CN104332428B - Chip pin apparatus for shaping and method based on Laser Thermal Stress Forming - Google Patents
Chip pin apparatus for shaping and method based on Laser Thermal Stress Forming Download PDFInfo
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- CN104332428B CN104332428B CN201410440423.5A CN201410440423A CN104332428B CN 104332428 B CN104332428 B CN 104332428B CN 201410440423 A CN201410440423 A CN 201410440423A CN 104332428 B CN104332428 B CN 104332428B
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- chip pin
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- 238000007493 shaping process Methods 0.000 title claims abstract description 57
- 230000008646 thermal stress Effects 0.000 title claims abstract description 23
- 238000000034 method Methods 0.000 title claims abstract description 11
- 238000005259 measurement Methods 0.000 claims abstract description 20
- 239000013307 optical fiber Substances 0.000 claims abstract description 19
- 238000012545 processing Methods 0.000 claims abstract description 18
- 238000005516 engineering process Methods 0.000 claims abstract description 13
- 239000000523 sample Substances 0.000 claims abstract description 13
- 238000006073 displacement reaction Methods 0.000 claims description 10
- 230000000399 orthopedic effect Effects 0.000 claims description 7
- 230000008859 change Effects 0.000 claims description 3
- 230000004075 alteration Effects 0.000 claims description 2
- 238000012937 correction Methods 0.000 abstract description 5
- 239000004065 semiconductor Substances 0.000 abstract description 3
- 230000007547 defect Effects 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000005452 bending Methods 0.000 description 5
- 238000005538 encapsulation Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000010137 moulding (plastic) Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4885—Wire-like parts or pins
- H01L21/4896—Mechanical treatment, e.g. cutting, bending
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Laser Surgery Devices (AREA)
- Laser Beam Processing (AREA)
Abstract
Chip pin apparatus for shaping and method based on Laser Thermal Stress Forming technology, belong to semiconductor applications, in order to overcome the uppity defect of uniformity precision after the correction of prior art pin, chip is fixed on chip pin apparatus for shaping by chip fixture, two-dimension moving platform is made to do scanning motion along diagram y-axis, the relative height differential of each chip pin is measured and is obtained by sensor probe, and measurement result is reached by computer by sensor controller；Adjustment focuses on relative position of the laser on chip pin, makes the scanning direction of focusing laser illustrate y-axis direction parallel；According to the target shaping height of each chip pin for measuring, by the laser power and sweep speed of computer settings optical fiber laser, laser shaping processing is carried out to pin；The relative altitude of pin is measured again by sensor probe, and computer is determined to continue current pin shaping processing by corresponding program or shaping carried out to next pin, until all pins meet tolerance.
Description
Technical field
The present invention relates to the chip pin apparatus for shaping and method based on Laser Thermal Stress Forming technology, belongs to semiconductor skill
Art field.
Background technology
In field of semiconductor manufacture, dual inline type (DIP) encapsulation IC chip has the advantages that to install and connects up convenient obtaining
Extensive application was obtained, but due to the impact of vibration, impact in manufacture process and transportation and packing link, the situation of chip pin bending
Happen occasionally, Integrated circuit manufacturers must carry out detection before electronic component dress is carried out and reject defective work to chip pin,
Which increase manufacturing cost and the production cycle of electronic product；On the other hand as electronic product updates the cycle increasingly
Hurry up, produce a large amount of discarded DIP encapsulation IC chips, these chips are most still to be used, but the pin for disassembling process chip is sent out
Bending is given birth to, it is necessary to carry out corresponding shaping and can use compared with dead astern.
Chinese patent notification number CN202363435, entitled " the whole foot device of adjust automatically chip pin ", using machinery
Punching press Principles of Plastic Molding is corrected to bending chip pin, because there is a certain amount of elastic recoil in pressure Plastic Forming,
Therefore the uniformity precision after pin correction is wayward.
