CN104244620A - 一种大型半导体设备集约型装配柜体 - Google Patents
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Abstract
本发明涉及一种大型半导体设备集约型装配柜体，包括机柜框架、包覆于所述机柜框架外围的外壳以及设于所述机柜框架内部的内部框架，所述内部框架将机柜框架分为位于上侧的第一散热通道、以及位于下侧并呈左右分布的供电部分和控制机箱，所述供电部分与控制机箱通过线缆连接，所述供电部分采用堆叠式放置且所述供电部分与控制机箱之间预留有维修空间，所述控制机箱采用自旋转式。本发明通过机构布局和预留的维修空间对所述供电部分的正反两面进行维护，利用自旋转式的控制机箱的旋转功能对所述控制机箱的正反两面分别进行维护，利用第一散热通道抽排供电部分及控制机箱的热量，同时，将散热、维护、安置线缆的空间单元合并，从而实现集约型装配。
Description
技术领域
本发明涉及半导体设备领域，尤其涉及一种大型半导体设备集约型装配柜体。
背景技术
目前半导体行业的设备多依托复杂的、大型的控制系统来运行，导致设备需要提供大量的空间给控制机箱、供电机箱、互连线缆以及维护区域等，在一定程度上增大了整机设备的尺寸。
现有的设备中有些设计已经考虑到以上问题，设备中单独设计的电气柜将分系统机箱安装于一个集中区域内，电气柜置于整机设备容易推拉出来的地方，解决了一定的安装空间浪费的问题，但由于推拉的范围需要提供的空间需要的大小基本要求维护人员能进出，所以这种形式的柜体又增加了设备外围空间的需求；而另外一种方式，通过托架模块解决推拉的空间浪费，但远远不能满足大型半导体设备中机箱前后面均维护的使用要求，且半导体设备中供电系统、供电模块设备等还是不可避免的需要同等的需求空间，不同的区域提供相同的安装维护空间，此时的互连线缆因几个不同的区域划分而给布局造成一定的制约，这种现象在大型的半导体设备中已经非常明显了。
发明内容
本发明提供一种大型半导体设备集约型装配柜体，以解决由于大型控制系统所涉及的供电设备繁琐、控制机箱多、互连线缆多、维护操作面多而导致的功能区域分离的现象。
为解决上述技术问题，本发明提供一种大型半导体设备集约型装配柜体，包括机柜框架、包覆于所述机柜框架外围的外壳以及设于所述机柜框架内部的内部框架，所述内部框架将所述机柜框架分为位于上侧的第一散热通道、以及位于下侧并呈左右分布的供电部分和控制机箱，所述供电部分与所述控制机箱通过线缆连接，所述供电部分采用堆叠式放置且所述供电部分与所述控制机箱之间预留有维修空间，所述控制机箱采用自旋转式。
较佳地，所述外壳中一组相邻的两个侧面采用可拆卸式的维护门，另外一组相邻的两个侧面与整机贴合。
较佳地，所述供电部分包括主供电柜、不间断电源以及若干分系统供电模块，所述若干分系统供电模块、主供电柜以及不间断电源依次纵向排列。
较佳地，所述控制机箱、主供电柜、不间断电源以及若干分系统供电模块均为正面操作背面插拔模式，所述控制机箱的背面与所述主供电柜、不间断电源以及若干分系统供电模块的背面分别通过所述线缆连接。
较佳地，所述若干分系统供电模块、主供电柜以及不间断电源的正面与所述维护门相对，背面与所述维修空间相对。
较佳地，所述内部框架上固定一竖直方向的旋转轴，所述控制机箱绕所述旋转轴旋转。
较佳地，所述外壳底部与所述控制机箱旋转0°和90°的位置上分别设有挡块。
较佳地，所述控制机箱在0°～90°之间旋转时，所述大型半导体设备集约型装配柜体的质心始终位于所述大型半导体设备集约型装配柜体内部，且质心高度小于总高度的一半。
较佳地，所述控制机箱的正面与维护门相对，所述控制机箱的背面与同侧的外壳之间设有第二散热通道。
较佳地，所述第一散热通道和第二散热通道分别通过风机散热。
较佳地，所述机柜框架和所述内部框架分别采用铝型材搭建。
与现有技术相比，本发明具有以下优点：
1.本发明通过将系统模块所需空间合并共用的布局优化及结构设计，使所涉及的模块实现集约装配，减少设备的空间约束，从而满足了大型半导体设备的复杂控制系统各有所需的空间要求；
