CN104276063A - Seat private cover and machining method thereof - Google Patents
Seat private cover and machining method thereof Download PDFInfo
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- CN104276063A CN104276063A CN201310292393.3A CN201310292393A CN104276063A CN 104276063 A CN104276063 A CN 104276063A CN 201310292393 A CN201310292393 A CN 201310292393A CN 104276063 A CN104276063 A CN 104276063A
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- Prior art keywords
- handrail
- inner panel
- forming
- outside plate
- counterdie
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C51/00—Shaping by thermoforming, i.e. shaping sheets or sheet like preforms after heating, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor
- B29C51/26—Component parts, details or accessories; Auxiliary operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C51/00—Shaping by thermoforming, i.e. shaping sheets or sheet like preforms after heating, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor
- B29C51/26—Component parts, details or accessories; Auxiliary operations
- B29C51/30—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C51/00—Shaping by thermoforming, i.e. shaping sheets or sheet like preforms after heating, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor
- B29C51/26—Component parts, details or accessories; Auxiliary operations
- B29C51/46—Measuring, controlling or regulating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60N—SEATS SPECIALLY ADAPTED FOR VEHICLES; VEHICLE PASSENGER ACCOMMODATION NOT OTHERWISE PROVIDED FOR
- B60N2/00—Seats specially adapted for vehicles; Arrangement or mounting of seats in vehicles
- B60N2/90—Details or parts not otherwise provided for
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Aviation & Aerospace Engineering (AREA)
- Transportation (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a seat private cover. The seat private cover comprises a back plate assembly, and left and right handrail assemblies which are mounted on the left and right sides of the back plate assembly, wherein the back plate assembly comprises an inner back plate and an outer back plate which are stuck by epoxy glue; the thickness of an epoxy glue layer between the inner back plate and the outer back plate is controlled by glass micro-beads filled in the sticking part between the inner back plate and the outer back plate; the left handrail assembly comprises a left handrail inner plate and a left handrail outer plate which are stuck by epoxy glue and the thickness of an epoxy glue layer between the left handrail inner plate and the left handrail outer plate is controlled by glass micro-beads filled into the sticking part between the left handrail inner plate and the left handrail outer plate; the right handrail assembly comprises a right handrail inner plate and a right handrail outer plate which are stuck by epoxy glue and the thickness of an epoxy glue layer between the right handrail inner plate and the right handrail outer plate is controlled by glass micro-beads filled into the sticking part between the right handrail inner plate and the right handrail outer plate. The seat private cover has the advantages of good strength and light weight and the requirements of nowadays society are met; the preparation process is simple; an adopted mould is simple in structure and low in cost. The invention further discloses a preparation method of the seat private cover.
Description
Technical field
The present invention relates to a kind of seat annex and preparing technical field thereof, particularly a kind of seat secret cover and job operation thereof.
Background technology
Along with the raising of people's living standard, the seat taken in travelling process requires more and more higher, and one is that requirement is comfortable, safety, and two is that requirement has certain privacy.Some seats for this reason with secret cover start to be applied in aircraft, railway transport vehicle, a kind of seat as Multifunctional seat for train disclosed in China Patent No. ZL201120149839.3j is exactly.Seat can be surrounded the space of a comparatively secret by the secret cover that this kind of seat is arranged, thus alleviates the interference of external environment to passenger as much as possible, increases the privacy of each seat, meets the personal needs of high-end passenger.This kind of seat generally includes backrest, seat cushion, handrail, base and scroll casing shape case, and scroll casing shape case and left and right handrail form whole secret cover, and backrest, seat cushion, base are enclosed in whole secret cover.Current scroll casing shape case and left and right the handrail all separately overall SMC of employing material molding manufacture, there are the following problems for such manufacture method: if 1 solid construction, then add the weight of product, do not meet current weight-saving requirement, waste material simultaneously, add the cost of seat.If 2 adopt hollow structure, owing to arranging plurality of devices at left and right handrail and scroll casing shape case capable needs, such as TV, reading lamp, earphone etc., such mould needs to arrange a lot of pulled core structure, complexity and the manufacturing cost of mould certainly will be increased like this, do not meet the requirement of enterprise to returns and efficiency.
