CN104244650A - Anti-high-overload protection box for electronic circuits - Google Patents
Anti-high-overload protection box for electronic circuits Download PDFInfo
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- CN104244650A CN104244650A CN201410506906.0A CN201410506906A CN104244650A CN 104244650 A CN104244650 A CN 104244650A CN 201410506906 A CN201410506906 A CN 201410506906A CN 104244650 A CN104244650 A CN 104244650A
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- shell body
- cover plate
- metal shell
- inner metal
- protection box
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Abstract
The invention relates to an anti-high-overload protection box for electronic circuits, and belongs to the technical field of process equipment. The anti-high-overload protection box is mainly technically characterized by comprising an outer shell, an inner metal shell, an outer cover plate, an inner metal cover plate, pouring sealants, buffer materials, a circuit component board, buffer washers and fixing bolts. The circuit component board is arranged in the inner metal shell, the inner metal shell, the inner metal cover plate, the pouring sealants and the circuit component board are integrally packaged and solidified, a space between the outer shell and the inner metal shell is filled with the buffer materials, nickel is plated on the inner surface and the outer surface of the inner metal shell, the inner metal shell and the inner metal cover plate form a shielding body, and electrostatic shielding effects can be realized for circuit components in the protection box. The anti-high-overload protection box has the advantages of simple structure, wide application range, reliability in performance, low manufacturing cost and the like.
Description
Technical field
The present invention relates to a kind of electronic circuit anti high overload protection box, belong to equipment Technology field, can the field such as extensive use Yu Haiyang scientific investigation test, weapons, Aero-Space, automobile, anti high overload protection is carried out to the circuit element of electronic system in high overload situation.
Background technology
In the fields such as modern marine scientific investigation test, weapons, Aero-Space, a typical development trend based on the electronic system of microelectric technique realizes lightweight, miniaturization ensureing high-performance and high reliability while.Electronic system is in high-performance high reliability, and anti high overload is an important indicator directly weighing electronic system overall performance and reliability.Ocean scientific investigation test enter water overload, the launching over loading of weapons ammunition and aerospace transmitting/landings overload etc., the electronic system requiring it to carry must possess the anti high overload even superelevation ability of transshipping.
In background technology, domesticly in anti high overload, carry out extensive work, the approach of anti high overload also has multiple, but to be nearly all the requirement used conventional methods for specific product design for they, namely wiring board, card, line and framed structure thereof is adopted to reach the object of anti high overload by the practicality of binding buffer material, the outstanding defect that this conventional method exists is the while of meeting anti high overload object, limit the miniaturization of electronic system, lightness, constrain systematic function and reliability lifting, the interference of electrostatic screen anti-electromagnetic-radiation can not be realized.In order to overcome above-mentioned deficiency, we develop electronic circuit anti high overload protection box.
Summary of the invention
Technical problem to be solved by this invention to provide a kind of electronic circuit anti high overload to protect box, it passes through inner metal shell body, metal inner cover plate, casting glue, circuit element slab integral encapsulates and solidifies, cushion is filled between shell body and inner metal shell body, the surfaces externally and internally of inner metal shell body adopts Nickel Plating Treatment, the anti-high overload performance of protection box can be significantly improved, significantly reduce the volume size of protection box, inner metal shell body simultaneously, metal inner cover plate composition shield, electrostatic screen can be carried out to the circuit element in protection box, effectively reduce the electromagnetic interference of external environment condition to circuit element.
