CN104324768B - The preparation method of a kind of small three-dimensional structure raceway groove micro flow chip - Google Patents
The preparation method of a kind of small three-dimensional structure raceway groove micro flow chip Download PDFInfo
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- CN104324768B CN104324768B CN201410574398.XA CN201410574398A CN104324768B CN 104324768 B CN104324768 B CN 104324768B CN 201410574398 A CN201410574398 A CN 201410574398A CN 104324768 B CN104324768 B CN 104324768B
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Abstract
The present invention relates to the preparation method of a kind of small three-dimensional structure raceway groove micro flow chip, comprise the bonding of the selection of the substrate in wet-etching technology, the embedding etching pattern, wet etching, substrate, described wet etching refers to substrate after the mask embedded object of over etching pattern, by conveying fixture, according to the speed of 0.01mm/min-1mm/min, substrate is put in etching liquid slowly, by the speed of adjustment conveying fixture, obtain the small three-dimensional structure raceway groove micro flow chip of different gradient. The preparation method of the present invention changes the raceway groove present situation that is too single and too rule of the micro flow chip in the past etched with direct immersion corrosion method, by adjusting the transfer rate of fixture, the time of each partial etching in the etching face of the substrate making to be immersed in etching liquid is different, thus obtains the small three-dimensional structure raceway groove of different special shape. Preparation method's technique of the present invention is simple, and the micro flow chip prepared has the feature of miniatureization, can be widely used in analysis field.
Description
Technical field
The present invention relates to a kind of technology preparing micro flow chip fast, specifically the preparation method of a kind of small three-dimensional structure micro flow chip raceway groove.
Background technology
Micro flow chip is the core of micro-analysis system, and the invention of micro flow chip and application provide great convenience to the scientific domains such as chemistry, food, environment, medical science, have impelled some miniatureization analyzed, integrated, automatization and convenientization. Save some chemical reactions greatly to the consumption of valuable chemical reagent, also improve analysis efficiency greatly, reduce expense.
Usually the main raw making micro flow chip has quartz, glass and silicon chip and some superpolymer etc. Using the micro flow chip that superpolymer makes, it is easy to make, but also has some shortcomings of itself, and its shortcoming may be summarized to be stability difference, can not meet some long-term detection demands. And its stability of micro flow chip that glass, quartz make is better, but traditional micro flow chip made with glass, quartz, its manufacture craft comprises photoetching and chemical etching, but its raceway groove of the micro flow chip that these techniques are made is all very regular, can not produce the micro flow chip of the raceway groove of some special shapes.
The micro flow chip of preparation mainly adopts photoetching and chemical etching at present, such as patent ZL200610019354.6 and patent ZL200510019720.3. The main material used has quartz, glass and superpolymer etc., it may also be useful to method prepared by micro flow chip many employings photoetching that superpolymer makes, and etching micro flow chip channel shape rule out, and the complex process cost height of photoetching, should not apply. The micro flow chip made at silicon base mediums such as glass and quartz mainly adopts the method for chemical etching to prepare, the micro flow chip good stability that it is made, it may also be useful to the life-span is long. But the raceway groove of the micro flow chip that the method for traditional chemical etching etches out is all very regular, the micro flow chip of the miniflow raceway groove with special shape cannot be etched. Traditional lithographic method can not etch the micro flow chip of special shape raceway groove.
Summary of the invention
It is an object of the invention to overcome above-mentioned the deficiencies in the prior art, it is provided that a kind of processing is simple, and efficiency height, has the micro flow chip of the small three-dimensional structure raceway groove of good chemical stability.
In order to realize above-mentioned purpose, the present invention solves the problems of the technologies described above the technical scheme adopted and is:
The preparation method of a kind of small three-dimensional structure raceway groove micro flow chip, comprise the bonding of the selection of the substrate in wet-etching technology, etch mask preparation, wet etching, substrate, described wet etching refers to the substrate of selection after etch mask preparation processes, by conveying fixture, by the speed of 0.01mm/min-1mm/min, substrate is put in etching liquid slowly, by the speed of adjustment conveying fixture with entering liquid angle, obtain the small three-dimensional structure raceway groove micro flow chip of different gradient.
Fixture is transferred speed and can be adjusted in real time within the scope of 0.01mm/min-1mm/min in etching process.
The etching face of substrate becomes the angle of 179.9 �� to 0.1 �� with the liquid level of etching liquid.
The surface, side of substrate and the liquid level of the etching liquid angle to 0 �� in 90 ��.
Owing to have employed above technical scheme, the present invention changes the raceway groove present situation that is too single and too rule of the micro flow chip in the past etched with direct immersion corrosion method, by the transfer rate of adjustment conveying fixture, the time of each partial etching in the etching face of the substrate making to be immersed in etching liquid is different, the time of the substrate etching being immersed in etching liquid after the substrate ratio being first immersed in etching liquid is long, whole raceway groove is finally made to present the relation of the gradient, such that it is able to obtain the small three-dimensional structure raceway groove of the different special shape gradient. The preparation method of the present invention, complete processing is simple, and the micro flow chip prepared has the feature of miniatureization three-dimensional structure, can be widely used in analysis field.
