CN104270901A - Coating process on basis of 823 protective agent - Google Patents
Coating process on basis of 823 protective agent Download PDFInfo
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- CN104270901A CN104270901A CN201410586111.5A CN201410586111A CN104270901A CN 104270901 A CN104270901 A CN 104270901A CN 201410586111 A CN201410586111 A CN 201410586111A CN 104270901 A CN104270901 A CN 104270901A
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- circuit board
- printed circuit
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Abstract
The invention relates to a coating process on the basis of an 823 protective agent and belongs to the technical field of a coating method of a protective coating for electronic equipment. The coating process is characterized in that through being in strict accordance with 14 processing steps, a uniform and consistent coating layer is formed on the surface of a preliminarily coated printed circuit board and pin holes generated on the surface of the coating layer, which are caused by generation of bubbles due to volatilization of the protective agent in the process of coating for the first time are covered by spraying for the second time, and thus, protection performance of the printed circuit board assembly is greatly reinforced and damage of static electricity, which is generated by friction between a brush and a printed board in the conventional brushing process, to the printed circuit board assembly, which is sensitive to static electricity, is completely avoided. Meanwhile, the coating process also solves the problems of surface flow marks or accumulation caused by residual brushmark and dip-coating in the brushing process and damage to elements, which is caused by easiness for penetration of a solvent. Three-prevention performance of preventing dampness and heat, mould and salt fog is greatly reinforced.
Description
Technical field
The present invention relates to a kind of based on 823 protectant coating processes, belong to electronic equipment protective coating painting method technical field.
Background technology
Due to the maintenanceability of DJB-823 solid film protective agent (hereinafter referred to as DJB-823 protective agent) and protective comparatively acrylic resin, organic siliconresin, polyurethane etc. to get well, the industry therefore becoming electronic equipment protective agent is first-selected.The protectant coated technique of DJB-823 generally adopts dip-coating at present and brushes two kinds of modes.Although these two kinds of coating processes can not affect by electrostatic, hectic fever, salt fog etc. to a certain degree safeguarding electronic devices, but also there are following some shortcomings: adopt dipping process, the protectant coating layer thickness of DJB-823 is not easily grasped, and after causing dip-coating, there is current mark on electronic equipment surface; In addition, the unavoidable sealing of some electric contacts is poor, and during dip-coating, DJB-823 solution easily infiltrates in element and affects element quality.Adopt brush coating process, hairbrush is brushed back and forth and is inevitably occurred brush mark on electronic equipment surface, and friction very easily produces electrostatic, damage electric contacts.
Summary of the invention
The object of the invention is to, provide a kind of technique simple, easy to operate, the even not trace of coating, avoid damaging electric contacts, antistatic, anti humid heat, Defend salt fog are effective; Solve existing dip-coating, brushing method easily at the remaining current mark of coating surface, brush mark, protective agent solution easily infiltrates in element or friction produces electrostatic, has a strong impact on coating quality, lesion element, causes the coating processes based on 823 coating of " three prevent " weak effect problem.
The present invention realizes above-mentioned purpose by the following technical solutions
1, a kind of based on 823 protectant coating processes, it is characterized in that: it completes as follows:
(1) coating material
Select military project level, aerospace grade DJB-823 protective agent;
(2) assemble printed circuit board assembly, carry out normal temperature electric performance test, with water washer cleaning after test passes, ensure printed circuit board assembly clean surface;
(3) cleaned printed circuit board assembly is put into thermostatic drying chamber and carry out preheating, preheat temperature: 45 ~ 50 DEG C, warm-up time: 20 ~ 30min;
(4) DJB-823 protective agent solution is put into water-bath to heat to 50 ~ 60 DEG C, treat that solution is limpid for subsequent use;
(5) the DJB-823 protective agent clear solution after heating is loaded spray gun, adjustment spray gun air pressure is 0.2 ~ 0.4MPa, and first time sprays printed circuit board assembly while hot;
(6) printed circuit board assembly after first time spraying is at room temperature dried 10 ~ 20min;
(7) according to the requirement of step 5, second time spraying is done to printed circuit board assembly after drying 10 ~ 20min;
(8) printed circuit board assembly after second time spraying is at room temperature dried 10 ~ 20min, putting into temperature is that 45 ~ 50 DEG C of thermostatic drying chambers are dry, and drying time is 120 ~ 150min;
(9) check film should evenly, clean, almost without current mark, nothing accumulation;
(10) carry out normal temperature electric performance test to the printed circuit board assembly be up to the standards, the printed circuit board assembly after test passes enters downstream;
(11) printed circuit board assembly after, electric performance test is qualified carries out humid heat test: temperature 30 ~ 60 DEG C, 95%, five test periods of relative humidity;
(12) mould test is carried out to printed circuit board assembly: be 30 DEG C ± 1 DEG C in temperature, spray mycotic spore suspension, duration of test runs 28 cycle under relative humidity 95% ± 5% condition;
(13) carry out salt mist test to printed circuit board assembly: test temperature is 35 DEG C ± 2 DEG C, carrying out 24h with 5% ± 1% salting liquid, to spray salt fog and 24h dry, and this two states hockets common 96h;
(14) by being qualified products after damp and hot, mould, salt mist test inspection.
