CN104242867A - Resonator element, resonator device, electronic apparatus, moving object, and method of manufacturing resonator element - Google Patents
Resonator element, resonator device, electronic apparatus, moving object, and method of manufacturing resonator element Download PDFInfo
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- CN104242867A CN104242867A CN201410283130.0A CN201410283130A CN104242867A CN 104242867 A CN104242867 A CN 104242867A CN 201410283130 A CN201410283130 A CN 201410283130A CN 104242867 A CN104242867 A CN 104242867A
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Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/21—Crystal tuning forks
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
- H03H9/0552—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement the device and the other elements being mounted on opposite sides of a common substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
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- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Oscillators With Electromechanical Resonators (AREA)
Abstract
The invention provides a resonator element, a resonator, an electronic device, an electronic apparatus, and a moving object, and can suppress damage due to impacts applied from outside. The resonator element (1) has a base part (12), vibrating arms (21, 22) having first principal surfaces (17) and second principal surfaces (18) in front-rear relationships with each other and extending from the base part (12), and side surfaces connected to the first principal surfaces (17) and the second principal surfaces (18) on ends of the vibrating arms (21, 22), and the side surfaces are slopes (15) having tilts with respect to perpendicular lines of the first principal surfaces (17) or the second principal surfaces (18) and provided from the first principal surfaces (17) to the second principal surfaces (18), and crystal faces.
Description
Technical field
The present invention relates to vibrating elements, employ the manufacture method of the resonator device of this vibrating elements, electronic equipment, moving body and vibrating elements.
Background technology
At small information equipment such as HDD (hard disk drive), mobile computer or IC-cards, and in the mobile communication equipment such as mobile phone, automobile telephone or paging system etc., the electronic devices such as slim oscillator and oscillator are widely used.Such as, disclosed in patent documentation 1 as in the piezoelectric vibrator of electronic device, in the encapsulation of the cover of the base part and thin plate that comprise thin box, shaker arm is floated carried out installing (connection) to the tuning-fork-type piezoelectric vibrator as vibrating elements.In the piezoelectric vibrator of this structure, when being applied with impact etc. from outside, due to this impact, the shaker arm flexure of tuning-fork-type piezoelectric vibrator, the end of shaker arm contact with the inner bottom surface of encapsulation, thus the possible breakage of shaker arm.
In order to suppress the breakage of such shaker arm, such as, in the piezoelectric vibrator disclosed in patent documentation 2, notch part being set by the terminal part of the shaker arm at tuning-fork-type piezoelectric vibrator and improving resistance to impact.In the piezoelectric vibrator disclosed in patent documentation 2, even if the shaker arm of tuning-fork-type piezoelectric vibrator bends due to impact from outside etc., thus the end of shaker arm contacts with the inner bottom surface of encapsulation, also can pass through notch part (C chamfering, R chamfering, order difference part) distributing shocks, prevent the breakage of tuning-fork-type piezoelectric vibrator.
[patent documentation 1] Japanese Unexamined Patent Publication 2008-22413 publication
[patent documentation 2] Japanese Unexamined Patent Publication 2009-253622 publication
But, C chamfering or the R chamfering of the shaker arm end setting of the piezoelectric vibrator disclosed in patent documentation 2 need the grinding or the grinding that utilize machining, when producing ground in batches and manufacturing in a large number, angle of inclination and shape produce deviation between larger individuality, thus have and extremely difficultly carry out the 1st problem that is stable and the regulation chamfer machining that deviation is little.
Further, have in a pair shaker arm, chamfer shape each other also produces the 2nd problem of larger difference.
And when the end side of shaker arm is configured with weight, has and while heavy effect is executed in maintenance, the 3rd problem of the vibrating reed breakage caused due to the substrate contacts with lift-launch vibrating reed must be reduced.
In addition, there is the order difference part of the end of the shaker arm being arranged at piezoelectric vibrator or the order difference part of 2 grades needs additional new operation, thus the 4th problem of cost up.
Summary of the invention
The present invention is in order to solve making at least partially of above-mentioned problem, and it can realize as following mode or application examples.
[application examples 1] should the feature of vibrating elements of use-case be, this vibrating elements has: base portion; Shaker arm, it has the 1st interarea and the 2nd interarea that are in positive inverse relation each other, and extension from described base portion; And side, it is connected with described 1st interarea and described 2nd interarea in the end of described shaker arm, described side has gradient relative to the vertical line of described 1st interarea or described 2nd interarea, be set to the inclined plane of described 2nd interarea from described 1st interarea always, and be crystal face.
According to should use-case, the side of the terminal part of shaker arm be set to link and be in the 1st interarea of positive inverse relation and the inclined plane of the 2nd interarea each other.This inclined plane is the crystal face that easily can be formed when the sharp processing of vibrating elements, and therefore the shape on inclined plane and the deviation of angle reduce.Thereby, it is possible to deviation between the individuality easily reducing inclined plane.In addition, even if shaker arm bends due to impact from outside etc., thus the end of shaker arm contacts with connected body, because the side of carrying out contacting becomes inclined plane, so carrying out the bight that contacts also is obtuse angle, can distributing shocks, prevent the damage of vibrating elements.
[application examples 2], in the vibrating elements described in above-mentioned application examples, preferably, described side is that logical overetched mistake etches formation.
According to should use-case, by carrying out etching (growth etching period) when the sharp processing of the vibrating elements based on etching, can easily form the inclined plane of the end of shaker arm.Deviation between individuality, owing to being crystal face, therefore, it is possible to make shape and angle not easily produce deviation, thus is reduced in inclined plane.The vibrating elements with the little inclined plane of deviation between individuality is provided thereby, it is possible to stable.