Embodiment
Below in conjunction with embodiment, the present invention is further described.
A preparation method for small three-dimensional structure micro flow chip raceway groove, preparation method carries out according to the following steps.
1, the selection of substrate and process: the substrate of the present invention can be glass, quartz or other material; The substrate chosen is cleaned, the impurity such as the greasy dirt of removal glass surface;
2, etch mask preparation: cleaned substrate of glass is carried out drying and processing, carries out etch mask preparation process in the upper and lower surface of substrate after drying and processing, obtain being etched figure;
3, wet etching: described wet etching refers to the substrate of selection after etch mask preparation processes, by conveying fixture, according to the speed of 0.01mm/min-1mm/min, substrate is put in etching liquid slowly, can by the design requirements of different raceway groove, making the etching face of substrate become the angle of 179.9 �� to 0.01 �� with the liquid level of etching liquid, the surface, side of substrate is immersed in etching liquid with the liquid level angle to 0 �� in 90 �� of etching liquid. By the speed of adjustment conveying fixture, obtain the small three-dimensional structure micro flow chip raceway groove of different gradient.
4, micro flow chip is prepared in the combination of lid sheet and substrate: the etch mask that the substrate of glass through above-mentioned process is got rid of its surface, makes complete out exposed of whole substrate of glass. After substrate of glass is carried out clean, choose micro flow chip lid sheet and substrate carries out combination and prepares micro flow chip, obtain having the micro flow chip of small three-dimensional structure raceway groove.
Specific embodiment
Embodiment 1
By above-mentioned preparation process
1, choice of the substrates is glass, and wherein the length of substrate of glass to be 75mm, width be 25mm, thickness are 2mm, and the substrate chosen is carried out cleaning, drying process;
2, upper and lower surface in the good substrate of drying and processing carries out mask embedded object, when process be expose on one of them surface of substrate one long for 60mm, width be the rectangular etch areas of 15mm;
3, by the substrate that mask embedding treatment is good, by conveying fixture, make the angle that etching face and etching liquid liquid level are in 90 ��, put in etching liquid with the speed of 1mm/min, etch 60min;
4, the substrate of glass of above-mentioned process is got rid of the mask embedded object on its surface, makes complete out exposed of whole substrate of glass. After substrate of glass is carried out clean, choose PDMS thin slice and it is bonded with substrate of glass as lid sheet, obtain the micro flow chip of the small three-dimensional structure raceway groove of slope shape.
Embodiment 2
By above-mentioned preparation process
1, choice of the substrates is glass, and wherein the length of substrate of glass to be 75mm, width be 25mm, thickness are 2mm, and the substrate chosen is carried out cleaning, drying process;
2, upper and lower surface in the good substrate of drying and processing carries out mask embedded object, when process be expose on one of them surface of substrate one long for 60mm, width be the rectangular etch areas of 10mm;
3, by the substrate that mask embedding treatment is good, by conveying fixture, making etching face become the angle of 0.01 �� with etching liquid liquid level, put in etching liquid with the speed of 0.01mm/min, etching 300min obtains slope shape raceway groove;
4, the substrate of glass of above-mentioned process is got rid of the mask mask embedded object on its surface, makes complete out exposed of whole substrate of glass. After substrate of glass is carried out clean, choose PDMS thin slice and it is bonded with substrate of glass as lid sheet, obtain the micro flow chip that the degree of depth is the small three-dimensional structure raceway groove of 1mm.
Embodiment 3
By above-mentioned preparation process
1, choice of the substrates is quartz, and wherein the length of quartz substrate to be 75mm, width be 25mm, thickness are 3mm, and the substrate chosen is carried out cleaning, drying process;
2, upper and lower surface in the good substrate of drying and processing carries out mask embedded object, when process be expose on one of them surface of substrate one long for 50mm, width be the rectangular etch areas of 10mm;
3, by the substrate that mask embedding treatment is good, by conveying fixture, making etching face become the angle of 179.9 �� with etching liquid liquid level, put in etching liquid with the speed of 0.5mm/min, etching 40min obtains slope shape raceway groove;
4, the quartz substrate of above-mentioned process is got rid of the mask embedded object on its surface, makes complete out exposed of whole quartz substrate. After quartz substrate is carried out clean, choose micro flow chip lid sheet and it is bonded with quartz substrate, obtain the micro flow chip that channel depth is the small three-dimensional structure raceway groove of 2mm.
Embodiment 4
By above-mentioned preparation process
1, choice of the substrates is glass, and wherein the length of substrate of glass to be 75mm, width be 25mm, thickness are 2mm, and the substrate chosen is carried out cleaning, drying process;
2, upper and lower surface in the good substrate of drying and processing carries out mask embedded object, when process be expose on one of them surface of substrate one long for 60mm, width be the rectangular etch areas of 15mm;
3, by the substrate that mask embedding treatment is good, by conveying fixture, making the surface, side of substrate become the angle of 0 �� with etching liquid liquid level, put in etching liquid with the speed of 1mm/min, etching 15min obtains the raceway groove of slope shape;
4, the substrate of glass of above-mentioned process is got rid of the mask embedded object on its surface, makes complete out exposed of whole substrate of glass. After substrate of glass is carried out clean, choose PDMS thin slice and it is bonded with substrate of glass as lid sheet, thus obtain the micro flow chip of small three-dimensional structure raceway groove.
