CN104344233A - LED lamp and manufacturing method thereof - Google Patents
LED lamp and manufacturing method thereof Download PDFInfo
- Publication number
- CN104344233A CN104344233A CN201310319789.2A CN201310319789A CN104344233A CN 104344233 A CN104344233 A CN 104344233A CN 201310319789 A CN201310319789 A CN 201310319789A CN 104344233 A CN104344233 A CN 104344233A
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- Prior art keywords
- boss
- fixture
- base
- circuit board
- radiator
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
Abstract
The invention provides an LED lamp and a manufacturing method thereof. The LED lamp comprises an insulating base, a radiator and a circuit board with LEDs, wherein the radiator and the circuit board are orderly arranged on the base; a plurality of insulating lug bosses are arranged in the base; a plurality of first through holes allowing the lug bosses to pass through are formed in the radiator correspondingly to the lug bosses; a plurality of second through holes allowing the lug bosses to pass through are formed in the circuit board correspondingly to the lug bosses; the circuit board is provided with a hot melting region surrounding the second through holes; the lug bosses orderly pass through the first through holes and the second through holes; the upper ends of the lug bosses extend out of the second through holes, and are formed in the holt melting region in a molten state and fixedly arranged in the hot melting region. According to the LED lamp and the manufacturing method thereof, the electrical properties and the connection reliability of the LED lamp can be improved and the manufacturing cost of the LED lamp can be reduced.
Description
Technical field
The present invention relates to LED field, particularly relate to LED lamp and preparation method thereof.
Background technology
Tradition tengsten lamp power consumption high, the life-span is short, under the overall situation of global resources anxiety, its gradually by national governments prohibit produce, substitute products are electricity-saving lamps thereupon, and electricity-saving lamp has the shortcomings such as pollution, therefore electricity-saving lamp had pollution-free and energy-conservation LED replace.Along with the high speed development of LED technology, LED illumination becomes the only choosing of novel green illumination gradually.LED is far superior to traditional lighting products in the aspect of principle of luminosity, energy-saving and environmental protection.
Due to incandescent lamp and electronic energy-saving lamp in the routine use of people still in occupation of very high ratio, LED manufacturer develops the LED illumination product meeting existing interface and people's use habit, makes people just can use the LED illumination product of a new generation when not needing to change former conventional lamp pedestal and circuit.So LED lamp is just arisen at the historic moment.The profile of LED lamp is similar to traditional tengsten lamp bulb, and current LED lamp adopts high-power LED chip to make usually.LED lamp have employed existing interface mode, i.e. screw socket, socket mode, and the use habit even in order to meet people has imitated the profile of incandescent lamp bulb.Based on the unidirectional principle of luminosity of LED, designer has done change and has made the distribution curve flux of LED lamp spot light that is basic and incandescent lamp convergent on fitting structure.The LED-based characteristics of luminescence, the structure of LED lamp wants relative incandescent lamp complicated, is substantially divided into light source, drive circuit, heat abstractor, and the common cooperation of these parts could bring up the LED lamp product of low energy consumption, long-life, specular removal and environmental protection.Therefore can find out LED lamp environmental protection, meet user habit environmental background under create.
At present, LED lamp generally includes base, is successively set on radiator on base and circuit board.Circuit board with LED normally adopts screwed lock to be fixed on radiator or base.But this fixed form reduces electric creep age distance on circuit board between electronic devices and components (namely between two current-carrying parts along the beeline on insulating materials surface), especially in small-sized light fixture, circuit board is less, creep age distance then on circuit board between electronic devices and components is restricted especially, can affect the electrical property of circuit board like this.Such as, when the creep age distance on circuit board between electronic devices and components is less, it often there will be the danger of failure when Hi-pot test, such as the breakdown short circuit of circuit board.Prior art many employings five metals screw makes circuit board be fixed on radiator.Cap nut (head of screw) diameter is larger, and on itself and aluminium base module, the distance of solder joint is shorter.The length of this distance can affect the Hi-pot test result (shorter high pressure is more difficult to be passed through) of lamp.If with the screw of plastic cement material, when locking, then screw is easy to be twisted off, and it wastes time and energy costly.And above-mentioned fixed form needs extra increase screw cost.A larger defect for current LED product cost height.