[application examples 3], in the vibrating elements described in above-mentioned application examples, preferably, when the angle of setting the extended line on described inclined plane and described 1st interarea or described 2nd interarea to intersect is as θ, the gradient of described side is in the scope of 84 Dus of ≦ θ≤88 degree.
According to should use-case, the deterioration in characteristics of minimizing the 1st interarea vibrating elements that cause different from the shape of the 2nd interarea can be provided, maintain electrical characteristic and small-sized vibrating elements.
[application examples 4], in the vibrating elements described in above-mentioned application examples, preferably, the terminal part of described shaker arm is provided with Enlarged width portion, described side is arranged at the end of described Enlarged width portion.
According to should use-case, can when extremely do not reduce Enlarged width portion execute heavy effect, prevent shaker arm from contacting the damage of the vibrating elements caused with connected body.In other words, while maintaining the miniaturization based on the vibrating elements executing heavy effect, resistance to impact can be guaranteed.
[application examples 5], in the vibrating elements of above-mentioned application examples, preferably, when the angle of setting the extended line on described inclined plane and described 1st interarea or described 2nd interarea to intersect is as θ, the gradient of described side is in the scope of 84 Dus of ≦ θ≤88 degree.
According to should use-case, following vibrating elements can be provided, this vibrating elements, while maintaining the miniaturization based on the vibrating elements executing heavy effect, reduces the deterioration in characteristics of the 1st interarea vibrating elements that cause different from the shape of the 2nd interarea, thus can maintain electrical characteristic.
[application examples 6] is in the vibrating elements described in above-mentioned application examples, preferably, in plan view, the connecting portion of described inclined plane and described 1st interarea and described inclined plane and distance L between the connecting portion of described 2nd interarea meet the relation of 0 < L≤100 (μm).
According to should use-case, the deterioration in characteristics of the vibrating elements that the difformity by reducing the 1st interarea side and the 2nd interarea side can be provided to cause maintains electrical characteristic and the small-sized vibrating elements of excellent impact resistance.
[application examples 7], in the vibrating elements described in above-mentioned application examples, preferably, described distance L meets the relation of 3 < L≤10 (μm).
According to should use-case, can provide and realize miniaturization further and the vibrating elements of excellent impact resistance.
[application examples 8] should the feature of resonator device described in use-case be, this resonator device has: the vibrating elements described in any example in above-mentioned application examples; And comprise the container of lid and substrate, be equipped with described vibrating elements in the above-described container.
According to should use-case, the vibrating elements that can be increased the connection angle of any one interarea and side by the inclined plane be connected with the 1st interarea and the 2nd interarea carries in container, even if therefore shaker arm bends due to impact from outside etc., thus the end of shaker arm contacts with connected body, also can distributing shocks, prevent the damage of vibrating elements, thus the resonator device of excellent impact resistance can be provided.
[application examples 9], in the resonator device described in above-mentioned application examples, preferably, the inclined plane of described vibrating elements tilts towards the narrower side in interval in described vibrating elements and the interval of described lid and the interval of described vibrating elements and described substrate.
According to should use-case, the electronic device achieving low level while maintaining resistance to impact can be provided in.
[application examples 10] should the feature of resonator device of use-case be, this resonator device has: the vibrating elements described in any example in above-mentioned application examples; And circuit part.
According to should use-case, excellent impact resistance can be provided and owing to there is vibrating elements and driving the circuit part of vibrating elements thus miniaturized excellent resonator device.
[application examples 11] should the feature of electronic equipment of use-case be, this electronic equipment has the vibrating elements described in any example in above-mentioned application examples.
According to should use-case, owing to using the vibrating elements decreasing the damage that the impact etc. from outside causes, therefore, it is possible to provide the electronic equipment improved the durability of external impact.
[application examples 12] should the feature of moving body of use-case be, this moving body has the vibrating elements described in any example in above-mentioned application examples.
According to should use-case, owing to using the vibrating elements decreasing the damage that the impact etc. from outside causes, therefore, it is possible to provide the moving body improved the durability of external impact.
[application examples 13] should the feature of manufacture method of vibrating elements of use-case be, this manufacture method comprises following operation: prepared substrate; Form the mask corresponding with the profile of vibrating elements on the substrate; And the described substrate in the region of exposing from described mask is etched, etch as follows in the operation of described etching: the time of this etching is than long by etching the time making described substrate through.
According to should use-case, by carrying out the time than by etching the long etching of time of making described substrate through, namely so-calledly crossing etching, the inclined plane as crystal face can be formed thus, therefore, it is possible to prevent the increase increasing the machining periods such as operation.
Accompanying drawing explanation
Fig. 1 is the skeleton diagram of the structure of the vibrating elements that execution mode is shown, (a) is plane graph, and (b) is end view, and (c) is the end view of the variation that inclined plane is shown.
Fig. 2 is the plane graph of the outline of the vibrating elements that execution mode is shown, (a) is vertical view, and (b) is upward view (perspective view).
Fig. 3 illustrates the outline of the vibrating elements of execution mode, is the B-B line cutaway view in Fig. 2 (a).
Fig. 4 is the front view of action when illustrating that vibrating elements receives impact.
Fig. 5 is the process flow chart of the vibrating elements manufacturing execution mode.
Fig. 6 is the process flow chart of the vibrating elements manufacturing execution mode.
Fig. 7 is the skeleton diagram of the structure that oscillator of the present invention is shown, (a) is plane graph, and (b) is G-G cutaway view.
Fig. 8 is the positive view of the general structure that oscillator of the present invention is shown.
Fig. 9 is the stereogram of the structure of the personal computer of the mobile model of the example illustrated as electronic equipment.
Figure 10 is the stereogram of the structure of the mobile phone of the example illustrated as electronic equipment.
Figure 11 is the stereogram of the structure of the digital still camera of the example illustrated as electronic equipment.
Figure 12 is the stereogram of the structure of the automobile of the example illustrated as moving body.
