CN104312040B - A kind of YMQ protects form integrated board - Google Patents
A kind of YMQ protects form integrated board Download PDFInfo
- Publication number
- CN104312040B CN104312040B CN201410554623.3A CN201410554623A CN104312040B CN 104312040 B CN104312040 B CN 104312040B CN 201410554623 A CN201410554623 A CN 201410554623A CN 104312040 B CN104312040 B CN 104312040B
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- Prior art keywords
- ymq
- integrated board
- form integrated
- protects
- projection
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
- C08K13/04—Ingredients characterised by their shape and organic or inorganic ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/346—Clay
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
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- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04G—SCAFFOLDING; FORMS; SHUTTERING; BUILDING IMPLEMENTS OR AIDS, OR THEIR USE; HANDLING BUILDING MATERIALS ON THE SITE; REPAIRING, BREAKING-UP OR OTHER WORK ON EXISTING BUILDINGS
- E04G9/00—Forming or shuttering elements for general use
- E04G9/10—Forming or shuttering elements for general use with additional peculiarities such as surface shaping, insulating or heating, permeability to water or air
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K2003/023—Silicon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
- C08K2003/265—Calcium, strontium or barium carbonate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
Abstract
Form integrated board is protected the invention discloses a kind of YMQ, the mass percent of its each composition material is：PVC：20%th, silica flour：4%th, high-calcium powder：5%th, nano inorganic siliceous material 23%, nano inorganic fiber 18%, kaolin：4%th, silica flour：10%th, plasticizer：3%th, lubricant：5%th, ultra-violet absorber：1%th, light stabilizer 1%, foaming agent 6% is constituted.It is shaped as front and rear two sides and is equipped with several dovetail grooves, one side middle part is provided with the circular projection for traversing whole side, with in the middle part of this sideways relative side provided with the circular groove for traversing this side, two other is provided with rectangle projection sideways, I-shaped connector is provided with the opposite rectangular recess of two aperture positions, the shape of two rectangular recess is engaged with rectangle projection, and when two pieces of YMQ protect form integrated board grafting, rectangle projection can be inserted into rectangular recess.The beneficial effects of the invention are as follows safe, manufacturing cost is low.
Description
Technical field
The invention belongs to building material technical field, it is related to a kind of YMQ and protects form integrated board.
Background technology
YMQ protects form integrated board and referred to：Nanometer heat insulating material and the one-time formed sheet material of building template.In current construction market
Used insulation material has two kinds of systems：1), thin-coat plaster system (Sandwich system)：Its main material has, XPS, EPS, poly-
Urethane, rock wool, composite etc., occur after construction cracking, come off, hollowing, heat-insulating property decay etc. common quality defect.It is theoretical
Service life is only 25 years.2), structure-integrated material：Composite (insulation and template one), XPS (EPS) steel wire net rack,
XPS (EPS) heat preservation module etc., if above material reaches the requirement of national building structure integrated energy-saving design 75%, material
Thickness needs 12-15cm, and its external wall protection body thickeies, construction area increase, and usable floor area is reduced, construction cost increase.It is compound
After material (insulation and template one) thickness increase, its security it is difficult to ensure that.
China carries forward vigorously building energy conservation now, and the energy-conservation of enclosed structure is difficult point, is also crucial.New builing structure
System --- building energy conservation and structure-integrated technology are that insulation material is placed in inside wall, with building structure Synchronization Design, apply
Work, insulated fire performance are good, quality safety is highly reliable, realize building enclosure insulation and construction wall same life-span, are both pair
Traditional architecture designs a major transformation with construction method, is also the effective way for cracking building heat preservation construction quality potential safety hazard
Footpath.
The content of the invention
Form integrated board is protected it is an object of the invention to provide a kind of YMQ, existing insulation material manufacturing cost height is solved,
The problem of heat insulation effect is poor, service life is few, security is inadequate.
The technical solution adopted in the present invention is that the mass percent that YMQ protects form integrated board composition material is：PVC：20%th,
Silica flour：4%th, high-calcium powder：5%th, nano inorganic siliceous material 23%, nano inorganic fiber 18%, kaolin：4%th, silica flour：
10%th, plasticizer：3%th, lubricant：5%th, ultra-violet absorber：1%th, light stabilizer 1%, foaming agent 6%.It is each above to constitute
Quality of materials percentage summation is 100%.
