CN104261816A - Low dielectric constant microwave dielectric ceramic NaBi2Sb3O11 capable of being sintered at low temperatures - Google Patents

Low dielectric constant microwave dielectric ceramic NaBi2Sb3O11 capable of being sintered at low temperatures Download PDF

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Publication number
CN104261816A
CN104261816A CN201410501912.7A CN201410501912A CN104261816A CN 104261816 A CN104261816 A CN 104261816A CN 201410501912 A CN201410501912 A CN 201410501912A CN 104261816 A CN104261816 A CN 104261816A
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ceramic
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microwave
low
dielectric ceramic
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苏聪学
覃杏柳
韦珍海
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Guilin University of Technology
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Guilin University of Technology
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Abstract

The invention discloses a low dielectric constant microwave dielectric ceramic NaBi2Sb3O11 capable of being sintered at low temperatures and a preparation method of the ceramic. The preparation method comprises the following steps: (1) weighing and dosing original powder of Na2CO3, Bi2O3 and Sb2O5 with the purities which are over (99.9wt%) based on composition of NaBi2Sb3O11; (2) carrying out wet type ball-mill mixing on the raw material for 12 hours, wherein the ball-milling medium is distilled water, and pre-sintering for 6 hours in atmosphere at 850 DEG C after being dried; and (3) adding an adhesive into the power prepared by the step (2) and granulating, then compression-moulding, and finally sintering for 4 hours in atmosphere at 900-930 DEG C, wherein the adhesive is a 5% polyvinyl alcohol solution, the addition of polyvinyl alcohol accounts for 3% of total weight of the powder. The ceramic disclosed by the invention is well sintered at 900-930 DEG C, and the dielectric constant reaches 28.4-29.3, the quality factor Qf value reaches 59600-64200GHz, and the temperature coefficient of resonance frequency is small, so that the ceramic has extremely huge application value in industry.