Label declaration
1,1a: vibrating elements; 2: oscillator; 3: oscillator; 10: substrate; 12: base portion; 15,15a, 15b: inclined plane; 16: reduced width portion; 17: the 1 interareas (front); 18: the 2 interareas (reverse side); 21,22: shaker arm; 23: support arm; 24,25: tup; 28,28a, 28b, 29,29a, 29b: groove; 30: electrode; 31: the 1 driving electrode; 32: the 2 driving electrode; 33a, 33b, 34a, 34b: side; 35a, 35b, 35c, 35d, 35e, 35f, 36a, 36b, 36c, 36d, 36e, 36f: wiring; 37: the 1 conductive welding disks; 38: the 2 conductive welding disks; 42,43: attachment; 44: closing line; 45,46: mounting terminal; 47,48: connecting electrode; 50,60: package main body; 51: the 1 substrates; 52: the 2 substrates; 53: the 3 substrates; 54: the 4 substrates; 56: cover; 58: seal; 62:IC chip; 64: resin material; 70: chamber; 80: the 1 chambers; 82: the 2 chambers; 100: display part; 506: as the automobile of moving body; 1100: as the personal computer of the mobile model of electronic equipment; 1200: as the mobile phone of electronic equipment; 1300: as the digital still camera of electronic equipment.
Embodiment
Below, with reference to accompanying drawing, the preferred embodiment of the present invention is described.
< vibrating elements >
The vibrating elements of Fig. 1 ~ Fig. 6 to embodiment of the present invention is used to be described.Fig. 1 is the skeleton diagram of the structure of the vibrating elements that embodiment of the present invention is shown, Fig. 1 (a) is plane graph, and Fig. 1 (b) is end view, and Fig. 1 (c) is the end view of the variation that inclined plane is shown.Fig. 2 is the plane graph of the vibrating elements of embodiment of the present invention, and Fig. 2 (a) is vertical view, and Fig. 2 (b) is upward view (perspective view).Fig. 3 is the B-B line cutaway view in Fig. 2 (a).Fig. 4 is the positive view of action when illustrating that vibrating elements receives impact.Fig. 5 and Fig. 6 is the process flow chart of the vibrating elements manufacturing execution mode.In addition, in the various figures, for convenience of explanation, as perpendicular to one another 3 axles, X-axis, Y-axis and Z axis is illustrated.In addition, in the following description, for convenience of explanation, also by plan view when observing from Z-direction referred to as " plan view ".And, for convenience of explanation, in the plan view when observing from Z-direction, with the face of+Z-direction be upper surface, the face of-Z-direction is described for lower surface.
Vibrating elements 1 shown in Fig. 1 has: substrate 10, and it has base portion 12 and shaker arm 21,22; And be arranged on the electrode 30 of the driving on this substrate 10.In addition, shaker arm 21,22 is formed by with lower component: the arm be connected with base portion; And be arranged at the end side of this arm, the tup (Enlarged width portion, also referred to as executing weight portion) 24,25 that width is wider than the width of this arm.
Substrate 10 is quartz materials, such as by quartz particularly Z cut quartz plate and to form and as piezoelectric substrate.Thus, vibrating elements 1 can play excellent vibration characteristics.It is using the quartz base plate of the Z crystallographic axis (optical axis) of quartz as thickness direction that Z cuts quartz plate.Preferred Z axis is consistent with the thickness direction of substrate 10, but, from the view point of the frequency temperature change reduced near normal temperature, make Z axis (such as, be less than about 15 °) a little relative to thickness direction and tilt.Substrate 10 has: base portion 12; From base portion 12 to-Y direction is outstanding, and two shaker arms 21,22 of spread configuration in the X-axis direction; From base portion 12 to-Y direction is outstanding, and the support arm 23 between two shaker arms 21,22.
Base portion 12, in roughly tabular, XY plane is expanded, is had thickness in the Z-axis direction.The base portion 12 of present embodiment, in the opposition side of shaker arm 21,22 and support arm 23, has width along with towards+Y direction and the reduced width portion 16 reduced gradually continuously or intermittently.By having such reduced width portion 16, leakage of vibration can be suppressed.In addition, reduced width portion 16 can be arranged as required, also can omit.
Shaker arm 21,22 spread configuration in the X-axis direction, and from base portion 12, extend (outstanding) to-Y direction respectively.In addition, the end section of shaker arm 21,22 is provided with tup 24,25.By arranging this tup 24,25, the miniaturization of vibrating elements 1 can be realized, and the frequency of the flexural vibrations of shaker arm 21,22 can be reduced.In addition, tup 24,25 can have multiple width as required.
In addition, be set to along the length of the X-direction wide width part larger than arm as the tup 24,25 executing heavy portion, but be not limited thereto, as long as the mass density of each unit length is larger than arm.Such as, executing weight portion also can be following structure: identical with the length along X-direction of arm, and is set to thicker than arm by the thickness along Z-direction.In addition, executing weight portion can also by arranging the metals such as Au on the surface of the arm corresponding to executing weight portion and forms thicklyer.And executing weight portion can also be made up of the material that mass density is higher than arm.
At the end of tup 24,25, i.e. the end of shaker arm 21,22, is provided with the side of the 1st interarea 17 connecting positive side and the 2nd interarea 18 of tossing about.This side comprises crystal face and the inclined plane 15 relative to the vertical line Q of the 1st interarea 17 or the 2nd interarea 18 with gradient.In addition, in the manner, inclined plane 15 is set to the 2nd interarea 18 from the 1st interarea 17 always.That is, inclined plane 15 is connected with the 1st interarea 17 and the 2nd interarea 18.Made the etch recipe of substrate attack by wet etching etc., such inclined plane 15 can be formed, can easily form inclined plane 15.