Be understandable that, the statement of this part only provides background information related to the present invention, may form or not form so-called prior art.
Summary of the invention
Technical problem to be solved by this invention is easily to occur that electric creep age distance is less, connection is firm not and the defect that cost is higher for LED lamp in prior art, provide a kind of can make each parts of LED lamp connect reliable, cost is lower and can increase the LED lamp of the creep age distance of electronic devices and components on circuit board.
The technical solution adopted for the present invention to solve the technical problems is to provide a kind of LED lamp, it comprises: the base of insulation, be set in turn in the radiator on base and the circuit board with LED, the boss of driver for driving LED and some insulation is provided with in base, correspondingly with boss on radiator be provided with several first through holes passed for boss, correspondingly with boss on circuit board be provided with several second through holes passed for boss, circuit board has hot melt district around described second through hole, shaping and be fixedly arranged on described hot melt district with molten state in above-mentioned hot melt district through the upper end of the boss of the first through hole and the second through hole successively.
In above-mentioned LED lamp, also comprise the first fixture of being arranged on base and coordinating with the second fixture be fixed on by radiator on base with the first fixture of being arranged on radiator, and the top of the first fixture and the second fixture is covered by the bottom of circuit board.
In above-mentioned LED lamp, the top of described first fixture and the second fixture is no more than the upper surface of described radiator.
In above-mentioned LED lamp, described first fixture is projection outstanding on base, and described second fixture is by securing for described projection fixing hole.
In above-mentioned LED lamp, described fixing hole comprises cylindrical fixing hole upper end and the lower end less than the aperture of fixing hole upper end, and described projection is cylindric and the diameter of projection is less than the aperture of fixing hole upper end.
In above-mentioned LED lamp, described second fixture is the convex closure be positioned at bottom radiator, described first fixture be positioned on base by securing for described convex closure installing hole.
In above-mentioned LED lamp, described boss is distributed on described base uniformly.
In above-mentioned LED lamp, the cross section of described base is rounded, and being distributed on described base of described boss symmetry.
In above-mentioned LED lamp, described boss is column and one-body molded with described base.
In order to better solve the problems of the technologies described above, present invention also offers a kind of preparation method of LED lamp, it comprises the following steps successively:
S10, the base making insulation respectively, radiator and the circuit board with LED, wherein, the boss of driver for driving LED and some insulation is established in base, radiator is arranged some first through holes corresponding with boss, circuit board is arranged some second through holes corresponding with boss, the surrounding of the second through hole has hot melt district;
S20, on base, place radiator and circuit board successively, make circuit board fit on radiator, make described some boss successively through described first through hole and the second through hole, and the upper end of each boss is stretched out from the second through hole of circuit board;
S30, upper end is made to melt in described hot melt district and be solidificated on described circuit board to the heating of the upper end of described boss.
In the preparation method of above-mentioned LED lamp, described step S10 is also included on base and arranges the first fixture, and on radiator arrange coordinate with the first fixture for radiator being fixed on the second fixture on base; Described step S20 also comprises and the first fixture and the second fixture being mutually fastened, and the top of the first fixture and the second fixture is covered by the bottom of circuit board.
In the preparation method of above-mentioned LED lamp, the top of described first fixture and the second fixture is no more than the upper surface of described radiator.
In the preparation method of above-mentioned LED lamp, described first fixture is projection outstanding on base or for being positioned at the installing hole on base, described second fixture is by securing for described projection fixing hole or for coordinating the convex closure fixed with installing hole.
In the preparation method of above-mentioned LED lamp, at described boss through after the first through hole and the second through hole and before to boss heating, boss exceeds 0.5-1mm than the upper surface of circuit board.
In the preparation method of above-mentioned LED lamp, in above-mentioned steps S30 by the upper end of ultrasonic welding machine contact boss with to the upper end melted by heat making boss.