Summary of the invention
One of technical matters to be solved by this invention is to provide for the problem existing for existing secret cover a kind of lightweight, seat secret cover that intensity is high.
Two of technical matters to be solved by this invention is the preparation method providing above-mentioned seat secret cover.
As the seat secret cover of first aspect present invention, comprise back board assembly and be arranged on described back board assembly left, a left side for right both sides, right arm assembly, it is characterized in that, described back board assembly comprises the entodorsum and outer backboard that are bonded together by epoxy glue, described left arm assembly comprises the left handrail inner panel and left handrail outside plate that are bonded together by epoxy glue, described left arm assembly comprises the right handrail inner panel and right handrail outside plate that are bonded together by epoxy glue, between described entodorsum and outer backboard, the thickness of epoxy adhesive layer is controlled by the micro glass bead be filled between entodorsum and outer backboard in abutting edge, between described left handrail inner panel and left handrail outside plate, the thickness of epoxy adhesive layer is controlled by the micro glass bead be filled between left handrail inner panel and left handrail outside plate in abutting edge, between described right handrail inner panel and right handrail outside plate, the thickness of epoxy adhesive layer is controlled by the micro glass bead be filled between right handrail inner panel and right handrail outside plate in abutting edge.
The diameter of described micro glass bead is 0.5mm.
Described micro glass bead shared volume in described epoxy adhesive layer is 3 ~ 6:94 ~ 97 with the ratio of volume shared by epoxy glue.
As the preparation method of the secret cover of second aspect present invention, it comprises the steps:
1, the preparation of back board assembly
1.1 prepare the entodorsum forming mould preparing entodorsum, this entodorsum forming mould comprises entodorsum shaping upper and the shaping counterdie of entodorsum, in the shaping counterdie of entodorsum, entodorsum die cavity is set, the profile of entodorsum shaping upper and the shaping counterdie of entodorsum sprays external release agent, then the SMC raw MAT'L being cut into given size is dropped in the entodorsum die cavity of the shaping counterdie of entodorsum, close entodorsum shaping upper, is heated to 145-155 DEG C of solidification and takes out shaping entodorsum after 5 minutes;
1.2 prepare the outer backboard forming mould preparing outer backboard, this outer backboard forming mould comprises outer backboard shaping upper and the shaping counterdie of outer backboard, outside in the shaping counterdie of backboard, outer backboard die cavity is set, the profile of backboard shaping upper and the shaping counterdie of outer backboard outside sprays external release agent, then the SMC raw MAT'L being cut into given size is dropped in the outer backboard die cavity of the shaping counterdie of outer backboard, close outer backboard shaping upper, is heated to 145-155 DEG C of solidification and takes out shaping outer backboard after 5 minutes;
1.3 polishing entodorsums and outer backboard on adhesive surface and adopt acetone to clean up, on the adhesive surface of entodorsum, bi-component epoxy is coated after drying, after gluing, the micro glass bead that diameter is 0.5mm is sprinkled again in epoxy glue, wherein micro glass bead shared volume in final epoxy adhesive layer is 3 ~ 6:94 ~ 97 with the ratio of volume shared by epoxy glue, and it is distributed as in the epoxy glue of every sq cm has 14 ~ 30 micro glass beads at least; By locating dowel pin, outer backboard and entodorsum are combined again;
The 1.4 inside and outside backboards that will combine, put into forming mould and carry out Heat forming, and wherein hot-forming temperature is 120 ± 3 DEG C, and the time is 20 minutes, and Heat forming terminates the back board assembly after taking out Heat forming; Glue unnecessary in forming process can overflow from the edge between inside and outside backboard;
2, the preparation of left arm assembly
Board forming die in the left handrail of the left handrail inner panel of 2.1 preparation preparation, in this left handrail, board forming die comprises sheet metal forming counterdie in left handrail inner panel shaping upper and left handrail, left handrail inner panel die cavity is set in sheet metal forming counterdie in left handrail, in left handrail inner panel shaping upper and left handrail sheet metal forming counterdie profile on spray external release agent, then the SMC raw MAT'L being cut into given size is dropped in the left handrail inner panel die cavity of sheet metal forming counterdie in left handrail, close left handrail inner panel shaping upper, be heated to 145-155 DEG C of solidification and take out shaping left handrail inner panel after 5 minutes,
