CN104252090A - Camera module group - Google Patents

Camera module group Download PDF

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Publication number
CN104252090A
CN104252090A CN201310260211.4A CN201310260211A CN104252090A CN 104252090 A CN104252090 A CN 104252090A CN 201310260211 A CN201310260211 A CN 201310260211A CN 104252090 A CN104252090 A CN 104252090A
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CN
China
Prior art keywords
brace
camera module
image sensor
conducting resinl
bend
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Application number
CN201310260211.4A
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Chinese (zh)
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CN104252090B (en
Inventor
栾静恩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHENZHEN SAIYIFA MICROELECTRONICS CO Ltd
STMicroelectronics Shenzhen Manufacturing Co Ltd
STMicroelectronics Shenzhen R&D Co Ltd
Original Assignee
SHENZHEN SAIYIFA MICROELECTRONICS CO Ltd
STMicroelectronics Shenzhen Manufacturing Co Ltd
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Application filed by SHENZHEN SAIYIFA MICROELECTRONICS CO Ltd, STMicroelectronics Shenzhen Manufacturing Co Ltd filed Critical SHENZHEN SAIYIFA MICROELECTRONICS CO Ltd
Priority to CN201310260211.4A priority Critical patent/CN104252090B/en
Publication of CN104252090A publication Critical patent/CN104252090A/en
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Abstract

Disclosed in the invention is a camera module group comprising a lens, an image sensor, an actuator, and connecting plates. The image sensor that is arranged below the lens and is coupled with lens optically includes connecting pads. The actuator is fixed outside the lens. One side of each connecting plate is connected with the actuator and the other side is connected to the connecting pad of the image sensor. The camera module group is characterized in that each onnecting plate at least includes a bending portion that is located at one side where the connecting plate and the image sensor are connected.

