CN104277442A - 一种热塑性组合物及其制备方法和应用 - Google Patents

一种热塑性组合物及其制备方法和应用 Download PDF

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CN104277442A
CN104277442A CN201410529835.6A CN201410529835A CN104277442A CN 104277442 A CN104277442 A CN 104277442A CN 201410529835 A CN201410529835 A CN 201410529835A CN 104277442 A CN104277442 A CN 104277442A
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邓文
刘可
杨虎
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SHENZHEN SPHONSUN TECHNOLOGY Co Ltd
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Abstract

本发明公开一种热塑性组合物及其制备方法和应用,该热塑性组合物按照重量百分比包括50.5~92.4%热塑性树脂、3~20%LDP添加剂、0.5~5%高介电添加剂、1.8~6%功能填料、0.2~0.5%分散剂和填充剂、1~7.5%增溶剂、1~10%表面改性剂、0.1~0.5%抗氧剂,制备方法是(1)预混和包覆:将LDP添加剂、高介电添加剂、功能填料、分散剂和填充剂、增溶剂、表面改性剂和抗氧剂先混合并包覆成组分A;(2)成型:注塑前将组分A和热塑性树脂按比例进行混合并在200℃左右抽粒烘干。本发明的热塑性组合物产品分散性好,力学性能和化学镀性能优异,具备很好的起镀性能和加工成型性,解决了现有材料由于注塑等原因导致的成分不均匀的问题,得到的金属化镀层厚度均匀,结晶细致,附着力良好,可实现100微米以下的精细线路。