2.2 prepare the left handrail mold for forming outer plate preparing left handrail outside plate, this left handrail mold for forming outer plate comprises left handrail outside plate shaping upper and the outer sheet metal forming counterdie of left handrail, in the outer sheet metal forming counterdie of left handrail, left handrail outside plate die cavity is set, the profile of the outer sheet metal forming counterdie of left handrail outside plate shaping upper and left handrail sprays external release agent, then the SMC raw MAT'L being cut into given size is dropped in the left handrail outside plate die cavity of the outer sheet metal forming counterdie of left handrail, close left handrail outside plate shaping upper, be heated to 145-155 DEG C of solidification and take out shaping left handrail outside plate after 5 minutes,
2.3 polishing left handrail inner panels and left handrail outside plate on adhesive surface and adopt acetone to clean up, on the adhesive surface of left handrail inner panel, bi-component epoxy is coated after drying, after gluing, the micro glass bead that diameter is 0.5mm is sprinkled in epoxy glue, wherein micro glass bead shared volume in final epoxy adhesive layer is 3 ~ 6:94 ~ 97 with the ratio of volume shared by epoxy glue, and it is distributed as in the epoxy glue of every sq cm has 14 ~ 30 micro glass beads at least; By locating dowel pin, left handrail outside plate and left handrail inner panel are combined again;
2.4, by the left handrail inner panel combined, left handrail outside plate, put into forming mould and carry out Heat forming, and wherein hot-forming temperature is 120 ± 3 DEG C, and the time is 20 minutes, and Heat forming terminates the left arm assembly after taking out Heat forming; Glue unnecessary in forming process can overflow from the edge between left handrail inner panel, left handrail outside plate;
3, the preparation of right arm assembly
Board forming die in the right handrail of the right handrail inner panel of 3.1 preparation preparation, in this right handrail, board forming die comprises sheet metal forming counterdie in right handrail inner panel shaping upper and right handrail, right handrail inner panel die cavity is set in sheet metal forming counterdie in right handrail, in right handrail inner panel shaping upper and right handrail sheet metal forming counterdie profile on spray external release agent, then the SMC raw MAT'L being cut into given size is dropped in the right handrail inner panel die cavity of sheet metal forming counterdie in right handrail, close right handrail inner panel shaping upper, be heated to 145-155 DEG C of solidification and take out shaping right handrail inner panel after 5 minutes,
3.2 prepare the right handrail mold for forming outer plate preparing right handrail outside plate, this right handrail mold for forming outer plate comprises right handrail outside plate shaping upper and the outer sheet metal forming counterdie of right handrail, in the outer sheet metal forming counterdie of right handrail, right handrail outside plate die cavity is set, the profile of the outer sheet metal forming counterdie of right handrail outside plate shaping upper and right handrail sprays external release agent, then the SMC raw MAT'L being cut into given size is dropped in the right handrail outside plate die cavity of the outer sheet metal forming counterdie of right handrail, close right handrail outside plate shaping upper, be heated to 145-155 DEG C of solidification and take out shaping right handrail outside plate after 5 minutes,
3.3 polishing right handrail inner panels and right handrail outside plate on adhesive surface and adopt acetone to clean up, on the adhesive surface of right handrail inner panel, bi-component epoxy is coated after drying, after gluing, the micro glass bead that diameter is 0.5mm is sprinkled in epoxy glue, wherein micro glass bead shared volume in final epoxy adhesive layer is 3 ~ 6:94 ~ 97 with the ratio of volume shared by epoxy glue, and it is distributed as in the epoxy glue of every sq cm has 14 ~ 30 micro glass beads at least; By locating dowel pin, right handrail outside plate and right handrail inner panel are combined again;
3.4, by the right handrail inner panel combined, right handrail outside plate, put into forming mould and carry out Heat forming, and wherein hot-forming temperature is 120 ± 3 DEG C, and the time is 20 minutes, and Heat forming terminates the right arm assembly after taking out Heat forming; Glue unnecessary in forming process can overflow from the edge between right handrail inner panel, right handrail outside plate;
4, backboard and left and right arm assembly are fitted together, form seat secret cover.