In addition, in the vibrating elements 1 of present embodiment, describe the structure being provided with tup 24,25 at the terminal part of shaker arm 21,22 as described above, but also can be the vibrating elements of the structure that tup 24,25 is not set.
In addition, for the gradient on inclined plane 15, the extended line angulation θ on the 2nd interarea 18 and inclined plane 15, be in other words positioned at tilt the 2nd interarea 18 of side of inclined plane 15 and be preferably in following ranges with the extended line angulation θ on inclined plane 15.
84 Dus of ≦ θ≤88 degree
Thus, by the gradient on inclined plane 15 is set in above-mentioned scope, can when extremely do not reduce tup 24,25 execute heavy effect, prevent the connected bodies such as tup 24,25 (shaker arm 21,22) and the inner surface such as encapsulated from contacting and the damage of vibrating elements 1 that causes.In other words, can provide and can maintain vibrating elements 1 that is miniaturized, that simultaneously guarantee resistance to impact, described miniaturization is by realizing based on the short sizing of shaker arm 21,22 of executing heavy effect.
In addition, if as the substrate 10 be made up of quartz of present embodiment, it is the structure with two shaker arms 21,22 that court-Y direction from base portion 12 is given prominence to, then can utilize the etching anisotropy that quartz has, angle is cut out according to substrate 10, etch with crossing during wet etching, easily form the inclined plane 15 as the crystal face of above-mentioned angle at the end (end of tup 24,25) of shaker arm 21,22.In addition, inclined plane 15 is the crystal faces that easily can be formed when the sharp processing of vibrating elements 1, and therefore the shape on inclined plane 15 and the deviation of angle reduce.Thereby, it is possible to deviation between the individuality on minimizing inclined plane 15.
In addition, preferably in the plan view observed from the 1st interarea 17 side, inclined plane 15 and the connecting portion of the 1st interarea 17 and inclined plane 15 and distance L between the connecting portion of the 2nd interarea 18 meet the relation of 0 < L≤100 (μm).By being set to above-mentioned scope apart from L, the electrical characteristic deterioration of the vibrating elements 1 that the difformity of the 1st interarea 17 side and the 2nd interarea 18 side can be suppressed to cause, can provide and maintain electrical characteristic and the small vibrating element 1 of excellent impact resistance.
Further, distance L preferably meets the relation of 3 < L≤10 (μm).By being set to such distance L, except above-mentioned effect, can also provide and not reduce executing heavy effect, in other words realizing miniaturization of tup 24,25, and the vibrating elements 1 of excellent impact resistance.
In addition, on shaker arm 21,22, be provided with respectively towards the groove with the end 28,29 that the 1st interarea 17 or the 2nd interarea 18 of tossing about of positive side open wide.These grooves 28,29 are configured to extend along Y direction, and in mutually the same shape.Therefore, shaker arm 21,22 is the shape of cross section of roughly " H " shape.By forming such groove 28,29, the heat sent due to flexural vibrations is difficult to spread (heat transfer), be greater than at beam frequency (beam frequency of machinery) f in the region of thermal insulation, region (f > f0) i.e. of thermal relaxation frequency f 0, thermoelasticity can be suppressed to lose.In addition, groove 28,29 can be arranged as required, also can omit.
Extend to-Y direction from base portion 12 as the support arm 23 of support portion, and between shaker arm 21,22.In addition, the elongated shape of support arm 23, roughly fixing at the gamut insied width (length of X-direction) of length direction.And support arm 23 is provided with the 1st, the 2nd conductive welding disk 37,38 at the lower surface (the 2nd interarea 18 of tossing about) of support arm 23.As the shape (particularly plan view shape) of support arm 23, be not particularly limited, the part that width changes can be had in the midway of length direction.
Above, simple declaration has been carried out to the structure of vibrating elements 1.Then, the electrode 30 be arranged on this substrate 10 is described.Fig. 2 is the plane graph of the electrode structure of the vibrating elements that first embodiment of the present invention is shown, Fig. 2 (a) is vertical view, and Fig. 2 (b) is the upward view (perspective view) of Fig. 2 (a).In addition, Fig. 3 is the B-B line cutaway view in Fig. 2 (a).
As shown in Figures 2 and 3, electrode 30 has: multiple 1st driving electrode 31; 1st electrode pad 37; Connect wiring 35a, 35b, 35c, 35d, 35e, 35f of this multiple 1st driving electrode 31 and the 1st conductive welding disk 37; Multiple 2nd driving electrode 32; 2nd conductive welding disk 38; And connect wiring 36a, 36b, 36c, 36d, 36e, 36f of this multiple 2nd driving electrode 32 and the 2nd conductive welding disk 38.
1st driving electrode 31 is arranged at each side 34a, 34b of the inner surface of each groove 28a, 28b of shaker arm 21 and shaker arm 22.1st driving electrode 31 of groove 28a is via the upper surface (the 1st interarea 17) crossing over base portion 12 and the wiring 35c arranged laterally, be connected with the 1st driving electrode 31 of side 34b, 1st driving electrode 31 of groove 28b, via the lower surface (the 2nd interarea 18) crossing over base portion 12 and the wiring 35e arranged laterally, is connected with the 1st driving electrode 31 of side 34b.In addition, wiring 35c, 35e is connected in the side of base portion 12.Then, the 1st driving electrode 31 of side 34b is connected via the 1st driving electrode 31 of the wiring 35f with side 34a that are arranged at tup 25.Further, side 34a the 1st driving electrode 31 via the upper surface with lower surface that are arranged at base portion 12 wiring 35b with wiring 35d be connected with the wiring 35a of the side being arranged at support arm 23.And wiring 35a is electrically connected with the 1st conductive welding disk 37 of the lower surface being arranged at support arm 23.