The present invention's beneficial effect is compared with prior art
Should based on 823 protectant coating processes, in strict accordance with (1) ~ (14) processing step, by first time spraying, due to continuity and the uniformity of gun spraying, can be formed evenly on coated printed circuit board assembly surface, consistent overlay, by second time spraying, the pin hole of the coat surface appearance that bubble causes is produced because protective agent volatilizees when covering coating for the first time, significantly enhance the barrier propterty of printed circuit board assembly, thoroughly avoid in conventional brush painting process because hairbrush and printed board friction produce electrostatic, thus the printed circuit board assembly of damage to electrostatic sensitive.Also solve the surface flow marks that brush mark remains, dip-coating causes or accumulation of brushing and producing simultaneously, and infiltrate the component wear caused because of solvent.Greatly strengthen " three prevent " performance to damp and hot, mould, salt fog; coating quality is high; protection effect is good; solve existing dip-coating, brushing method well easily at the remaining current mark of coating surface, brush mark; protective agent solution easily infiltrates in element or friction produces electrostatic; have a strong impact on coating quality, lesion element, cause the problem of " three prevent " weak effect.
Embodiment
1, a kind of based on 823 protectant coating processes, it is characterized in that: it completes as follows:
(1) coating material
Select military project level, aerospace grade DJB-823 protective agent;
(2) assemble printed circuit board assembly, carry out normal temperature electric performance test, with water washer cleaning after test passes, ensure printed circuit board assembly clean surface;
(3) cleaned printed circuit board assembly is put into thermostatic drying chamber and carry out preheating, preheat temperature: 45 ~ 50 DEG C, warm-up time: 20 ~ 30min;
(4) DJB-823 protective agent solution is put into water-bath to heat to 50 ~ 60 DEG C, treat that solution is limpid for subsequent use;
(5) the DJB-823 protective agent clear solution after heating is loaded spray gun, adjustment spray gun air pressure is 0.2 ~ 0.4MPa, and first time sprays printed circuit board assembly while hot;
(6) printed circuit board assembly after first time spraying is at room temperature dried 10 ~ 20min;
(7) according to the requirement of step 5, second time spraying is done to printed circuit board assembly after drying 10 ~ 20min;
(8) printed circuit board assembly after second time spraying is at room temperature dried 10 ~ 20min, putting into temperature is that 45 ~ 50 DEG C of thermostatic drying chambers are dry, and drying time is 120 ~ 150min;
(9) check film should evenly, clean, almost without current mark, nothing accumulation;
(10) carry out normal temperature electric performance test to the printed circuit board assembly be up to the standards, the printed circuit board assembly after test passes enters downstream;
(11) printed circuit board assembly after electric performance test is qualified carries out humid heat test: temperature 30 ~ 60 DEG C, 95%, five test periods of relative humidity;
(12) mould test is carried out to printed circuit board assembly: be 30 DEG C ± 1 DEG C in temperature, spray mycotic spore suspension, duration of test runs 28 cycle under relative humidity 95% ± 5% condition;
(13) carry out salt mist test to printed circuit board assembly: test temperature is 35 DEG C ± 2 DEG C, carrying out 24h with 5% ± 1% salting liquid, to spray salt fog and 24h dry, and this two states hockets common 96h;
(14) by being qualified products after damp and hot, mould, salt mist test inspection.