Description

一种热塑性组合物及其制备方法和应用
技术领域
本发明涉及热塑性组合物,尤其涉及一种高填充性功能塑料及其制备方法和应用。
背景技术
目前,使用激光直接图形(LDP)方法形成3D线路变得越来越流行。在LDP方法中,激光束在产品表面上移动从而在要设置导电路径的地方活化该塑料表面。借助于激光直接图形化加精细化镀方法,可获得100微米或者更小的精细线路。此外,导电路径之间的间隔也可达到100微米或者更小。该方法节省了最终用途应用中的空间和重量,激光直接图形化的另一优点是它的灵活性。如果改变电路的设计,问题仅仅是要对控制激光的计算机进行重新编程,无需改变模具。
LDP方法中采用一种特殊的活性催化剂。激光在工件表面烧蚀出需要的活化区域,光束所经过之处会造成表面微观粗糙,同时激光的路径也是金属活性催化中心暴露的位置。这些活性催化中心就是下一步进行化学镀处理时的结晶核。可使用的其它化学镀方法包括但不限于镀铜、金、镍、银、锌、锡、铬及镉等。
作为备选的加工材料种类非常普遍,如常规的聚碳酸酯树脂(PC)或者聚合物合金,ABS树脂(丙烯腈/丁二烯/苯乙烯共聚物共混产生),PA6(尼龙),LCP(液晶聚合物),热塑性聚酯(PBT,PET以及混合物),PI(聚酰胺)没有明显的区别。这些材料被广泛地用于电气或者电子部件、个人电脑、笔记本电脑和便携式计算机,手机,传感器,医疗器械和其它通讯设备中。这些应用的市场趋势包括短的开发周期、设计的变化、成本降低、小型化、多样化和功能性。
在实际的加工过程中,颗粒在材料中的分散均匀度决定了LDP材料表面化镀金属层的厚度均匀性,分散性能同时影响材料的加工性能。因此需要引入特殊的加工助剂和采用特殊的处理方法,此外由于金属氧化物通常在加热状态下发生分子链断裂,从而影响材料最终的力学性能。引入的助剂可以很好的抵制体系的热降解。需要考虑添加量,太多的加入量会导致材料的其它性能的改变。
在实际的加工过程中,配方设计除了需要满足材料加工性能外,由于产品最终的使用要求的差异导致在配方中需要加入大量添加剂,来满足其它性能指标,如提高材料的介电性能值,提高其助燃性能,加入其它颜料来改进色彩方面的要求,加入纤维来提高尺寸稳定性等。通常使得这里面包含着大量的无机类型的填料。
常规的LDS方法中对于添加的激光直接图形化材料没有进行任何处理直接填充和包覆,会影响其使用效果。实际应用中涉及的配方通常有其他填料,这些添加剂叠加作用导致配方材料的注塑成型性能、力学性能以及后期的激光加工和化镀性能下降。
SABIC,BASF等的专利中相关添加剂为Cu2CrO4或者铜铬混合氧化物,含有不符合ROHS的Cr元素。
发明内容
本发明针对现有技术中的不足而提供一种高填充性功能塑料及其制备方法和应用,解决目前采用的高无机含量的混合体系加工性能差和产物稳定性不足的问题。
本发明的技术方案如下:
热塑性组合物,按照重量百分比包括如下组分:
    热塑性树脂              50.5~92.4%
    LDP添加剂              3~20%
    高介电添加剂           0.5~5%
    功能填料                 1.8~6%
    分散剂和填充剂       0.2~0.5%
    增溶剂                    1~7.5%
    表面改性剂              1~10%
    抗氧剂                    0.1~0.5%。
上述热塑性组合物为聚碳酸酯、聚碳酸酯/丙烯腈-丁二烯-苯乙烯树脂共混物中的一种或两种的混合物。
上述LDP添加剂为Co-Ti-O混合氧化物。
上述高介电添加剂为钛酸铜钙或高介电常数的陶瓷材料。
上述功能填料为二氧化钛、氧化锌或氧化钙中的一种或几种。
上述分散剂和填充剂为石墨烯。
上述增溶剂为有机硅类或有机硅与普通橡胶弹性体混合物的中的一种。
上述表面改性剂为有机硅或有机钛类改性剂中的一种或两种的混合物。
上述抗氧剂为四[β-(3,5-二叔丁基-4-羟基苯基)丙酸]季戊四醇粉末或颗粒。
上述热塑性组合物的制备方法,步骤如下:
(1)预混和包覆:将重量百分比为3~20%的LDP添加剂、0.5~5%高介电添加剂、1.8~6%功能填料、0.2~0.5%分散剂和填充剂、1~7.5%增溶剂、1~10%表面改性剂和0.1~0.5%抗氧剂先混合并包覆成组分A;
(2)成型:注塑前将组分A和重量百分比为50.5~92.4%的热塑性树脂进行混合并在200℃左右抽粒烘干。
进一步的,上述热塑性组合物可以通过激光加工表面后激光加工区域被活化,被加工区域在SPS-100、SPS-200药水体系或者MID-100化镀药水体系中沉积铜以后,得到铜线路。
本发明的有益效果:本发明的热塑性组合物产品分散性好,力学性能和化学镀性能优异,具备很好的起镀性能和加工成型性,解决了现有材料由于注塑等原因导致的成分不均匀的问题,得到的金属化镀层厚度均匀,结晶细致,附着力良好,可实现100微米以下的精细线路;本发明的LDP添加剂体系中不含不符合ROHS的Cr元素。
具体实施方式
为了更好的说明本发明,现作进一步的说明。
表1:各实施例成份比例表
实施例1:
(1)预混和包覆:将重量百分比为20%的Co-Ti-O(CAS:68186-85-6)、5%钛酸铜钙、6%二氧化钛、0.5%石墨烯、7.5%有机硅类、10%有机硅和0.5%四[β-(3,5-二叔丁基-4-羟基苯基)丙酸]季戊四醇先混合并包覆成组分A1;
(2)成型:注塑前将组分A1和重量百分比为50.5%的聚碳酸酯进行混合并在200℃左右抽粒烘干。
实施例2:
(1)预混和包覆:将重量百分比为15%的Co-Ti-O(CAS:68186-85-6)、3%高介电常数的陶瓷材料、5%氧化锌、0.4%石墨烯、6%有机硅与普通橡胶弹性体混合物、8%有机钛类改性剂和0.4%四[β-(3,5-二叔丁基-4-羟基苯基)丙酸]季戊四醇先混合并包覆成组分A2;
(2)成型:注塑前将组分A2和重量百分比为62.2%的聚碳酸酯/丙烯腈-丁二烯-苯乙烯树脂共混物进行混合并在200℃左右抽粒烘干。
实施例3:
(1)预混和包覆:将重量百分比为10%的Co-Ti-O(CAS:68186-85-6)、2.5%钛酸铜钙、4%氧化钙、0.3%石墨烯、4%有机硅类、5%有机硅和0.3%四[β-(3,5-二叔丁基-4-羟基苯基)丙酸]季戊四醇先混合并包覆成组分A3;
(2)成型:注塑前将组分A3和重量百分比为73.9%的聚碳酸酯进行混合并在200℃左右抽粒烘干。
实施例4:
(1)预混和包覆:将重量百分比为5%的Co-Ti-O(CAS:68186-85-6)、1%高介电常数的陶瓷材料、3%二氧化钛和氧化锌混合物、0.25%石墨烯、2%有机硅与普通橡胶弹性体混合物、3%有机钛类改性剂和0.2%四[β-(3,5-二叔丁基-4-羟基苯基)丙酸]季戊四醇先混合并包覆成组分A4;
(2)成型:注塑前将组分A4和重量百分比为85.55%的聚碳酸酯/丙烯腈-丁二烯-苯乙烯树脂共混物进行混合并在200℃左右抽粒烘干。
实施例5:
(1)预混和包覆:将重量百分比为3%的Co-Ti-O(CAS:68186-85-6)、0.5%钛酸铜钙、1.8%二氧化钛、氧化锌和氧化钙的混合物、0.2%石墨烯、1%增有机硅类、1%有机硅和有机钛类改性剂的混合物和0.1%四[β-(3,5-二叔丁基-4-羟基苯基)丙酸]季戊四醇先混合并包覆成组分A5;
(2)成型:注塑前将组分A5和重量百分比为92.4%的热聚碳酸酯和聚碳酸酯/丙烯腈-丁二烯-苯乙烯树脂共混物的混合物进行混合并在200℃左右抽粒烘干。
表2:各实施例综合性能
注:附着力测试判定:0级最好,5级最差。
表2为实施例1~5的热塑性组合物的测试综合性能表,由表2得知,起镀时间为30分钟以内,化学镀得到的金属化层厚度均匀,结晶细致;附着力良好,可实现100微米及以下的精细线路。

