CN104282427B - Die casting inductor pad processing technology - Google Patents
Die casting inductor pad processing technology Download PDFInfo
- Publication number
- CN104282427B CN104282427B CN201310276551.6A CN201310276551A CN104282427B CN 104282427 B CN104282427 B CN 104282427B CN 201310276551 A CN201310276551 A CN 201310276551A CN 104282427 B CN104282427 B CN 104282427B
- Authority
- CN
- China
- Prior art keywords
- die casting
- casting inductor
- auxiliary
- coil
- processing technology
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The present invention relates to a kind of die casting inductor pad processing technology, including material preparation step, prepare die casting inductor body to be processed, this die casting inductor body interior is arranged with coil, and the ora terminalis at these coil two ends exposes to this die casting inductor body surface；Auxiliary sticks together step, and the ora terminalis outer surface plating respectively at these its coil two ends of die casting inductor body sets auxiliary adhesion layer, and the material of this auxiliary adhesion layer is copper；End silver step, on respectively this auxiliary adhesion layer, plating sets one end silver layer；Plating step, from inside to outside, sequentially plates the first electrodeposited coating and the second electrodeposited coating on respectively this end silver layer；Step is sticked together by being provided with this auxiliary before end silver step, and between the ora terminalis of die casting inductor its coil of body and end silver layer, plating can set an auxiliary adhesion layer, this auxiliary adhesion layer is made substantially to have the effect of the ora terminalis area extending and increasing these coil two ends, can avoid or reduce the situation producing peeling between this end silver layer and ora terminalis, reach effect product yield being substantially improved with reducing manufacturing cost.
Description
Technical field
The present invention relates to the pad processing technology of a kind of die casting inductor, can avoid holding silver layer to peel off especially with regard to one
Die casting inductor pad processing technology.
Background technology
Pressing, ask shown in Fig. 1, general die casting inductor, its inductance body 10 mainly utilizes molding with metal dust
(Molding) mode pressing and forming, the manufacture method in its thin portion is all and as it is known to those skilled in the art that and repeat no more in this,
This inductance body 10 is internal is arranged with a coil 11, and the ora terminalis 111,112 at these coil 11 two ends exposes to inductance body 10 table again
Face, next forms outer electrode (i.e. pad) respectively then at this ora terminalis 111,112 outer surface, and thereby, this die casting inductor is i.e.
Can be suitable for using surface mount mode (Surface Mount Technology, SMT) rapid welding on circuit board, to join the most again
Closing refering to shown in Fig. 2, Fig. 3, current industry, for the method forming outer electrode on die casting inductor, mainly first passes through end silver
Step 15 plates, in its ora terminalis 111,112 outer surface of this coil 11, the end silver layer 21 that a material is silver (Ag), next recycles
Plating step 16, the most sequentially plates the first electrodeposited coating the 22, second electrodeposited coating 23 and the 3rd plating on this end silver layer 21
Layer 24, wherein the material of this first electrodeposited coating 22, second electrodeposited coating 23 and the 3rd electrodeposited coating 24 is sequentially respectively copper (Cu), nickel
(Ni) with stannum (Sn), it addition, industry also has omission layers of copper only to plate the mode of two-layer electrodeposited coating (i.e. nickel dam and tin layers).
This commonly uses the pad processing technology of die casting inductor, though can reach formation outer electrode with applicable SMT rapid welding
Purpose, but because of the generally circular in cross section enamel-covered wire of coil 11 (i.e. copper cash), therefore the ora terminalis 111 at its two ends, 112(cut) area is the least,
Cause the contact area between the ora terminalis 111,112 of this coil 11 and end silver layer 21 the most limited, therefore, please also refer to figure
Shown in 4, the most easily produce the phenomenon of peeling (peeling) between this end silver layer 21 and ora terminalis 111,112, in turn result in product good
Rate reduces and improves with manufacturing cost, is event, how to develop one and can avoid or reduce the peeling of end silver layer, in order to improving product yield
Die casting inductor pad processing technology, become the technical task of great urgency and practical value.
Summary of the invention
Because existing die casting inductor pad processing technology, because easily producing peeling between end silver layer and ora terminalis, cause
Product yield reduces and improves with manufacturing cost, therefore it is an object of the invention to provide a kind of die casting inductor pad and makes work
Skill, was provided with this auxiliary by the present invention before end silver step and sticks together step, and can be in the ora terminalis of die casting inductor its coil of body
And between end silver layer, plating sets an auxiliary adhesion layer, and the material of this auxiliary adhesion layer is copper, and makes this auxiliary adhesion layer substantially
Can have the effect of the ora terminalis area extending and increasing these coil two ends, produce between this end silver layer and ora terminalis in order to avoiding or reduce
Raw situation about peeling off, and then make the present invention can reach effect product yield being substantially improved with reducing manufacturing cost.