2.与传统独立的拖拉式柜体相比，本发明最大程度的不占用外围空间，将所需维护区域设置于柜体内部，并能提供相对较多的空间需求；
3.与传统单一的控制机柜相比，本发明集成了不同系统模块的功能需求，还将装配空间、维护区域、互连线缆互不影响的布置于共用区域内，实现“一加一大于二”的空间需求。
附图说明
图1为本发明一具体实施方式的大型半导体设备集约型装配柜体的立体结构示意图；
图2为本发明一具体实施方式的大型半导体设备集约型装配柜体的外形结构示意图；
图3为本发明一具体实施方式的大型半导体设备集约型装配柜体的俯视示意图（控制机箱闭合状态）；
图4为本发明一具体实施方式的大型半导体设备集约型装配柜体的俯视示意图（控制机箱旋开状态）；
图5为本发明一具体实施方式的大型半导体设备集约型装配柜体中控制机箱旋开过程中线缆状态示意图；
图6为本发明一具体实施方式的大型半导体设备集约型装配柜体中分系统机箱的结构示意图。
图中：100-机柜框架、200-外壳、210-维护门、300-内部框架、400-第一散热通道、410-风机、500-供电部分、510-维修空间、520-主供电柜、530-不间断电源、540-分系统供电模块、550-线缆、551-线缆节点、600-控制机箱、610-挡块、620-旋转轴、630-第二散热通道、640-分系统机箱、641-接插件维护区、642-板卡维护区、643-可拆卸面板、700-整机。
具体实施方式
为使本发明的上述目的、特征和优点能够更加明显易懂，下面结合附图对本发明的具体实施方式做详细的说明。需说明的是，本发明附图均采用简化的形式且均使用非精准的比例，仅用以方便、明晰地辅助说明本发明实施例的目的。
本发明提供的大型半导体设备集约型装配柜体，如图1至图5所示，包括机柜框架100、包覆于所述机柜框架100外围的外壳200以及设于所述机柜框架100内部的内部框架300，所述内部框架300将所述机柜框架100分为位于上侧的第一散热通道400、以及位于下侧并呈左右分布的供电部分500和控制机箱600，所述供电部分500与所述控制机箱600通过线缆550连接，所述供电部分500采用堆叠式放置且所述供电部分500与所述控制机箱600之间预留有维修空间510，所述控制机箱600采用自旋转式，具体地，本实施例中，大型半导体设备集约型装配柜体的长为825mm，宽为1980mm，高为2500mm，所述控制机箱600部分可以安装42U的双排控制机箱；所述供电部分500可以安装大于35U的安装空间，当然，可以根据需求对高度区域进行调节。本发明通过机构布局和预留的维修空间510对所述供电部分500的正反两面进行维护，利用自旋转式的控制机箱600的旋转功能对所述控制机箱600的正反两面分别进行维护，利用第一散热通道400抽排供电部分500及控制机箱600的热量，同时，将散热、维护、安置线缆550的空间单元合并，安装、调试、维护各不干扰，从而实现集约型装配。本发明考虑各控制单元所需区域的相互制约性，合理的把空间合并、建立互不干扰区作为解决这种大型设备体积扩张的主要解决方案，类似“合并同类项”的方式把空间压缩在一个区域，具体地，把供电系统500、控制机箱600、线缆550、第一散热通道400进行统一的区域共同分配，通过设计唯一的安装位置提供唯一的维护空间，从而减少整机700的空间压力。
较佳地，请参考图2，并结合图3和图4，所述外壳200中一组相邻的两个侧面采用可拆卸式的维护门210，另外一组相邻的两个侧面与整机700贴合。也就是说，本发明的大型半导体设备集约型装配柜体的六个面中，除上下两面以外，两相邻的侧面镶嵌至所述整机700中，另外两个相邻的侧面裸露在外，作为安装、调试、维护的空间。
