CN104280834A - Optical communication device - Google Patents
Optical communication device Download PDFInfo
- Publication number
- CN104280834A CN104280834A CN201310287067.3A CN201310287067A CN104280834A CN 104280834 A CN104280834 A CN 104280834A CN 201310287067 A CN201310287067 A CN 201310287067A CN 104280834 A CN104280834 A CN 104280834A
- Authority
- CN
- China
- Prior art keywords
- weld pad
- driving chip
- substrate
- light
- communication device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/40—Transceivers
Abstract
The invention relates to an optical communication device. The optical communication device comprises a connector, a first substrate, a first driver chip, a light-emitting element, a second driver chip, a light receiving element, a coupling lens set and an optical waveguide. The first substrate is borne by the connector and electrically connected with the connector. The first substrate comprises a bottom face arranged opposite to the first substrate and a bearing face far away from the bottom face. The light-emitting element and the light receiving element are contained in the first substrate. The first driver chip is borne by the bearing face and eclectically connected with the first substrate and the light-emitting element. The second driver chip is borne by the bearing face and eclectically connected with the first substrate and the light receiving element. The coupling lens set is connected to the first driver chip and the second driver chip in a pluggable and bridging mode, and the optical waveguide is arranged on the coupling lens set in a pluggable mode.
Description
Technical field
The present invention relates to a kind of communication device, particularly relate to a kind of optical communication device.
Background technology
In optical communication device, information is transmitted with the form of light signal, carries out computing, process as electronic signals.Existing optical communication device generally comprises a circuit board, and light signal is converted to electric signal or converts electrical signals to the photovalve of light signal, be used for driving the driving chip of described photovalve, be used for the optical fiber of transmitting optical signal and be used for described photovalve and described optical fiber to carry out the coupled lens of optical coupled.Be all adopt UV glue to be fixed on by coupled lens on described circuit board in existing optical communication device, optical fiber is fixed on coupled lens by the same UV glue that adopts, and causes disassembling and assembling not easily.
Summary of the invention
In view of this, be necessary to provide a kind of optical communication device being convenient to disassemble and assemble.
A kind of optical communication device, comprises a connector, a first substrate, one first driving chip, a light-emitting component, one second driving chip, receipts optical element, a coupled lens group and an optical waveguide.Described first substrate is carried on described connector and is electrically connected with described connector.Described first substrate comprises the loading end that a bottom surface and be oppositely arranged with described first substrate deviates from described bottom surface.Described light-emitting component and described receipts optical element are all contained in described first substrate.Described first driving chip is carried on described loading end, and is all electrically connected with described first substrate and described light-emitting component.Described second driving chip is carried on described loading end, and is all electrically connected with described first substrate and described receipts optical element.Described coupled lens group is connected across described first driving chip and described second driving chip pluggablely, and described optical waveguide is arranged at described coupled lens group pluggablely.
Relative to prior art, described coupled lens group is connected across described first driving chip and described second driving chip pluggablely, and described optical waveguide is arranged at described coupled lens group pluggablely, is convenient to disassemble and assemble.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the optical communication device of embodiment of the present invention.
Main element symbol description
Optical communication device 100
Connector 10
First substrate 20
First driving chip 30
Light-emitting component 40
Second driving chip 45
Receive optical element 50
Second substrate 60
Coupled lens group 70
Transparent support frame 80
Optical waveguide 90
Joint face 11
First weld pad 111
Bottom surface 21
Loading end 22
Second weld pad 210
First soldered ball 112
Accepting groove 220
Second weld pad 222
3rd weld pad 223
First surface 31
Second surface 32
4th weld pad 311
5th weld pad 312
Second soldered ball 313
First pilot hole 320
Light-emitting area 41
First light collecting part 42
6th weld pad 411
7th weld pad 412
3rd soldered ball 314
Second pilot hole 4520
3rd surface 451
4th surface 452
8th weld pad 453
9th weld pad 454
4th soldered ball 4530
Light-emitting area 51
Second light collecting part 52
Tenth weld pad 511
11 weld pad 512
5th soldered ball 513
Lower surface 61
Upper surface 62
12 weld pad 612
13 weld pad 613
6th soldered ball 614
7th soldered ball 615
First light hole 55
Second light hole 65
Lower surface 71
Upper surface 72
First reference column 710
Coupled lens 711
3rd pilot hole 720
5th surface 81
6th surface 82
Second reference column 810
4th pilot hole 820
Light guide section 91
Fixed part 92
3rd reference column 920
Following embodiment will further illustrate the present invention in conjunction with above-mentioned accompanying drawing.