Further, it is rectangle that YMQ, which protects form integrated board body, and front and rear two sides is equipped with several dovetail grooves, each dovetail
Trench bottom is wide, and opening portion is small, and the dovetail groove on front and rear two sides be arranged in parallel and evenly distributed, and dovetail groove protects mould one through whole YMQ
The surface of body plate body, YMQ is protected in four sides of form integrated board body, and one of side middle part, which is provided with, traverses whole side
Circular projection, in the middle part of this sideways relative side, provided with the circular groove for traversing this side, when two pieces of YMQ protect moulds one
During plate grafting, circular projection can extrude grafting and enter in circular groove, and two other is provided with rectangle projection, I-shaped connection sideways
Part is engaged provided with the opposite rectangular recess of two aperture positions, the shape of two rectangular recess with rectangle projection, work
The thickness of font connector is identical with the thickness that YMQ protects form integrated board body, rectangular when two pieces of YMQ protect form integrated board grafting
Shape projection can be inserted into rectangular recess.
The beneficial effects of the invention are as follows safe, high insulating effect, manufacturing cost are low.With the Lou Titong life-spans.
Brief description of the drawings
Fig. 1 is that YMQ of the present invention protects form integrated board positive structure schematic；
Fig. 2 is that YMQ of the present invention protects form integrated board side structure schematic diagram；
Fig. 3 is the I-shaped connector schematic diagram of the present invention；
Fig. 4 is that L-type YMQ of the present invention protects form integrated board schematic diagram；
Fig. 5 is using YMQ guarantor's form integrated board schematic diagrames in window；
Fig. 6 is that the YMQ after construction protects form integrated board heat insulation system organigram.
In figure, 1.YMQ guarantor's form integrated board bodies, 2. dovetail grooves, 3. circular projections, 4. circular grooves, 5. rectangle projections,
6. I-shaped connector, 7. rectangular recess, 100. reinforced concrete walls, 101.YMQ protects form integrated board, 102. complex heat-preservation sand
Pulp layer, 103. alkaline-resisting grid cloths, 104. decorative mortars, 105. finish coats.
Embodiment
The present invention is described in detail with reference to the accompanying drawings and detailed description.
YMQ of the present invention is protected form integrated board and is formed following material with high temperature, high pressure polymerisation reactive extrursion.Its composition material
Mass percent is：PVC is (modified：PVC、PE、PC、PU、PPR)：20%th, silica flour：4%th, high-calcium powder：5%th, nano inorganic is siliceous
Material 23% (aeroge), nano inorganic fiber 18%, kaolin：4%th, silica flour：10%th, plasticizer：3%th, lubricant：
5%th, ultra-violet absorber：1%th, light stabilizer 1%, foaming agent 6%.Each composition material mass percent summation is above
100%.
Manufacture craft：YMQ, which protects form integrated board, to be cut by high temperature, high pressure polymerisation reactive extrursion mould, by specification
Form.It is first according to above material prescription and prepares material, material stirring → high temperature polymerization → high pressure extrusion (material molds) → drop
Warm cooling → traction is cut → is packed.
YMQ of the present invention protects the shape of form integrated board as depicted in figs. 1 and 2：It is rectangle that YMQ, which protects form integrated board body 1, preceding
Two sides is equipped with several dovetail grooves 2 afterwards, and each bottom of dovetail groove 2 is wide, and opening portion is small, and the dovetail groove 2 on front and rear two sides is parallel to be set
Put and evenly distributed, dovetail groove 2 protects the surface of form integrated board body 1 through whole YMQ, YMQ protects four of form integrated board body 1
In side, one of side middle part is provided with the circular projection 3 for traversing whole side, in the middle part of this sideways relative side, if
There is the circular groove 4 for traversing this side, when two pieces of YMQ protect form integrated board grafting, circular projection 3 can extrude grafting and enter circular recessed
In groove 4, two other is provided with rectangle projection 5 sideways, as shown in figure 3, I-shaped connector 6 is opposite provided with two aperture positions
Rectangular recess 7, the shape of two rectangular recess 7 is engaged with rectangle projection 5, the thickness of I-shaped connector 6 with
The thickness that YMQ protects form integrated board body 1 is identical, and when two pieces of YMQ protect form integrated board grafting, rectangle projection 5 can be inserted into rectangular
In connected in star 7.So design very science solves cold-heat bridge phenomenon.