Embodiment 5
By above-mentioned preparation process
1, choice of the substrates is glass, and wherein the length of substrate of glass to be 75mm, width be 25mm, thickness are 2mm, and the substrate chosen is carried out cleaning, drying process;
2, upper and lower surface in the good substrate of drying and processing carries out mask embedded object, when process be expose on one of them surface of substrate one long for 60mm, width be the rectangular etch areas of 10mm;
3, by substrate that mask embedding treatment is good, by conveying fixture, making surface, side and the etching liquid liquid level angle at 45 �� of substrate, put in etching liquid with the speed of 0.5mm/min, etching 120min obtains the slope shape raceway groove of an angle at 45 �� along its length;
4, the substrate of glass of above-mentioned process is got rid of the mask embedded object on its surface, makes complete out exposed of whole substrate of glass. After substrate of glass is carried out clean, choose PDMS thin slice and it is bonded with substrate of glass as lid sheet, it is possible to obtain the micro flow chip of the small three-dimensional structure raceway groove of a kind of special shape.
Embodiment 6
By above-mentioned preparation process
1, choice of the substrates is quartz, and wherein the length of quartz substrate to be 30mm, width be 10mm, thickness are 2mm, and the substrate chosen is carried out cleaning, drying process;
2, upper and lower surface in the good substrate of drying and processing carries out mask embedded object, when process be expose on one of them surface of substrate one long for 3mm, width be the rectangular etch areas of 2mm;
3, by the substrate that mask embedding treatment is good, by conveying fixture, the angle making the surface, side of substrate in 90 �� with etching liquid liquid level, puts in etching liquid with the speed of 0.01mm/min, and etching 300min obtains the raceway groove of slope shape;
4, the quartz substrate of above-mentioned process is got rid of the mask embedded object on its surface, makes complete out exposed of whole quartz substrate. After quartz substrate is carried out clean, choose micro flow chip lid sheet and it is bonded with quartz substrate, thus obtain the micro flow chip of the small three-dimensional structure raceway groove of the slope shape gradient.
Embodiment 7
By above-mentioned preparation process
1, choice of the substrates is silicon chip, and wherein length at the bottom of silicon wafer-based to be 60mm, width be 15mm, thickness are 2mm, and the substrate chosen is carried out cleaning, drying process;
2, upper and lower surface in the good substrate of drying and processing carries out mask embedded object, when process be expose on one of them surface of substrate one long for 30mm, width be the rectangular etch areas of 10mm;
3, by substrate that mask embedding treatment is good, by conveying fixture, make the etching face of substrate and etching liquid liquid level angle in 90 ��, conveying fixture is immersed in etching liquid slowly, first with the speed etching 60min of 0.1mm/min, and then with the speed etching 20min of 0.5mm/min, then continue to etch, with 1mm/min speed, the raceway groove that 14min obtains continuous slope shape again;
4, get rid of the mask embedded object on its surface at the bottom of silicon wafer-based to above-mentioned process, make at the bottom of whole silicon wafer-based complete out exposed. After carrying out clean at the bottom of silicon wafer-based, choose micro flow chip lid sheet and it is bonded with at the bottom of silicon wafer-based, thus obtain the micro flow chip of the small three-dimensional structure raceway groove of the continuous slope shape gradient.
The substrate that mask embedded object is handled well by the displacement platform that the present invention's utilization is made, in the process of etching, obtains the micro flow chip of different small three-dimensional structure raceway groove by the different angles of adjustment immersion etching liquid liquid level. Lithographic method of the present invention compares the method for existing chemical etching, and complete processing is simple, it is possible to effectively obtain the micro flow chip of the small three-dimensional structure raceway groove of the different special shape gradient. The micro flow chip that the present invention prepares has the feature of miniatureization, can be widely used in analysis field.
Claims (3)
1. the preparation method of a small three-dimensional structure raceway groove micro flow chip, comprise the bonding of the selection of substrate in wet-etching technology, the embedding etching pattern, wet etching, substrate, it is characterized in that: described wet etching refers to the substrate of selection after the mask embedded object of over etching pattern, by conveying fixture, according to the speed of 0.01mm/min-1mm/min, substrate is put in etching liquid slowly, by the speed of adjustment conveying fixture, obtain the small three-dimensional structure raceway groove micro flow chip of different gradient.
2. the preparation method of small three-dimensional structure raceway groove micro flow chip according to claim 1, it is characterised in that: the etching face of substrate becomes the angle of 179.9 �� to 0.01 �� with the liquid level of etching liquid.
3. the preparation method of small three-dimensional structure raceway groove micro flow chip according to claim 1, it is characterised in that: surface, the side of substrate and the liquid level of the etching liquid angle to 0 �� in 90 ��.
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