It is good that the seat secret cover adopting said method to prepare has intensity, and lightweight advantage, meets the requirement of society, and its preparation technology is simple, and the mould structure adopted is simple, and cost is low.
Accompanying drawing explanation
Fig. 1 is the structural representation of seat secret photograph of the present invention.
Fig. 2 is the bonding schematic diagram of backboard of the present invention.
Fig. 3 is the bonding schematic diagram of the left arm assembly of the present invention.
Fig. 4 is the bonding schematic diagram of the right arm assembly of the present invention.
Detailed description of the invention
The technological means realized to make the present invention, creation characteristic, reaching object and effect is easy to understand, below in conjunction with concrete diagram, setting forth the present invention further.
See the seat secret cover shown in Fig. 1, figure, comprise back board assembly 100 and the left and right arm assembly 200,300 being arranged on back board assembly 100 arranged on left and right sides.
See Fig. 2, back board assembly 100 comprises the entodorsum 110 and outer backboard 120 that are bonded together by epoxy glue; Between entodorsum 110 and outer backboard 120, the thickness of epoxy adhesive layer 130 is controlled by the micro glass bead 150 be filled between entodorsum 110 and outer backboard 120 in abutting edge 140
See Fig. 3, left arm assembly 200 comprises the left handrail inner panel 210 and left handrail outside plate 220 that are bonded together by epoxy glue.Between left handrail inner panel 210 and left handrail outside plate 220, the thickness of epoxy adhesive layer 230 is controlled by the micro glass bead 250 be filled between left handrail inner panel 210 and left handrail outside plate 220 in abutting edge 240;
See Fig. 4, right arm assembly 300 comprises the right handrail inner panel 310 and right handrail outside plate 320 that are bonded together by epoxy glue 330, and between right handrail inner panel 310 and right handrail outside plate 320, the thickness of epoxy adhesive layer 330 is controlled by the micro glass bead 350 be filled between right handrail inner panel 310 and right handrail outside plate 320 in abutting edge 340.
Illustrate how above-mentioned seat secret cover prepares below in conjunction with specific embodiment.