The size and thickness that YMQ protects form integrated board can need to make according to construction, and it is dovetail groove that YMQ, which protects form integrated board surface,
2：Be in order to concrete wall is stronger is interlocked, reach stronger purpose.YMQ protects recruitment between form integrated board
The connection of shaped connecting piece 6 is to solve cold bridge phenomenon to make better heat preservation, and connection is more firm, it is now more scientific to solve cold bridge.And
Can another both sides use circular groove inserting mode, more convenient in construction, rapid construction, saving engineering time.Such as Fig. 4 and
Shown in Fig. 5, in building body beam and column, window, moulding, YMQ guarantor's form integrated boards can be designed as L-type, this design is effective
Solve the insulation of beam, post, window, lines.
YMQ protects form integrated board construction technology：YMQ protect form integrated board row's plate → snap the line → cut → assembling reinforcement and cushion block →
Vertical YMQ protect form integrated board → vertical inner side building template → wear split bolt → two-tube master of the shuttering stupefied → shuttering of flitch time it is stupefied →
Adjustment fixed form position → casting concrete → concrete curing → dismounting inner template, split bolt and flitch → is smeared 20MM and answered
Close phase transition insulation mortar it is levelling → Decorative Construction.YMQ after construction protect form integrated board heat insulation system construction as shown in fig. 6, its by
It is interior to outer to be respectively：Reinforced concrete wall 100, YMQ protects form integrated board 101, and composite thermal insulation mortar layer (200mm is thick) 102 is alkaline-resisting
Grid cloth 103, decorative mortar 104, finish coat 105.The performance indications that YMQ of the present invention protects form integrated board are as shown in table 1：
The performance indications of table 1
| Pilot project | Unit | Performance indications | Test method |
| Superficial density | Kg/ cubic metres | ≤450-500 | GB/710801.1 |
| Impact strength | J | ≥80 | JGJ144 |
| Anti- folding load | N | ≥5000 | GB/T 19631 |
| Compression strength | Mpa | ≥800 | GB/T10801.2 |
| Weather resisteant | It is secondary | More than 50 | JGJ144 |
| Thermal conductivity factor | w/m2.k | ≤0.008-0.015 | GB/T10294 |
| Bending strength | Mpa | ≥29.7 | JGJ144 |
| Combustibility | - | A1 | GB8624 |
It is a kind of new building energy conservation and structure-integrated technology that YMQ of the present invention, which protects form integrated board, with insulation
Effect is good, design and construction are easy, insulation with wall with the life-span the features such as.The many common quality defects of existing insulation material are avoided to ask
Topic, solves the problems, such as fire safety evaluating during building heat preservation engineering construction and use, meets the performance of concrete-pouring template
It is required that, insulation unites two into one with template, reduces construction costs.Being truly realized building energy conservation heat insulation will with structure-integrated
Ask.It is A1 grades that YMQ of the present invention, which protects form integrated board fire-protection rating,.Thermal conductivity factor is 0.008-0.015W/m2.K.Structure, go along with sb. to guard him, protect
Warm three functions realize Synchronization Design, synchronous construction and the examination of wall thermal insulating and structure, it is not necessary to separately take in one
Secondary Insulation, you can meet design standard for energy efficiency of buildings (fractional energy savings more than 75%).This technology efficiently solves wall
The quality problems such as heat insulating work ftractures, come off, hollowing, while avoiding security against fire hidden danger, reduce construction costs, so as to reach
Building heat preservation and wall same life-span are arrived.Thoroughly realize building energy conservation heat insulation integrated technique.It effectively obstructs heat transfer, heat
Convection current and heat radiation, the low 0.008---0.015W/m of thermal conductivity factor2.k.3 times equivalent to polyurethane, 5 times of EPS, the 6 of XPS
Again, 12 times of thermal insulation mortar, 30 times of brick wall.The performance comparison of different materials is as shown in table 2：
The material property contrast table of 2 building structure integrated energy-saving of table 75%
Described above is only the better embodiment to the present invention, not makees any formal limit to the present invention
System, every technical spirit according to the present invention belongs to any simple modification made for any of the above embodiments, equivalent variations and modification
In the range of technical solution of the present invention.