LED lamp provided by the invention by arranging the boss of several insulation respectively on base, radiator arranges first through hole that for boss pass corresponding with boss, and second through hole that for boss pass corresponding with boss is set on circuit boards, simultaneously, circuit board is formed with hot melt district around the second through hole, then boss is successively through after the first through hole and the second through hole, the upper end of boss stretch out circuit board and in hot melt district by melted by heat Post RDBMS in hot melt district, then base plate and radiator pass through boss, first through hole and the second through hole are firmly fixed on circuit boards, three connects reliably, and, boss is insulator, therefore it can improve the creep age distance on circuit board between electronic devices and components, simultaneously, whole LED lamp structure is simple, its manufacture craft is simple, and then the cost of LED lamp can be reduced.
Accompanying drawing explanation
Fig. 1 is the half-finished exploded view of LED lamp in an embodiment provided by the invention;
Fig. 2 be in an embodiment provided by the invention boss fusing solidification before the half-finished structural representation of LED lamp;
Fig. 3 is the profile of the LED lamp formed after middle boss fusing solidification embodiment illustrated in fig. 2;
Fig. 4 is the structure chart of base in another embodiment provided by the invention;
Fig. 5 is the structure chart of radiator in another embodiment provided by the invention;
Fig. 6 is after base and radiator being installed in advance in an embodiment provided by the invention and melts the structural representation before fixing;
Fig. 7 be embodiment illustrated in fig. 6 in first fixture fusing rear base and radiator solidify after structural representation;
Fig. 8 is the Making programme figure of LED lamp provided by the invention.
Detailed description of the invention
In order to make technical problem solved by the invention, technical scheme and beneficial effect clearly understand, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
In describing the invention, it will be appreciated that, term " longitudinal direction ", " transverse direction ", " on ", D score, "front", "rear", "left", "right", " vertically ", " level ", " top ", " end " " interior ", the orientation of the instruction such as " outward " or position relationship be based on orientation shown in the drawings or position relationship, only the present invention for convenience of description and simplified characterization, instead of indicate or imply that the device of indication or element must have specific orientation, with specific azimuth configuration and operation, therefore can not be interpreted as limitation of the present invention.
See shown in Fig. 1 to Fig. 7, the invention provides a kind of LED lamp, it mainly comprises: base 1, radiator 2 and the circuit board 3 with LED.Base 1 is insulator, is provided with the boss 11 of driver for driving LED and some insulation in it.Radiator 2 is mainly used in LED heat radiation, and it is arranged on base 1, and, radiator 2 is provided with several the first through holes 21.First through hole 21 is corresponding with boss 11 to be arranged, and namely the quantity of the first through hole 21 and shape of first through hole 11 corresponding with boss 11 mates with boss 11 to make boss 11 pass the first through hole 21.Circuit board 3 is arranged on radiator 2, circuit board 3 is provided with several the second through holes 31, second through hole 31 is corresponding with boss 11 to be arranged, and namely the quantity of the second through hole 31 and shape of second through hole 11 corresponding with boss 11 mates with boss 11 to make boss 11 pass the second through hole 31.Circuit board 3 has hot melt district around the second through hole 31.Boss 11 on base plate is successively through after the first through hole 21 and the second through hole 31, and the part (i.e. the upper end of boss 11) of stretching out from the second through hole 31 in boss is shaping and be installed in hot melt district with molten state in hot melt district.Namely the upper end of boss 11 is exposed from the second through hole 31 through after the first through hole 21 and the second through hole 31 successively, and, the upper end of boss 11 is exposed rear by heat fused, after the mode curing moldings such as cooling are passed through from molten condition in the upper end of boss 11, the upper end of boss 11 is fixed on the hot melt district of circuit board 3 naturally; Because second through hole 31 covers by completely after the upper end fusing solidification of boss 11, be similar to cap nut and equally boss 11 and base plate be fixed on circuit board 3; And then by boss 11, base 1 and circuit board 3 are fixed and radiator 2 is also clamped and fastened between base 1 and circuit board 3.So on the one hand, LED lamp provided by the invention ensure that the reliability connected between base 1, radiator 2 and circuit board 3 three.On the other hand, because base 1 and boss 11 are insulator, so to melt and the upper end being solidificated in the boss 11 in the hot melt district of circuit board 3 is also insulator, and then it can improve the electric creep age distance of electronic devices and components on circuit board 3 greatly.Meanwhile, the structure of above-mentioned base 1, radiator 2 and circuit board 3 is simple, its respective making is different and assembling between three also comparatively simple and fast, and then can reduce the cost of manufacture of LED lamp.