The technical scheme that the present invention solves the employing of its technical problem is: it comprises shell body, inner metal shell body, outer cover plate, metal inner cover plate, casting glue, cushion, circuit element plate, buffer gasket, set bolt,
Described shell body is the square box body structure of global formation,
Described inner metal shell body is the square box body structure that the global formation length of side is less than shell body,
The upper surface of shell body, inner metal shell body subtend sidewall is provided with multiple bolt apertures,
The bottom at inner 4 angles of inner metal shell body is provided with 4 bases, each base is provided with 1 bolt apertures,
Plating layer of metal nickel is electroplated according to technological requirement in the inside and outside surface of inner metal shell body,
Described outer cover plate is the square equal with the shell body length of side,
Outer cover plate is provided with the multiple countersunk screw holes corresponding to the multiple bolt apertures in shell body sidewall upper face,
Described metal inner cover plate is the square equal with the inner metal shell body length of side,
Metal inner cover plate is provided with the multiple countersunk screw holes corresponding to the multiple bolt apertures in inner metal shell body sidewall upper surface,
The thickness of metal inner cover plate is 0.5mm ~ 1.0mm,
The composition of described casting glue is epoxy resin, dibutyl phthalate, epoxy hardener, white carbon, and four kinds of raw materials configure according to a certain ratio at normal temperatures and form,
The material of described cushion is the mixture of foamed aluminium and felt,
Circuit element plate is loaded in inner metal shell body, and 4 set bolts are inserted in buffer gasket respectively, tightens 4 set bolts and circuit element plate is fixed on bolt apertures on inner 4 bases of inner metal shell body,
Casting glue adopts pouring type to fill inner metal shell body completely,
Metal inner cover plate mounts cover on inner metal shell body, and multiple sunk screw passes through the countersunk screw holes spinning of metal inner cover plate in the corresponding bolt apertures of inner metal shell body sidewall,
Tighten sunk screw, inner metal shell body, metal inner cover plate, sealing, circuit element plate form integral module, are sealed between inner metal shell body, metal inner cover plate by casting glue,
Inner metal shell body, metal inner cover plate form shield, carry out electrostatic screen to the circuit element in protection box,
The module of overall package is placed in vacuum environment, is cured at normal temperatures to casting glue,
Packaged module is placed in shell body,
Cushion is filled in space between shell body and inner metal shell body, metal inner cover plate and compacting by technological requirement,
Outer cover plate mounts cover on shell body, and multiple sunk screw passes through the countersunk screw holes spinning of outer cover plate in the corresponding bolt apertures of shell body sidewall, tightens sunk screw and forms protection box,
The shock resistance being packaged into overall protection box is high, avoids circuit element, connecting line to produce the relative changing of the relative positions under large overload effect.
The beneficial effect that the present invention is compared with the existing technology produced
1, inner housing and inner cover plate owing to protecting box adopt metal material, and the surfaces externally and internally of inner metal shell body is through Nickel Plating Treatment, and protection box inside, by casting glue package curing, significantly improves anti high overload and the anti-electromagnetic interference capability of protection box.
2, because inner metal shell body and metal inner cover plate are by casting glue overall package, make anti high overload protect the volume size of box significantly to reduce, be conducive to the miniaturization of system, lightness.
3, there is structure simple, applied range, the advantage such as dependable performance, low cost of manufacture.
Accompanying drawing explanation
Fig. 1 is the structural representation of electronic circuit anti high overload of the present invention protection box.
Fig. 2 be Fig. 1 China and foreign countries housing 1, inner metal shell body 2, cushion 6 P to vertical view.
Fig. 3 is the three-dimensional view of inner metal shell body 2 in Fig. 1.
Fig. 4 is the three-dimensional view of metal inner cover plate 4 in Fig. 1.
Embodiment
Below in conjunction with accompanying drawing, most preferred embodiment of the present invention is further described.
Referring to accompanying drawing 1,2, a kind of electronic circuit anti high overload protection box, it comprises shell body 1, inner metal shell body 2, outer cover plate 3, metal inner cover plate 4, casting glue 5, cushion 6, circuit element plate 7, buffer gasket 8, set bolt 9.
Shell body 1 is the square box body structure of global formation.
Inner metal shell body 2 is less than the square box body structure of shell body 1 for the global formation length of side.
The upper surface of shell body 1, inner metal shell body 2 subtend sidewall is provided with multiple bolt apertures 10.
The bottom at inner 4 angles of inner metal shell body 2 is provided with 4 bases 11, each base 11 is provided with 1 bolt apertures 10.
The inside and outside surface of inner metal shell body 2, according to technological requirement plating plating layer of metal nickel, meets the requirement of metal shell 1 in salt fog resistance ability, adhesion strength, air-tightness etc.
Outer cover plate 3 is the square equal with shell body 1 length of side.
Outer cover plate 3 is provided with the multiple countersunk screw holes corresponding to the multiple bolt apertures in shell body 1 sidewall upper face 10.
Metal inner cover plate 4 is the square equal with inner metal shell body 2 length of side.
Metal inner cover plate 4 is provided with the multiple countersunk screw holes corresponding to the multiple bolt apertures in inner metal shell body 2 sidewall upper face 10.
The thickness of metal inner cover plate 4 is 0.5mm ~ 1.0mm.
The composition of casting glue 5 is epoxy resin, dibutyl phthalate, epoxy hardener, white carbon, and four kinds of raw materials configure according to a certain ratio at normal temperatures and form, the good fluidity of the casting glue 5 of normal temperature configuration.