Claims (2)
1. a kind of YMQ protects form integrated board, it is characterised in that：The mass percent of each composition material is：PVC：20%th, silica flour：
4%th, high-calcium powder：5%th, nano inorganic siliceous material 23%, nano inorganic fiber 18%, kaolin：4%th, silica flour：10%th,
Plasticizer：3%th, lubricant：5%th, ultra-violet absorber：1%th, light stabilizer 1%, foaming agent 6%, each composition material matter of the above
It is 100% to measure percentage summation.
2. protect form integrated board according to a kind of YMQ described in claim 1, it is characterised in that：It is length that YMQ, which protects form integrated board body (1),
Square, front and rear two sides is equipped with several dovetail grooves (2), and each dovetail groove (2) bottom is wide, and opening portion is small, the swallow on front and rear two sides
Stern notch (2) be arranged in parallel and evenly distributed, and dovetail groove (2) protects the surface of form integrated board body (1) through whole YMQ, and YMQ protects mould
In four sides of integrated board body (1), one of side middle part is provided with the circular projection (3) for traversing whole side, with this
It is circular when two pieces of YMQ protect form integrated board grafting provided with the circular groove (4) for traversing this side sideways in the middle part of relative side
Projection (3) can extrude grafting and enter in circular groove (4), and two other is provided with rectangle projection (5), I-shaped connector sideways
(6) provided with the opposite rectangular recess (7) of two aperture positions, shape and the rectangle projection (5) of two rectangular recess (7)
It is engaged, the thickness of I-shaped connector (6) is identical with the thickness that YMQ protects form integrated board body (1), when two pieces of YMQ protect mould one
During body plate grafting, rectangle projection (5) can be inserted in rectangular recess (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410554623.3A CN104312040B (en) | 2014-10-20 | 2014-10-20 | A kind of YMQ protects form integrated board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410554623.3A CN104312040B (en) | 2014-10-20 | 2014-10-20 | A kind of YMQ protects form integrated board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104312040A CN104312040A (en) | 2015-01-28 |
| CN104312040B true CN104312040B (en) | 2017-09-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410554623.3A Expired - Fee Related CN104312040B (en) | 2014-10-20 | 2014-10-20 | A kind of YMQ protects form integrated board |
Country Status (1)
| Country | Link |
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| CN (1) | CN104312040B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1458468A (en) * | 2003-06-09 | 2003-11-26 | 胡首信 | Heat radiation floor bed and producing method |
| CN2780874Y (en) * | 2005-11-25 | 2006-05-17 | 翟秀英 | Building energy-saving wall module for easy indoor decoration |
| CN102167872A (en) * | 2011-05-23 | 2011-08-31 | 南京航空航天大学 | Micro-foaming wood plastic composite material plate for building template and preparation method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4021739B2 (en) * | 2002-10-08 | 2007-12-12 | 旭化成ケミカルズ株式会社 | Resin plate for concrete formwork |
-
2014
- 2014-10-20 CN CN201410554623.3A patent/CN104312040B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1458468A (en) * | 2003-06-09 | 2003-11-26 | 胡首信 | Heat radiation floor bed and producing method |
| CN2780874Y (en) * | 2005-11-25 | 2006-05-17 | 翟秀英 | Building energy-saving wall module for easy indoor decoration |
| CN102167872A (en) * | 2011-05-23 | 2011-08-31 | 南京航空航天大学 | Micro-foaming wood plastic composite material plate for building template and preparation method thereof |
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| Publication number | Publication date |
|---|---|
| CN104312040A (en) | 2015-01-28 |
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| TR01 | Transfer of patent right |
Effective date of registration: 20190523 Address after: 100020 Guanzhuang Township, Chaoyang District, Beijing, 1 Building, 1 Floor 1607 Patentee after: Beijing Yiming Enterprise Energy Saving Technology Co., Ltd. Address before: No. 33 Dagu Village, Shaji Town, Suining County, Xuzhou City, Jiangsu Province Patentee before: Liu Shuwen |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170905 Termination date: 20191020 |