For reaching above-mentioned purpose, the present invention provides a kind of die casting inductor pad processing technology, and its step comprises: step of getting the raw materials ready
Suddenly, preparing a die casting inductor body to be processed, this die casting inductor body interior is arranged with coil, outside the ora terminalis at these coil two ends
It is exposed to this die casting inductor body surface；Auxiliary sticks together step, respectively at the ora terminalis appearance at these its coil two ends of die casting inductor body
Face plating sets an auxiliary adhesion layer, and the material of this auxiliary adhesion layer is copper；End silver step, on respectively this auxiliary adhesion layer, plating sets one end
Silver layer；Plating step, from inside to outside, sequentially plates one first electrodeposited coating and one second electrodeposited coating, so on respectively this end silver layer
I.e. complete the pad processing technology of the present invention.
Before end silver step, it is provided with this auxiliary by the present invention and sticks together step, and can be in die casting inductor its coil of body
Between ora terminalis and end silver layer, plating sets an auxiliary adhesion layer, and the material of this auxiliary adhesion layer is copper, and makes this auxiliary adhesion layer real
Can have the effect of ora terminalis area extending and increasing these coil two ends in matter, in order to can avoid or reduce this end silver layer and ora terminalis it
Between produce the situation of peeling, and then make the present invention can reach effect product yield being substantially improved with reducing manufacturing cost.
Accompanying drawing explanation
Fig. 1 is to commonly use its die casting inductor not yet to form the schematic perspective view of outer electrode；
Fig. 2 is for commonly using steps flow chart block schematic diagram；
Fig. 3 is to commonly use the schematic side view after its die casting inductor forms outer electrode；
Fig. 4 is that the silver layer of holding commonly using its die casting inductor is easily generated the action schematic diagram of peeling；
Fig. 5 is the steps flow chart block schematic diagram of the present invention；
Fig. 6 is the action schematic diagram that its material preparation step of the present invention and auxiliary stick together step；
Fig. 7 is the action schematic diagram of its end silver step of the present invention；
Fig. 8 is the action schematic diagram of its plating step of the present invention.
Description of reference numerals:
10-inductance body；11-coil；111-ora terminalis；112-ora terminalis；15-end silver step；
16-plating step；21-end silver layer；22-the first electrodeposited coating；23-the second electrodeposited coating；24-the 3rd electrodeposited coating；
3-material preparation step；30-die casting inductor body；31-coil；311-ora terminalis；312-ora terminalis；
4-auxiliary sticks together step；40-assists adhesion layer；5-end silver step；50-end silver layer；
6-plating step；60-the first electrodeposited coating；61-the second electrodeposited coating.
Detailed description of the invention
As it is shown in figure 5, the present invention provides a kind of die casting inductor pad processing technology, its step comprises:
Material preparation step 3, as shown in Figure 6, this material preparation step 3 prepares a die casting inductor body 30 to be processed, wherein, this mould
Casting inductance body 30 be typically to utilize metal dust mixing organic resin that particle diameter is 1-100 μm (as epoxy resin, PU resin or
Phenolic resin), then by solidifying (Curing) after molding (Molding) mode pressing and forming, this die casting inductor i.e. can be obtained originally
Body 30, wherein, it is 1 to 10% that this organic resin accounts for the percentage by weight (wt%) of die casting inductor body 30 entirety, this metal dust
Can be carbon back iron powder (Carbonyl iron powder) or for iron(-)base powder (Iron-based alloy powder) or
For noncrystalline iron(-)base powder (Amorphous iron-based alloy powder), this die casting inductor body 30 again
Other thin portion manufacture method belongs to the inventive point of prior art and non-invention, therefore not describes in detail at this, this die casting inductor body
30 inside are arranged with coil 31, and the ora terminalis 311,312 at these coil 31 two ends exposes to this die casting inductor body 30 surface, again this line
Circle 31 is circular enamel-covered wire；
Auxiliary sticks together step 4, and as shown in Figure 6, this auxiliary sticks together step 4 respectively at its coil 31 of this die casting inductor body 30
Ora terminalis 311, the 312 outer surface plating at two ends sets an auxiliary adhesion layer 40, and the material of this auxiliary adhesion layer 40 can be copper, again this auxiliary
The thickness of adhesion layer 40 can be 0.01～30 μm (micron), additionally, in the present embodiment, the film plating process of this auxiliary adhesion layer 40