Below in embodiment, understood, unless stated otherwise, the SMC material that it adopts is prepared by Shanghai Lv Tong composite material Co., Ltd, its model is SMC2400LMC2408, the bi-component epoxy adopted is a kind of two component epoxy glue of LORD Company, and its model is lord320/322, and micro glass bead is that Shanghai Rui Guo mechanical equipment Co., Ltd produces, its model is GB30#, and diameter is 0.5mm
Embodiment 1
The preparation method of secret cover, it comprises the steps:
1, the preparation of back board assembly
1.1 prepare the entodorsum forming mould preparing entodorsum, this entodorsum forming mould comprises entodorsum shaping upper and the shaping counterdie of entodorsum, in the shaping counterdie of entodorsum, entodorsum die cavity is set, the profile of entodorsum shaping upper and the shaping counterdie of entodorsum sprays external release agent, then the SMC raw MAT'L being cut into given size is dropped in the entodorsum die cavity of the shaping counterdie of entodorsum, close entodorsum shaping upper, is heated to 145-155 DEG C of solidification and takes out shaping entodorsum after 5 minutes;
1.2 prepare the outer backboard forming mould preparing outer backboard, this outer backboard forming mould comprises outer backboard shaping upper and the shaping counterdie of outer backboard, outside in the shaping counterdie of backboard, outer backboard die cavity is set, the profile of backboard shaping upper and the shaping counterdie of outer backboard outside sprays external release agent, then the SMC raw MAT'L being cut into given size is dropped in the outer backboard die cavity of the shaping counterdie of outer backboard, close outer backboard shaping upper, is heated to 145-155 DEG C of solidification and takes out shaping outer backboard after 5 minutes;
1.3 polishing entodorsums and outer backboard on adhesive surface and adopt acetone to clean up, on the adhesive surface of entodorsum, bi-component epoxy is coated after drying, after gluing, the micro glass bead that diameter is 0.5mm is sprinkled again in epoxy glue, wherein micro glass bead shared volume in final epoxy adhesive layer is 3 ~ 6:94 ~ 97 with the ratio of volume shared by epoxy glue, and it is distributed as in the epoxy glue of every sq cm has 14 ~ 30 micro glass beads at least; By locating dowel pin, outer backboard and entodorsum are combined again;
The 1.4 inside and outside backboards that will combine, put into forming mould and carry out Heat forming, and wherein hot-forming temperature is 120 ± 3 DEG C, and the time is 20 minutes, and Heat forming terminates the back board assembly after taking out Heat forming; Glue unnecessary in forming process can overflow from the edge between inside and outside backboard;
2, the preparation of left arm assembly
Board forming die in the left handrail of the left handrail inner panel of 2.1 preparation preparation, in this left handrail, board forming die comprises sheet metal forming counterdie in left handrail inner panel shaping upper and left handrail, left handrail inner panel die cavity is set in sheet metal forming counterdie in left handrail, in left handrail inner panel shaping upper and left handrail sheet metal forming counterdie profile on spray external release agent, then the SMC raw MAT'L being cut into given size is dropped in the left handrail inner panel die cavity of sheet metal forming counterdie in left handrail, close left handrail inner panel shaping upper, be heated to 145-155 DEG C of solidification and take out shaping left handrail inner panel after 5 minutes,
2.2 prepare the left handrail mold for forming outer plate preparing left handrail outside plate, this left handrail mold for forming outer plate comprises left handrail outside plate shaping upper and the outer sheet metal forming counterdie of left handrail, in the outer sheet metal forming counterdie of left handrail, left handrail outside plate die cavity is set, the profile of the outer sheet metal forming counterdie of left handrail outside plate shaping upper and left handrail sprays external release agent, then the SMC raw MAT'L being cut into given size is dropped in the left handrail outside plate die cavity of the outer sheet metal forming counterdie of left handrail, close left handrail outside plate shaping upper, be heated to 145-155 DEG C of solidification and take out shaping left handrail outside plate after 5 minutes,
2.3 polishing left handrail inner panels and left handrail outside plate on adhesive surface and adopt acetone to clean up, on the adhesive surface of left handrail inner panel, bi-component epoxy is coated after drying, after gluing, the micro glass bead that diameter is 0.5mm is sprinkled in epoxy glue, wherein micro glass bead shared volume in final epoxy adhesive layer is 3 ~ 6:94 ~ 97 with the ratio of volume shared by epoxy glue, and it is distributed as in the epoxy glue of every sq cm has 14 ~ 30 micro glass beads at least; By locating dowel pin, left handrail outside plate and left handrail inner panel are combined again;