较佳地，请重点参考图1，所述供电部分500包括主供电柜520、不间断电源530以及若干分系统供电模块540，所述若干分系统供电模块540、主供电柜520以及不间断电源530依次纵向排列，所述分系统供电模块540为分系统提供功率及电压的额外要求，具体地，所述控制机箱600、主供电柜520、不间断电源530以及若干分系统供电模块540均为正面操作背面插拔模式，本实施例中，正面为日常观测及维护面，背面为装配及维护面，所述控制机箱600的背面与所述主供电柜520、不间断电源530以及若干分系统供电模块540的背面分别通过所述线缆550连接。较佳地，所述若干分系统供电模块540、主供电柜520以及不间断电源530的正面与所述维护门210相对，背面与所述维修空间510相对，本实施例中，所述维修空间510的宽度，即图3中L1的长度为300mm，可对所述供电部分500的背面全尺寸进行维护；另外，所述线缆550置于所述维修空间510内，布置压力不大，满足人眼观测视角即可，在本实施例中，请重点参考图3和图4，在所述供电部分500和控制机箱600中间的内部框架300以及所述控制机箱600背面的外壳200上分别设有线缆节点551，用于整理、固定线缆550。
较佳地，请重点参考图3和图4，并结合图1，所述内部框架300上固定一竖直方向的旋转轴620，也就是说，所述旋转轴620底部的连接点与顶部的连接点处于一个垂向平面内的一条垂线上，所述控制机箱600绕所述旋转轴620旋转，所述外壳200底部与所述控制机箱600旋转0°和90°的位置上分别设有挡块610，换句话说，所述控制机箱600绕所述旋转轴620旋转，当所述控制机箱600在初始状态，即旋转0°时，以及完全旋开状态，即旋转90°时，分别与所述挡块610相接触，以限制所述控制机箱600进一步旋转，避免与所述线缆550以及其他部件之间的碰撞及干扰，当然，线缆550的自由余量保证所述控制机箱600在旋转过程中，线缆550始终不干扰旋转或破坏接插件的装配可靠性。
本实施例中，所述控制机箱600包括14个分系统机箱640，由于所述分系统机箱640背面的空间是贴合于整机700的，不能进行直接的维护，所以不能类似供电部分500那样，简单的堆叠留出操作空间就能进行装配及维护，且维护时需要插拔调试而要求维护空间能足够满足操作人员能进出方便。如图6所示为一种分系统机箱640的结构形式，包括接插件维护区641、板卡维护区642以及可拆卸面板643，所述接插件维护区641的深度空间需求约100mm；所述板卡维护区642中板卡完全拔出需要200mm左右深度的空间；所述可拆卸面板643的深度空间需求约100mm，故闭合状态时只需提供线缆550的放置区域（宽度约为200mm），旋出后留出维护人员进出空间、线缆550放置的共用区域，宽度为L2（SEMI标准为610mm），实现了两个状态互换过程中最大程度的利用内部空间达到空间共用的效果。
另外，请重点参考图1，假设14个分系统机箱640分别为两排，且为质量相同、均匀排布的形式，通过对负重设计，将所述控制机箱600旋出和闭合状态对进行质心变化模拟，计算出所述控制机箱600以旋转轴620为轴在0°～90°之间旋转时，所述大型半导体设备集约型装配柜体的质心始终位于所述大型半导体设备集约型装配柜体内部，且质心高度小于总高度的一半，优选的，所述质心高度小于1200mm，保证旋转过程中整个柜体的可靠性、安全性。
较佳地，如图3和图4所示，所述控制机箱600的正面与维护门210相对，所述控制机箱600的背面与同侧的外壳200之间设有第二散热通道630，较佳地，所述第一散热通道400和第二散热通道630分别通过风机410散热，具体地，热风由所述风机410统一抽排入所述第一散热通道400和第二散热通道630内，由外部环境集中收集。
较佳地，所述机柜框架100和所述内部框架300分别采用铝型材搭建，可根据设备模块的尺寸变化进行缩放；较佳地，所述供电部分500与控制机箱600通过金属板（图中未示出）隔离，互不干扰。
需要说明的是，本发明的大型半导体设备集约型装配柜体在实际操作时具体表现为以下环节：
1.装配调试时：所述供电部分500堆叠放置后，操作人员在设备外围进行调试，在所述维修空间510内进行接插件的安装及线缆550的布置；控制机箱600装配后，转出至图4所示的状态进行机箱接插件安装及线缆550的布置，装配完毕后转回，可在设备外围进行正面的调试。具体地，如图5所示，在所述控制机箱600旋开和闭合的过程中，所述线缆550在重力和折弯力的作用下做箭头方向的折合、释放运动。