The material of cushion 6 is the mixture of foamed aluminium and felt.
Circuit element plate 7 is loaded in inner metal shell body 2, and 4 set bolts 9 are inserted in buffer gasket 8 respectively, tightens 4 set bolts 9 and circuit element plate 7 is fixed on bolt apertures 10 on inner 4 bases 11 of inner metal shell body 2.
Casting glue 5 adopts pouring type to fill inner metal shell body 2 completely.
Metal inner cover plate 4 mounts cover on inner metal shell body 2, and multiple sunk screw passes through the countersunk screw holes spinning of metal inner cover plate 4 in the corresponding bolt apertures 10 of inner metal shell body 2 sidewall.
Tighten sunk screw, inner metal shell body 2, metal inner cover plate 4, sealing 5, circuit element plate 7 form integral module, are sealed between inner metal shell body 2, metal inner cover plate 4 by casting glue 5.
Inner metal shell body 2, metal inner cover plate 4 form shield, carry out electrostatic screen to the circuit element in protection box, reduce external environment condition to the electromagnetic interference of circuit element.
The module of overall package is placed in vacuum environment; at normal temperatures casting glue 5 is cured; casting glue 5 solidifies that post-shrinkage ratio is low, intensity is high; caking property is good; there is enough toughness; the stress of package curing in protection box is little, has good fatigue resistance, rupture life strength, thermal endurance and resistance to sudden heating.
Packaged module is placed in shell body 1, and cushion 6 is filled in space between shell body 1 and inner metal shell body 2, metal inner cover plate 4 and compacting by technological requirement.
Outer cover plate 3 mounts cover on shell body 1, and multiple sunk screw passes through the countersunk screw holes spinning of outer cover plate 3 in the corresponding bolt apertures 10 of shell body 1 sidewall, tightens sunk screw and forms protection box.
The shock resistance being packaged into overall protection box is high, avoids circuit element, connecting line to produce the relative changing of the relative positions under large overload effect.
Claims (3)
1. an electronic circuit anti high overload protection box, is characterized in that: it comprises shell body (1), inner metal shell body (2), outer cover plate (3), metal inner cover plate (4), casting glue (5), cushion (6), circuit element plate (7), buffer gasket (8), set bolt (9);
The square box body structure that described shell body (1) is global formation;
Described inner metal shell body (2) is less than the square box body structure of shell body (1) for the global formation length of side;
The upper surface of shell body (1), inner metal shell body (2) subtend sidewall is provided with multiple bolt apertures (10);
The bottom at inner 4 angles of inner metal shell body (2) is provided with 4 bases (11), each base (11) is provided with 1 bolt apertures (10);
The inside and outside surface of inner metal shell body (2) is according to technological requirement plating plating layer of metal nickel;
Described outer cover plate (3) is the square equal with shell body (1) length of side;
Outer cover plate (3) is provided with the multiple countersunk screw holes corresponding to the multiple bolt apertures in shell body (1) sidewall upper face (10);
Described metal inner cover plate (4) is the square equal with inner metal shell body (2) length of side;
Metal inner cover plate (4) is provided with the multiple countersunk screw holes corresponding to the multiple bolt apertures in inner metal shell body (2) sidewall upper face (10);
The composition of described casting glue (5) is epoxy resin, dibutyl phthalate, epoxy hardener, white carbon, and four kinds of raw materials configure according to a certain ratio at normal temperatures and form;
Circuit element plate (7) is loaded in inner metal shell body (2), 4 set bolts (9) are inserted in buffer gasket (8) respectively, tighten 4 set bolts (9) and circuit element plate (7) are fixed on bolt apertures (10) on inner 4 bases (11) of inner metal shell body (2);
Casting glue (5) adopts pouring type to fill inner metal shell body (2) completely;
Metal inner cover plate (4) mounts cover on inner metal shell body (2), and multiple sunk screw passes through the countersunk screw holes spinning of metal inner cover plate (4) in the corresponding bolt apertures (10) of inner metal shell body (2) sidewall;
Tighten sunk screw, inner metal shell body (2), metal inner cover plate (4), sealing (5), circuit element plate (7) form integral module, are sealed between inner metal shell body (2), metal inner cover plate (4) by casting glue (5);
Inner metal shell body (2), metal inner cover plate (4) form shield, carry out electrostatic screen to the circuit element in protection box;
The module of overall package is placed in vacuum environment, is cured at normal temperatures to casting glue (5);
Packaged module is placed in shell body (1);
Cushion (6) is filled in space between shell body (1) and inner metal shell body (2), metal inner cover plate (4) and compacting by technological requirement;
Outer cover plate (3) mounts cover on shell body (1), and multiple sunk screw passes through the countersunk screw holes spinning of outer cover plate (3) in the corresponding bolt apertures (10) of shell body (1) sidewall, tightens sunk screw and forms protection box.
