CN104253190A

CN104253190A - Encapsulation method of lighting-used LEDs

Info

Publication number: CN104253190A
Application number: CN201310262670.6A
Authority: CN
Inventors: 凌敬平
Original assignee: Individual
Current assignee: Individual
Priority date: 2013-06-27
Filing date: 2013-06-27
Publication date: 2014-12-31

Abstract

The invention provides an encapsulation method of lighting-used LEDs and belongs to the LED production technical field. The encapsulation method of the lighting-used LEDs includes the following steps that: (1) LED chips are integrated on a substrate, so that a COB light source module can be formed; and (2) an LED module encapsulated by the COB light source module is provided with a plurality of chips on a bottom plate, and a distributed constant current technology is adopted, and after blue chips are installed, wiring can be realized through lead bonding, and the blue chips are coated with a phosphor material, so that white LEDs can be formed through encapsulation. According to the encapsulation method of the lighting-used LEDs of the invention, the method includes the steps of the COB light source module formation step and the LED lamp formation step, and therefore, time and labor can be saved, and device encapsulation cost can be decreased; and the plurality of chips are adopted, so that brightness can be improved, and the realization of optimal allocation of the LED chips can be facilitated, and the input current quantity of single LED chips can be decreased, so that high efficiency can be ensured.

Description

The method for packing of illuminating LED

Technical field

The invention belongs to LED manufacture technology field, particularly relate to a kind of method for packing of illuminating LED.

Background technology

Illumination is exactly provide light for mankind's eye perceives world and identification object.The sun is the optimal illumination light source of natural cheapness, solar light irradiation less than place, human needs is thrown light on by artificial light source.The mankind, to the use of lighting source, experienced by from the simple light source such as candle, oil lamp, gas lamp, to the incandescent lamp of Edison invented, then to electric light sources such as fluorescent lamp, Halogen lamp LED, high-pressure sodium lamp, metal halogen lamp, three-color fluorescent lamps.The appearance of electric light sources, while bring more and more light to the world, also brings the problem of increasing energy-conserving and environment-protective aspect.In the later stage the 90's of 20th century, the appearance of white light LEDs, makes the solid-state illumination of energy-conserving and environment-protective become possibility.

The ligthing paraphernalia being light source with light-emitting diode (LED) relies on low in energy consumption, that the life-span is long feature to start gradually commercially to permeate.Wherein, the bulb type LED illumination being intended to the conventional bulb such as alternative incandescent lamp bulb, bulb type fluorescence lamp receives much concern recently especially.Because the unit interval price of the bulb calculated according to the LED life-span is suitable with conventional bulb, so, be expected to accelerate to popularize in average family.

Summary of the invention

The invention provides a kind of method for packing of illuminating LED.The method for packing of illuminating LED of the present invention, is realized by following technical proposals:

(1) LED integrated chip is made COB light source module on substrate;

(2) LED module of COB light source module encapsulation installs many pieces of LED chips, distributed constant current technology on base plate, after installing blue chip, forms wiring, be then coated with fluorescent material, be encapsulated as White LED by wire bonding.

Adopt the method for packing of illuminating LED of the present invention, by the route of " COB light source module → LED light fixture ", not only saving of work and time, and the cost that device package can be saved; Use many pieces of chips to improve brightness, also contribute to the best configuration realizing LED chip, reduce the input current amount of single led chip to guarantee high efficiency.

Embodiment

Below by specific embodiment, the present invention is further illustrated.

LED has energy-efficient, environmental protection, long service life, fast response time, safe and reliable and use the distinguishing features such as flexible, and extensively being approved by the public, is the revolutionary lighting source of forth generation after kerosene lamp, incandescent lamp, gaseous discharge lamp.Come out the time of four more than ten years so far from first LED in 1962, the encapsulation form of LED there occurs differentiation repeatedly.Encapsulate from the glass bulb in the 60's, to the epoxy encapsulation in the 70's, to the four pin Piranha encapsulation of middle and later periods in the 90's, SMD SMD encapsulates, illumination encapsulates, chip integrated COB encapsulates.That applies at semiconductor lighting along with illuminating LED deepens continuously, and its encapsulation form there occurs change repeatedly at short several Nian Liyi.

The comparison light-source encapsulation form of the main performance index of various lighting source, under the prerequisite of guaranteed performance reduce encapsulation, one, Development of Novel LED light-source encapsulation form, reducing the change each time of encapsulation, application cost LED encapsulation form under the prerequisite of guaranteed performance, is all make because of the difference of its application demand.Will the LED light source moving towards following illumination be what kind of? can existing LED encapsulation move towards illumination? answer this problem, the demand of semiconductor lighting to LED light source must be understood.