2.维修维护时：打开维护门210，所述供电部分500的正面维护可直接进行维护，在所述维修空间510内进行接插件的排查及更换操作；同理，打开维护门210后，可在直接对控制机箱600的正面进行维护，转出控制机箱600，操作人员可对所有控制机箱600进行接插件的排查及更换操作。
综上所述，本发明提供的大型半导体设备集约型装配柜体，包括机柜框架100、包覆于所述机柜框架100外围的外壳200以及设于所述机柜框架100内部的内部框架300，所述内部框架300将所述机柜框架100分为位于上侧的第一散热通道400、以及位于下侧并呈左右分布的供电部分500和控制机箱600，所述供电部分500与所述控制机箱600通过线缆550连接，所述供电部分500采用堆叠式放置且所述供电部分500与所述控制机箱600之间预留有维修空间510，所述控制机箱600采用自旋转式。本发明通过机构布局和预留的维修空间510对所述供电部分500的正反两面进行维护，利用自旋转式的控制机箱600的旋转功能对所述控制机箱600的正反两面分别进行维护，利用第一散热通道400抽排供电部分500及控制机箱600的热量，同时，将散热、维护、安置线缆550的空间单元合并，安装、调试、维护各不干扰，从而实现集约型装配。
显然，本领域的技术人员可以对发明进行各种改动和变型而不脱离本发明的精神和范围。这样，倘若本发明的这些修改和变型属于本发明权利要求及其等同技术的范围之内，则本发明也意图包括这些改动和变型在内。
Claims (11)
1.一种大型半导体设备集约型装配柜体，其特征在于，包括机柜框架、包覆于所述机柜框架外围的外壳以及设于所述机柜框架内部的内部框架，所述内部框架将所述机柜框架分为位于上侧的第一散热通道、以及位于下侧并呈左右分布的供电部分和控制机箱，所述供电部分与所述控制机箱通过线缆连接，所述供电部分采用堆叠式放置且所述供电部分与所述控制机箱之间预留有维修空间，所述控制机箱采用自旋转式。
2.如权利要求1所述的大型半导体设备集约型装配柜体，其特征在于，所述外壳中一组相邻的两个侧面采用可拆卸式的维护门，另外一组相邻的两个侧面与整机贴合。
3.如权利要求2所述的大型半导体设备集约型装配柜体，其特征在于，所述供电部分包括主供电柜、不间断电源以及若干分系统供电模块，所述若干分系统供电模块、主供电柜以及不间断电源依次纵向排列。
4.如权利要求3所述的大型半导体设备集约型装配柜体，其特征在于，所述控制机箱、主供电柜、不间断电源以及若干分系统供电模块均为正面操作背面插拔模式，所述控制机箱的背面与所述主供电柜、不间断电源以及若干分系统供电模块的背面分别通过所述线缆连接。
5.如权利要求4所述的大型半导体设备集约型装配柜体，其特征在于，所述若干分系统供电模块、主供电柜以及不间断电源的正面与所述维护门相对，背面与所述维修空间相对。
6.如权利要求4所述的大型半导体设备集约型装配柜体，其特征在于，所述内部框架上固定一竖直方向的旋转轴，所述控制机箱绕所述旋转轴旋转。
7.如权利要求6所述的大型半导体设备集约型装配柜体，其特征在于，所述外壳底部与所述控制机箱旋转0°和90°的位置上分别设有挡块。
8.如权利要求7所述的大型半导体设备集约型装配柜体，其特征在于，所述控制机箱在0°～90°之间旋转时，所述大型半导体设备集约型装配柜体的质心始终位于所述大型半导体设备集约型装配柜体内部，且质心高度小于总高度的一半。
9.如权利要求6所述的大型半导体设备集约型装配柜体，其特征在于，所述控制机箱的正面与维护门相对，所述控制机箱的背面与同侧的外壳之间设有第二散热通道。
10.如权利要求9所述的大型半导体设备集约型装配柜体，其特征在于，所述第一散热通道和第二散热通道分别通过风机散热。
11.如权利要求1所述的大型半导体设备集约型装配柜体，其特征在于，所述机柜框架和所述内部框架分别采用铝型材搭建。
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