2.4, by the left handrail inner panel combined, left handrail outside plate, put into forming mould and carry out Heat forming, and wherein hot-forming temperature is 120 ± 3 DEG C, and the time is 20 minutes, and Heat forming terminates the left arm assembly after taking out Heat forming; Glue unnecessary in forming process can overflow from the edge between left handrail inner panel, left handrail outside plate;
3, the preparation of right arm assembly
Board forming die in the right handrail of the right handrail inner panel of 3.1 preparation preparation, in this right handrail, board forming die comprises sheet metal forming counterdie in right handrail inner panel shaping upper and right handrail, right handrail inner panel die cavity is set in sheet metal forming counterdie in right handrail, in right handrail inner panel shaping upper and right handrail sheet metal forming counterdie profile on spray external release agent, then the SMC raw MAT'L being cut into given size is dropped in the right handrail inner panel die cavity of sheet metal forming counterdie in right handrail, close right handrail inner panel shaping upper, be heated to 145-155 DEG C of solidification and take out shaping right handrail inner panel after 5 minutes,
3.2 prepare the right handrail mold for forming outer plate preparing right handrail outside plate, this right handrail mold for forming outer plate comprises right handrail outside plate shaping upper and the outer sheet metal forming counterdie of right handrail, in the outer sheet metal forming counterdie of right handrail, right handrail outside plate die cavity is set, the profile of the outer sheet metal forming counterdie of right handrail outside plate shaping upper and right handrail sprays external release agent, then the SMC raw MAT'L being cut into given size is dropped in the right handrail outside plate die cavity of the outer sheet metal forming counterdie of right handrail, close right handrail outside plate shaping upper, be heated to 145-155 DEG C of solidification and take out shaping right handrail outside plate after 5 minutes,
3.3 polishing right handrail inner panels and right handrail outside plate on adhesive surface and adopt acetone to clean up, on the adhesive surface of right handrail inner panel, bi-component epoxy is coated after drying, after gluing, the micro glass bead that diameter is 0.5mm is sprinkled in epoxy glue, wherein micro glass bead shared volume in final epoxy adhesive layer is 3 ~ 6:94 ~ 97 with the ratio of volume shared by epoxy glue, and it is distributed as in the epoxy glue of every sq cm has 14 ~ 30 micro glass beads at least; By locating dowel pin, right handrail outside plate and right handrail inner panel are combined again;
3.4, by the right handrail inner panel combined, right handrail outside plate, put into forming mould and carry out Heat forming, and wherein hot-forming temperature is 120 ± 3 DEG C, and the time is 20 minutes, and Heat forming terminates the right arm assembly after taking out Heat forming; Glue unnecessary in forming process can overflow from the edge between right handrail inner panel, right handrail outside plate;
4, backboard and left and right arm assembly are fitted together, form seat secret cover.
After testing, the weight of this embodiment backboard is 10.5Kg; The weight of left arm assembly is the weight of the right arm assembly of 11.2Kg is 11.2Kg, seat secret cover assembly according to IEC61373 standard by X-direction 30m/s
2; Y direction 30m/s
2; Z-direction 50m/s
2, name cycle 30ms half-sine wave; Each 3 times of three axis; Positive and negative each circulation 1 time, impacts impact resistance test and other performance tests of 18 times altogether.
Claims (4)
1. seat secret cover, comprise back board assembly and be arranged on described back board assembly left, a left side for right both sides, right arm assembly, it is characterized in that, described back board assembly comprises the entodorsum and outer backboard that are bonded together by epoxy glue, described left arm assembly comprises the left handrail inner panel and left handrail outside plate that are bonded together by epoxy glue, described right arm assembly comprises the right handrail inner panel and right handrail outside plate that are bonded together by epoxy glue, between described entodorsum and outer backboard, the thickness of epoxy adhesive layer is controlled by the micro glass bead be filled between entodorsum and outer backboard in abutting edge, between described left handrail inner panel and left handrail outside plate, the thickness of epoxy adhesive layer is controlled by the micro glass bead be filled between left handrail inner panel and left handrail outside plate in abutting edge, between described right handrail inner panel and right handrail outside plate, the thickness of epoxy adhesive layer is controlled by the micro glass bead be filled between right handrail inner panel and right handrail outside plate in abutting edge.
2. seat secret cover as claimed in claim 1, it is characterized in that, the diameter of described micro glass bead is 0.5mm.