Embodiment
Do one below in conjunction with accompanying drawing to the present invention specifically to introduce.
As shown in Figure 1, for the optical communication device 100 that embodiment of the present invention provides, it comprises a connector 10, first substrate 20,1 first driving chip 30, light-emitting component 40,1 second driving chip 45, and receives optical element 50, second substrate 60, coupled lens group 70, transparent support frame 80 and an optical waveguide 90.
Described connector 10 comprises a joint face 11.Described joint face 11 is provided with multiple first weld pad 111.
Described first substrate 20 is carried on described joint face 11, and is electrically connected with described connector 10.Particularly, described first substrate 20 comprises a bottom surface 21 be oppositely arranged with described joint face 11, there to be the loading end 22 deviating from described bottom surface 21.Corresponding multiple described first weld pad 111 in described bottom surface 21 is provided with multiple second weld pad 210.One_to_one corresponding between multiple described second weld pad 210 and multiple described first weld pad 111.Be electrically connected by multiple first soldered ball 112 between multiple described second weld pad 210 and multiple described first weld pad 111.The loading end 22 of described first substrate 20 offers an accepting groove 220.Described loading end 22 is provided with one second weld pad 222 and one the 3rd weld pad 223.Described second weld pad 222 and described 3rd weld pad 223 are distributed in the both sides of described accepting groove 220.
Described first driving chip 30 to be carried on described loading end 22 and to be electrically connected with described first substrate 20.Particularly, described first driving chip 30 comprises the second surface 32 that a first surface be oppositely arranged with described loading end 22 31 and deviates from described first surface 31.Described first surface 31 is provided with one the 4th weld pad 311 and one the 5th weld pad 312.Be electrically connected by one second soldered ball 313 between described 4th weld pad 311 and described second weld pad 222.Described first driving chip 30 is supported on described loading end 22 by described second soldered ball 313.Described second surface 32 offers one first pilot hole 320.
Described light-emitting component 40 comprises a light-emitting area 41, and described light-emitting area 41 forms hemispheric first light collecting part 42.Described first light collecting part 42 is formed by drippage colloid in described light-emitting area 41.In other embodiments, described first light collecting part 42 also can be obtained by shaping manufacture, is then bonded to described light-emitting area 41.Described light-emitting area 41 is provided with one the 6th weld pad 411 and one the 7th weld pad 412.Described 6th weld pad 411 is arranged around described first light collecting part 42 with described 7th weld pad 412.Described light-emitting component 40 is a laser diode (laser diode, LD).Described light-emitting component 40 is housed in described accepting groove 220, and described 6th weld pad 411 is electrically connected with the 5th weld pad 312 of described first driving chip 30 by one the 3rd soldered ball 314.Described 4th surface 452 offers one second pilot hole 4520.
Described second driving chip 45 to be carried on described loading end 22 and to be electrically connected with described first substrate 20.Particularly, described second driving chip 45 comprises the 4th surface 452 that the 3rd surface 451 and be oppositely arranged with described loading end 22 deviates from described 3rd surface 451.Described 3rd surface 451 is provided with one the 8th weld pad 453 and one the 9th weld pad 454.Be electrically connected by one the 4th soldered ball 4530 between described 8th weld pad 453 and the 3rd weld pad 223 of described first substrate 20.Described second driving chip 45 is supported on described loading end 22 by described 4th soldered ball 4530 simultaneously.
Described receipts optical element 50 comprises a receipts light face 51, and described receipts light face 51 forms hemispheric second light collecting part 52.Described second light collecting part 52 is formed by drippage colloid in described receipts light face 51.In other embodiments, described second light collecting part 52 also can be obtained by shaping manufacture, is then bonded to described receipts light face 51.Described receipts light face 51 is provided with 1 the tenth weld pad 511 and 1 the 11 weld pad 512.Described tenth weld pad 511 is arranged around described second light collecting part 52 with described 11 weld pad 512.Described receipts optical element 50 is a photodiode (photo diode, PD).Described receipts optical element 50 is also housed in described accepting groove 220, and described tenth weld pad 511 is electrically connected with the 9th weld pad 454 of described second driving chip 45 by one the 5th soldered ball 513.