(chemical plating, also known as electroless can to use galvanoplastic (electroplating) or electroless plating method
Plating) or sputtering method (sputtering), detailed step or the operating principle of above-mentioned each film plating process are all art technology
Known to personnel, repeat no more in this；
End silver step 5, as it is shown in fig. 7, this end silver step 5 is that plating sets one end silver layer 50 on respectively this auxiliary adhesion layer 40,
The material of this end silver layer 50 can be silver, and the thickness of this end silver layer 50 can be 5～100 μm (micron) again；
Plating step 6, as shown in Figure 8, this plating step 6 is from inside to outside, sequentially plates one on respectively this end silver layer 50
First electrodeposited coating 60 and one second electrodeposited coating 61, wherein, the material of this first electrodeposited coating 60 can be nickel, this second electrodeposited coating 61
Material can be stannum, and the thickness of this first electrodeposited coating 60 can be 0.01～30 μm (micron) again, and the thickness of this second electrodeposited coating 61 can
It is 0.01～30 μm (micron), the most i.e. completes the pad processing technology of the present invention；
As shown in Figure 5, Figure 8, before end silver step 5, it is provided with this auxiliary by the present invention and sticks together step 4, and can be in molding
Between ora terminalis 311,312 and the end silver layer 50 of its coil 31 of inductance body 30, plating sets an auxiliary adhesion layer 40, and this auxiliary is sticked together
Layer 40 material be copper, and make this auxiliary adhesion layer 40 substantially can have extend and increase these coil 31 two ends ora terminalis 311,
The effect (being also copper material because of coil 31) of 312 areas, also can be significantly increased between this ora terminalis 311,312 and end silver layer 50
Contact area, produces the situation of peeling in order to avoiding or reduce, and then makes the present invention between this end silver layer 50 and ora terminalis 311,312
Can reach effect product yield being substantially improved with reducing manufacturing cost.
Claims (9)
1. a die casting inductor pad processing technology, its step comprises:
Material preparation step, this material preparation step is to prepare a die casting inductor body to be processed, and this die casting inductor body interior is arranged with
Coil, this coil is circular enamel-covered wire, and the ora terminalis at these coil two ends exposes to this die casting inductor body surface；Auxiliary sticks together step
Suddenly, this auxiliary sticks together step is that the ora terminalis outer surface plating respectively at these its coil two ends of die casting inductor body sets an auxiliary and sticks together
Layer, the material of this auxiliary adhesion layer is copper, and the material of this coil is identical with the material of this auxiliary adhesion coating；
End silver step, this end silver step is that plating sets one end silver layer on respectively this auxiliary adhesion layer, and the material of this end silver layer is silver；
Plating step, this plating step is from inside to outside, sequentially plates one first electrodeposited coating and one second on respectively this end silver layer
Electrodeposited coating, wherein, the material of this first electrodeposited coating is nickel, and the material of this second electrodeposited coating is stannum, the most i.e. completes pad system
Make technique.
2. die casting inductor pad processing technology as claimed in claim 1, wherein the thickness of this auxiliary adhesion layer be 0.01～
30 μm (micron).
3. die casting inductor pad processing technology as claimed in claim 1, the auxiliary that wherein this auxiliary is sticked together in step is sticked together
Its film plating process of layer is for using galvanoplastic or electroless plating method or sputtering method.
4. die casting inductor pad processing technology as claimed in claim 1, wherein the thickness of this end silver layer is that 5～100 μm are (micro-
Rice).
5. die casting inductor pad processing technology as claimed in claim 1, wherein the thickness of this first electrodeposited coating be 0.01～
30 μm (micron), the thickness of this second electrodeposited coating is 0.01～30 μm (micron).
6. die casting inductor pad processing technology as claimed in claim 1, the wherein die casting inductor body in this material preparation step,
It is to utilize the metal dust mixing organic resin that particle diameter is 1-100 μm, then by solid after molding (Molding) mode pressing and forming
Change (Curing) and obtain.
7. die casting inductor pad processing technology as claimed in claim 6, wherein said organic resin accounts for die casting inductor body
Overall percentage by weight (wt%) is 1 to 10%.
8. die casting inductor pad processing technology as claimed in claim 7, wherein this metal dust is carbon back iron powder
(Carbonyl iron powder) or be iron(-)base powder (Iron-based alloy powder).