3. seat secret cover as claimed in claim 1 or 2, is characterized in that, described micro glass bead shared volume in described epoxy adhesive layer is 3 ~ 6:94 ~ 97 with the ratio of volume shared by epoxy glue.
4. a preparation method for secret cover according to claim 1, is characterized in that, comprise the steps:
1], the preparation of back board assembly
1.1] the entodorsum forming mould preparing entodorsum is prepared, this entodorsum forming mould comprises entodorsum shaping upper and the shaping counterdie of entodorsum, in the shaping counterdie of entodorsum, entodorsum die cavity is set, the profile of entodorsum shaping upper and the shaping counterdie of entodorsum sprays external release agent, then the SMC raw MAT'L being cut into given size is dropped in the entodorsum die cavity of the shaping counterdie of entodorsum, close entodorsum shaping upper, is heated to 145-155 DEG C of solidification and takes out shaping entodorsum after 5 minutes;
1.2] the outer backboard forming mould of the outer backboard of preparation is prepared, this outer backboard forming mould comprises outer backboard shaping upper and the shaping counterdie of outer backboard, outside in the shaping counterdie of backboard, outer backboard die cavity is set, the profile of backboard shaping upper and the shaping counterdie of outer backboard outside sprays external release agent, then the SMC raw MAT'L being cut into given size is dropped in the outer backboard die cavity of the shaping counterdie of outer backboard, close outer backboard shaping upper, is heated to 145-155 DEG C of solidification and takes out shaping outer backboard after 5 minutes;
1.3] to polish the adhesive surface on entodorsum and outer backboard adopt acetone to clean up, on the adhesive surface of entodorsum, bi-component epoxy is coated after drying, after gluing, the micro glass bead that diameter is 0.5mm is sprinkled again in epoxy glue, wherein micro glass bead shared volume in final epoxy adhesive layer is 3 ~ 6:94 ~ 97 with the ratio of volume shared by epoxy glue, and it is distributed as in the epoxy glue of every sq cm has 14 ~ 30 micro glass beads at least; By locating dowel pin, outer backboard and entodorsum are combined again;
1.4] the inside and outside backboard will combined, puts into forming mould and carries out Heat forming, and wherein hot-forming temperature is 120 ± 3 DEG C, and the time is 20 minutes, and Heat forming terminates the back board assembly after taking out Heat forming; Glue unnecessary in forming process can overflow from the edge between inside and outside backboard;
2], the preparation of left arm assembly
2.1] prepare preparation left handrail inner panel left handrail in board forming die, in this left handrail, board forming die comprises sheet metal forming counterdie in left handrail inner panel shaping upper and left handrail, left handrail inner panel die cavity is set in sheet metal forming counterdie in left handrail, in left handrail inner panel shaping upper and left handrail sheet metal forming counterdie profile on spray external release agent, then the SMC raw MAT'L being cut into given size is dropped in the left handrail inner panel die cavity of sheet metal forming counterdie in left handrail, close left handrail inner panel shaping upper, be heated to 145-155 DEG C of solidification and take out shaping left handrail inner panel after 5 minutes,
2.2] the left handrail mold for forming outer plate of the left handrail outside plate of preparation is prepared, this left handrail mold for forming outer plate comprises left handrail outside plate shaping upper and the outer sheet metal forming counterdie of left handrail, in the outer sheet metal forming counterdie of left handrail, left handrail outside plate die cavity is set, the profile of the outer sheet metal forming counterdie of left handrail outside plate shaping upper and left handrail sprays external release agent, then the SMC raw MAT'L being cut into given size is dropped in the left handrail outside plate die cavity of the outer sheet metal forming counterdie of left handrail, close left handrail outside plate shaping upper, be heated to 145-155 DEG C of solidification and take out shaping left handrail outside plate after 5 minutes,