Because boss 11 and base 1 can be one-body molded, so the manufacture craft of LED lamp provided by the invention can further reduce and its cost also can further reduce.Simultaneously, because boss 11 is insulator, so the creep age distance in LED lamp provided by the invention on circuit board 3 between electronic devices and components can be increased, the layout of circuit on the circuit board 3 being conducive to circuit board 3 especially small volume like this, and the danger of the breakdown short circuit of electronic devices and components in circuit can be greatly reduced, and then the electrical property of circuit board 3 is optimized more.
In order to improve the reliability that LED lamp provided by the invention connects further, the present invention is also further optimized.Concrete, see shown in Fig. 2 to Fig. 7.In a preferred embodiment of the invention, base 1 is also provided with the first fixture 12, radiator 2 is provided with the second fixture 22 and the second fixture 22 mates to be fixed on base 1 by radiator 2 with the first fixture 12, simultaneously, the top of the first fixture 12 and the second fixture 22 is all covered by the bottom of circuit board 3, to avoid the first fixture 12 or the second fixture 22 to affect the creep age distance of electronic devices and components on circuit board 3 while ensureing the reliability that base 1 is connected with radiator 2.Even if that is the first fixture 12 and the second fixture 22 are the common fixture that can conduct electricity such as screw, when both cover by base plate, it also can ensure the electrical property of circuit board 3 in LED lamp.Preferably, the top of the first fixture 12 and the second fixture 22 is no more than the upper surface of radiator 2, with the flat conditions making the first fixture 12 and the second fixture 22 not affect radiator 2 upper surface, and then circuit board 3 can better be fitted on radiator 2, thus the heat on circuit board 3 can better be distributed.
What deserves to be explained is, the first fixture 12 together with being fixed on radiator 2 by base 1 and the second fixture 22 can adopt many structures.Preferably, see Fig. 6 and Fig. 7, the first fixture 12 is projection outstanding on base 1, and the second fixture 22 is by securing for described projection fixing hole.Such as projection and fixing hole are withheld by the similar form being snapped in draw-in groove.The structure of securing for projection projection and fixing hole is well known to those skilled in the art, so the structure of projection and fixing hole does not enumerate by passing hole.In the preferred embodiment of the present invention, fixing hole comprises cylindrical fixing hole upper end and the lower end less than the aperture of fixing hole upper end.Such as Fig. 4 and Fig. 7, fixing hole upper end is cylindrical, and the lower end of fixing hole is cylindric less than the aperture of fixing hole upper end in aperture, or the lower end of fixing hole is the aperture funnel-form less than its upper end.So projection better can be fixed by the fixing hole of shape retrieval.Projection is cylindric and the diameter of projection is less than the aperture of fixing hole upper end.Because projection will pass installing hole, the equal diameters or suitable of the usual diameter of columned projection and the lower end of fixing hole.In the preferred embodiment, projection passed the lower end of installing hole and (carry out pre-installation by base 1 and radiator 2 after being positioned at the upper end of installing hole, top due to projection is no more than the upper surface of radiator 2, so projection is preferably placed at the centre of the upper end of installing hole), heat the upper end of projection, the upper end of projection can be melted and be solidified in the upper end of installing hole, and then base 1 and radiator 2 are firmly fixed together.In like manner, the second fixture 22 can for being positioned at the convex closure bottom radiator 2, the first fixture 12 for be positioned on base 1 by securing for described convex closure installing hole.