Described light-emitting component 40 and described receipts optical element 50 are all contained in described accepting groove 220, the overall volume of described optical communication device 100 can be reduced.
Described second substrate 60 is arranged between described first driving chip 30 and described second driving chip 45.Described second substrate 60 comprises the upper surface 62 that a lower surface be all oppositely arranged with described light-emitting component 40 and described receipts optical element 50 61 and deviates from described lower surface 61.Described lower surface 61 is provided with 1 the 12 weld pad 612 and 1 the 13 weld pad 613.Described 12 weld pad 612 is electrically connected with described 7th weld pad 412 of described light-emitting component 40 by one the 6th soldered ball 614.Described 13 weld pad 613 is electrically connected with described 11 weld pad 512 of described receipts optical element 50 by one the 7th soldered ball 615.
Described second substrate 60 is all arranged at interval with described first driving chip 30 and described second driving chip 45.Therefore, be formed with one first light hole 55 between described second substrate 60 and described first driving chip 30, described first light hole 55 aligns mutually with described first light collecting part 42.Be formed with one second light hole 65 between described second substrate 60 and described second driving chip 45, described second light hole 65 aligns mutually with described second light collecting part 52.
Described coupled lens group 70 is located between described first driving chip 30 and described second driving chip 45.Particularly, described coupled lens group 70 comprises the upper surface 72 that a lower surface be all oppositely arranged with described first driving chip 30 and described second driving chip 45 71 and one and described lower surface 71 deviate from mutually.Described upper surface 72 is oppositely arranged with described transparent support frame 80.Corresponding first pilot hole 320 position of described first driving chip 30 of described lower surface 71 and the second pilot hole 4520 position of described second driving chip 45 are vertically extended with two the first reference columns 710.Described two the first reference columns 710 insert described first pilot hole 320 respectively with in described second pilot hole 4520, with make described coupled lens group 70 pluggable be arranged between described first driving chip 30 and described second driving chip 45.In present embodiment, described two the first reference columns 710 are individually fixed in described first pilot hole 320 with in described second pilot hole 4520 by the mode of interference fit.Described lower surface 71 is also formed with two coupled lens 711.In two described coupled lens 711, wherein a coupled lens 711 aligns with described first light hole 55 and described first light collecting part 42 homogeneous phase.Wherein another coupled lens 711 aligns with described second light hole 65 and described second light collecting part 52 homogeneous phase.Described upper surface 72 offers two the 3rd pilot holes 720.
Described transparent support frame 80 adopts clear glass or transparent rubber to make.In present embodiment, described transparent support frame 80 adopts glass to make.Described transparent support frame 80 is arranged at described coupled lens group 70 pluggablely.Particularly, described transparent support frame 80 comprises the 5th surface 81 and the one and the described 5th surperficial 81 the 6th surface 82 deviated from mutually be all oppositely arranged with described coupled lens group 70 and described upper surface 62.Described 6th surface 82 is oppositely arranged with described optical waveguide 90.Two the 3rd pilot hole 720 positions of described 5th surface 81 corresponding described coupled lens groups 70 are vertically extended with two the second reference columns 810.Described two the second reference columns 810 insert in described two the 3rd pilot holes 720 respectively, with make described transparent support frame 80 pluggable be arranged at the described upper surface 72 of described coupled lens group 70.In present embodiment, described two the second reference columns 810 are individually fixed in described two the 3rd pilot holes 720 by the mode of interference fit.Described 6th surface 82 offers two the 4th pilot holes 820.
Described optical waveguide 90 comprises a light guide section 91 and the fixed part 92 around described light guide section 91.Described fixed part 92 is arranged at described transparent support frame 80 pluggablely.Particularly, two the 4th pilot hole 820 positions of the corresponding described transparent support frame 80 of described fixed part 92 are provided with two the 3rd reference columns 920.Described two the 3rd reference columns 920 insert in described two the 4th pilot holes 820 respectively, with make described optical waveguide 90 pluggable be arranged at described transparent support frame 80.In present embodiment, described two the 3rd reference columns 920 are individually fixed in described two the 4th pilot holes 820 by the mode of interference fit.