From the performance index of present stage, LED has tentatively possessed the ability entering lighting field.Although current performance advantage is also not obvious, along with the hasty breaching of extension, chip technology and the continuous progress of encapsulation technology, LED will be much better than the performance of conventional light source as the performance of lighting source, and this prospect can be expected.LED light source will enter lighting field, and the quality of performance is prerequisite, and the height of cost is only real decisive factor.At the initial stage of semiconductor lighting development, it is necessary for putting forth effort on and pursuing performance; Develop into certain phase at semiconductor lighting, we should by diversion to how significantly to reduce costs under the prerequisite of guaranteed performance.Because what we will do is not the art work that petty bourgeoisies are appreciated, but all receptible staple commodities of ordinary populace.The height of finished product decides LED as the height of light source to lighting field permeability.The reduction of merchandise cost, generally has following approach: material cost declining--existing product scheme Shang Ya supplier material valency, reduce material rate or select substitution material, the most effectively, but limited extent, and there is certain quality risk; Technology cost declining--adopt technical strategies, change existing product scheme, reduce materials and manufacture link, amplitude is objective; Efficiency cost declining--depend on the progress of technology, facilities and administration.Reduce the cost of LED light source, above approach all will be considered, but overriding concern is how in response to the feature of semiconductor lighting, and the constraint of the encapsulation idea that breaks traditions, reduces the packaging cost of LED with new technical scheme.For traditional lighting, be all generally the pattern adopting " light source+light fixture ", the manufacture of light source is relatively independent of light fixture.Due to LED light source have volume little, send out high light and be easy to control, therefore generally can make according to the requirement of illuminating effect in the application and change flexibly and select.For semiconductor lighting, the manufacture of light source and light fixture does not have obvious boundary, and the reduction of LED light source cost should be considered with the requirement entirety of illuminator.Therefore, the encapsulation scheme of LED light source should require according to the drive circuit of illuminator, thermal management, optical design and structural design etc. and make, object is exactly the LED light-source encapsulation form of Development of Novel, under the prerequisite ensureing overall performance, significantly reduce encapsulation and application cost.Two, integrated chip COB light source module personalization encapsulation may become the following main flow packing forms of semiconductor lighting.LED has discrete and integrated two kinds of packing forms.LED discrete device belongs to conventional package, is widely used in the field that each is relevant, through the development of four more than ten years, has defined a series of main product form.Integrated chip COB module belongs to personalized encapsulation at present, is mainly the application product of some cases and designs and produce, and not yet forms main product form.Traditional LED light fixture way is: LED point of source discrete device → MCPCB light source module → LED light fixture, the way mainly taked owing to not having ready-made suitable core light source component, not only work consuming is time-consuming, and cost is higher.In fact, " LED light source discrete device → MCPCB light source module " can unite two into one by we, directly LED integrated chip is made COB light source module on MCPCB (or other substrate), walk the route of " COB light source module → LED light fixture ", not only saving of work and time, and the cost that device package can be saved.

Compared with discrete LED device, COB light source module can save the packaging cost of LED, photo engine module cost of manufacture and secondary light-distribution cost in illumination applications.In the lighting lamp system of identical function, actual measuring and calculating can reduce the light source cost of about 30%, and this application for semiconductor lighting has very great meaning.In performance, by reasonably designing and lenticule model, the drawback such as some light, dazzle etc. that COB light source module can avoid discrete light sources combination of devices to exist effectively; By adding suitable red chip combination, under not obvious reduction source efficiency and the prerequisite in life-span, can also effectively improve the color rendering (can accomplish more than 90 at present) of light source.In application, it is simpler and convenient that COB light source module can make the installation of lighting factory produce, and significantly reduces application cost.In production, existing technology and equipment can support the extensive manufacture of the COB light source module of rate of good quality rate completely.Along with the expansion of LED illumination market, light fixture demand is in quick growth, and we according to the demand of different lamps application, can progressively form serial COB light source module main product, so that large-scale production completely.Three, miniaturized patch formula LED also by be LED light source other one large main product except the main flow packing forms that the COB light source module of integrated chip likely becomes following semiconductor lighting, high-performance, low cost, be convenient to the other one large main product that large-scale production manufacture and the miniaturized patch formula LED that installs application also will be LED light source.

The main forms of future semiconductor illumination is: flat illumination--office space or back lighting; Banded illumination--decorative lighting; Lamp lighting--substitute traditional lighting.In flat illumination product, the COB light source module of integrated chip and the application of adopting surface mounted LED are incited somebody to action and deposit; In banded illuminating product, adopting surface mounted LED is by leading; In lamp lighting product, the application of the COB light source module of integrated chip will become main flow.In a word, the LED light source moving towards to throw light on is by large for formation two main flow form--and the miniaturized LED device of integrated chip COB light source module volume of functionalization, low cost will be eternal theme.Who can take the lead in breaking traditions the constraint of encapsulation, develops the LED light source meeting semiconductor lighting demand, and who just can account for obtain the first chance of product; Cost can be accomplished ultimate attainment by who under the prerequisite of guaranteed performance, and who just can hold the market of following LED light source.

Following main stream light sources of throwing light on adopts COB(chip on board) package specific White LED module, distributed constant current technology, continue to optimize " LED constant current driving+light source " total solution, continue the light efficiency promoting LED module, the miniaturization of Switching Power Supply, the sealing of Continuous optimization heat dissipation design and raising LED module improves heat radiation.The LED module of COB encapsulation has installed many pieces of LED chips, distributed constant current technology on base plate, after installing blue chip, forms wiring, be then coated with fluorescent material, be encapsulated as White LED by wire bonding.Use many pieces of chips to improve brightness, also contribute to the best configuration realizing LED chip, reduce the input current amount of single led chip to guarantee high efficiency.And can be calculated less than 90% by power circuit power conversion efficiency, the luminous efficiency of the White LED module monomer of COB encapsulation is 103 ~ 105lm/W.If existing illumination is all changed as LED illumination, illumination power consumption is expected to reduce about half.

Claims

1. a method for packing for illuminating LED, is characterized in that comprising the following steps:

(1) LED integrated chip is made COB light source module on substrate;