2. electronic circuit anti high overload protection box according to claim 1, is characterized in that: the thickness of described metal inner cover plate (4) is 0.5mm ~ 1.0mm.
3. electronic circuit anti high overload protection box according to claim 1, is characterized in that: the material of described cushion (6) is the mixture of foamed aluminium and felt.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410506906.0A CN104244650B (en) | 2014-09-28 | 2014-09-28 | Anti-high-overload protection box for electronic circuits |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410506906.0A CN104244650B (en) | 2014-09-28 | 2014-09-28 | Anti-high-overload protection box for electronic circuits |
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| CN104244650A true CN104244650A (en) | 2014-12-24 |
| CN104244650B CN104244650B (en) | 2017-02-01 |
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| CN201410506906.0A Active CN104244650B (en) | 2014-09-28 | 2014-09-28 | Anti-high-overload protection box for electronic circuits |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105636389A (en) * | 2016-03-11 | 2016-06-01 | 中国科学院光电研究院 | Vacuum seal structure and manufacturing method thereof |
| CN107645871A (en) * | 2017-11-10 | 2018-01-30 | 江苏天兴光电科技有限公司 | A kind of PLC packaging cartridges with vibration-damping radiating function |
| CN109973585A (en) * | 2019-03-29 | 2019-07-05 | 西安电子科技大学 | High-overload-resistant test control circuit composite protection structure |
| CN110213899A (en) * | 2019-06-27 | 2019-09-06 | 北京机械设备研究所 | A kind of pcb board encapsulating device of dual overload-resistant impact |
| CN111988936A (en) * | 2020-08-17 | 2020-11-24 | 中国兵器工业集团第二一四研究所苏州研发中心 | Electronic module high overload resistance reinforcing structure and method |
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| CN202396134U (en) * | 2011-11-28 | 2012-08-22 | 广州金升阳科技有限公司 | Six-side shielded encapsulation box |
| CN203086868U (en) * | 2012-12-30 | 2013-07-24 | 天地（常州）自动化股份有限公司 | Circuit board protection box |
| CN204291699U (en) * | 2014-09-28 | 2015-04-22 | 江南工业集团有限公司 | A kind of electronic circuit anti high overload protection box |
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| US20110242743A1 (en) * | 2010-04-06 | 2011-10-06 | Samsung Mobile Display Co. Ltd. | Organic light-emitting display device and electronic equipment including the same |
| CN201830573U (en) * | 2010-10-15 | 2011-05-11 | 天津市欣乐电子有限公司 | Innovative structural shell |
| CN202396134U (en) * | 2011-11-28 | 2012-08-22 | 广州金升阳科技有限公司 | Six-side shielded encapsulation box |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105636389A (en) * | 2016-03-11 | 2016-06-01 | 中国科学院光电研究院 | Vacuum seal structure and manufacturing method thereof |
| CN107645871A (en) * | 2017-11-10 | 2018-01-30 | 江苏天兴光电科技有限公司 | A kind of PLC packaging cartridges with vibration-damping radiating function |
| CN109973585A (en) * | 2019-03-29 | 2019-07-05 | 西安电子科技大学 | High-overload-resistant test control circuit composite protection structure |
| CN109973585B (en) * | 2019-03-29 | 2019-12-06 | 西安电子科技大学 | High-overload-resistant test control circuit composite protection structure |
| CN110213899A (en) * | 2019-06-27 | 2019-09-06 | 北京机械设备研究所 | A kind of pcb board encapsulating device of dual overload-resistant impact |
| CN110213899B (en) * | 2019-06-27 | 2020-04-10 | 北京机械设备研究所 | Dual anti-overload-impact PCB filling and sealing device |
| CN111988936A (en) * | 2020-08-17 | 2020-11-24 | 中国兵器工业集团第二一四研究所苏州研发中心 | Electronic module high overload resistance reinforcing structure and method |
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| Publication number | Publication date |
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| CN104244650B (en) | 2017-02-01 |
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