Description

A kind of camera module
Technical field
The present invention relates to camera field, and in particular to a kind of camera module.
Background technology
Along with the development of optical image technology, camera module is widely used in various imaging device is as digital camera, video camera, specifically can be published in IEEE Transactions on Pattern Analysisand Machine Intelligence see people such as Rahul Swaminathan, Vol.22, document Nonmetriccalibration of wide-angle lenses and polycameras in No.10, October 2000.
Along with digital camera technology development, the fuselage of camera is often both little and light, easily because the vibrations in capture process cause light to correspond to the skew of the image space on camera module, and then causes filmed image fuzzy.Current anti-shake method is mainly divided into electronic type and optical profile type, wherein better with optical anti-shake effect.Optical anti-shake then can be divided into two kinds traditionally: one is that camera lens is shockproof, that is, according to vibrations direction and the degree of camera, the position of corresponding adjustment camera lens and angle, make compensation, makes light path keep stable; One is that image device is shockproof, that is, after perception camera shake, image sensor initiatively makes reverse movement, keeps image stabilization.No matter be that camera lens is shockproof or image device is shockproof, all need, actuator is set in camera module and moves that vibrations are compensated to drive camera lens or image sensor.
Auto-focusing use made by the existing actuator for camera module more, namely for driving camera lens module or image sensor to move along the optical axis direction of camera module.Such as, conventional voice coil motor comprises fixing fitted tube, movable accommodating cylinder, coil, magnet and brace.Described movable accommodating cylinder is coaxially arranged in fixing fitted tube, and drives it to be subjected to displacement for accommodating camera lens module or image sensor.Described coil and magnet are relatively arranged between fixing fitted tube and movable accommodating cylinder, for providing driving force.Described brace is used for the elastic-restoring force providing the optical axis direction along camera module to movable accommodating cylinder.
Fig. 1 shows the structural representation of the camera module according to prior art.Particularly, described camera module comprises camera lens 100, image sensor 200, actuator 300 and brace 400.More specifically, as shown in Figure 1, image sensor 200 is positioned at the below of camera lens 100, and with camera lens 100 optical coupled.Actuator 300 is fixed on the outside of camera lens 100.The side of brace 400 connects actuator 300, and opposite side is connected to image sensor 200.Wherein, image sensor 200 also comprises connection gasket 201, and brace 400 is vertically connected on the connection gasket 201 of image sensor 200.Preferably, brace 400 is made up of elastic metallic material.Actuator 300 is electrically connected with image sensor 200 by brace 400.Wherein, preferably, brace 400 is electrically connected by conducting resinl with image sensor 200.Or in a change case, brace 400 and image sensor 200 are weldingly connected.In use, because thermal and mechanical stress concentrates on the junction of conducting resinl, therefore easily there is fracture in the brace of junction, and then cause resistance to become the problems such as large or the complete open circuit of circuit.
Summary of the invention
For defect of the prior art, the object of this invention is to provide a kind of camera module.
There is provided a kind of camera module according to an aspect of the present invention, it comprises: camera lens; Image sensor, described image sensor is positioned at the below of described camera lens, and is coupled with described lens optical, and it also comprises connection gasket; Actuator, described actuator is fixed on the outside of described camera lens; Brace, the side of described brace connects described actuator, and opposite side is connected to the connection gasket of described image sensor; It is characterized in that, described brace at least comprises a bend, the side that described crooked position is connected in described brace with described image sensor.
Preferably, be connected between described brace with described connection gasket by conducting resinl, described conducting resinl is applied to the junction of described brace and described connection gasket.
Preferably, be welded to connect between described brace and described connection gasket.
Preferably, described crooked position is in the top of described conducting resinl.
Preferably, at least one described bend contacts with described conducting resinl.
Preferably, the cross section of described bend is a trapezoidal wave.
Preferably, the cross section of described bend is a square wave.
Preferably, the cross section of described bend is a sine wave.
Preferably, described camera module also comprises: conductive component, and described conductive component is connected between described conducting resinl and described connection gasket, and described conducting resinl is all positioned within described conductive component.
Preferably, described conductive component and described connection gasket are weldingly connected.
The present invention is by providing a kind of camera module, and it arranges a bend by the junction be connected with conducting resinl on brace, and this bend makes brace strengthen the stress ability to bear of the junction be connected with conducting resinl, prevents from rupturing herein.
Accompanying drawing explanation
By reading the detailed description done non-limiting example with reference to the following drawings, other features, objects and advantages of the present invention will become more obvious:
Fig. 1 illustrates the structural representation of the camera module according to prior art;
Fig. 2 illustrates the vertical section structure schematic diagram of brace according to the first embodiment of the present invention and image sensor junction;
Fig. 3 illustrates the vertical section structure schematic diagram of brace according to a second embodiment of the present invention and image sensor junction;
Fig. 4 illustrates the vertical section structure schematic diagram of brace according to the third embodiment of the invention and image sensor junction;