During use, described first driving chip 30 sends a drive singal, sends light after described light-emitting component 40 receives drive singal.The light that described light-emitting component 40 sends after coupled lens 711 described in described first light hole 55 directive, then enters to the light guide section 91 of described optical waveguide 90 after described first light collecting part 42 converges through described transparent support frame 80.The process of described receipts optical element 50 receiving optical signals is contrary with described light-emitting component 40.
In other embodiments, the first light collecting part 42 and the second light collecting part 52 also can not be set.
In other embodiments, also transparent support frame 80 can not be set, and described optical waveguide 90 be directly positioned the upper surface 72 of described coupled lens group 70.
In other embodiments, also by other modes such as buckles, be connected across described first driving chip 30 and described second driving chip 45 by pluggable for described coupled lens group 70.
In other embodiments, also by other modes such as buckles, be arranged at described coupled lens group 70 by pluggable for described transparent support frame 80.
In other embodiments, also by other modes such as buckles, be arranged at described transparent support frame 80 by pluggable for described optical waveguide 90.
Described coupled lens group 70 is connected across described first driving chip 30 and described second driving chip 45 pluggablely, and described optical waveguide 90 is arranged at described coupled lens group 70 pluggablely, is convenient to disassemble and assemble.
Be understandable that, for the person of ordinary skill of the art, other various corresponding change and distortion can be made by technical conceive according to the present invention, and all these change the protection domain that all should belong to the claims in the present invention with distortion.
Claims (10)
1. an optical communication device, comprise a connector, one first substrate, one first driving chip, one light-emitting component, one second driving chip, one receives optical element, one coupled lens group and an optical waveguide, described first substrate is carried on described connector and is electrically connected with described connector, described first substrate comprises a bottom surface be oppositely arranged with described first substrate, and the loading end that deviates from described bottom surface, described light-emitting component and described receipts optical element are all contained in described first substrate, described first driving chip is carried on described loading end, and be all electrically connected with described first substrate and described light-emitting component, described second driving chip is carried on described loading end, and be all electrically connected with described first substrate and described receipts optical element, described coupled lens group is connected across described first driving chip and described second driving chip pluggablely, described optical waveguide is arranged at described coupled lens group pluggablely.
2. optical communication device as claimed in claim 1, it is characterized in that: described connector comprises a joint face, described first substrate is carried on described joint face, described joint face is provided with multiple first weld pad, corresponding multiple described first weld pad in described bottom surface of described first substrate is provided with multiple second weld pad, one_to_one corresponding between multiple described second weld pad and multiple described first weld pad, is electrically connected by multiple first soldered ball between multiple described second weld pad and multiple described first weld pad.
3. optical communication device as claimed in claim 1, it is characterized in that: the loading end of described first substrate offers an accepting groove, described light-emitting component and described receipts optical element are all contained in described accepting groove.
4. optical communication device as claimed in claim 1, it is characterized in that: described loading end is provided with one second weld pad and one the 3rd weld pad, described first driving chip comprises a first surface be oppositely arranged with described loading end, described first surface is provided with one the 4th weld pad and one the 5th weld pad, be electrically connected by one second soldered ball between described 4th weld pad and described second weld pad, described light-emitting component comprises a light-emitting area, described light-emitting area is provided with one the 6th weld pad and one the 7th weld pad, described 6th weld pad is electrically connected by the 5th weld pad of one the 3rd soldered ball and described first driving chip, described second driving chip comprises the 3rd surface be oppositely arranged with described loading end, described 3rd is provided with one the 8th weld pad and one the 9th weld pad on the surface, be electrically connected by one the 4th soldered ball between described 8th weld pad and the 3rd weld pad of described first substrate, described receipts optical element comprises a light-emitting area, described receipts light face is provided with 1 the tenth weld pad and 1 the 11 weld pad, described tenth weld pad is electrically connected by the 9th weld pad of one the 5th soldered ball and described second driving chip, described optical communication device comprises a second substrate further, described second substrate is arranged between described first driving chip and described second driving chip, described second substrate comprises a lower surface be all oppositely arranged with described light-emitting component and described receipts optical element, described lower surface is provided with 1 the 12 weld pad and 1 the 13 weld pad, described 12 weld pad is electrically connected by described 7th weld pad of one the 6th soldered ball and described light-emitting component, described 13 weld pad is electrically connected by described 11 weld pad of one the 7th soldered ball and described receipts optical element.