Claims (10)

1.一种热塑性组合物,其特征在于:按照重量百分比包括如下组分:
   热塑性树脂              50.5~92.4%
   LDP添加剂              3~20%
   高介电添加剂           0.5~5%
   功能填料                 1.8~6%
   分散剂和填充剂       0.2~0.5%
   增溶剂                     1~7.5%
   表面改性剂              1~10%
   抗氧剂                    0.1~0.5%。
2.根据权利要求1所述热塑性组合物,其特征在于:所述热塑性组合物为聚碳酸酯、聚碳酸酯/丙烯腈-丁二烯-苯乙烯树脂共混物中的一种或两种的混合物。
3.根据权利要求1所述热塑性组合物,其特征在于:所述LDP添加剂为Co-Ti-O混合氧化物。
4.根据权利要求1所述热塑性组合物,其特征在于:所述高介电添加剂为钛酸铜钙或高介电常数的陶瓷材料。
5.根据权利要求1所述热塑性组合物,其特征在于:所述功能填料为二氧化钛、氧化锌或氧化钙中的一种或几种;所述分散剂和填充剂为石墨烯。
6.根据权利要求1所述热塑性组合物,其特征在于:所述增溶剂为有机硅类或有机硅与普通橡胶弹性体混合物的中的一种。
7.根据权利要求1所述热塑性组合物,其特征在于:所述表面改性剂为有机硅或有机钛类改性剂中的一种或两种的混合物。
8.根据权利要求1所述热塑性组合物,其特征在于:所述抗氧剂为四[β-(3,5-二叔丁基-4-羟基苯基)丙酸]季戊四醇粉末或颗粒。
9.根据权利要求1~8任一项所述热塑性组合物的制备方法,其特征在于:步骤如下:
(1)预混和包覆:将重量百分比为3~20%的LDP添加剂、0.5~5%高介电添加剂、1.8~6%功能填料、0.2~0.5%分散剂和填充剂、1~7.5%增溶剂、1~10%表面改性剂和0.1~0.5%抗氧剂先混合并包覆成组分A;
(2)成型:注塑前将组分A和重量百分比为50.5~92.4%的热塑性树脂进行混合并在200℃左右抽粒烘干。
10.根据权利要求1~8任一项所述热塑性组合物的应用,其特征在于:所述热塑性组合物可以通过激光加工表面后激光加工区域被活化,被加工区域在SPS-100、SPS-200药水体系或者MID-100化镀药水体系中沉积铜以后,得到铜线路。
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