On the other hand, the 2nd driving electrode 32 is arranged at each side 33a, 33b of the inner surface of each groove 29a, 29b of shaker arm 22 and shaker arm 21.2nd driving electrode 32 of groove 29a is via the wiring 36b of upper surface being arranged at base portion 12, be connected with the 2nd driving electrode 32 of side 33b, 2nd driving electrode 32 of groove 29b, via the wiring 36c of lower surface being arranged at base portion 12, is connected with the 2nd driving electrode 32 of side 33b.Then, the 2nd driving electrode 32 being arranged at side 33b is connected with the 2nd driving electrode 32 being arranged at side 33a via the wiring 36d being arranged at tup 24.And, the wiring 36b of the upper surface of base portion 12 is via the wiring 36e of upper surface being arranged at base portion 12, the wiring 36c of the lower surface of base portion 12 via the wiring 36f of lower surface being arranged at base portion 12, and is connected with the wiring 36a of the side being arranged at support arm 23 respectively.And wiring 36a is electrically connected with the 2nd conductive welding disk 38 of the lower surface being arranged at support arm 23.
Thus, by each wiring, driving voltage is applied to the 1st, the 2nd driving electrode 31,32 from the 1st, the 2nd conductive welding disk 37,38, in the shaker arm of vibrating elements, suitably produce electric field thus, two shaker arms 21,22 with each other repeatedly close, away from mode vibrate with assigned frequency in direction (XY in-plane) in roughly face.As the constituent material of electrode 30, be not particularly limited, such as, can use the electric conducting materials such as metal material and tin indium oxide (ITO) such as gold (Au), billon, platinum (Pt), aluminium (Al), aluminium alloy, silver (Ag), silver alloy, chromium (Cr), evanohm, copper (Cu), molybdenum (Mo), niobium (Nb), tungsten (W), iron (Fe), titanium (Ti), cobalt (Co), zinc (Zn), zirconium (Zr).
(variation on inclined plane)
Here, the variation on inclined plane is described with reference to Fig. 1 (c).Fig. 1 (c) is the end view of the variation that inclined plane is shown.As shown in Fig. 1 (c), the vibrating elements 1a of variation is compared with the vibrating elements 1 of above-mentioned execution mode, and the 1st interarea 17 and the 2nd interarea 18 are positioned at rightabout.In other words, inclined plane 15b is arranged to roll tiltedly towards the 1st interarea 17.
The inclined plane 15b of variation connects the 1st interarea 17 of positive side and the 2nd interarea 18 of tossing about, and has gradient relative to the vertical line Q of the 1st interarea 17 or the 2nd interarea 18.Further, inclined plane 15b is set to the 2nd interarea 18 from the 1st interarea 17 always.That is, inclined plane 15b is connected with the 1st interarea 17 and the 2nd interarea 18.Even if be set to such inclined plane 15b, also can use the method for makings such as wet etching, can easily form inclined plane 15b.
In addition, for the gradient of inclined plane 15b, same with above-mentioned execution mode, the extended line angulation θ of the 1st interarea 17 and inclined plane 15b, the 1st interarea 17 being in other words positioned at 15b inclination side, inclined plane are preferably in following ranges with the extended line angulation θ of inclined plane 15b.
84 Dus of ≦ θ≤88 degree
Thereby, it is possible to by the gradient of inclined plane 15b being located in above-mentioned scope, obtain the effect identical with execution mode.
In addition, inclined plane 15b's is identical with above-mentioned execution mode with the distance L between 15b's and the 2nd interarea 18 the connecting portion of the connecting portion of the 1st interarea 17 and inclined plane, is therefore omitted in this explanation.
(manufacture method of vibrating elements)
Above, the structure of vibrating elements 1 is illustrated.Such vibrating elements 1 can manufacture in the following way.Below, the manufacture method of vibrating elements 1 is described according to the process flow chart shown in Fig. 5 (a) ~ (e) He Fig. 6 (f) ~ (j).In addition, Fig. 5 and Fig. 6 shows profile etch operation.In addition, the manufacture method below illustrated is an example, also can manufacture vibrating elements 1 by other manufacture methods.
Fig. 5 and Fig. 6 is the process chart of an example of manufacture method for illustration of vibrating elements 1, and each operation of Fig. 5 and Fig. 6 shows the region corresponding with the cutting plane of the shaker arm 21,22 at the B-B cutting line place of Fig. 2 (a) according to process sequence.In addition, in the figure, support arm 23 is eliminated.
(preparatory process of substrate)
In Fig. 5 (a), prepare the substrate 71 be made up of the piezoelectric of the size can isolating multiple or a large amount of vibrating elements 1.Now, when making the vibrating elements 1 of tuning-fork-type the carrying out by operation, with the X crystallographic axis shown in Fig. 1 be electric axis, Y crystallographic axis for mechanical axis and the Z crystallographic axis mode that is optical axis, from the monocrystalline of piezoelectric, such as quartz, cut out substrate 71.In addition, when cutting out substrate 71 from the monocrystalline of quartz, in the orthogonal coordinate system that above-mentioned X crystallographic axis, Y crystallographic axis and Z crystallographic axis are formed, tilting approximately to bear around X-axis 6 degree to positive 6 degree forms the XY plane be made up of X-axis and Y-axis.
(formation process of Corrosion Resistant Film)
As shown in Fig. 5 (a), form Corrosion Resistant Film 72 by methods such as sputtering or evaporations on the surface (positive and negative) of substrate 71.As shown in the figure, form Corrosion Resistant Film 72 at the tow sides of the substrate 71 be made up of quartz, Corrosion Resistant Film 72 is such as formed by as the layers of chrome of substrate layer and the coating of coating gold thereon.
In addition, in following operation, identical processing is carried out to the upper and lower surface of substrate 71, therefore in order to avoid miscellaneous and only upper surface is described.