DJB-823 protective agent can produce a large amount of bubble in coating volatilization process, and these bubbles can form a large amount of pin hole on overlay surface, easily cause moisture to enter element body, have a strong impact on protection effect.Adopt present invention process flow process, by second time spraying, cover the pin hole on first time overlay surface, effectively improve protection effect.Regulate nozzle according to the size and shape of coated before spraying, make it form the suitable spraying of sector size.Adopt spray gun spraying, due to continuity and the uniformity of gun spraying, even, consistent overlay can be formed on coated surface, due to hairbrush and the fricative electrostatic of printed board in thorough solution conventional brush painting process, damage the printed circuit board assembly to electrostatic sensitive; And dip coating process is easily piled up at printed circuit board assembly remained on surface current mark or formation solvent and is caused " three prevent " poor performance, shortens the useful life of printed circuit board assembly.
Adopt present invention process, must operate in strict accordance with (1) ~ (14) step, during spraying, spray gun runs and wants steady, spray coverage linking is wanted evenly, spray gun pressure must adjust between 0.2 ~ 0.4MPa.
A kind of technical parameter based on 823 protectant coating processes is as follows:
Ocular estimate
According to the printed circuit board assembly after coated technique spraying DJB-823 protective agent of the present invention under normal temperature, humidity, mould and salt fog state, its surface color, gloss and tack are without significant change.
Coating layer thickness, adhesive force, insulation resistance (table one)
Electrical property (table two)
" three prevent " effect:
After printed circuit board assembly spraying DJB-823 protective agent, stable performance under damp and hot, mould and salt fog situation, printed conductor and base material are corrosion-free without variable color, metalwork.Maintainability:
Can directly melt with flatiron, easy to maintenance.
Embodiment
Certain dual-use product---radio circuit printed board assembly, voicefrequency circuit printed board assembly, high-current supply circuit printing plate assembly etc. are all according to the present invention---is based on after coating processes (1) ~ (14) step spraying of 823 coating, through " humid heat test ", " mould test " and " salt mist test " inspection, the technical parameter of radio circuit printed board assembly, voicefrequency circuit printed board assembly, high-current supply circuit printing plate assembly all can meet requirement listed by table one, table two.Under how damp and hot, many moulds, many salt mist environments conditions such as coastal, island all can long-term, stable, normally work.
The above is the embodiment of this invention, above-mentioned illustrating is not construed as limiting flesh and blood of the present invention, person of an ordinary skill in the technical field can make an amendment above-mentioned embodiment or be out of shape after having read this specification, and does not deviate from the spirit and scope of the invention.
Claims (1)
1., based on 823 protectant coating processes, it is characterized in that: it completes as follows:
(1) coating material
Select military project level, aerospace grade DJB-823 protective agent;
(2) assemble printed circuit board assembly, carry out normal temperature electric performance test, with water washer cleaning after test passes, ensure printed circuit board assembly clean surface;
(3) cleaned printed circuit board assembly is put into thermostatic drying chamber and carry out preheating, preheat temperature: 45 ~ 50 DEG C, warm-up time: 20 ~ 30min;
(4) DJB-823 protective agent solution is put into water-bath to heat to 50 ~ 60 DEG C, treat that solution is limpid for subsequent use;
(5) the DJB-823 protective agent clear solution after heating is loaded spray gun, adjustment spray gun air pressure is 0.2 ~ 0.4MPa, and first time sprays printed circuit board assembly while hot;
(6) printed circuit board assembly after first time spraying is at room temperature dried 10 ~ 20min;
(7) according to the requirement of step (5), second time spraying is done to printed circuit board assembly after drying 10 ~ 20min;
(8) printed circuit board assembly after second time spraying is at room temperature dried 10 ~ 20min, putting into temperature is that 45 ~ 50 DEG C of thermostatic drying chambers are dry, and drying time is 120 ~ 150min;
(9) check film should evenly, clean, almost without current mark, nothing accumulation;
(10) carry out normal temperature electric performance test to the printed circuit board assembly be up to the standards, the printed circuit board assembly after test passes enters downstream;
(11) printed circuit board assembly after electric performance test is qualified carries out humid heat test: temperature 30 ~ 60 DEG C, 95%, five test periods of relative humidity;
(12) mould test is carried out to printed circuit board assembly: be 30 DEG C ± 1 DEG C in temperature, spray mycotic spore suspension, duration of test runs 28 cycle under relative humidity 95% ± 5% condition;
(13) carry out salt mist test to printed circuit board assembly: test temperature is 35 DEG C ± 2 DEG C, carrying out 24h with 5% ± 1% salting liquid, to spray salt fog and 24h dry, and this two states hockets common 96h;
(14) by being qualified products after damp and hot, mould, salt mist test inspection.
