base is large area aluminium base, its size is corresponding with the size of the inner top surface of Down lamp housing, and this aluminium base is close to and is fixed on described inner top surface by tapping screw, and described LED luminescence chip is located at the front of described aluminium base in single chips solid matter mode.
2. a kind of Down lamp LED light source plate radiator structure according to claim 1, is characterized in that, described aluminium base front does not arrange that LED luminescence chip parts transversely is equipped with Copper Foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420031938.5U CN203784875U (en) | 2014-01-18 | 2014-01-18 | Heat dissipation structure of LED (Light Emitting Diode) light source board for down lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420031938.5U CN203784875U (en) | 2014-01-18 | 2014-01-18 | Heat dissipation structure of LED (Light Emitting Diode) light source board for down lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203784875U true CN203784875U (en) | 2014-08-20 |
Family
ID=51321056
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420031938.5U Expired - Fee Related CN203784875U (en) | 2014-01-18 | 2014-01-18 | Heat dissipation structure of LED (Light Emitting Diode) light source board for down lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203784875U (en) |
-
2014
- 2014-01-18 CN CN201420031938.5U patent/CN203784875U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140820 Termination date: 20220118 |