Description

Low temperature sintering dielectric constant microwave dielectric ceramic NaBi 2sb 3o 11
Technical field
The present invention relates to dielectric ceramic material, dielectric ceramic material particularly relating to Ceramic Resonator and the microwave device such as wave filter used for the manufacture of microwave frequency and preparation method thereof.
Background technology
Microwave dielectric ceramic refers to and to be applied in microwave frequency band (mainly UHF and SHF frequency range) circuit as dielectric material and to complete the pottery of one or more functions, the components and parts such as resonator, wave filter, dielectric substrate and medium wave circuit are widely used as in modern communication, it is the key foundation material of modern communication technology, in portable mobile phone, automobile telephone, cordless telephone, telestar susceptor and military radar etc., there is very important application, in the miniaturization, integrated process of modern communication instrument, just playing increasing effect.
Be applied to the dielectric ceramic of microwave frequency band, the requirement of following dielectric characteristics should be met: (1) seriation DIELECTRIC CONSTANT ε rto adapt to the requirement of different frequency and different application occasion; (2) high quality factor q value or dielectric loss tan δ to reduce noise, general requirement Qf>=3000 GHz; (3) the temperature factor τ of resonant frequency ?little of as far as possible to ensure the thermostability that device has had, general requirement-10/ DEG C≤τ ?≤+10 ppm/ DEG C.From late 1930s, just someone attempts dielectric substance to be applied to microwave technology in the world, and prepares TiO 2microwave dielectric filter, but its temperature coefficient of resonance frequency τ ?too greatly cannot be practical.Since the seventies in last century, start the large-scale development to medium ceramic material, according to relative permittivity ε rsize from use frequency range different, usually the microwave-medium ceramics be developed and developing can be divided into 4 classes.
(1) ultralow dielectric microwave dielectric ceramic, main representative is Al 2o 3-TiO 2, Y 2baCuO 5, MgAl 2o 4and Mg 2siO 4deng, its ε r≤ 20, quality factor q × f>=50000GHz, τ ?≤ 10 ppm/ ° C.Be mainly used in microwave base plate and high-end microwave device.
(2) low ε rwith the microwave dielectric ceramic of high q-factor, mainly BaO-MgO-Ta 2o 5, BaO-ZnO-Ta 2o 5or BaO-MgO-Nb 2o 5, BaO-ZnO-Nb 2o 5system or the composite system MWDC material between them.Its ε r=25 ~ 30, Q=(1 ~ 2) × 10 4(under the GHz of f>=10), τ ?≈ 0.Be mainly used in the microwave communication equipments such as the direct broadcasting satellite of f >=8 GHz as dielectric resonance device.
(3) medium ε rwith the microwave dielectric ceramic of Q value, mainly with BaTi 4o 9, Ba 2ti 9o 20(Zr, Sn) TiO 4deng the MWDC material for base, its ε r=35 ~ 40, Q=(6 ~ 9) × 10 3(under f=3 ~-4GHz), τ ?≤ 5 ppm/ ° C.Be mainly used in microwave military radar in 4 ~ 8 GHz range of frequency and communication system as dielectric resonance device.
(4) high ε rand the microwave dielectric ceramic that Q value is lower, be mainly used in civilian mobile communcations system in 0.8 ~ 4GHz range of frequency, this is also the emphasis of microwave dielectric ceramic research.Since the eighties, the people such as Kolar, Kato in succession find and have studied perovskite-like tungsten bronze type BaO-Ln 2o 3-TiO 2series (Ln=La, Sm, Nd or Pr etc. are called for short BLT system), complex perovskite structure CaO-Li 2o-Ln 2o 3-TiO 2series, lead base series material, Ca 1-xln 2x/3tiO 3be contour ε rmicrowave dielectric ceramic, the wherein BaO-Nd of BLT system 2o 3-TiO 2material dielectric constant reaches 90, lead base series (Pb, Ca) ZrO 3specific inductivity reaches 105.
The sintering temperature of these material systems is generally higher than 1300 ° of C above, can not directly and the low melting point metal such as Ag and Cu burn formation laminated ceramic capacitor altogether.In recent years, along with LTCC Technology (Low Temperature Co-fired Ceramics, the requirement of development LTCC) and the development of microwave multilayer device, researchist both domestic and external has carried out exploring widely and studying to some low fever's system materials, mainly adopt devitrified glass or glassceramic composites system, because low melting glass has relatively high dielectric loss mutually, the existence of glassy phase substantially increases the dielectric loss of material.Therefore development is the emphasis of current research without the low fired microwave dielectric ceramic material of glassy phase.
Can in the process of low fired microwave dielectric ceramic materials in exploration and development of new, the material systems such as the Li based compound that intrinsic sintering temperature is low, Bi based compound, tungstate architecture compound and tellurate architecture compound get the attention and research, but due to three performance index (ε of microwave dielectric ceramic rwith Qf and τ ?) between be that the relation of mutually restriction is (see document: the restricting relation between microwave dielectric ceramic materials dielectric properties, Zhu Jianhua, Liang Fei, Wang little Hong, Lv Wenzhong, electronic component and material, phase March the 3rd in 2005), meet three performance requriementss and the single-phase microwave-medium ceramics of low temperature sintering is considerably less, mainly their temperature coefficient of resonance frequency is usually excessive or quality factor are on the low side and cannot production application.Current is the summary of experience drawn by great many of experiments to the research major part of microwave-medium ceramics, but complete theory is not had to set forth the relation of microtexture and dielectric properties, therefore, in theory also cannot predict its microwave dielectric property such as temperature coefficient of resonance frequency and quality factor from the composition of compound and structure, which greatly limits the development of low temperature co-fired technology and microwave multilayer device.Such as described in currently available technology can low-temperature sintering dielectric constant microwave dielectric ceramic usually because its temperature coefficient of resonance frequency is bigger than normal and high sintering temperature and cannot being applied in LTCC technology.Exploring can low-temperature sintering (sintering temperature is lower than 1000 ° of C) with exploitation, has near-zero resonance frequency temperature coefficient (τ simultaneously ?≈ 0) be that those skilled in the art thirst for solving always but are difficult to the difficult problem that succeeds all the time with the dielectric constant microwave dielectric ceramic of higher figure of merit (Q × f>=50000GHz).
Summary of the invention
The object of this invention is to provide and a kind of there is good thermostability and low-loss, simultaneously low temperature sintering dielectric constant microwave dielectric ceramic material and preparation method thereof.
The chemical constitution of microwave dielectric ceramic material of the present invention is NaBi 2sb 3o 11.
Preparation method's step of this microwave dielectric ceramic material is:
(1) be 99.9%(weight percent by purity) more than Na 2cO 3, Bi 2o 3and Sb 2o 5starting powder press NaBi 2sb 3o 11composition weigh batching.
(2) step (1) raw material wet ball-milling is mixed 12 hours, ball-milling medium is distilled water, pre-burning 6 hours in 850 DEG C of air atmosphere after oven dry.
(3) in the powder that step (2) is obtained, binding agent is added and after granulation, then compression moulding, finally in 900 ~ 930 DEG C of air atmosphere, sinter 4 hours; Described binding agent adopts mass concentration to be the polyvinyl alcohol solution of 5%, and polyvinyl alcohol addition accounts for 3% of powder total mass.
Pottery prepared by the present invention is good at 900 ~ 930 DEG C of sintering, and specific inductivity reaches 28.4 ~ 29.3, the temperature factor τ of its resonant frequency ?little, temperature stability is good; Quality factor q f value, up to 59600-64200GHz, can be widely used in the manufacture of the microwave devices such as various high-frequency reonsator and wave filter, can meet the technology needs of low temperature co-fired technology and microwave multilayer device, industrially have great using value.
Embodiment
Embodiment:
Table 1 shows 3 specific embodiments and microwave dielectric property thereof that form different sintering temperature of the present invention.Its preparation method is described above, carries out the evaluation of microwave dielectric property by cylindrical dielectric resonator method.
This pottery can be widely used in the manufacture of the microwave devices such as various medium substrates, can meet the technology needs of the system such as mobile communication and satellite communications.
Table 1:

Claims (1)

1. a low temperature sintering temperature-stable dielectric constant microwave dielectric ceramic, is characterized in that the chemical constitution of described microwave dielectric ceramic is: NaBi 2sb 3o 11;
Preparation method's concrete steps of described microwave-medium ceramics are:
(1) be 99.9%(weight percent by purity) more than Na 2cO 3, Bi 2o 3and Sb 2o 5starting powder press NaBi 2sb 3o 11composition weigh batching;
(2) step (1) raw material wet ball-milling is mixed 12 hours, ball-milling medium is distilled water, pre-burning 6 hours in 850 DEG C of air atmosphere after oven dry;
(3) in the powder that step (2) is obtained, binding agent is added and after granulation, then compression moulding, finally in 900 ~ 930 DEG C of air atmosphere, sinter 4 hours; Described binding agent adopts mass concentration to be the polyvinyl alcohol solution of 5%, and polyvinyl alcohol addition accounts for 3% of powder total mass.
CN201410501912.7A 2014-09-27 2014-09-27 Low dielectric constant microwave dielectric ceramic NaBi2Sb3O11 capable of being sintered at low temperatures Pending CN104261816A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104722309A (en) * 2015-03-06 2015-06-24 三峡大学 Visible-light-responded photocatalyst K2Ni2Sb8O23 and preparation method thereof
CN105272201A (en) * 2015-11-30 2016-01-27 桂林理工大学 Temperature-stable low-dielectric-constant micro dielectric ceramic Na3Bi5(PO4)6 and preparation method thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1631840A (en) * 2004-12-31 2005-06-29 清华大学 Low-temperature sintered sosoloid microwave dielectric ceramic material
JP2005314212A (en) * 2004-04-30 2005-11-10 Korea Inst Of Science & Technology Microwave dielectric ceramic composition for low-temperature firing and its manufacturing method
CN104058746A (en) * 2014-06-30 2014-09-24 桂林理工大学 Microwave dielectric ceramic LiNd2V3O11 allowing low-temperature sintering and preparation method thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005314212A (en) * 2004-04-30 2005-11-10 Korea Inst Of Science & Technology Microwave dielectric ceramic composition for low-temperature firing and its manufacturing method
CN1631840A (en) * 2004-12-31 2005-06-29 清华大学 Low-temperature sintered sosoloid microwave dielectric ceramic material
CN104058746A (en) * 2014-06-30 2014-09-24 桂林理工大学 Microwave dielectric ceramic LiNd2V3O11 allowing low-temperature sintering and preparation method thereof

Non-Patent Citations (1)

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Title
J.-C.CHAMPARNAUD-MESJARD ET AL.: "NaBi2Sb3O11: an ordered structure related to the cubic KSbO3 type", 《EUR.J.SOLID STATE INORG.CHEM.》, vol. 32, no. 5, 31 December 1995 (1995-12-31) *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104722309A (en) * 2015-03-06 2015-06-24 三峡大学 Visible-light-responded photocatalyst K2Ni2Sb8O23 and preparation method thereof
CN105272201A (en) * 2015-11-30 2016-01-27 桂林理工大学 Temperature-stable low-dielectric-constant micro dielectric ceramic Na3Bi5(PO4)6 and preparation method thereof

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Application publication date: 20150107