CN104279436A - Lamp - Google Patents

Lamp Download PDF

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Publication number
CN104279436A
CN104279436A CN201310275528.5A CN201310275528A CN104279436A CN 104279436 A CN104279436 A CN 104279436A CN 201310275528 A CN201310275528 A CN 201310275528A CN 104279436 A CN104279436 A CN 104279436A
Authority
CN
China
Prior art keywords
hole
circuit board
heat dissipation
oxide
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201310275528.5A
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Chinese (zh)
Other versions
CN104279436B (en
Inventor
周明杰
曾伟锋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oceans King Lighting Science and Technology Co Ltd
Oceans King Dongguan Lighting Technology Co Ltd
Shenzhen Oceans King Lighting Engineering Co Ltd
Original Assignee
Oceans King Lighting Science and Technology Co Ltd
Oceans King Dongguan Lighting Technology Co Ltd
Shenzhen Oceans King Lighting Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oceans King Lighting Science and Technology Co Ltd, Oceans King Dongguan Lighting Technology Co Ltd, Shenzhen Oceans King Lighting Engineering Co Ltd filed Critical Oceans King Lighting Science and Technology Co Ltd
Priority to CN201310275528.5A priority Critical patent/CN104279436B/en
Publication of CN104279436A publication Critical patent/CN104279436A/en
Application granted granted Critical
Publication of CN104279436B publication Critical patent/CN104279436B/en
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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015Fastening arrangements intended to retain light sources
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00Arrangement of electric circuit elements in or on lighting devices
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2101/00Point-like light sources

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

The invention discloses a lamp. The lamp comprises a radiating box, a plurality of MOS transistors, a circuit board and a plurality of fixing racks. The MOS transistors are mounted on the circuit board, and the fixing racks are mounted on the circuit board. The radiating box is provided with a storage space, a pair of locating grooves and a plurality of first fixing holes. The MOS transistors, the circuit board and the fixing racks are stored in the storage space, the locating grooves are formed in a pair of inner side walls of the storage space, the circuit board is stored in the locating grooves, and accordingly the circuit board can be located on the radiating box. The first fixing holes penetrate through a pair of opposite side walls of the radiating box. Each fixing rack is provided with a second fixing hole, a plurality of first fixing pieces penetrate through the first fixing holes and are fixed in the second fixing holes, and thus the fixing racks can be fixed on the radiating box. According to the lamp, the first fixing pieces fix the fixing racks on the radiating box from outside to inside, the MOS transistors are fixed on the radiating box, hence, the MOS transistors can be mounted and dismounted conveniently, and the problem that screws are mounted from inside to outside so that the MOS transistors cannot be mounted and dismounted easily in the prior art is solved.

