CN104312040A - YMQ heat-preserving and template integrated board - Google Patents
YMQ heat-preserving and template integrated board Download PDFInfo
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- CN104312040A CN104312040A CN201410554623.3A CN201410554623A CN104312040A CN 104312040 A CN104312040 A CN 104312040A CN 201410554623 A CN201410554623 A CN 201410554623A CN 104312040 A CN104312040 A CN 104312040A
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- ymq
- integrated board
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- form integrated
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- 239000000463 material Substances 0.000 claims abstract description 19
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000000843 powder Substances 0.000 claims abstract description 8
- 239000005995 Aluminium silicate Substances 0.000 claims abstract description 4
- 235000012211 aluminium silicate Nutrition 0.000 claims abstract description 4
- 229910052791 calcium Inorganic materials 0.000 claims abstract description 4
- 239000011575 calcium Substances 0.000 claims abstract description 4
- 239000012784 inorganic fiber Substances 0.000 claims abstract description 4
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000000314 lubricant Substances 0.000 claims abstract description 4
- 239000002131 composite material Substances 0.000 claims description 9
- 239000000377 silicon dioxide Substances 0.000 claims description 6
- 239000004902 Softening Agent Substances 0.000 claims description 3
- 239000006096 absorbing agent Substances 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- 235000013312 flour Nutrition 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 230000000149 penetrating effect Effects 0.000 abstract 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- 239000003463 adsorbent Substances 0.000 abstract 1
- 239000004088 foaming agent Substances 0.000 abstract 1
- 230000037431 insertion Effects 0.000 abstract 1
- 238000003780 insertion Methods 0.000 abstract 1
- 239000004611 light stabiliser Substances 0.000 abstract 1
- 239000004014 plasticizer Substances 0.000 abstract 1
- 239000010453 quartz Substances 0.000 abstract 1
- 239000002210 silicon-based material Substances 0.000 abstract 1
- 239000011863 silicon-based powder Substances 0.000 abstract 1
- 238000010276 construction Methods 0.000 description 16
- 238000009413 insulation Methods 0.000 description 16
- 238000004134 energy conservation Methods 0.000 description 6
- 239000004570 mortar (masonry) Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 238000004321 preservation Methods 0.000 description 5
- 239000004567 concrete Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000001360 synchronised effect Effects 0.000 description 3
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000011150 reinforced concrete Substances 0.000 description 2
- 238000009416 shuttering Methods 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000004964 aerogel Substances 0.000 description 1
- 230000002742 anti-folding effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000011449 brick Substances 0.000 description 1
- 239000004566 building material Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000011490 mineral wool Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000011505 plaster Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000007115 recruitment Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
- C08K13/04—Ingredients characterised by their shape and organic or inorganic ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/346—Clay
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04G—SCAFFOLDING; FORMS; SHUTTERING; BUILDING IMPLEMENTS OR AIDS, OR THEIR USE; HANDLING BUILDING MATERIALS ON THE SITE; REPAIRING, BREAKING-UP OR OTHER WORK ON EXISTING BUILDINGS
- E04G9/00—Forming or shuttering elements for general use
- E04G9/10—Forming or shuttering elements for general use with additional peculiarities such as surface shaping, insulating or heating, permeability to water or air
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K2003/023—Silicon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
- C08K2003/265—Calcium, strontium or barium carbonate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Dispersion Chemistry (AREA)
- Mechanical Engineering (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- Building Environments (AREA)
- Finishing Walls (AREA)
Abstract
The invention discloses a YMQ heat-preserving and template integrated board. The YMQ heat-preserving and template integrated board is prepared from the following materials by weight percent: 20 percent of PVC, 4 percent of silicon powder, 5 percent of high-calcium powder, 23 percent of nano inorganic silicon material, 18 percent of nano inorganic fibers, 4 percent of kaolin, 10 percent of quartz powder, 3 percent of plasticizer, 5 percent of lubricating agent, 1 percent of ultraviolet adsorbent, 1 percent of light stabilizer and 6 percent of foaming agent. The YMQ heat-preserving and template integrated board is characterized in that a plurality of dovetail grooves are arranged on the front surface and rear surface of the integrated board, the middle of one side surface of the integrated boar is provided with a round projection transversely penetrating through the whole side surface, the middle of one side surface opposite to the side surface is provided with a round groove transversely penetrating through the side surface, a rectangular projection is respectively arranged on the other two side surfaces, an I-shaped connecting part is provided with two rectangular grooves with two openings opposite to each other, the shape of each rectangular groove is matched with the rectangular projection, when the two YMQ heat-preserving and template integrated board is in insertion connection, the rectangular projections can be inserted into the rectangular grooves. The YMQ heat-preserving and template integrated board has the beneficial effects of high safety and low manufacturing cost.