(patterning step of profile)
Then, as shown in Fig. 5 (b), in order to profile composition whole coating resist 73 (the coating operation of resist) of the positive and negative Corrosion Resistant Film 72 of substrate 71.As resist 73, the positive corrosion-resisting agent of such as ECA system, PGMEA system suitably can be used.In addition, the formation process of above-mentioned Corrosion Resistant Film and the patterning step of profile are equivalent to the operation forming mask.
(wet etching operation)
Then, as shown in Fig. 5 (c), configure the mask (not shown) of predetermined pattern width in order to profile composition, after exposure, remove photosensitive after resist 73, also remove Corrosion Resistant Film 72 according to the order of Au, Cr accordingly with removed Resist portions.
Then, as shown in Fig. 5 (d), remove the resist 73 on Corrosion Resistant Film 72, the part in outside is exposed from the profile of the vibrating elements 1 beyond the region covered by Corrosion Resistant Film 72, and as shown in Fig. 5 (e), whole applies resist 74.
Then, as shown in Fig. 6 (f), the resist 74 of the part in the groove portion of Outboard Sections and each shaker arm is removed from the profile of vibrating elements 1.
Then, as shown in Fig. 6 (g), such as using hydrofluoric acid solution as etching solution, to as Outboard Sections from the substrate 71 that the profile of vibrating elements 1 is exposed, carry out the profile etch (below also referred to as etching work procedure) of piezoelectric vibration piece.This etching work procedure littlely to terminate 2 in 3 hours, but changed according to the concentration of hydrofluoric acid solution, kind and temperature etc.In the present embodiment, as etching solution, use hydrofluoric acid, ammonium fluoride, by its concentration be Capacity Ratio 1:1, temperature is 65 degree ± condition of 1 degree (degree Celsius) etches.By etching with this condition, with about 30 minutes through substrates 71, cross etching by what then carry out 2 hours, the crystal face that can carry out the inclined plane 15 of shaker arm 21,22 end reducing and extend in-Y direction of the etching residue produced in+X-direction exposes.That is, with about 2 and a half hours, etching work procedure completes.
(half-etching operation)
Then, as shown in Fig. 6 (h), remove the Corrosion Resistant Film 72 in the groove portion of shaker arm.
The substrate 71 exposed for removing Corrosion Resistant Film 72, further as shown in Fig. 6 (i), uses hydrofluoric acid solution etc. to carry out the half-etching in the groove portion of shaker arm 21,22.
In the present embodiment, as etching solution, use hydrofluoric acid, ammonium fluoride, by its concentration be Capacity Ratio 1:1, temperature is 65 degree ± condition of 1 degree (degree Celsius), completed etching work procedure with 30 minutes to about 60 minutes.
Thus, the 1st groove portion 28A, 29A and the 2nd groove portion 28B, 29B of shaker arm 21,22 is formed.
Then, as shown in Fig. 6 (j), remove resist 74 from Corrosion Resistant Film 72, also remove Corrosion Resistant Film 72.This state is the state of the electrode not forming the vibrating elements 1 shown in Fig. 1.
Then, in not shown electrode forming process, the metal film formed for the formation of electrode at whole by the method such as evaporation or sputtering.This metal film is exciting electrode, forms by as the layers of chrome and coating electrode layer (golden coating) thereon with Corrosion Resistant Film same substrate layer.
Then, carry out electrode formed in the coating operation of resist, implement to distinguish covering (not shown) of the region (with reference to Fig. 2) that should form electrode and the region that should not form electrode, expose, remove unwanted resist, the metal film that remove is exposed.Then, use the etching solution of such as KI etc., removed the metal film exposed by wet etching.Thus, the metal film that will remove is removed completely by etching.Finally, unwanted resist is peeled off completely.
By above operation, the vibrating elements 1 of the structure shown in Fig. 1 ~ Fig. 3 completes.
If use above-mentioned manufacture method, then time of the carrying out etching longer than the time making substrate 71 through by wet etching, namely carry out so-calledly crossing etching, thus the inclined plane 15 as crystal face can be formed.Therefore, it is possible to easily form inclined plane 15 when not increasing operation.
According to vibrating elements 1 as described above, by the inclined plane 15 be connected with the 1st interarea 17 and the 2nd interarea 18, the angle θ that the 2nd interarea 18 is connected with side can be reduced.In other words, the connection angle in the bight that inclined plane 15 is connected with the 2nd interarea 18 can be increased, i.e. interior angle θ 1.
When using the front view of Fig. 4 to be described, be positioned at the mode of hollow with shaker arm 21,22, utilize support arm 23 that vibrating elements 1 is connected to the connected bodies 8 such as encapsulation, described support arm 23 is as the support portion comprising base portion 12.When applying the vibrating elements 1 connected by single armed like this by the impact from outside shown in arrow F, shaker arm 21,22 bends, and the bight of the end of shaker arm 21,22 (with tup 24a, the 25a shown in chain-dotted line in figure) contacts with connected body 8 sometimes.Even if tup 24a, 25a contact like this with connected body 8, the connection angle in the bight that inclined plane 15 is connected with the 2nd interarea 18 and interior angle θ 1 also increase and become obtuse angle, therefore, it is possible to distributing shocks, thus prevent the damage of vibrating elements 1.
In addition, inclined plane 15 is the crystal faces that easily can be formed when the sharp processing of vibrating elements 1, and therefore the shape on inclined plane 15 and the deviation of angle reduce.Thereby, it is possible to deviation between the individuality on minimizing inclined plane 15.Thereby, it is possible to the deterioration in characteristics of the vibrating elements 1 providing the difformity of suppression the 1st interarea 17 side and the 2nd interarea 18 side to cause, maintain electrical characteristic and small-sized vibrating elements 1.