The content of the invention
In order to overcome the uppity defect of uniformity precision after the correction of prior art pin, the present invention to provide a kind of base
In the chip pin apparatus for shaping and method of Laser Thermal Stress Forming technology, with reference to No-contact Displacement Measurement technology, DIP is capable of achieving
Without Mod correction, the method has rigorous logicality, engineering for the noncontact of the high consistency of 0.5 micron of encapsulation IC chip pin
Simple, precision reliability is realized, without resilience problem, and possesses the condition that automation is processed, with preferable economic and practical.
To solve the above problems, the technical scheme is that：
Based on the chip pin apparatus for shaping of Laser Thermal Stress Forming technology, including laser thermal stress orthopedic systems and non-connect
Tactile displacement measurement system two parts；
Laser thermal stress orthopedic systems include two-dimension moving platform, chip fixture, laser scan unit and optical fiber laser,
Chip fixture is used to clamp chip, and both are arranged on two-dimension moving platform, and the laser that optical fiber laser sends is through optical fiber
Scanning motion is done after being transferred into laser scan unit, ultimately form focusing laser projection on the chip pin for treating shaping, it is right
Chip pin does shaping processing；
No-contact Displacement Measurement System includes aberration displacement sensor probe, sensor controller and computer, sensor
Pop one's head in the height change of fore-and-aft survey chip pin is processed in pin shaping and measurement result is reached by sensor controller
Computer, computer feeds back to laser thermal stress orthopedic systems after measurement result is compared with desired value carries out next round shaping and adds
Work, until all chip pin differences in height of chip are all adjusted within the margin of tolerance after repeatedly processing.
Based on the chip pin shaping methods of Laser Thermal Stress Forming technology, comprise the following steps：
Step one, chip is fixed on two-dimension moving platform by chip fixture, two-dimension moving platform is done along y-axis
Scanning motion, measures and obtains the relative height differential of each chip pin by sensor probe, will by sensor controller
Measurement result reaches computer；
Step 2, adjustment focus on relative position of the laser on chip pin, make the scanning direction and y-axis side of focusing laser
To parallel；The target shaping height of each chip pin measured according to step one, by computer settings optical fiber laser
Laser power and sweep speed, the laser that optical fiber laser sends do scanning fortune into after laser scan unit through Optical Fiber Transmission
It is dynamic, focusing laser projection is ultimately formed on the chip pin for treating shaping, laser shaping processing is carried out to chip pin；
Step 3, measures the relative altitude of chip pin again, so by sensor probe after completing shaping processing
Computer is determined to continue current chip pin shaping processing or next chip pin is carried out whole by corresponding program afterwards
Shape, until all chip pins meet tolerance.
The invention has the beneficial effects as follows：1st, noncontact processing, is capable of achieving the quick pin distortion correction not against mould, and
Without rebound phenomenon；2nd, plastic precision is high, feeds back with reference to non-contact measurement system, and achievable 0.5 micron high accuracy pin is consistent
Property shaping, meet uniformity tolerance to pin during current chip is installed；3rd, shaping efficiency high, facilitates implementation and adds automatically
Work, due to this device using laser as manufacturing process, measurement adopts non-contact displacement sensor, and both constitute closed-loop system can
Realize the quick pin detection and shaping of high-volume chip；4th, low cost of manufacture, without the need for being set for various sizes of chip again
Count shaping mould and increase investment.
Description of the drawings
Fig. 1 is structural representation of the present invention based on the chip pin apparatus for shaping of Laser Thermal Stress Forming technology.
Specific embodiment
Below in conjunction with the accompanying drawings the present invention is described in further details.
As shown in figure 1, the chip pin apparatus for shaping based on Laser Thermal Stress Forming technology, including laser thermal stress shaping
System and No-contact Displacement Measurement System two parts.