Description
Technical field
The invention belongs to building material technical field, relate to a kind of YMQ and protect form integrated board.
Background technology
YMQ protects form integrated board and refers to: nanometer heat insulating material and the one-time formed sheet material of building template.1), thin-coat plaster system (Sandwich system) lagging material that current construction market uses has two kinds of systems:: its main raw has, XPS, EPS, urethane, rock wool, matrix material etc., there will be cracking after construction, come off, hollowing, the common quality defect such as heat-insulating property decay.Theoretical working life is only 25 years.2), structural integrity formed material: matrix material (insulation and template one), XPS (EPS) steel wire net rack, XPS (EPS) heat preservation module etc., if above material reaches the requirement of national building structure integrated energy-saving design 75%, material thickness needs 12-15cm, its external wall protection body thickeies, floor area of building increases, usable floor area reduces, and construction cost increases.After matrix material (insulation and template one) thickness increases, its security is difficult to ensure.
China carries forward vigorously building energy conservation now, and namely the energy-conservation of enclosed structure be difficult point, is also crucial.New builing structure system---building energy conservation and structure-integrated technology are that lagging material is placed in body of wall inside, with building structure synchronous design, construction, insulated fire performance is good, quality safety reliability is strong, achieve building enclosure insulation and construction wall same life-span, being a major transformation to traditional architecture design and constructional method, is also the effective way cracking building heat preservation construction quality potential safety hazard.
Summary of the invention
The object of the present invention is to provide a kind of YMQ to protect form integrated board, solve existing lagging material manufacturing cost high, heat insulation effect is poor, working life is few, problem that security is inadequate.
The technical solution adopted in the present invention is the mass percent of YMQ guarantor form integrated board composition material: PVC:20%, silica flour: 4%, high-calcium powder: 5%, nano inorganic siliceous material 23%, nano inorganic fiber 18%, kaolin: 4%, silica powder: 10%, softening agent: 3%, lubricant: 5%, UV light absorber: 1%, photostabilizer 1%, whipping agent 6%.Each composition material mass percent summation is 100% above.
Further, it is rectangle that YMQ protects form integrated board body, two sides, front and back is equipped with several dovetail-indents, wide bottom each dovetail-indent, opening portion is little, before and after the dovetail-indent on two sides to be arranged in parallel and evenly distributed, dovetail-indent runs through the surface that whole YMQ protects form integrated board body, YMQ protects in four sides of form integrated board body, the circular projection of traversing whole side is provided with in the middle part of one of them side, in the middle part of the side that side is relative therewith, be provided with the circular groove traversing this side, when two pieces of YMQ protect form integrated board grafting, circular projection can extrude grafting and enter in circular groove, two other side is provided with rectangle projection, I-shaped web member is provided with the contrary rectangular recess of two aperture positions, the shape of two rectangular recess matches with rectangle projection, the thickness of I-shaped web member is identical with the thickness that YMQ protects form integrated board body, when two pieces of YMQ protect form integrated board grafting, rectangle projection can be inserted in rectangular recess.
The invention has the beneficial effects as follows that security is high, high insulating effect, low cost of manufacture.With the Lou Titong life-span.
Accompanying drawing explanation
Fig. 1 is that YMQ of the present invention protects form integrated board Facad structure schematic diagram;
Fig. 2 is that YMQ of the present invention protects form integrated board side structure schematic diagram;
Fig. 3 is I-shaped web member schematic diagram of the present invention;
Fig. 4 is that L-type YMQ of the present invention protects form integrated board schematic diagram;
Fig. 5 adopts YMQ to protect form integrated board schematic diagram at window;
Fig. 6 is that the YMQ after construction protects form integrated board heat insulation system organigram.
In figure, 1.YMQ protects form integrated board body, 2. dovetail-indent, 3. circular projection, 4. circular groove, 5. rectangle projection, 6. I-shaped web member, 7. rectangular recess, 100. reinforced concrete walls, 101.YMQ protects form integrated board, 102. composite thermal insulation mortar layers, 103. alkaline-resisting grid cloth, 104. plastering mortars, 105. finish coats.
Embodiment
Below in conjunction with the drawings and specific embodiments, the present invention is described in detail.
YMQ of the present invention protects form integrated board and is formed with high temperature, high pressure polymerisation reactive extrursion by following material.The mass percent of its composition material is: PVC (modification: PVC, PE, PC, PU, PPR): 20%, silica flour: 4%, high-calcium powder: 5%, nano inorganic siliceous material 23% (aerogel), nano inorganic fiber 18%, kaolin: 4%, silica powder: 10%, softening agent: 3%, lubricant: 5%, UV light absorber: 1%, photostabilizer 1%, whipping agent 6%.Each composition material mass percent summation is 100% above.