2.3] to polish the adhesive surface on left handrail inner panel and left handrail outside plate adopt acetone to clean up, on the adhesive surface of left handrail inner panel, bi-component epoxy is coated after drying, after gluing, the micro glass bead that diameter is 0.5mm is sprinkled in epoxy glue, wherein micro glass bead shared volume in final epoxy adhesive layer is 3 ~ 6:94 ~ 97 with the ratio of volume shared by epoxy glue, and it is distributed as in the epoxy glue of every sq cm has 14 ~ 30 micro glass beads at least; By locating dowel pin, left handrail outside plate and left handrail inner panel are combined again;
2.4] by the left handrail inner panel combined, left handrail outside plate, put into forming mould and carry out Heat forming, wherein hot-forming temperature is 120 ± 3 DEG C, and the time is 20 minutes, and Heat forming terminates the left arm assembly after taking out Heat forming; Glue unnecessary in forming process can overflow from the edge between left handrail inner panel, left handrail outside plate;
3], the preparation of right arm assembly
3.1] prepare preparation right handrail inner panel right handrail in board forming die, in this right handrail, board forming die comprises sheet metal forming counterdie in right handrail inner panel shaping upper and right handrail, right handrail inner panel die cavity is set in sheet metal forming counterdie in right handrail, in right handrail inner panel shaping upper and right handrail sheet metal forming counterdie profile on spray external release agent, then the SMC raw MAT'L being cut into given size is dropped in the right handrail inner panel die cavity of sheet metal forming counterdie in right handrail, close right handrail inner panel shaping upper, be heated to 145-155 DEG C of solidification and take out shaping right handrail inner panel after 5 minutes,
3.2] the right handrail mold for forming outer plate of the right handrail outside plate of preparation is prepared, this right handrail mold for forming outer plate comprises right handrail outside plate shaping upper and the outer sheet metal forming counterdie of right handrail, in the outer sheet metal forming counterdie of right handrail, right handrail outside plate die cavity is set, the profile of the outer sheet metal forming counterdie of right handrail outside plate shaping upper and right handrail sprays external release agent, then the SMC raw MAT'L being cut into given size is dropped in the right handrail outside plate die cavity of the outer sheet metal forming counterdie of right handrail, close right handrail outside plate shaping upper, be heated to 145-155 DEG C of solidification and take out shaping right handrail outside plate after 5 minutes,
3.3] to polish the adhesive surface on right handrail inner panel and right handrail outside plate adopt acetone to clean up, on the adhesive surface of right handrail inner panel, bi-component epoxy is coated after drying, after gluing, the micro glass bead that diameter is 0.5mm is sprinkled in epoxy glue, wherein micro glass bead shared volume in final epoxy adhesive layer is 3 ~ 6:94 ~ 97 with the ratio of volume shared by epoxy glue, and it is distributed as in the epoxy glue of every sq cm has 14 ~ 30 micro glass beads at least; By locating dowel pin, right handrail outside plate and right handrail inner panel are combined again;
3.4] by the right handrail inner panel combined, right handrail outside plate, put into forming mould and carry out Heat forming, wherein hot-forming temperature is 120 ± 3 DEG C, and the time is 20 minutes, and Heat forming terminates the right arm assembly after taking out Heat forming; Glue unnecessary in forming process can overflow from the edge between right handrail inner panel, right handrail outside plate;
4], by backboard and left and right arm assembly fit together, form seat secret cover.
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CN108464661A (en) * | 2018-03-31 | 2018-08-31 | 广东知识城运营服务有限公司 | A kind of cinema is anti-to bother device |
CN112026814A (en) * | 2020-08-31 | 2020-12-04 | 山东嘉泰交通设备有限公司 | Business seat and arrangement method thereof |
CN112171190A (en) * | 2020-09-18 | 2021-01-05 | 山东华盛荣镁业科技有限公司 | Magnesium-based seat privacy cover and preparation process thereof |
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CN112171190A (en) * | 2020-09-18 | 2021-01-05 | 山东华盛荣镁业科技有限公司 | Magnesium-based seat privacy cover and preparation process thereof |
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