CN104332523B - Tri-mode composite detector based on graphene - Google Patents

Tri-mode composite detector based on graphene Download PDF

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Publication number
CN104332523B
CN104332523B CN201410402836.4A CN201410402836A CN104332523B CN 104332523 B CN104332523 B CN 104332523B CN 201410402836 A CN201410402836 A CN 201410402836A CN 104332523 B CN104332523 B CN 104332523B
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China
Prior art keywords
graphene
detector element
photosensor chip
microstrip antenna
detector
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CN201410402836.4A
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CN104332523A (en
Inventor
李墨
韩德宽
孙珞珂
段磊
孙维国
陈洪许
张亮
朱旭波
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AVIC Kaimai (Shanghai) Infrared Technology Co.,Ltd.
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China Airborne Missile Academy
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/08Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
    • H01L31/10Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by at least one potential-jump barrier or surface barrier, e.g. phototransistors
    • H01L31/101Devices sensitive to infrared, visible or ultraviolet radiation
    • H01L31/1013Devices sensitive to infrared, visible or ultraviolet radiation devices sensitive to two or more wavelengths, e.g. multi-spectrum radiation detection devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02Details

Abstract

The invention relates to a tri-mode composite detector based on grapheme. The tri-mode detector includes a base at the bottommost layer. A first detector element, a second detector element, and a microstrip are arranged sequentially from bottom to top on the base in a spaced manner. The first detector element is fixed on the base. The two ends of the second detector element and the microstrip are fixed on the base through supports. The microstrip antenna is used for receiving submillimeter waves. The first detector element and the second detector element are used for receiving spectrum radiances of two different wavebands respectively so that the tri-mode composite detector is formed. The composite detector is capable of obtaining more comprehensive target information so that improvement of the anti-interference capability of the detector is facilitated.