Manufacture craft: YMQ protects form integrated board and is through high temperature, high pressure polymerisation reactive extrursion mould, forms by specification cutting.First prepare material according to above material prescription, material stirring → high temperature polymerization → high pressure is extruded (material molds) → cooling down → traction sanction and is cut → pack.
YMQ of the present invention protects the shape of form integrated board as depicted in figs. 1 and 2: it is rectangle that YMQ protects form integrated board body 1, two sides, front and back is equipped with several dovetail-indents 2, wide bottom each dovetail-indent 2, opening portion is little, before and after the dovetail-indent 2 on two sides to be arranged in parallel and evenly distributed, dovetail-indent 2 runs through the surface that whole YMQ protects form integrated board body 1, YMQ protects in four sides of form integrated board body 1, the circular projection 3 of traversing whole side is provided with in the middle part of one of them side, in the middle part of the side that side is relative therewith, be provided with the circular groove 4 traversing this side, when two pieces of YMQ protect form integrated board grafting, circular projection 3 can extrude grafting and enter in circular groove 4, two other side is provided with rectangle projection 5, as shown in Figure 3, I-shaped web member 6 is provided with the contrary rectangular recess 7 of two aperture positions, the shape of two rectangular recess 7 matches with rectangle projection 5, the thickness of I-shaped web member 6 is identical with the thickness that YMQ protects form integrated board body 1, when two pieces of YMQ protect form integrated board grafting, rectangle projection 5 can be inserted in rectangular recess 7.Such design very science solve cold-heat bridge phenomenon.
YMQ protects the size of form integrated board and thickness can need to make according to construction, and it is dovetail-indent 2 that YMQ protects form integrated board surface: be in order to stronger being interlocked of concrete wall, reach more firmly object.Between YMQ guarantor form integrated board, recruitment shaped connecting piece 6 connects is solve cold bridge phenomenon to make better heat preservation, and connection is more firm, solution cold bridge is now more scientific.And another both sides adopt circular groove inserting mode, more convenient when constructing, can rapid construction, save the engineering time.As shown in Figure 4 and Figure 5, at building body beam and column, window, moulding, YMQ can be protected form integrated board and be designed to L-type, this design efficiently solves the insulation of beam, post, window, lines.
YMQ protects form integrated board construction technology: YMQ protect form integrated board row plate → snap the line → sanctions cut → that assembling reinforcement and cushion block → vertical YMQ protect form integrated board → vertical inner side building template → wear split bolt → shuttering flitch time stupefied → two-tube master of shuttering is stupefied → adjust fixed die plate position → casting concrete → concrete pouring → dismounting inner formword, split bolt and flitch → smear 20MM composite phase-change thermal insulation mortar levelling → Decorative Construction.YMQ after construction protects form integrated board heat insulation system structure as shown in Figure 6, and it is respectively from the inside to the outside: reinforced concrete wall 100, YMQ protects form integrated board 101, composite thermal insulation mortar layer (200mm is thick) 102, alkaline-resisting grid cloth 103, plastering mortar 104, finish coat 105.The performance index that YMQ of the present invention protects form integrated board are as shown in table 1:
Table 1 performance index
| Test subject | Unit | Performance index | Test method |
| Surface density | Kg/ cubic meter | ≤450-500 | GB/710801.1 |
| Resistance to impact shock | J | ≥80 | JGJ144 |
| Anti-folding load | N | ≥5000 | GB/T?19631 |
| Ultimate compression strength | Mpa | ≥800 | GB/T10801.2 |
| Weather resisteant | Secondary | More than 50 | JGJ144 |
| Thermal conductivity | w/m 2.k | ≤0.008-0.015 | GB/T10294 |
| Bending strength | Mpa | ≥29.7 | JGJ144 |
| Combustionproperty | - | A1 | GB8624 |
It is a kind of novel building energy conservation and structure-integrated technology that YMQ of the present invention protects form integrated board, there is good effect of heat insulation, design and construct easy, be incubated and body of wall with features such as life-spans.Avoid the many common quality defect problems of existing lagging material, solve fire safety problem in building heat preservation engineering construction and use procedure, meet the performance requriements of concrete-pouring template, insulation and template unite two into one, and reduce construction costs.Really achieve building energy conservation heat insulation and structure-integrated requirement.It is A1 level that YMQ of the present invention protects form integrated board fire-protection rating.Thermal conductivity is 0.008-0.015W/m
2.K.Structure, go along with sb. to guard him, be incubated three functions in one, achieve the synchronous design of wall thermal insulating and structure, synchronous construction and examination, do not need to take secondary Insulation separately, design standard for energy efficiency of buildings (fractional energy savings more than 75%) can be met.The quality problems such as the wall thermal insulating engineering that solves this technology effective ftractures, come off, hollowing, avoid security against fire hidden danger simultaneously, reduce construction costs, thus reach building heat preservation and body of wall same life-span.Thoroughly achieve building energy conservation heat insulation integrated technique.It effectively intercepts thermal conduction, thermal convection and thermal radiation, the low 0.008---0.015W/m of thermal conductivity
2.k.Be equivalent to 3 times of urethane, 5 times of EPS, 6 times, 12 times of thermal insulation mortar, 30 times of brick wall of XPS.The performance comparison of different materials is as shown in table 2:
Table 2 building structure integrated energy-saving 75% material property contrast table
The above is only to better embodiment of the present invention, not any pro forma restriction is done to the present invention, every according to technical spirit of the present invention to any simple modification made for any of the above embodiments, equivalent variations and modification, all belong in the scope of technical solution of the present invention.