Description

Light fixture
Technical field
The present invention relates to field of illuminating lamps, particularly relate to a kind of light fixture.
Background technology
Light fixture generally comprises the circuit board and heat dissipation box that are provided with metal-oxide-semiconductor (Metal Oxide Semiconductor Field Effect Transistor, MOSFET), and circuit board is installed in heat dissipation box.But metal-oxide-semiconductor is from inside to outside fixed on heat dissipation box by screw by existing light fixture, thus cause installation and removal difficulty.
Summary of the invention
The object of the present invention is to provide a kind of light fixture easy for installation.
In order to solve the problems of the technologies described above, the invention provides a kind of light fixture, it comprises heat dissipation box, multiple metal-oxide-semiconductor (Metal Oxide Semiconductor Field Effect Transistor, MOSFET), circuit board and multiple fixed mount, described metal-oxide-semiconductor is installed on described circuit board, described fixed mount is installed on described circuit board and is close to described metal-oxide-semiconductor, to protect described metal-oxide-semiconductor, described heat dissipation box is provided with receiving space, a pair locating slot and multiple first fixing hole, described metal-oxide-semiconductor, described circuit board and described fixed mount are contained in receiving space, described locating slot She Ge is in the pair of inside wall of described receiving space, the sidewall that a pair of described circuit board is relative is contained in described locating slot, so that described circuit board is positioned described heat dissipation box, described first fixing hole runs through the relative sidewall of a pair of described heat dissipation box, fixed mount described in each is provided with second fixing hole corresponding with described first fixing hole, multiple first fixture passes described first fixing hole and is fixed in described second fixing hole, so that described fixed mount is fixed on described heat dissipation box.
Wherein, described first fixing hole is through hole, and described second fixing hole is screwed hole.
Wherein, described circuit board is provided with multipair locating hole, and fixed mount described in each comprises a pair angle, and described angle inserts in described locating hole, so that described fixed mount is located described circuit board.
Wherein, the cross sectional shape of angle described in each is work shape, surprisingly departs from described circuit board to prevent described fixed mount.
Wherein, described in each, fixed mount comprises stator, and described stator bends from the top of described fixed mount to described metal-oxide-semiconductor, and the top of metal-oxide-semiconductor described in described stator 44 clasp, to protect described metal-oxide-semiconductor.
Wherein, described heat dissipation box also comprises multiple radiating ribs, and described radiating ribs is protruded from the wall outer surface of described heat dissipation box, and described first fixing hole runs through described radiating ribs.
Wherein, described first fixing hole is counterbore and comprises the first hole and the second hole, and described first hole is communicated with described second hole, and the diameter in described first hole is greater than the diameter in described second hole, and the head of described first fixture is contained in described first hole.
Wherein, described light fixture also comprises a pair holding board, and described holding board is installed on the both ends of described heat dissipation box, for closing described circuit board and described metal-oxide-semiconductor.
Wherein, holding board described in each is provided with rectangular accepting groove, and the both ends on described circuit board are provided with terminal, and described terminal protrudes from described accepting groove.
Wherein, described heat dissipation box is provided with multiple first holding hole, described first holding hole She Ge is in the corner of described receiving space, holding board described in each is provided with the second holding hole corresponding to multiple and described first holding hole, multiple second fixture is fixed in described first holding hole, described holding board to be fixed on the end of described heat dissipation box through described second holding hole.
Light fixture provided by the invention, the first fixture is utilized from outside to inside fixed mount to be fixed on heat dissipation box, so that metal-oxide-semiconductor is fixed on heat dissipation box, thus the installation and removal of metal-oxide-semiconductor are all more convenient, solve screw in prior art and from inside to outside install and cause the problem that the installation and removal of metal-oxide-semiconductor are all more difficult.
Accompanying drawing explanation
In order to be illustrated more clearly in technical scheme of the present invention, be briefly described to the accompanying drawing used required in embodiment below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the decomposing schematic representation of the light fixture that embodiment of the present invention provides;
Fig. 2 is the decomposed schematic diagram of the light fixture shown in Fig. 1;
Fig. 3 is the schematic diagram of the heat dissipation box shown in Fig. 1;
Fig. 4 is the sectional view of linearly IV-IV in Fig. 3;
Fig. 5 is the schematic diagram of the fixed mount shown in Fig. 1;
Fig. 6 is the sectional view along broken line VI-VI in Fig. 5;
Fig. 7 is the assembling schematic diagram of the light fixture shown in Fig. 1;
Fig. 8 is the cross-sectional schematic of Fig. 7.
Detailed description of the invention
Below in conjunction with the accompanying drawing in embodiment of the present invention, the technical scheme in embodiment of the present invention is clearly and completely described.
Please also refer to Fig. 1 to Fig. 4, it is a kind of light fixture 100 provided by the invention.Described light fixture 100 comprises heat dissipation box 10, multiple metal-oxide-semiconductor 20 (Metal Oxide Semiconductor Field Effect Transistor, MOSFET), circuit board 30 and multiple fixed mount 40.Described metal-oxide-semiconductor 20 is installed on described circuit board 30, and described fixed mount 40 is installed on described circuit board 30 and is close to described metal-oxide-semiconductor 20, to protect described metal-oxide-semiconductor 20.Described heat dissipation box 10 is provided with receiving space 12, a pair locating slot 14 and multiple first fixing hole 16, described metal-oxide-semiconductor 20, described circuit board 30 and described fixed mount 40 are contained in receiving space 12, described locating slot 14 She Ge is in a pair of described receiving space 12 relative madial wall, the sidewall that a pair of described circuit board 30 is relative is contained in described locating slot 14, so that described circuit board 30 is positioned described heat dissipation box 10, described first fixing hole 16 runs through the relative sidewall of a pair of described heat dissipation box 10, fixed mount 40 described in each is provided with second fixing hole 46 corresponding with described first fixing hole 16, multiple first fixture 90 passes described first fixing hole 16 and is fixed in described second fixing hole 46, so that described fixed mount 40 is fixed on described heat dissipation box 10.