In a preferred embodiment of the invention, some boss 11 distribute uniformly on base 1, and it can make boss 11 be evenly distributed with the power that is fixedly connected with of circuit board 3, and then base 1 and circuit board 3 are better fixed together.More preferably, the cross section of base 1 is rounded, and described boss 11 symmetry to be distributed on described base 1 that (then the first fixing hole is also inevitable be uniformly distributed accordingly on radiator 2, second fixing hole also distributes uniformly on circuit board 3), like this can so that base 1 processing and fabricating and make base 1 convex platform 11 uniform force, and then base 1, radiator 2 and circuit board 3 are better fixed together.More preferably, boss 11 is in cylindric and boss 11 is one-body molded with base 1, and it makes the making of base 1 more convenient and can improve the reliability that boss 11 is connected with circuit board 3.
Present invention also offers the preparation method of above-mentioned LED lamp, shown in Figure 8.Its preparation method mainly comprises the following steps successively:
S10, the base 1 making insulation respectively, radiator 2 and the circuit board 3 with LED, wherein, the boss 11 of driver for driving LED and some insulation is established in base 1, radiator 2 is arranged some first through holes 21 corresponding with boss 11, surrounding circuit board 3 being arranged some second through hole 31, second through holes 31 corresponding with boss 11 has hot melt district;
S20, on base 1, place radiator 2 and circuit board 3 successively, circuit board 3 is made to fit on radiator 2, make described some boss 11 successively through described first through hole 21 and the second through hole 31, and the upper end of each boss 11 exceeds the plane at described circuit board 3 place; Even if base 1, radiator 2 and circuit board 3 carries out pre-installation, boss 11 is made the upper end of boss 11 to be stretched out on circuit board 3 through the first fixing hole and the second fixing hole from the second through hole 31 successively.
S30, the upper end of boss 11 is made to melt in hot melt district and be solidificated on foregoing circuit plate 3 to the heating of the upper end of boss 11.Boss 11 is insulation, and boss 11 is usually made by plastic cement and boss 11 is one-body molded by plastic cement together with base 1.By firing equipment, the upper end of boss 11 is melted, then boss 11 upper end the hot melt district of circuit board 3 fusing and after a period of time, it is solidificated on circuit board 3 by molten state.
Again participate in shown in Fig. 2 to Fig. 8, in a preferred embodiment of the invention, make base 1, the radiator 2 of aluminum, the aluminium base module (namely with the circuit board 3 of LED) of plastic cement.Base 1 profile is roughly in cylindric, and in the middle of it, limit positional symmetry is provided with two boss 11 partially.This boss 11 should be noted the design of height and size when designing, boss 11 size need decide according to the size of the objects such as the inner space of the base 1 of plastic cement and its fixing driver.Inner space due to plastic base 1 is used to placement power drives, and it need ensure to drive the prerequisite that can put into get off to design the size (boss 11 cross sectional shape can be square or circular) of boss 11.Hot melt district on circuit board 3 can be a slice hollow plate reserved on circuit board 3, also this reserved hollow plate can be carried out processing environment when certain process makes this hot melt district bear to be carried out the upper end of boss 11 hot melt, such as, can bear high temperature.