Laser thermal stress orthopedic systems include that two-dimension moving platform 11, chip fixture 1, laser scan unit 4 and optical fiber swash
Light device 6.Chip fixture 1 is used to clamp chip 9, and both are arranged on two-dimension moving platform 11, has multiple chips on chip 9
Pin 2.The laser that optical fiber laser 6 sends can do scanning motion through Transmission Fibers 5 into after laser scan unit 4, finally
Focus on laser 3 to be incident upon on the chip pin 2 for treating shaping, the chip pin 2 to deforming does shaping processing.
No-contact Displacement Measurement System specifically includes sensor probe 8, sensor controller 7 and computer 10.Sensor
Probe 8 is processed the height change of fore-and-aft survey chip pin 2 in pin shaping and is passed measurement result by sensor controller 7
To computer 10, computer 10 feeds back to laser thermal stress orthopedic systems after comparing measurement result and desired value carries out next round
Shaping is processed, until 2 difference in height of all chip pins of chip 9 is all adjusted within the margin of tolerance after repeatedly processing.
Based on the chip pin shaping methods of Laser Thermal Stress Forming technology, comprise the following steps：
Step one, chip 9 is fixed on two-dimension moving platform 11 by chip fixture 1, makes 11 edge of two-dimension moving platform
Diagram y-axis and do scanning motion, the relative height differential of each chip pin is measured and obtained by sensor probe 8, by passing
Measurement result is reached computer 10 by sensor controller 7；
Step 2, adjustment focus on relative position of the laser 3 on chip pin 2, illustrate the scanning direction of focusing laser 3
Y-axis direction is parallel；The target shaping height of each chip pin 2 measured according to step one, sets optical fiber by computer 10
The laser power and sweep speed of laser instrument 6, the laser that optical fiber laser 6 sends are transferred into laser scanning list through optical fiber 5
Scanning motion is done after unit 4, focusing laser 3 is ultimately formed and is incident upon on the chip pin 2 for treating shaping, chip pin 2 is swashed
Light shaping is processed；
Step 3, measures the relative altitude of chip pin 2 again by sensor probe 8 after completing shaping processing,
Then computer 10 determines to continue current chip pin 2 shaping processing or to next chip pin 2 by corresponding program
Shaping is carried out, until all chip pins 2 meet tolerance.
The principle of the chip pin orthopedic systems is using the uneven of the optical-fiber laser generation focused on metal pins
Temperature field induces thermal stress to produce desired shaping.Specifically, under temperature gradient mechanism effect, metal pins are due to local
It is heated and produces stress, when the stress exceedes the yield limit of metal, pin will produces the direction for bending towards laser irradiation
The bending of specific direction, the relative height differential of each pin that can be obtained according to measurement in actual shaping operation determine laser
Direction of illumination and laser technical parameterses, so as to complete the uniformity shaping of pin on whole DIP chips.During laser shaping
As each laser action time is very short, heat affected area very little, heat will not reach chip internal and produce destruction to which.
Claims (3)
1. the chip pin apparatus for shaping based on Laser Thermal Stress Forming technology, is characterized in that, including laser thermal stress shaping system
System and No-contact Displacement Measurement System two parts；
Laser thermal stress orthopedic systems include two-dimension moving platform (11), chip fixture (1), laser scan unit (4) and optical fiber
Laser instrument (6)；Chip fixture (1) is for clamping chip (9), and both are arranged on two-dimension moving platform (11)；Optical-fiber laser
The laser that device (6) sends does scanning motion after optical fiber (5) is transferred into laser scan unit (4), ultimately forms focusing and swashs
Light (3) is incident upon on the chip pin (2) for treating shaping, and shaping processing is done to chip pin (2)；
No-contact Displacement Measurement System includes aberration displacement sensor probe (8), sensor controller (7) and computer (10),
Sensor probe (8) is processed the height change of fore-and-aft survey chip pin (2) in pin shaping and passes through sensor controller (7)
Measurement result is reached into computer (10), it is whole that computer (10) feeds back to laser thermal stress after measurement result is compared with desired value
Shape system carries out next round shaping processing, until all chip pins (2) difference in height of chip (9) is all adjusted after repeatedly processing
Within the margin of tolerance.