In above-mentioned vibrating elements 1, use and cut by the Z as piezoelectric substrate the vibrating elements with the so-called tuning-fork-type of 2 shaker arms 21,22 that quartz plate forms and be illustrated, but the structure of vibrating elements is not limited thereto.Such as, the piezoelectric vibration device being provided with piezoelectrics on a silicon substrate can also be applied to, or the sensor element etc. of acceleration, angular speed, pressure etc. can be measured.
< oscillator >
Then, Fig. 7 is used to be described the oscillator of an example as the electronic device applying above-mentioned vibrating elements 1 of the present invention.Fig. 7 is the skeleton diagram of the structure that oscillator of the present invention is shown, Fig. 7 (a) is the plane graph of oscillator, and Fig. 7 (b) is the G-G cutaway view of Fig. 7 (a).In addition, in Fig. 7 (a), the internal structure of oscillator for convenience of description, illustrates the state after unloading lower cover member.
Oscillator 2 is formed by with lower part: vibrating elements 1; For receiving the package main body 50 of the rectangular box of vibrating elements 1; And the cover 56 to be made up of glass, pottery, metal etc.In addition, be the pressure reduction space of substantial vacuum in the chamber 70 receiving vibrating elements 1.Here, package main body 50 is equivalent to basal part, and chamber 70 is equivalent to container.
As shown in Fig. 7 (b), package main body 50 is stacked 1st substrate 51, the 2nd substrate 52 and mounting terminal 45 and is formed.Multiple mounting terminal 45 is possessed in the outer bottom face of the 1st substrate 51.In addition, in the assigned position of the upper surface of the 1st substrate 51, the multiple connecting electrodes 47 conducted via not shown through electrode or interlayer wiring and mounting terminal 45 are provided with.2nd substrate 52 is the ring bodies after removing central portion, is provided with the chamber 70 of storage vibrating elements 1.
1st substrate 51 and the 2nd substrate 52 of package main body 50 discussed above are made up of the material with insulating properties.As such material, be not particularly limited, the various potteries such as such as oxide-based ceramic, nitride-based pottery, carbon compound pottery can be used.In addition, to be arranged in each electrode of package main body 50, terminal or the wiring pattern that they are electrically connected and layer wiring pattern etc. general by the metal line material such as screen printing tungsten (W), molybdenum (Mo) on the insulating material, fire, and implement the plating of nickel (Ni), gold (Au) etc. thereon and be arranged to.
Cover 56 as lid is preferably arranged to by the material making light pass through, such as pyrex etc., has carried out gas-tight seal by utilizing seal 58 to carry out engaging to package main body 50.Thus, after the lid sealing of package main body 50, from outside via cover 56 to irradiating laser near the end of vibrating elements 1, make the electrode part evaporation arranged herein, thus can carry out utilizing quality to cut down the frequency adjustment of mode.In addition, when not carrying out such frequency adjustment, cover 56 can be formed by the metal materials such as teleoseal (lid).
Be accommodated in vibrating elements 1 in the chamber 70 of package main body 50 will be arranged at the 1st, the 2nd conductive welding disk 37,38 of support arm 23 and be arranged at two connecting electrodes 47 aligned position accordingly respectively of upper surface of the 1st substrate 51 of package main body 50, and engage by attachment 42.The attachment of the conductivity such as the projection that attachment 42 such as can be made up of metal or soft solder etc. use or conductive adhesive, carry out the joint of machinery while realizing electrical connection.
The inclined plane 15 preferably comprised with the end profile of tup 24,25 (with reference to Fig. 1) configures towards the mode of the upper surface side of the 1st substrate 51 and is connected vibrating elements 1.In other words, vibrating elements 1 is configured in chamber 70 by the mode of the distance H1 between the upper surface being preferably greater than vibrating elements 1 and the 1st substrate 51 with the distance H2 between vibrating elements 1 and cover 56.That is, vibrating elements 1 is configured in the inclined plane mode that a narrower side tilts towards interval.By configuring vibrating elements 1 like this, even if the interval H1 between the upper surface of vibrating elements 1 and the 1st substrate 51 is narrower, and the vibrating elements 1 creating flexure due to the impact from outside contacts with the upper surface of the 1st substrate 51, because the interior angle θ in the bight that above-mentioned inclined plane 15 is connected with the 1st interarea 17 or the 2nd interarea 18 1 is obtuse angle, so also can distributing shocks, thus prevent the damage of vibrating elements 1.Thereby, it is possible to provide resistance to impact to improve and achieve the oscillator 2 as electronic device of low level.
< oscillator >
Then, Fig. 8 is used to be described the oscillator of an example as the electronic device applying above-mentioned vibrating elements 1 of the present invention.Fig. 8 is the positive view of the general structure that oscillator of the present invention is shown.
Oscillator 3 is formed by with lower part: vibrating elements 1; The package main body 60 of storage vibrating elements 1; For driving the IC chip (chip part) 62 of vibrating elements 1; And the cover 56 as lid to be made up of glass, pottery or metal etc.In addition, be the pressure reduction space of substantial vacuum in the 1st chamber 80 receiving vibrating elements 1.Here, package main body 60 is equivalent to basal part, and the 1st chamber 80 is equivalent to container.
As shown in Figure 8, package main body 60 is stacked 1st substrate 51, the 2nd substrate 52, the 3rd substrate 53, the 4th substrate 54 and mounting terminal 46 and is formed.In addition, package main body 60 has the 1st chamber 80 opened wide towards upper surface and the 2nd chamber 82 opened wide towards lower surface.
Be accommodated in vibrating elements 1 in the 1st chamber 80 of package main body 60 will be arranged at the 1st, the 2nd conductive welding disk 37,38 of support arm 23 and be arranged at two connecting electrodes aligned position accordingly respectively of upper surface of the 1st substrate 51 of package main body 60, and engage by attachment 42.Attachment 42 can use the attachment of the conductivity such as projection or conductive adhesive be such as made up of metal or soft solder etc.By using such attachment 42, the joint of machinery can be carried out while realizing electrical connection.
