CN104332426A - Equipment and method for detecting noncontact scanning polished wafer surface roughness - Google Patents
Equipment and method for detecting noncontact scanning polished wafer surface roughness Download PDFInfo
- Publication number
- CN104332426A CN104332426A CN201410660605.3A CN201410660605A CN104332426A CN 104332426 A CN104332426 A CN 104332426A CN 201410660605 A CN201410660605 A CN 201410660605A CN 104332426 A CN104332426 A CN 104332426A
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- silicon chip
- manipulator
- scattered light
- surface roughness
- silicon
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
The invention provides equipment and a method for detecting noncontact scanning polished wafer surface roughness. The method includes that a light scattering principle is utilized to detect the edges of silicon wafers and particles on the surfaces of the silicon wafers; in the process of detection, wafer fetching and classified placing of the silicon wafers are performed through a manipulator, so that automated control is realized; a detection image and a set of data corresponding roughness of the silicon wafers are formed after detection is completed, so that a detector can acquire information of the silicon wafers more visually, simply and conveniently.
Description
Technical field
The invention belongs to checkout gear field, especially relates to a kind of checkout equipment and detection method of non-contact scanning polished silicon wafer surface roughness.
Background technology
Along with the increase of silicon chip diameter, the core number on every sheet silicon chip can increase, and the cost of chip will reduce.But along with silicon chip is to large diameter future development, the quality requirement of manufacturer to semiconductor silicon wafer is also more and more higher, but affect a lot of because have of silicon wafer performance, wherein the surface appearance feature of silicon chip is one of standard of key reaction Si wafer quality.The shape characteristic of silicon chip surface comprises size and the density, organic substance, microroughness, natural oxidizing layer etc. of particle, and these all can have a strong impact on the performance that the later stage produces device.And for manufacture chip, the quality control on the surface of silicon chip is extremely important, so it is very important for carrying out detection to wafer topography.And existing silicon chip surface roughness measurement generally adopts artificial hand-held detector to carry out Scanning Detction to silicon chip one by one, its detection efficiency is low, and very easily cause undetected, and present roughness instrument needs when detecting directly to contact with silicon chip surface, damage can be caused to silicon chip surface, leave potential safety hazard for silicon chip below uses.
Summary of the invention
The invention will solve above technical problem, provides checkout equipment and the detection method of non-contact scanning polished silicon wafer surface roughness.
For solving the problems of the technologies described above, the technical scheme that the invention adopts is: the checkout equipment of non-contact scanning polished silicon wafer surface roughness, comprise work box, silicon chip sending station, silicon chip receiving platform, silicon chip treats scaffold tower, first manipulator, positioning mechanical arm, second manipulator, laser diverging system and scattered light receiving system, described silicon chip sending station is positioned at described tank inlet, described silicon chip receiving platform is positioned at described tank outlet, described first manipulator, positioning mechanical arm, second manipulator, silicon chip treats scaffold tower, laser diverging system and scattered light receiving system are all positioned at described casing, described first manipulator and described second manipulator lay respectively at the both sides that described silicon chip treats scaffold tower, described positioning mechanical arm is positioned at described silicon chip to be treated below scaffold tower.
Further, also comprise control system and display system, described display system is connected with described control system.
Further, described laser diverging system comprises laser, photoelectric sensor and photoelectric type and seeks limit machine, described photoelectric sensor and described photoelectric type are sought limit machine and are positioned at below described positioning mechanical arm, and described laser, photoelectric sensor and photoelectric type are sought limit machine and be all connected with described control system.
Further, described scattered light receiving system comprises some scattered light sensors, and described scattered light sensor is connected with described control system.
Further, described positioning mechanical arm is the suctorial rotating machine arm of band.
The detection method of non-contact scanning polished silicon wafer surface roughness, comprises the following steps:
Carry out range set to silicon chip parameter to be measured, laser and photoelectric type are sought limit chance and are started voluntarily according to the induction of photoelectric sensor and stop;
The sheet basket that silicon chip is housed is put into silicon chip sending station, by the first manipulator silicon chip taken out from sheet basket and be put into silicon chip and treat scaffold tower, laser and photoelectric type are sought the end face edge of limit machine to silicon chip and are scanned, and positioning mechanical arm holds silicon chip and rotates simultaneously, stops after rotating 360 degrees;
While scanning the end face edge of silicon chip, scattered light receiving system receives the scattered light of silicon chip surface particle institute scattering, and scattered light signal is sent to control system;
Control system processes acquisition optical information, draws corresponding image and test data, and is sent to display system display, and simultaneously control system is to the parameter area comparison of the silicon wafer parameters recorded and setting;
After silicon slice under test has been tested, defective silicon chip is positioned in the sheet indigo plant of defective silicon chip receiving platform by the second manipulator, is positioned over by qualified silicon chip in the sheet indigo plant of qualified silicon chip receiving platform.
The advantage that the invention has and good effect are: the checkout equipment of non-contact scanning polished silicon wafer surface roughness and detection method, the scattering principle of light is utilized to detect the edge of silicon chip and silicon chip surface particle, undertaken getting sheet and carrying out sorting placement to silicon chip by manipulator in testing process, achieve Automated condtrol, detect the data of the roughness that can form a detected image and one group of corresponding silicon chip after terminating, the information drawing silicon chip that tester is more intuitively easy can be made.