Description

A kind of three mould complex detectors based on Graphene
Technical field
The present invention relates to a kind of three mould complex detectors based on Graphene, belong to multimode, in multispectral complex probe Detector technology.
Background technology
Sub-MM Wave Antenna has range resolution ratio height, wave beam width, is suitable to extensive search, intercepts and captures target, and sub- milli Metric wave can extract the much information such as frequency spectrum, amplitude, phase place, polarization from objective emission ripple, penetrates smog, sand and dust ability strong;With Microwave is compared, and has higher resolution and tracking accuracy because wave beam is narrow, and antenna size is little, device volume is little, can produce big Doppler effect, is conducive to differentiating microinching target, but easy electromagnetic wave interference.Infrared and ultraviolet two waveband detects permissible Obtain the radiation feature in different-waveband for the target simultaneously, be conducive to improving the capacity of resisting disturbance of detector.
It is to obtain a kind of reality of detected target more abundant information and have that submillimeter wave, infrared and ultraviolet are combined The technological approaches of effect.Require compact conformation, small volume and be coaxially total to visual field in some application systems.Antenna is visited as optics The window surveying device can achieve that aperture detects altogether, but this antenna must printing opacity.Graphene is the planar being become by carbon atom arrangement Honeycomb crystal lattice structure, has very high transmitance in infrared and ultraviolet band, and in electric property, mechanical property and leading Hot property aspect has outstanding performance.It is therefore possible to use Graphene substitutes the metallic film in conventional microstrip antenna, system The Sub-MM Wave Antenna of standby thoroughly infrared and ultraviolet, its combination with infrared photosensor chip and ultraviolet photosensor chip can realize three moulds Compound stacked detectors.
Content of the invention
The purpose of the present invention is for providing a kind of three mould complex detectors based on Graphene, in order to solve some detections Detection accuracy height, compact conformation, the technical problem of small volume is required in system.
For achieving the above object, the solution of the present invention includes a kind of three mould complex detectors based on Graphene, described Three mould detectors include the pedestal of the bottom, impact faces interval setting first detector element, the second spy successively from down to up Survey device element and microstrip antenna;Described microstrip antenna is submillimeter wave microstrip antenna, the dielectric base of described microstrip antenna It is graphene conductive film above piece, the gap that graphene conductive film etches becomes array distribution, in dielectric substrate On another side, with graphene conductive film, each gap correspondence position is printed with metal feeder.
First detector element is fixed on pedestal, and the two ends of the second detector element and microstrip antenna are fixed by support On pedestal.
First detector element is infrared photosensor chip, and the second detector element is ultraviolet photosensor chip, described ultraviolet The spacing of photosensor chip and infrared photosensor chip is 20~100 μm, and the spacing of ultraviolet photosensor chip and dielectric substrate is 20 ~100 μm.
The infrared and good insulant of UV-permeable: silicon dioxide or sapphire selected by described dielectric substrate;Described Metal feeder is made up of chrome gold (cr/au) or copper (cu).
Infrared photosensor chip material therefor is insb, hgcdte or super crystal lattice material;Used by described ultraviolet photosensor chip Material is sic, zno, cds, diamond film or alxga1-xN material, wherein, 0≤x≤1.
Described graphene conductive film is 2-8 layer graphene thin film.
Technical scheme, by combining microstrip antenna and different light-sensitive elements, constitutes one and is based on Three mould complex detectors of Graphene.Microstrip antenna can receive submillimeter wave, and different light-sensitive elements can obtain target again In the radiation characteristic of different-waveband, more comprehensive object information can be obtained, be conducive to improving the capacity of resisting disturbance of detector.
In addition, the graphene film that the conductive film of microstrip antenna uses, there is very high transmission in infrared and ultraviolet band Rate, when the ray including infrared, ultraviolet light and submillimeter wave injects this three moulds detector, first passes around Graphene micro-strip sky Line, receives to submillimeter wave, because this microstrip antenna integrally has good transmitance to infrared, ultraviolet light, so thereafter The light-sensitive element of setting can detect to ultraviolet, infrared light;And uv-sensitive component is well saturating using having to medium-wave infrared The material crossed is made, and therefore while receiving ultraviolet radioactive, the reception on infrared optical sensor thereafter affects less;By Asia Millimeter wave, infrared and ultraviolet combine and can obtain abundant target property information.
Brief description
Fig. 1 is the side view of three mould complex detectors in the embodiment of the present invention;
Fig. 2 is the top view of three mould complex detectors in the embodiment of the present invention;
In figure 1- dielectric substrate, 2- conductive film, 3- metal feeder, 4- ultraviolet photosensor chip, 5- medium-wave infrared light Quick chip, 6- support, 7- pedestal.
Specific embodiment
The three mould complex detectors based on Graphene of the present invention, including the pedestal 7 of the bottom, pedestal 7 above by Under to upper the first detector element 5 of interval setting successively, the second detector element 4 and microstrip antenna, the first detector 5 element is solid It is scheduled on pedestal 7, the two ends of the second detector element 4 are fixed on pedestal 7 by inner support, the two ends of microstrip antenna are by outer Support is fixed on pedestal.
The present invention will be further described in detail below in conjunction with the accompanying drawings.
Fig. 1, Fig. 2 show the three moulds spies that a kind of submillimeter wave microstrip antenna, ultraviolet detector and Infrared Detectorss are combined Survey device, be conductive film above the dielectric substrate of microstrip antenna, the gap that conductive film etches becomes array distribution, On dielectric substrate another side, with conductive film, each gap correspondence position is printed with metal feeder;Microstrip antenna exhausted Edge dielectric substrate 1 is made up of 0.2 millimeter of sapphire of thickness, and conductive film 2 is the graphene film of two-layer or multilamellar, leads The slot pattern etching on conductive film is 4 × 4 element array figures;The material of metal feeder 3 selects chrome gold, and support 6 is two Group, relatively low for inner support, higher for support arm, support arm is enclosed within outside inner support, and the height of inner support is 30 μm, support arm Height be 60 μm.And the lower end of two supports 6 is attached on pedestal 7 by Wear Characteristics of Epoxy Adhesive.Epoxy is passed through at the two ends of microstrip antenna On support arm, the two ends of ultraviolet photosensor chip 4 are attached on inner support by Wear Characteristics of Epoxy Adhesive, medium-wave infrared photosensor chip for glue 5 are affixed directly on pedestal 7 by epoxy glue.The mid frequency of Antenna Operation is 85ghz.
Medium-wave infrared photosensor chip 5 is single-element detector, and material therefor is insb.The making material of medium-wave infrared photosensor chip Material can also be hgcdte or super crystal lattice material, and its structure can also be four-quadrant or alignment structure.Ultraviolet photosensor chip 4 is single First detector, material therefor is sic material, and its making material can also be zno, cds, diamond film or alxga1-xN material (0 ≤x≤1).
Dielectric substrate material is chosen at the infrared material with ultraviolet band with good transmitance, can be titanium dioxide Silicon, Afluon (Asta) or spinelle etc., the metal feeder 3 described in the present invention chooses the good metal material of electric conductivity, such as chrome gold Or chromium/aluminum (cr/al) etc. (cr/au).
On provide a kind of specific embodiment, but the present invention is not limited to described embodiment.The base of the present invention This thinking is such scheme, for those of ordinary skill in the art, according to the teachings of the present invention, designs various modifications Model, formula, parameter do not need to spend creative work.Without departing from the principles and spirit of the present invention to enforcement Change, modification, replacement and modification that mode is carried out still fall within protection scope of the present invention.