5. optical communication device as claimed in claim 1, it is characterized in that: described first driving chip comprises one away from the second surface of described loading end, described second driving chip comprises the 4th surface away from described loading end, described second surface offers one first pilot hole, described 4th offers one second pilot hole on the surface, described coupled lens group comprises a lower surface be all oppositely arranged with described first driving chip and described second driving chip, first position of positioning hole of corresponding described first driving chip of described lower surface, and the second position of positioning hole of described second driving chip is extended with two the first reference columns, described two the first reference columns insert in described first pilot hole and described second pilot hole respectively, with make described coupled lens group pluggable be arranged between described first driving chip and described second driving chip.
6. optical communication device as claimed in claim 5, is characterized in that: described two the first reference columns are individually fixed in described first pilot hole and described second pilot hole by the mode of interference fit.
7. optical communication device as claimed in claim 1, it is characterized in that: described coupled lens group comprises a upper surface be oppositely arranged with described transparent support frame, described upper surface offers two the 3rd pilot holes, described transparent support frame comprises the 5th surface be oppositely arranged with described coupled lens group, two the 3rd position of positioning hole of the described 5th corresponding described coupled lens group in surface are extended with two the second reference columns, described two the second reference columns insert in described two the 3rd pilot holes respectively, with make described transparent support frame pluggable be arranged at the described upper surface of described coupled lens group.
8. optical communication device as claimed in claim 1, is characterized in that: described two the second reference columns are individually fixed in described two the 3rd pilot holes by the mode of interference fit.
9. optical communication device as claimed in claim 1, it is characterized in that: described transparent support frame comprises the 6th surface be oppositely arranged with described optical waveguide, described 6th surface offers two the 4th pilot holes, two the 4th position of positioning hole of the corresponding described transparent support frame of described fixed part are provided with two the 3rd reference columns, described two the 3rd reference columns insert in described two the 4th pilot holes respectively, with make described optical waveguide pluggable be arranged at described transparent support frame.
10. optical communication device as claimed in claim 9, is characterized in that: described two the 3rd reference columns are individually fixed in described two the 4th pilot holes by the mode of interference fit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310287067.3A CN104280834A (en) | 2013-07-10 | 2013-07-10 | Optical communication device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310287067.3A CN104280834A (en) | 2013-07-10 | 2013-07-10 | Optical communication device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104280834A true CN104280834A (en) | 2015-01-14 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310287067.3A Pending CN104280834A (en) | 2013-07-10 | 2013-07-10 | Optical communication device |
Country Status (1)
| Country | Link |
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| CN (1) | CN104280834A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070058904A1 (en) * | 2005-09-14 | 2007-03-15 | Takuma Ban | Method of alignment of an optical module and an optical module using thereof |
| US20080036103A1 (en) * | 2006-08-09 | 2008-02-14 | Hitachi, Ltd. | Manufacturing method of multi-channel optical module |
| CN101498819A (en) * | 2008-01-31 | 2009-08-05 | 索尼株式会社 | Optical-electrical transmission connector, optical-electrical transmission device and electronic device |
| CN102375185A (en) * | 2010-08-20 | 2012-03-14 | 国碁电子(中山)有限公司 | Optical transceiver and manufacturing method thereof |
| CN103185927A (en) * | 2011-12-29 | 2013-07-03 | 鸿富锦精密工业（深圳）有限公司 | Optical fiber transmission module |
-
2013
- 2013-07-10 CN CN201310287067.3A patent/CN104280834A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070058904A1 (en) * | 2005-09-14 | 2007-03-15 | Takuma Ban | Method of alignment of an optical module and an optical module using thereof |
| US20080036103A1 (en) * | 2006-08-09 | 2008-02-14 | Hitachi, Ltd. | Manufacturing method of multi-channel optical module |
| CN101498819A (en) * | 2008-01-31 | 2009-08-05 | 索尼株式会社 | Optical-electrical transmission connector, optical-electrical transmission device and electronic device |
| CN102375185A (en) * | 2010-08-20 | 2012-03-14 | 国碁电子(中山)有限公司 | Optical transceiver and manufacturing method thereof |
| CN103185927A (en) * | 2011-12-29 | 2013-07-03 | 鸿富锦精密工业（深圳）有限公司 | Optical fiber transmission module |
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