In the present embodiment, heat dissipation box 10 is formed by extruded.Described fixed mount 40 is formed by galvanized sheet punch forming.
Light fixture 100 provided by the invention, utilizes the first fixture 90 from outside to inside fixed mount 40 to be fixed on heat dissipation box 10, so that metal-oxide-semiconductor 20 is fixed on heat dissipation box 10.Because this fixed form facilitates staff to mount and dismount the first fixture 90, namely the installation and removal of metal-oxide-semiconductor 20 are all more convenient, solve screw in prior art and from inside to outside install and cause the problem that the installation and removal of metal-oxide-semiconductor are all more difficult.
As shown in Figure 3 and Figure 4, in the present embodiment, described first fixing hole 16 is through hole, and described second fixing hole 46 is screwed hole, and the first fixture 90 is screw.During installation, the first fixture 90 passes the first fixing hole 16 and is locked in screwed hole, thus fixed mount 40 is fixed on described heat dissipation box 10.
As a further improvement on the present invention, described heat dissipation box 10 also comprises multiple radiating ribs 18, and described radiating ribs 18 is protruded from the outer surface of the sidewall of described heat dissipation box 10, and described first fixing hole 16 runs through described radiating ribs 18.
Further, described first fixing hole 16 is counterbore and comprises the first hole 162 and the second hole 164, described first hole 162 is communicated with described second hole 164, and the diameter in described first hole 162 is greater than the diameter in described second hole 164, the head of described first fixture 90 is contained in described first hole 162 (please refer to Fig. 8).
As shown in Figure 1, each metal-oxide-semiconductor 20 is provided with multiple pin 21, and circuit board 30 is provided with many groups jack 31 corresponding with described pin 21.During installation, described pin 21 inserts in jack 31, so that metal-oxide-semiconductor 20 is installed on circuit board 30.
Please also refer to Fig. 5 and Fig. 6, as a further improvement on the present invention, circuit board 30 is provided with multipair locating hole 32, and fixed mount 40 described in each comprises a pair angle 42, described angle 42 inserts in described locating hole 32, so that described fixed mount 40 is located described circuit board 30.
In the present embodiment, the cross sectional shape of each angle 42 is work shape, and to prevent, described fixed mount 40 is unexpected departs from described circuit board 30.During installation, each angle 42 by being extruded through locating hole 32, so that each fixed mount 40 is installed on circuit board 30.During use, the cross sectional shape because of each angle 42 is work shape, thus in use, angle 42 not easily departs from from locating hole 32, and then prevents the described circuit board 30 of the unexpected disengaging of fixed mount 40.
As a further improvement on the present invention, each fixed mount 40 also comprises stator 44, and stator 44 bends from the top of fixed mount 40 to metal-oxide-semiconductor 20.After installation, the top of each stator 44 clasp metal-oxide-semiconductor 20, to protect metal-oxide-semiconductor 20.
Because of the stator 44 clasp metal-oxide-semiconductor 20 of fixed mount 40, thus in transport and use procedure, metal-oxide-semiconductor 20 not easily rocks and breaking circuit plate 30, thus metal-oxide-semiconductor 20 can be installed on circuit board 30 securely, and then improves the quality of light fixture 100.
As depicted in figs. 1 and 2, as a further improvement on the present invention, described light fixture 100 also comprises a pair holding board 50, and described holding board 50 is installed on the both ends of described heat dissipation box 10, for closing described circuit board 30 and described metal-oxide-semiconductor 20.
In the present embodiment, described holding board 50 is formed by aluminium sheet punch forming.The cross sectional shape of each holding board 50 is roughly L shape.
Further, holding board 50 described in each is provided with rectangular accepting groove 52, and the both ends of described circuit board 30 are provided with terminal 38, and described terminal 38 protrudes from described accepting groove 52.
In the present embodiment, described heat dissipation box 10 is provided with multiple first holding hole 11, described first holding hole 11 She Ge is in the corner of described receiving space 12, holding board 50 described in each is provided with the second holding hole 51 corresponding to multiple and described first holding hole 11, multiple second fixture 80 is fixed in described first holding hole 11, described holding board 50 to be fixed on the end of described heat dissipation box 10 through described second holding hole 51.
Please also refer to Fig. 1 to Fig. 8, during installation, the pin 21 of described metal-oxide-semiconductor 20 inserts in circuit board 30 jack 31, so that metal-oxide-semiconductor 20 is installed on circuit board 30; The angle 42 of described fixed mount 40 inserts in the locating hole 32 of described circuit board 30, so that described fixed mount 40 is located described circuit board 30; The sidewall that a pair of described circuit board 30 is relative is contained in the locating slot 14 of described heat dissipation box 10, so that circuit board 30 is positioned heat dissipation box 10; Multiple first fixture 90 passes the first fixing hole 16 of described heat dissipation box 10 and is fixed in the second fixing hole 46 of described fixed mount 40, and so that described fixed mount 40 is fixed on described heat dissipation box 10, thus circuit board 30 is fixed on heat dissipation box 10; Multiple second fixture 80 is fixed in the first holding hole 11 of described heat dissipation box 10 through the second holding hole 51 of described holding board 50, described holding board 50 to be fixed on the end of described heat dissipation box 10, thus heat dissipation box 10, metal-oxide-semiconductor 20, circuit board 30, fixed mount 40 and holding board 50 are just assembled into light fixture 100.
The above is the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention; can also make some improvements and modifications, these improvements and modifications are also considered as protection scope of the present invention.