In the above-described embodiments, the radiator 2 of making is in cylindric, and in centre, inclined limit positional symmetry is provided with the first through hole 21 for it.Inclined limit, the centre positional symmetry of circuit board 3 is provided with the second through hole 31.First carry out pre-installation, the base 1 by plastic cement inserts in radiator 2, circuit board 3 is fitted in radiator 2 surface.Boss 11 is successively through after the first through hole 21 and the second through hole 31, the upper end of boss 11 is exposed from the second through hole 31 on circuit board 3, hot melt is carried out by the top of the upper end from boss 11 with Thermal melt gun, by the technique controlling heating, the upper end of boss 11 is melted, plastic cement then after fusing is piled up in Rong Jiao district (this case Rong Jiao district is hollow plate reserved on aluminium base), when forming the state as cap nut after the solidification of this plastic cement and be connected to reach with the plastic cement do not melted the object of fixing circuit board 3, then circuit board 3 to be tightly attached on radiator 2 and can effective transferring heat.So the present invention grips radiator 2 by aluminium base module and base 1, and fix without screw, certainly can also increase the locking force (locking between radiator 2 and plastic base 1 in advance with screw) between the base 1 of plastic cement and radiator 2 to strengthen strong degree.Preferably, step S10 is also included on base 1 and arranges the first fixture 12, and on radiator 2 arrange coordinate with the first fixture 12 for radiator 2 being fixed on the second fixture 22 on base 1; Step S20 also comprises and the first fixture 12 and the second fixture 22 being mutually fastened, and the top of the first fixture 12 and the second fixture 22 is covered by the bottom of circuit board 3.What base 1 and radiator 2 can be made like this to fix is more firm.More preferably, the top of the first fixture 12 and the second fixture 22 is no more than the upper surface of described radiator 2, can better fit on radiator 2 and then improve the heat-sinking capability of LED lamp to make circuit board 3.First fixture 12 can for projection outstanding on base 1 or for being positioned at the installing hole on base 1, and the second fixture 22 is by securing for described projection fixing hole or for coordinating fixing convex closure with installing hole.Colloid size after the height of the upper end (namely exposing the upper end of the second through hole 31 in boss 11) of base 1 convex platform 11 melts depending on boss 11 heat and hot melt district size are determined.In a preferred embodiment of the invention, boss 11 passes the first through hole 21 and the second through hole 31 is rear and before heating boss 11 (namely after LED lamp pre-installation and before hot melt), it is 0.5-1mm that boss 11 exceeds than the upper surface of circuit board 3 height of upper end before hot melt exposing the second through hole 31 in 0.5-1mm(and boss 11).The space of the circuit board 3 occupied after energy firm being fixed on circuit board 3 also can reduce the upper end hot melt of boss 11 after so both can having ensured the upper end hot melt of boss 11.The technology that the mode of carrying out hot melt to the upper end of boss 11 is well known to those skilled in the art, preferably, in step S30 by the upper end of ultrasonic welding machine contact boss 11 with to the upper end melted by heat making boss 11, the upper end being conducive to boss 11 is like this formed spherical on circuit board 3, and then can better be fixed on circuit board 3.
LED prodigiosin provided by the invention simplifies the operation technique and reducing costs.The present invention adopts the boss of insulation to fix circuit board in conjunction with hot melting way, and it can improve the electrical property of LED lamp while ensureing the reliability that LED lamp connects, and it is simple to operate, be suitable for batch production, cost of manufacture is lower.
In the description of this description, specific features, structure, material or feature that the description of reference term " embodiment ", " some embodiments ", " example ", " concrete example " or " some examples " etc. means to describe in conjunction with this embodiment or example are contained at least one embodiment of the present invention or example.In this manual, identical embodiment or example are not necessarily referred to the schematic representation of above-mentioned term.And the specific features of description, structure, material or feature can combine in an appropriate manner in any one or more embodiment or example.
In describing the invention, unless otherwise prescribed and limit, it should be noted that, term " installation ", " being connected ", " connection " should be interpreted broadly, such as, can be mechanical connection or electrical connection, also can be the connection of two element internals, can be directly be connected, also indirectly can be connected by intermediary, for the ordinary skill in the art, the concrete meaning of above-mentioned term can be understood as the case may be.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any amendments done within the spirit and principles in the present invention, equivalent replacement and improvement etc., all should be included within protection scope of the present invention.
Claims (15)
1. a LED lamp, it is characterized in that, comprise: the base of insulation, be set in turn in the radiator on base and the circuit board with LED, the boss of some insulation is provided with in base, correspondingly with boss on radiator be provided with several first through holes passed for boss, several second through holes of being provided with confession boss passing corresponding to boss on circuit board, circuit board has hot melt district around described second through hole, described boss is successively through the first through hole and the second through hole, the upper end of boss is stretched out from the second through hole and shaping and be fixedly arranged on described hot melt district with molten state in above-mentioned hot melt district.