Accompanying drawing explanation
Fig. 1 is the assay device structures schematic diagram of non-contact scanning polished silicon wafer surface roughness.
In figure: 1, display system; 2, positioning mechanical arm; 3, silicon chip sending station;
4, the first manipulator; 5, the second manipulator; 6, silicon chip receiving platform;
7, laser diverging system; 8, scattered light receiving system; 9, silicon chip treats scaffold tower;
10, work box.
Embodiment
Below the specific embodiment of the invention is elaborated.
As shown in Figure 1, the checkout equipment of non-contact scanning polished silicon wafer surface roughness, comprise work box 10, silicon chip sending station 3, silicon chip receiving platform 6, silicon chip treats scaffold tower 9, first manipulator 4, positioning mechanical arm 2, second manipulator 5, laser diverging system 7 and scattered light receiving system 8, described silicon chip sending station 3 is positioned at described casing 10 entrance, described silicon chip receiving platform 6 is positioned at described casing 10 and exports, described first manipulator 4, positioning mechanical arm 2, second manipulator 5, silicon chip treats scaffold tower 9, laser diverging system 7 and scattered light receiving system 8 are all positioned at described casing 10, described first manipulator 4 and described second manipulator 5 lay respectively at the both sides that described silicon chip treats scaffold tower 9, described positioning mechanical arm 2 is positioned at described silicon chip to be treated below scaffold tower 9.
Also comprise control system and display system 1, described display system 1 is connected with described control system.
Described laser diverging system 7 comprises laser, photoelectric sensor and photoelectric type and seeks limit machine, described photoelectric sensor and described photoelectric type are sought limit machine and are positioned at below described positioning mechanical arm 2, and described laser, photoelectric sensor and photoelectric type are sought limit machine and be all connected with described control system.
Described scattered light receiving system 8 comprises some scattered light sensors, and described scattered light sensor is connected with described control system.
Described positioning mechanical arm 2 is the suctorial rotating machine arm of band.
The detection method of non-contact scanning polished silicon wafer surface roughness, comprises the following steps:
Carry out range set to silicon chip parameter to be measured, laser and photoelectric type are sought limit chance and are started voluntarily according to the induction of photoelectric sensor and stop;
The sheet basket that silicon chip is housed is put into silicon chip sending station 3, by the first manipulator 4 silicon chip taken out from sheet basket and be put into silicon chip and treat scaffold tower 9, laser and photoelectric type are sought the end face edge of limit machine to silicon chip and are scanned, and positioning mechanical arm 2 holds silicon chip and rotates simultaneously, stops after rotating 360 degrees;
While scanning the end face edge of silicon chip, scattered light receiving system 8 receives the scattered light of silicon chip surface particle institute scattering, and scattered light signal is sent to control system;
Control system processes acquisition optical information, draws corresponding image and test data, and is sent to display system 1 and shows, and control system is to the parameter area comparison of the silicon wafer parameters recorded and setting simultaneously;
After silicon slice under test has been tested, defective silicon chip is positioned in the sheet indigo plant of defective silicon chip receiving platform 6 by the second manipulator 5, is positioned over by qualified silicon chip in the sheet indigo plant of qualified silicon chip receiving platform 6.
A most preferred embodiment is utilize the detection method of contactless polished silicon wafer surface roughness to detect 8 inches of polished silicon wafer edge patterns, and it mainly uses the scattering principle of light.After unlatching marginal test system, range set is carried out to the parameter that 8 cun of silicon chips will be surveyed, then being put into by the sheet basket that 8 cun of silicon chips are housed deposits on the silicon chip sending station 3 of sheet basket, by the first manipulator 48 cun of silicon chips are taken out from sheet basket and be put into silicon chip and treat scaffold tower 9, silicon chip treats have a photoelectric type seeking border and rotating machine arm to seek limit centralized positioning to silicon chip below scaffold tower 9, seek limit terminate rear laser system by beginning from the reference end face of silicon chip, the edge of 8 cun of silicon chips is scanned, the sucker of the rotating machine arm while scanning below 8 cun of silicon chips holds silicon chip, rotate with certain angular speed, namely limit rotation limit is scanned, silicon slice rotating 360 degree of rear stoppings.In the process of scanning, if when having particle or scratch on the surface of silicon chip, because different material surface is different to the scattered power of light, certain change will be there is in optical signalling, scattered light sensor light signal is received and have one correspondingly control system the scattered light signal received is processed, and show that corresponding image and test data are shown by display system 1, control system can contrast the parameter area of the parameter of the silicon chip recorded and setting simultaneously, silicon chip can be placed in the middle of the sheet basket on qualified silicon chip receiving platform 6 by qualified silicon chip second manipulator 5, underproof silicon chip second manipulator 5 will be put in the middle of the sheet basket on defective silicon chip receiving platform 6.