2. the chip pin apparatus for shaping based on Laser Thermal Stress Forming technology according to claim 1, it is characterised in that
There are on the chip (9) multiple chip pins (2).
3. the chip pin shaping methods based on Laser Thermal Stress Forming technology, is characterized in that, comprise the following steps：
Step one, chip (9) is fixed on two-dimension moving platform (11) by chip fixture (1), two-dimension moving platform is made
(11) scanning motion is done along y-axis, the relative height differential of each chip pin (2) is measured and obtained by sensor probe (8),
Measurement result is reached by computer (10) by sensor controller (7)；
Step 2, adjustment focus on laser (3) relative position on chip pin (2), make the scanning direction of focusing laser (3) with
Y-axis direction is parallel；The target shaping height of each chip pin (2) measured according to step one, is set by computer (10)
The laser power and sweep speed of optical fiber laser (6), the laser that optical fiber laser (6) sends are transferred into through optical fiber (5)
Laser scan unit does scanning motion after (4), ultimately forms focusing laser (3) and is incident upon on the chip pin (2) for treating shaping, right
Chip pin (2) carries out laser shaping processing；
Step 3, measures the relative altitude of chip pin (2) again by sensor probe (8) after completing shaping processing,
Then computer (10) is determined to continue current chip pin (2) shaping processing or next chip is drawn by corresponding program
Pin (2) carries out shaping, until all chip pins (2) meet tolerance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410440423.5A CN104332428B (en) | 2014-08-29 | 2014-08-29 | Chip pin apparatus for shaping and method based on Laser Thermal Stress Forming |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410440423.5A CN104332428B (en) | 2014-08-29 | 2014-08-29 | Chip pin apparatus for shaping and method based on Laser Thermal Stress Forming |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104332428A CN104332428A (en) | 2015-02-04 |
| CN104332428B true CN104332428B (en) | 2017-04-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410440423.5A Active CN104332428B (en) | 2014-08-29 | 2014-08-29 | Chip pin apparatus for shaping and method based on Laser Thermal Stress Forming |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109633225A (en) * | 2018-12-27 | 2019-04-16 | 深圳市海维光电科技有限公司 | A kind of production technology of circuit board detecting testing needle |
| CN112582310B (en) * | 2020-12-28 | 2024-03-19 | 无锡中微腾芯电子有限公司 | Direct-insertion type packaging integrated circuit pin shaping equipment |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202363435U (en) * | 2011-12-15 | 2012-08-01 | 苏州工业园区恒越自动化科技有限公司 | Pin-shaping device for automatically adjusting chip pins |
| CN103537803A (en) * | 2012-07-16 | 2014-01-29 | 深圳市木森科技有限公司 | Method and device for solder ball shaping |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4088121B2 (en) * | 2002-08-14 | 2008-05-21 | 富士通株式会社 | Contactor manufacturing method |
| WO2014038087A1 (en) * | 2012-09-10 | 2014-03-13 | 富士機械製造株式会社 | Lead correction method and lead correction device |
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- 2014-08-29 CN CN201410440423.5A patent/CN104332428B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202363435U (en) * | 2011-12-15 | 2012-08-01 | 苏州工业园区恒越自动化科技有限公司 | Pin-shaping device for automatically adjusting chip pins |
| CN103537803A (en) * | 2012-07-16 | 2014-01-29 | 深圳市木森科技有限公司 | Method and device for solder ball shaping |
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| CN104332428A (en) | 2015-02-04 |
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Effective date of registration: 20190830 Address after: Room 601-10, 6th floor, 52 Block 2, Jingyuan North Street, Beijing Economic and Technological Development Zone, 100176 Patentee after: Beijing Guowang Optical Technology Co., Ltd. Address before: 130033 southeast Lake Road, Jilin, Changchun, No. 3888 Patentee before: Changchun Inst. of Optics and Fine Mechanics and Physics, Chinese Academy of Sci |