Fig. 5 illustrates the vertical section structure schematic diagram of brace according to a fourth embodiment of the invention and image sensor junction; And
Fig. 6 illustrates the vertical section structure schematic diagram of brace according to a fifth embodiment of the invention and image sensor junction.
Embodiment
Below in conjunction with drawings and Examples, technology contents of the present invention is described further:
Fig. 2 shows the vertical section structure schematic diagram of brace according to the first embodiment of the present invention and image sensor junction.Particularly, with prior art shown in Fig. 1 unlike, brace 400 at least comprises at least one bend 401, and bend 401 is positioned at the side that brace 400 is connected with image sensor 200.More specifically, as shown in Figure 2, brace 400 is connected on the connection gasket 201 of image sensor 200 by conducting resinl 500.Wherein, conducting resinl 500 is applied to the junction of brace 400 and connection gasket 201.Bend 401 is positioned at the top of conducting resinl 500.Further, in the embodiment depicted in figure 2, the cross section of bend 401 is a trapezoidal wave.Bend 401 makes brace 400 can bear the stress in all directions of itself and connection gasket 201 junction and not rupture.
Further, in some change case, brace 400 also can comprise multiple bend 401.Such as, in a change case, brace 400 can comprise two bends, 401, two bends 401 and be connected, form two trapezoidal waves.Or in another change case, brace 400 can comprise three bends, 401, three bends 401 and be connected, form three trapezoidal waves.It will be appreciated by those skilled in the art that these change case all can be achieved, it will not go into details herein.
Fig. 3 shows the vertical section structure schematic diagram of brace according to a second embodiment of the present invention and image sensor junction.Fig. 3 can be understood as a change case of above-mentioned Fig. 2.Particularly, with above-mentioned embodiment illustrated in fig. 2 unlike, at least one bend 401 ' contacts with conducting resinl 500.And the cross section of bend 401 ' is a sine wave.In this embodiment, cross section is that the bottom of the sine waveform of sinusoidal wave bend 401 ' is arranged in conducting resinl 500.Which increase the contact area between brace 400 and conducting resinl 500, and then strengthen the reliability of brace 400, not easily rupture.
Further, with above-mentioned similarly embodiment illustrated in fig. 2, in some change case, brace 400 also can comprise multiple bend 401 '.Such as, in a change case, brace 400 can comprise two bends, 401 ', two bends 401 ' and be connected, form two sine waves.Or in another change case, brace 400 can comprise three bends, 401 ', three bends 401 ' and be connected, form three sine waves.It will be appreciated by those skilled in the art that these change case all can be achieved, it will not go into details herein.
Fig. 4 shows the vertical section structure schematic diagram of brace according to the third embodiment of the invention and image sensor junction.Fig. 4 can be understood as a change case of above-mentioned Fig. 3.Particularly, with embodiment illustrated in fig. 3 similar, bend 401 " bottom contact with conducting resinl 500.And with above-mentioned embodiment illustrated in fig. 3 unlike, and bend 401 " cross section be a square wave.In this embodiment, cross section is the bend 401 of square wave " the bottom of square-wave waveform contact with conducting resinl 500.Which increase the contact area between brace 400 and conducting resinl 500, and then strengthen the reliability of brace 400, not easily rupture.
Further, with above-mentioned Fig. 2 or similarly embodiment illustrated in fig. 3, in some change case, brace 400 also can comprise multiple bend 401 ".Such as, in a change case, brace 400 can comprise two bends 401 ", two bends 401 " be connected, form two square waves.Or in another change case, brace 400 can comprise three bends 401 ", three bends 401 " be connected, form three square waves.It will be appreciated by those skilled in the art that these change case all can be achieved, it will not go into details herein.
Fig. 5 shows the vertical section structure schematic diagram of brace according to a fourth embodiment of the invention and image sensor junction.Fig. 5 can be understood as another change case of above-mentioned Fig. 3.Particularly, with above-mentioned embodiment illustrated in fig. 3 unlike, bend 401 " ' cross section be an irregular triangle.Wherein, bend 401 " ' bottom completely and conducting resinl 500 be affixed, to add the contact area between brace 400 and conducting resinl 500, the reliability of reinforced company's contact pin 400, makes it not easily rupture.
Fig. 6 shows the vertical section structure schematic diagram of brace according to a fifth embodiment of the invention and image sensor junction.Fig. 6 can be understood as a change case of above-mentioned Fig. 3.Particularly, described camera module also comprises conductive component 600.Conductive component 600 is between conducting resinl 500 and connection gasket 201, and wherein, conducting resinl 500 is all positioned within conductive part 600, prevents conducting resinl 500 from overflowing conductive component 600, and also can promote the height of conducting resinl 500.More specifically, as shown in Figure 6, preferably, conductive component 600 is a grooved, and it can be connected on connection gasket 201 in advance.Preferably, conductive component 600 and connection gasket 201 are by being weldingly connected, and it will not go into details herein.
More further, it will be appreciated by those skilled in the art that and the invention provides a kind of camera module, it arranges a bend by the junction be connected with conducting resinl on brace, this bend makes brace strengthen the stress ability to bear of the junction be connected with conducting resinl, prevents from rupturing herein.
Although the present invention with preferred embodiment disclose as above, but itself and be not used to limit the present invention.Those skilled in the art, without departing from the spirit and scope of the present invention, when doing various changes and amendment.Therefore, the scope that protection scope of the present invention ought define depending on claims is as the criterion.