Priority Applications (1)
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CN201410586111.5A CN104270901A (en) | 2014-10-28 | 2014-10-28 | Coating process on basis of 823 protective agent |
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CN201410586111.5A CN104270901A (en) | 2014-10-28 | 2014-10-28 | Coating process on basis of 823 protective agent |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105355515A (en) * | 2015-11-12 | 2016-02-24 | 西安铁路信号有限责任公司 | Relay contact protective method |
CN111103017A (en) * | 2020-01-06 | 2020-05-05 | 西南电子技术研究所(中国电子科技集团公司第十研究所) | Method for rapidly verifying three-proofing coating performance of circuit board assembly |
CN111465209A (en) * | 2020-04-16 | 2020-07-28 | 四川九立微波有限公司 | Coating process for radio frequency circuit and radio frequency circuit |
CN112642676A (en) * | 2020-12-14 | 2021-04-13 | 北京航天微电科技有限公司 | Composite protection method for metal packaging device, obtained product and application |
CN113522708A (en) * | 2021-06-23 | 2021-10-22 | 上海大学 | Menthol-based reversible nondestructive sealing and protecting method for bronze ware |
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US20050281009A1 (en) * | 2004-06-17 | 2005-12-22 | Kokusan Denki Co., Ltd. | Electronic circuit unit for internal combustion engine |
CN2807441Y (en) * | 2005-05-24 | 2006-08-16 | 熊猫电子集团有限公司 | High-power switch assembly of wireless communication equipment power base and broad/narrow band conversion |
CN2836067Y (en) * | 2006-03-30 | 2006-11-08 | 邢建春 | High temperature-resistant, high damp-resistant, salt-resistant intelligent controller for LonWorks network |
CN101072473A (en) * | 2007-06-17 | 2007-11-14 | 成都市宇中梅科技有限责任公司 | Moisture-proof circuit board processing method and product |
CN102196674A (en) * | 2011-03-30 | 2011-09-21 | 苏州工业园区非而智能电器有限公司 | Electronic circuit board moistureproof process |
CN102995090A (en) * | 2012-11-27 | 2013-03-27 | 南京三乐电子信息产业集团有限公司 | Treatment method for improving surface protection performance of aluminum or aluminum alloy of electronic tube device |
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2014
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Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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US20050281009A1 (en) * | 2004-06-17 | 2005-12-22 | Kokusan Denki Co., Ltd. | Electronic circuit unit for internal combustion engine |
CN2807441Y (en) * | 2005-05-24 | 2006-08-16 | 熊猫电子集团有限公司 | High-power switch assembly of wireless communication equipment power base and broad/narrow band conversion |
CN2836067Y (en) * | 2006-03-30 | 2006-11-08 | 邢建春 | High temperature-resistant, high damp-resistant, salt-resistant intelligent controller for LonWorks network |
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CN102196674A (en) * | 2011-03-30 | 2011-09-21 | 苏州工业园区非而智能电器有限公司 | Electronic circuit board moistureproof process |
CN102995090A (en) * | 2012-11-27 | 2013-03-27 | 南京三乐电子信息产业集团有限公司 | Treatment method for improving surface protection performance of aluminum or aluminum alloy of electronic tube device |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105355515A (en) * | 2015-11-12 | 2016-02-24 | 西安铁路信号有限责任公司 | Relay contact protective method |
CN111103017A (en) * | 2020-01-06 | 2020-05-05 | 西南电子技术研究所(中国电子科技集团公司第十研究所) | Method for rapidly verifying three-proofing coating performance of circuit board assembly |
CN111465209A (en) * | 2020-04-16 | 2020-07-28 | 四川九立微波有限公司 | Coating process for radio frequency circuit and radio frequency circuit |
CN111465209B (en) * | 2020-04-16 | 2022-11-08 | 四川九立微波有限公司 | Coating process for radio frequency circuit and radio frequency circuit |
CN112642676A (en) * | 2020-12-14 | 2021-04-13 | 北京航天微电科技有限公司 | Composite protection method for metal packaging device, obtained product and application |
CN113522708A (en) * | 2021-06-23 | 2021-10-22 | 上海大学 | Menthol-based reversible nondestructive sealing and protecting method for bronze ware |
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Application publication date: 20150107 |