Claims (10)

1. a light fixture, it is characterized in that, described light fixture comprises heat dissipation box, multiple metal-oxide-semiconductor (Metal Oxide Semiconductor Field Effect Transistor, MOSFET), circuit board and multiple fixed mount, described metal-oxide-semiconductor is installed on described circuit board, described fixed mount is installed on described circuit board and is close to described metal-oxide-semiconductor, to protect described metal-oxide-semiconductor, described heat dissipation box is provided with receiving space, a pair locating slot and multiple first fixing hole, described metal-oxide-semiconductor, described circuit board and described fixed mount are contained in receiving space, described locating slot is arranged at the pair of inside wall of described receiving space, the sidewall that a pair of described circuit board is relative is contained in described locating slot, so that described circuit board is positioned described heat dissipation box, described first fixing hole runs through the relative sidewall of a pair of described heat dissipation box, fixed mount described in each is provided with second fixing hole corresponding with described first fixing hole, multiple first fixture passes described first fixing hole and is fixed in described second fixing hole, so that described fixed mount is fixed on described heat dissipation box.
2. light fixture according to claim 1, is characterized in that, described first fixing hole is through hole, and described second fixing hole is screwed hole.
3. light fixture according to claim 1, is characterized in that, described circuit board is provided with multipair locating hole, and fixed mount described in each comprises a pair angle, and described angle inserts in described locating hole, so that described fixed mount is located described circuit board.
4. light fixture according to claim 3, is characterized in that, the cross sectional shape of angle described in each is work shape, surprisingly departs from described circuit board to prevent described fixed mount.
5. light fixture according to claim 3, is characterized in that, described in each, fixed mount comprises stator, and described stator bends from the top of described fixed mount to described metal-oxide-semiconductor, and the top of metal-oxide-semiconductor described in described stator 44 clasp, to protect described metal-oxide-semiconductor.
6. light fixture according to claim 1, is characterized in that, described heat dissipation box also comprises multiple radiating ribs, and described radiating ribs is protruded from the wall outer surface of described heat dissipation box, and described first fixing hole runs through described radiating ribs.
7. light fixture according to claim 6, it is characterized in that, described first fixing hole is counterbore and comprises the first hole and the second hole, described first hole is communicated with described second hole, and the diameter in described first hole is greater than the diameter in described second hole, the head of described first fixture is contained in described first hole.
8. light fixture according to claim 1, is characterized in that, described light fixture also comprises a pair holding board, and described holding board is installed on the both ends of described heat dissipation box, for closing described circuit board and described metal-oxide-semiconductor.
9. light fixture according to claim 8, is characterized in that, holding board described in each is provided with rectangular accepting groove, and the both ends on described circuit board are provided with terminal, and described terminal protrudes from described accepting groove.
10. light fixture according to claim 8, it is characterized in that, described heat dissipation box is provided with multiple first holding hole, described first holding hole is arranged at the corner of described receiving space, holding board described in each is provided with the second holding hole corresponding to multiple and described first holding hole, multiple second fixture is fixed in described first holding hole, described holding board to be fixed on the end of described heat dissipation box through described second holding hole.
CN201310275528.5A 2013-07-02 2013-07-02 Lamps and lanterns Active CN104279436B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201310275528.5A CN104279436B (en) 2013-07-02 2013-07-02 Lamps and lanterns