Claims (6)

1. a kind of three mould complex detectors based on Graphene are it is characterised in that three described mould complex detectors include bottom The pedestal of layer, impact faces interval setting first detector element, the second detector element and microstrip antenna successively from down to up; Described microstrip antenna is submillimeter wave microstrip antenna, is that graphene conductive is thin above the dielectric substrate of described microstrip antenna Film, gap that graphene conductive film etches becomes array distribution, in dielectric substrate another side, thin with graphene conductive On film, each gap correspondence position is printed with metal feeder.
2. the three mould complex detectors based on Graphene according to claim 1 are it is characterised in that the first detector element It is fixed on pedestal, the two ends of the second detector element and microstrip antenna are fixed on pedestal by support.
3. the three mould complex detectors based on Graphene according to claim 1 are it is characterised in that the first detector element For infrared photosensor chip, the second detector element is ultraviolet photosensor chip, described ultraviolet photosensor chip and infrared photosensor chip Spacing be 20~100 μm, the spacing of ultraviolet photosensor chip and dielectric substrate is 20~100 μm.
4. the three mould complex detectors based on Graphene according to claim 1 are it is characterised in that described dielectric base Piece selects the infrared and good insulant of UV-permeable: silicon dioxide or sapphire;Described metal feeder is by chrome gold (cr/au) Or copper (cu) makes.
5. the three mould complex detectors based on Graphene according to claim 3 are it is characterised in that infrared photosensor chip institute It is insb, hgcdte or super crystal lattice material with material;Described ultraviolet photosensor chip material therefor is sic, zno, cds, Buddha's warrior attendant Stone film or alxga1-xN material, wherein, 0≤x≤1.
6. the three mould complex detectors based on Graphene according to claim 1 are it is characterised in that described graphene conductive Thin film is 2-8 layer graphene thin film.
CN201410402836.4A 2014-08-15 2014-08-15 Tri-mode composite detector based on graphene Active CN104332523B (en)

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Publication number Priority date Publication date Assignee Title
CN106711241B (en) * 2016-12-21 2018-04-17 西安交通大学 A kind of graphene transparent electrode diamond base ultraviolet detector and preparation method thereof
CN108630667B (en) * 2017-03-23 2020-04-28 中国空空导弹研究院 Infrared detector
CN107271042A (en) * 2017-04-27 2017-10-20 中国空空导弹研究院 A kind of detector crosstalk measuring device, its preparation method and crosstalk measuring method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0797256A2 (en) * 1996-03-19 1997-09-24 HE HOLDINGS, INC. dba HUGHES ELECTRONICS Three band and four band multispectral structures having two simultaneous signal outputs
CN101419996A (en) * 2008-12-04 2009-04-29 中国电子科技集团公司第十三研究所 Infrared-ultraviolet multi-color detector and production process thereof
CN102741164A (en) * 2009-12-15 2012-10-17 格尔德殿工业公司 Large area deposition of graphene on substrates, and products including the same
CN102856628A (en) * 2011-03-08 2013-01-02 中国空空导弹研究院 Conformal antenna for millimeter wave/infrared dual mode composite detection

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7561107B2 (en) * 2006-09-07 2009-07-14 Intelleflex Corporation RFID device with microstrip antennas
CN102074803A (en) * 2009-11-20 2011-05-25 联想(北京)有限公司 Microstrip-fed slot antenna and mobile terminal
CN102738572A (en) * 2012-06-06 2012-10-17 东南大学 Broadband directional microstrip patch antenna

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0797256A2 (en) * 1996-03-19 1997-09-24 HE HOLDINGS, INC. dba HUGHES ELECTRONICS Three band and four band multispectral structures having two simultaneous signal outputs
CN101419996A (en) * 2008-12-04 2009-04-29 中国电子科技集团公司第十三研究所 Infrared-ultraviolet multi-color detector and production process thereof
CN102741164A (en) * 2009-12-15 2012-10-17 格尔德殿工业公司 Large area deposition of graphene on substrates, and products including the same
CN102856628A (en) * 2011-03-08 2013-01-02 中国空空导弹研究院 Conformal antenna for millimeter wave/infrared dual mode composite detection

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Material Region Division and Antenna Application of Monolayer and Multilayer Graphene;Bian Wu, Yang Hao;《The 8th European Conference on Antennas and Propagation (EuCAP 2014)》;20140411;参见摘要、第497页左栏倒数第10-14行、第498页左栏第1-5行,图2 *

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Patentee after: AVIC Kaimai (Shanghai) Infrared Technology Co.,Ltd.

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Patentee before: CHINA AIRBORNE MISSILE ACADEMY

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