9. die casting inductor pad processing technology as claimed in claim 7, wherein this metal dust is noncrystalline ferrous alloy
Powder (Amorphous iron-based alloy powder).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310276551.6A CN104282427B (en) | 2013-07-03 | 2013-07-03 | Die casting inductor pad processing technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310276551.6A CN104282427B (en) | 2013-07-03 | 2013-07-03 | Die casting inductor pad processing technology |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104282427A CN104282427A (en) | 2015-01-14 |
| CN104282427B true CN104282427B (en) | 2016-12-28 |
Family
ID=52257230
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310276551.6A Active CN104282427B (en) | 2013-07-03 | 2013-07-03 | Die casting inductor pad processing technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104282427B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108155003A (en) * | 2016-12-06 | 2018-06-12 | 美磊科技股份有限公司 | Die casting inductor preparation method |
| CN111899970A (en) * | 2019-05-06 | 2020-11-06 | 奇力新电子股份有限公司 | Preparation method of inductor |
| CN114267530A (en) * | 2022-03-03 | 2022-04-01 | 金动力智能科技（深圳）有限公司 | Production line for producing integrated inductor |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1215900A (en) * | 1997-10-24 | 1999-05-05 | 株式会社村田制作所 | Inductor and method of manufacturing the same |
| JP2004165539A (en) * | 2002-11-15 | 2004-06-10 | Toko Inc | Inductor |
| CN1822263A (en) * | 2005-02-18 | 2006-08-23 | Tdk株式会社 | Ceramic electronic component and multilayer capacitor |
| CN102194571A (en) * | 2010-02-05 | 2011-09-21 | 株式会社村田制作所 | Laminated electronic component and manufacturing method therefor |
| CN102682951A (en) * | 2012-05-25 | 2012-09-19 | 深圳市麦捷微电子科技股份有限公司 | High-power flat inductor and method for manufacturing same |
-
2013
- 2013-07-03 CN CN201310276551.6A patent/CN104282427B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1215900A (en) * | 1997-10-24 | 1999-05-05 | 株式会社村田制作所 | Inductor and method of manufacturing the same |
| JP2004165539A (en) * | 2002-11-15 | 2004-06-10 | Toko Inc | Inductor |
| CN1822263A (en) * | 2005-02-18 | 2006-08-23 | Tdk株式会社 | Ceramic electronic component and multilayer capacitor |
| CN102194571A (en) * | 2010-02-05 | 2011-09-21 | 株式会社村田制作所 | Laminated electronic component and manufacturing method therefor |
| CN102682951A (en) * | 2012-05-25 | 2012-09-19 | 深圳市麦捷微电子科技股份有限公司 | High-power flat inductor and method for manufacturing same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104282427A (en) | 2015-01-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102047564B1 (en) | Chip electronic component and manufacturing method thereof | |
| CN110556241B (en) | Electronic assembly and method of manufacturing the same | |
| KR101187350B1 (en) | Magnetic material and coil component using the same | |
| JP5082002B1 (en) | Magnetic materials and coil parts | |
| CN105261459B (en) | Electronic component and its manufacture method | |
| CN104853576A (en) | Electromagnetic shielding membrane with excellent shielding performance and production technology thereof | |
| US20160189840A1 (en) | Electronic component and method of manufacturing the same | |
| JP2016092404A (en) | Chip electronic component and method of manufacturing the same | |
| EP2615196A1 (en) | Copper foil and manufacturing method therefor, copper foil with carrier and manufacturing method therefor, printed circuit board, and multilayer printed circuit board | |
| CN104282427B (en) | Die casting inductor pad processing technology | |
| CN111755233A (en) | Sectional forming micro-inductor manufacturing process | |
| CN203072250U (en) | Semi-finished product for production of printed circuit board and printed circuit board | |
| KR102184566B1 (en) | Coil electronic component and manufacturing method thereof | |
| CN110323031B (en) | Electronic assembly and method of manufacturing the same | |
| CN102904010A (en) | Antenna oscillator utilizing plastic as main material and manufacturing method of antenna oscillator | |
| CN104853577A (en) | Ultrathin electromagnetic shielding membrane and production technology thereof | |
| KR101173444B1 (en) | Laminated circuit board | |
| CN108511167A (en) | Coil component | |
| CN105321684B (en) | Magnetic material core and coil device | |
| CN103854825A (en) | Magnetic passive element and manufacturing method thereof | |
| US20200335264A1 (en) | Coil component and its manufacturing method | |
| CN105702421B (en) | Electronic building brick and its manufacturing method | |
| CN209388835U (en) | A kind of inductance core and inductor | |
| JP5129893B1 (en) | Magnetic materials and coil parts | |
| JP2015195178A5 (en) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190311 Address after: No. 240 Binjiang South Road, Zhangpu Town, Kunshan City, Suzhou City, Jiangsu Province Patentee after: Mag. layers Electronic Technology (Kunshan) Co., Ltd. Address before: Hsinchu County, Taiwan, China Patentee before: Mag.Layers Scientific-Technics Co., Ltd. |