2. LED lamp as claimed in claim 1, it is characterized in that, also comprise the first fixture of being arranged on base and coordinating with the second fixture be fixed on by radiator on base with the first fixture of being arranged on radiator, and the top of the first fixture and the second fixture is covered by the bottom of circuit board.
3. LED lamp as claimed in claim 2, it is characterized in that, the top of described first fixture and the second fixture is no more than the upper surface of described radiator.
4. LED lamp as claimed in claim 2 or claim 3, is characterized in that, described first fixture is projection outstanding on base, and described second fixture is by securing for described projection fixing hole.
5. LED lamp as claimed in claim 4, it is characterized in that, described fixing hole comprises cylindrical fixing hole upper end and the lower end less than the aperture of fixing hole upper end, and described projection is cylindric and the diameter of projection is less than the aperture of fixing hole upper end.
6. as claimed in claim 2 or claim 3 LED lamp, it is characterized in that, described second fixture is the convex closure be positioned at bottom radiator, described first fixture be positioned on base by securing for described convex closure installing hole.
7. LED lamp as claimed in claim 1, it is characterized in that, described boss is distributed on described base uniformly.
8. LED lamp as claimed in claim 7, it is characterized in that, the cross section of described base is rounded, and being distributed on described base of described boss symmetry.
9. the LED lamp as described in claim 1 or 8, is characterized in that, described boss is column and one-body molded with described base.
10. a preparation method for LED lamp, is characterized in that, comprises the following steps successively:
S10, the base making insulation respectively, radiator and the circuit board with LED, wherein, the boss of some insulation is established in base, radiator is arranged some first through holes corresponding with boss, circuit board is arranged some second through holes corresponding with boss, and the surrounding of the second through hole has hot melt district;
S20, on base, place radiator and circuit board successively, circuit board is fitted on radiator and makes described some boss successively through described first through hole and the second through hole, and the upper end of each boss is stretched out from the second through hole of circuit board;
S30, the upper end of described boss to be heated, make the upper end of boss melt in described hot melt district and be solidificated on described circuit board.
11. preparation methods as claimed in claim 10, it is characterized in that, described step S10 is also included on base and arranges the first fixture, and on radiator arrange coordinate with the first fixture for radiator being fixed on the second fixture on base; Described step S20 also comprises and the first fixture and the second fixture being mutually fastened, and the top of the first fixture and the second fixture is covered by the bottom of circuit board.
12. preparation methods as claimed in claim 11, is characterized in that, the top of described first fixture and the second fixture is no more than the upper surface of described radiator.
13. preparation methods as described in claim 11 or 12, it is characterized in that, described first fixture is projection outstanding on base or for being positioned at the installing hole on base, described second fixture is by securing for described projection fixing hole or for coordinating the convex closure fixed with installing hole.
14. preparation methods as claimed in claim 13, is characterized in that, at described boss through after the first through hole and the second through hole and before to boss heating, boss exceeds 0.5-1mm than the upper surface of circuit board.
15. preparation methods as claimed in claim 14, is characterized in that, in above-mentioned steps S30 by the upper end of ultrasonic welding machine contact boss with to the upper end melted by heat making boss.
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| CN201310319789.2A CN104344233A (en) | 2013-07-26 | 2013-07-26 | LED lamp and manufacturing method thereof |
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| CN201310319789.2A CN104344233A (en) | 2013-07-26 | 2013-07-26 | LED lamp and manufacturing method thereof |
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| CN104344233A true CN104344233A (en) | 2015-02-11 |
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| CN202176944U (en) * | 2011-08-12 | 2012-03-28 | 东莞健达照明有限公司 | Decorative lamp |
| US20130088874A1 (en) * | 2011-10-07 | 2013-04-11 | Chen-Lung Huang | Led projecting lamp |
| CN102997138A (en) * | 2012-10-16 | 2013-03-27 | 广东国晟投资有限公司 | Light emitting diode (LED) spot lamp |
| CN202938119U (en) * | 2012-12-05 | 2013-05-15 | 深圳市聚作照明股份有限公司 | Light emitting diode (LED) bulb |
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Application publication date: 20150211 |