Claims (10)

1. a camera module, it comprises:
Camera lens;
Image sensor, described image sensor is positioned at the below of described camera lens, and is coupled with described lens optical, and it also comprises connection gasket;
Actuator, described actuator is fixed on the outside of described camera lens;
Brace, the side of described brace connects described actuator, and opposite side is connected to the connection gasket of described image sensor;
It is characterized in that, described brace at least comprises a bend, the side that described crooked position is connected in described brace with described image sensor.
2. camera module according to claim 1, is characterized in that, is connected between described brace with described connection gasket by conducting resinl, and described conducting resinl is applied to the junction of described brace and described connection gasket.
3. camera module according to claim 1, is characterized in that, is welded to connect between described brace and described connection gasket.
4. camera module according to claim 2, is characterized in that, described crooked position is in the top of described conducting resinl.
5. camera module according to claim 2, is characterized in that, at least one described bend contacts with described conducting resinl.
6. camera module according to claim 1, is characterized in that, the cross section of described bend is a trapezoidal wave.
7. camera module according to claim 1, is characterized in that, the cross section of described bend is a square wave.
8. camera module according to claim 1, is characterized in that, the cross section of described bend is a sine wave.
9. camera module according to claim 2, is characterized in that, described camera module also comprises:
Conductive component, described conductive component is connected between described conducting resinl and described connection gasket, and described conducting resinl is all positioned within described conductive component.
10. camera module according to claim 9, is characterized in that, described conductive component and described connection gasket are weldingly connected.
CN201310260211.4A 2013-06-26 2013-06-26 A kind of camera module Active CN104252090B (en)

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CN104252090B CN104252090B (en) 2017-11-03

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Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1039351A (en) * 1996-07-26 1998-02-13 Nikon Corp Lens supporting mechanism and shake correcting camera
KR100576156B1 (en) * 2003-10-22 2006-05-03 삼성전자주식회사 Semiconductor device formed dam and mounting structure of the semiconductor device
CN1773319A (en) * 2004-11-11 2006-05-17 鸿富锦精密工业(深圳)有限公司 Lens module with function of lowering stray light
KR20090004189A (en) * 2007-07-06 2009-01-12 엘지이노텍 주식회사 Camera module
KR20090016860A (en) * 2007-08-13 2009-02-18 엘지이노텍 주식회사 Camera module
CN101808191A (en) * 2009-02-16 2010-08-18 鸿富锦精密工业(深圳)有限公司 Shockproof camera module
CN101990755A (en) * 2008-05-14 2011-03-23 Hysonic株式公司 Photography device with anti-shake function
US20120326200A1 (en) * 2011-06-22 2012-12-27 Advanced Optoelectronic Technology, Inc. Flip-chip light emitting diode and method for making the same
WO2013027927A2 (en) * 2011-08-19 2013-02-28 (주)하이소닉 Wire spring coupling structure of image stabilization apparatus for camera
CN203337979U (en) * 2013-06-26 2013-12-11 深圳赛意法微电子有限公司 Camera module

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1039351A (en) * 1996-07-26 1998-02-13 Nikon Corp Lens supporting mechanism and shake correcting camera
KR100576156B1 (en) * 2003-10-22 2006-05-03 삼성전자주식회사 Semiconductor device formed dam and mounting structure of the semiconductor device
CN1773319A (en) * 2004-11-11 2006-05-17 鸿富锦精密工业(深圳)有限公司 Lens module with function of lowering stray light
KR20090004189A (en) * 2007-07-06 2009-01-12 엘지이노텍 주식회사 Camera module
KR20090016860A (en) * 2007-08-13 2009-02-18 엘지이노텍 주식회사 Camera module
CN101990755A (en) * 2008-05-14 2011-03-23 Hysonic株式公司 Photography device with anti-shake function
CN101808191A (en) * 2009-02-16 2010-08-18 鸿富锦精密工业(深圳)有限公司 Shockproof camera module
US20120326200A1 (en) * 2011-06-22 2012-12-27 Advanced Optoelectronic Technology, Inc. Flip-chip light emitting diode and method for making the same
WO2013027927A2 (en) * 2011-08-19 2013-02-28 (주)하이소닉 Wire spring coupling structure of image stabilization apparatus for camera
CN203337979U (en) * 2013-06-26 2013-12-11 深圳赛意法微电子有限公司 Camera module

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