Claims (2)
1. a YMQ protects form integrated board, it is characterized in that: the mass percent of each composition material is: PVC:20%, silica flour: 4%, high-calcium powder: 5%, nano inorganic siliceous material 23%, nano inorganic fiber 18%, kaolin: 4%, silica powder: 10%, softening agent: 3%, lubricant: 5%, UV light absorber: 1%, photostabilizer 1%, whipping agent 6%, above each composition material mass percent summation is 100%.
2. protect form integrated board according to YMQ a kind of described in claim 1, it is characterized in that: it is rectangle that YMQ protects form integrated board body (1), two sides, front and back is equipped with several dovetail-indents (2), each dovetail-indent (2) bottom is wide, opening portion is little, before and after the dovetail-indent (2) on two sides to be arranged in parallel and evenly distributed, dovetail-indent (2) runs through the surface that whole YMQ protects form integrated board body (1), YMQ protects in four sides of form integrated board body (1), the circular projection (3) of traversing whole side is provided with in the middle part of one of them side, in the middle part of the side that side is relative therewith, be provided with the circular groove (4) traversing this side, when two pieces of YMQ protect form integrated board grafting, circular projection (3) can extrude grafting and enter in circular groove (4), two other side is provided with rectangle projection (5), I-shaped web member (6) is provided with the contrary rectangular recess (7) of two aperture positions, the shape of two rectangular recess (7) matches with rectangle projection (5), the thickness that thickness and the YMQ of I-shaped web member (6) protect form integrated board body (1) is identical, when two pieces of YMQ protect form integrated board grafting, rectangle projection (5) can be inserted in rectangular recess (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410554623.3A CN104312040B (en) | 2014-10-20 | 2014-10-20 | A kind of YMQ protects form integrated board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410554623.3A CN104312040B (en) | 2014-10-20 | 2014-10-20 | A kind of YMQ protects form integrated board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104312040A true CN104312040A (en) | 2015-01-28 |
| CN104312040B CN104312040B (en) | 2017-09-05 |
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|---|---|---|---|
| CN201410554623.3A Expired - Fee Related CN104312040B (en) | 2014-10-20 | 2014-10-20 | A kind of YMQ protects form integrated board |
Country Status (1)
| Country | Link |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1458468A (en) * | 2003-06-09 | 2003-11-26 | 胡首信 | Heat radiation floor bed and producing method |
| JP2004133008A (en) * | 2002-10-08 | 2004-04-30 | Asahi Kasei Chemicals Corp | Resin plate for concrete form |
| CN2780874Y (en) * | 2005-11-25 | 2006-05-17 | 翟秀英 | Building energy-saving wall module for easy indoor decoration |
| CN102167872A (en) * | 2011-05-23 | 2011-08-31 | 南京航空航天大学 | Micro-foaming wood plastic composite material plate for building template and preparation method thereof |
-
2014
- 2014-10-20 CN CN201410554623.3A patent/CN104312040B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004133008A (en) * | 2002-10-08 | 2004-04-30 | Asahi Kasei Chemicals Corp | Resin plate for concrete form |
| CN1458468A (en) * | 2003-06-09 | 2003-11-26 | 胡首信 | Heat radiation floor bed and producing method |
| CN2780874Y (en) * | 2005-11-25 | 2006-05-17 | 翟秀英 | Building energy-saving wall module for easy indoor decoration |
| CN102167872A (en) * | 2011-05-23 | 2011-08-31 | 南京航空航天大学 | Micro-foaming wood plastic composite material plate for building template and preparation method thereof |
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| CN104312040B (en) | 2017-09-05 |
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Effective date of registration: 20190523 Address after: 100020 Guanzhuang Township, Chaoyang District, Beijing, 1 Building, 1 Floor 1607 Patentee after: Beijing Yiming Enterprise Energy Saving Technology Co., Ltd. Address before: No. 33 Dagu Village, Shaji Town, Suining County, Xuzhou City, Jiangsu Province Patentee before: Liu Shuwen |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
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Granted publication date: 20170905 Termination date: 20191020 |