Above an embodiment of the invention has been described in detail, but described content being only the preferred embodiment of the invention, the practical range for limiting the invention can not being considered to.All equalization changes done according to the invention application range with improve, within the patent covering scope that still all should belong to the invention.
Claims (6)
1. the checkout equipment of non-contact scanning polished silicon wafer surface roughness, it is characterized in that: comprise work box, silicon chip sending station, silicon chip receiving platform, silicon chip treats scaffold tower, first manipulator, positioning mechanical arm, second manipulator, laser diverging system and scattered light receiving system, described silicon chip sending station is positioned at described tank inlet, described silicon chip receiving platform is positioned at described tank outlet, described first manipulator, positioning mechanical arm, second manipulator, silicon chip treats scaffold tower, laser diverging system and scattered light receiving system are all positioned at described casing, described first manipulator and described second manipulator lay respectively at the both sides that described silicon chip treats scaffold tower, described positioning mechanical arm is positioned at described silicon chip to be treated below scaffold tower.
2. the checkout equipment of a kind of non-contact scanning polished silicon wafer surface roughness according to claim 1, it is characterized in that: also comprise control system and display system, described display system is connected with described control system.
3. the checkout equipment of a kind of non-contact scanning polished silicon wafer surface roughness according to claim 2, it is characterized in that: described laser diverging system comprises laser, photoelectric sensor and photoelectric type and seeks limit machine, described photoelectric sensor and described photoelectric type are sought limit machine and are positioned at below described positioning mechanical arm, and described laser, photoelectric sensor and photoelectric type are sought limit machine and be all connected with described control system.
4. the checkout equipment of a kind of non-contact scanning polished silicon wafer surface roughness according to claim 2, is characterized in that: described scattered light receiving system comprises some scattered light sensors, and described scattered light sensor is connected with described control system.
5. the checkout equipment of a kind of non-contact scanning polished silicon wafer surface roughness according to claim 1, is characterized in that: described positioning mechanical arm is the suctorial rotating machine arm of band.
6. the detection method of non-contact scanning polished silicon wafer surface roughness, comprises the following steps:
Carry out range set to silicon chip parameter to be measured, laser and photoelectric type are sought limit chance and are started voluntarily according to the induction of photoelectric sensor and stop;
The sheet basket that silicon chip is housed is put into silicon chip sending station, by the first manipulator silicon chip taken out from sheet basket and be put into silicon chip and treat scaffold tower, laser and photoelectric type are sought the end face edge of limit machine to silicon chip and are scanned, and positioning mechanical arm holds silicon chip and rotates simultaneously, stops after rotating 360 degrees;
While scanning the end face edge of silicon chip, scattered light receiving system receives the scattered light of silicon chip surface particle institute scattering, and scattered light signal is sent to control system;
Control system processes acquisition optical information, draws corresponding image and test data, and is sent to display system display, and simultaneously control system is to the parameter area comparison of the silicon wafer parameters recorded and setting;
After silicon slice under test has been tested, defective silicon chip is positioned in the sheet indigo plant of defective silicon chip receiving platform by the second manipulator, is positioned over by qualified silicon chip in the sheet indigo plant of qualified silicon chip receiving platform.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410660605.3A CN104332426A (en) | 2014-11-18 | 2014-11-18 | Equipment and method for detecting noncontact scanning polished wafer surface roughness |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410660605.3A CN104332426A (en) | 2014-11-18 | 2014-11-18 | Equipment and method for detecting noncontact scanning polished wafer surface roughness |
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| CN104332426A true CN104332426A (en) | 2015-02-04 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017107638A1 (en) * | 2015-12-25 | 2017-06-29 | 深圳艾尼尔角膜工程有限公司 | Automatic sorting and collecting system and method for cornea packages |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1181135A (en) * | 1995-03-06 | 1998-05-06 | Ade光学系统公司 | Surface inspection system and method of inspecting surface of workpiece |
| CN101171506A (en) * | 2005-05-06 | 2008-04-30 | 恪纳腾技术公司 | Wafer edge inspection |
| CN101326622A (en) * | 2005-12-06 | 2008-12-17 | 芝浦机械电子装置股份有限公司 | Surface roughness tester |
| CN103339496A (en) * | 2010-12-09 | 2013-10-02 | 米尔鲍尔股份公司 | Optical examination device and optical examination method |
-
2014
- 2014-11-18 CN CN201410660605.3A patent/CN104332426A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1181135A (en) * | 1995-03-06 | 1998-05-06 | Ade光学系统公司 | Surface inspection system and method of inspecting surface of workpiece |
| CN101171506A (en) * | 2005-05-06 | 2008-04-30 | 恪纳腾技术公司 | Wafer edge inspection |
| CN101326622A (en) * | 2005-12-06 | 2008-12-17 | 芝浦机械电子装置股份有限公司 | Surface roughness tester |
| CN103339496A (en) * | 2010-12-09 | 2013-10-02 | 米尔鲍尔股份公司 | Optical examination device and optical examination method |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017107638A1 (en) * | 2015-12-25 | 2017-06-29 | 深圳艾尼尔角膜工程有限公司 | Automatic sorting and collecting system and method for cornea packages |
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Application publication date: 20150204 |