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310275528.5A CN104279436B (en) 2013-07-02 2013-07-02 Lamps and lanterns

Publications (2)

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CN104279436A true CN104279436A (en) 2015-01-14
CN104279436B CN104279436B (en) 2018-05-08

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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005259757A (en) * 2004-03-09 2005-09-22 Calsonic Kansei Corp Pwm modular structure
US20100039771A1 (en) * 2005-01-19 2010-02-18 Intelligent Electronic Systems (Ies) Method for cooling a static electronic power converter device and corresponding device
CN101778517A (en) * 2010-02-10 2010-07-14 海南世银能源科技有限公司 Electronic ballast structure
CN201541422U (en) * 2009-11-25 2010-08-04 海南嘉润动力有限公司 Hinge-type auxiliary radiating and fastening device of electronic device casing body
CN201657564U (en) * 2010-04-20 2010-11-24 广州冠今电子科技有限公司 Waterproof radiating box body of electric appliance
CN102065661A (en) * 2010-12-14 2011-05-18 山东柏斯莱特照明电器有限公司 Waterproof electrical-appliance shell
CN201937933U (en) * 2010-11-24 2011-08-17 蔡跃进 Electrodeless lamp electronic ballast
CN202373575U (en) * 2011-12-16 2012-08-08 四川长虹欣锐科技有限公司 Radiating device for power semiconductor device

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005259757A (en) * 2004-03-09 2005-09-22 Calsonic Kansei Corp Pwm modular structure
US20100039771A1 (en) * 2005-01-19 2010-02-18 Intelligent Electronic Systems (Ies) Method for cooling a static electronic power converter device and corresponding device
CN201541422U (en) * 2009-11-25 2010-08-04 海南嘉润动力有限公司 Hinge-type auxiliary radiating and fastening device of electronic device casing body
CN101778517A (en) * 2010-02-10 2010-07-14 海南世银能源科技有限公司 Electronic ballast structure
CN201657564U (en) * 2010-04-20 2010-11-24 广州冠今电子科技有限公司 Waterproof radiating box body of electric appliance
CN201937933U (en) * 2010-11-24 2011-08-17 蔡跃进 Electrodeless lamp electronic ballast
CN102065661A (en) * 2010-12-14 2011-05-18 山东柏斯莱特照明电器有限公司 Waterproof electrical-appliance shell
CN202373575U (en) * 2011-12-16 2012-08-08 四川长虹欣锐科技有限公司 Radiating device for power semiconductor device

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Publication number Publication date
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