The inclined plane 15 preferably comprised with the end profile of tup 24,25 (with reference to Fig. 1) configures towards the mode of the upper surface side of the 1st substrate 51 and is connected vibrating elements 1.In other words, vibrating elements 1 is configured in the 1st chamber 80 by the mode of the distance H1 between the upper surface being preferably greater than vibrating elements 1 and the 1st substrate 51 with the distance H2 between vibrating elements 1 and cover 56.That is, vibrating elements 1 is configured in the inclined plane mode that a narrower side tilts towards interval.By configuring vibrating elements 1 like this, even if the interval H1 between the upper surface of vibrating elements 1 and the 1st substrate 51 is narrower, and the vibrating elements 1 creating flexure due to the impact from outside contacts with the upper surface of the 1st substrate 51, because the interior angle θ in the bight that above-mentioned inclined plane is connected with the 1st interarea 17 or the 2nd interarea 18 1 is obtuse angle, so also can distributing shocks, thus prevent the damage of vibrating elements 1.Thereby, it is possible to provide resistance to impact to improve and achieve the oscillator 3 as electronic device of low level.
The outside bottom surface of the 4th substrate 54 is provided with multiple mounting terminal 46.In addition, mounting terminal 46 is via not shown through electrode or interlayer wiring and be arranged at the connecting electrode 47 of upper surface of the 1st substrate 51 and the connecting electrode 48 of the lower surface that is arranged at the 3rd substrate 53 conducts.
The 1st chamber 80 being accommodated with the package main body 60 of vibrating elements 1 such as engages with cover 56 via the seal 58 of pyrex etc., thus is hermetically sealed.
On the other hand, in the 2nd chamber 82 of package main body 60, be accommodated with IC chip 62, this IC chip 62 is fixed to the lower surface of the 1st substrate 51 via the attachment such as solder or bonding agent 43.In addition, in the 2nd chamber 82, at least two connecting electrodes 48 are provided with.Connecting electrode 48 is electrically connected with IC chip 62 by closing line 44.In addition, in the 2nd chamber 82, be filled with resin material 64, by this resin material 64, IC chip 62 sealed.
IC chip 62 has the drive circuit (oscillating circuit) of the driving for controlling vibrating elements 1, when being driven vibrating elements 1 by this IC chip 62, can take out the signal of assigned frequency.
< electronic equipment >
Then, according to Fig. 9 ~ Figure 11, describe electronic equipment in detail, this electronic apparatus application as one embodiment of the present invention electronic device, any one in the oscillator 2 that employs vibrating elements 1 or the oscillator 3 employing vibrating elements 1.In addition, in explanation, show the example of application oscillator 2.
Fig. 9 is the stereogram of the architectural overview of the mobile model as electronic equipment (or notebook type) personal computer that the oscillator 2 had as the electronic device of one embodiment of the present invention is shown.In the figure, personal computer 1100 is made up of the main part 1104 with keyboard 1102 and the display unit 1106 with display part 100, and display unit 1106 is rotatably bearing on main part 1104 by hinge structure portion.The built-in oscillator 2 with the function of the timing source as signal transacting in such personal computer 1100.
Figure 10 is the stereogram of the architectural overview of the mobile phone as electronic equipment (also comprising PHS) that the oscillator 2 had as the electronic device of one embodiment of the present invention is shown.In the figure, mobile phone 1200 has multiple action button 1202, answer mouth 1204 and call mouth 1206, in action button 1202 and answer between mouth 1204 and be configured with display part 100.The built-in oscillator 2 with the function of the timing source as signal transacting in such mobile phone 1200.
Figure 11 is the stereogram of the architectural overview of the digital still camera as electronic equipment that the oscillator 2 had as the electronic device of one embodiment of the present invention is shown.In addition, in the figure, the connection between external equipment is also shown simply.Here, film camera in the past carries out photosensitive by the light image of subject to silver film, on the other hand, digital still camera 1300 carries out opto-electronic conversion by imaging apparatuss such as CCD (Charge Coupled Device: charge coupled device) to the light image of subject and generates image pickup signal (picture signal).
The back side of the shell (fuselage) 1302 in digital still camera 1300 is provided with display part 100, is configured to show according to the image pickup signal of CCD, and display part 100 plays function as view finder subject being shown as electronic image.Further, the face side (in figure rear side) of shell 1302 is provided with the light receiving unit 1304 comprising optical lens (image pickup optical system) and CCD etc.
When cameraman confirms the shot object image of display in display part 100 and presses shutter release button 1306, the image pickup signal of the CCD in this moment is transferred in memory 1308 and stores.Further, in this digital still camera 1300, the input and output terminal 1314 of video signal output terminal 1312 and data communication is provided with in the side of shell 1302.And, as shown in the figure, as required, video signal output terminal 1312 connects televimonitor 1430, data communication with input and output terminal 1314 on connect personal computer 1440.And, be configured to by predetermined operation, the image pickup signal be stored in memory 1308 outputted to televimonitor 1430 or personal computer 1440.The built-in oscillator 2 with the function of the timing source as signal transacting in such digital still camera 1300.
In addition, except the personal computer (mobile model personal computer) of Fig. 9, the mobile phone of Figure 10, beyond the digital still camera of Figure 11, oscillator 2 as the electronic device of an embodiment of the invention such as can also be applied to ink jet type discharger (such as ink-jet printer), laptop PC, TV, video camera, video tape recorder, on-vehicle navigation apparatus, beep-pager, electronic notebook (also comprising communication function), e-dictionary, calculator, electronic game station, word processor, work station, visual telephone, antitheft televimonitor, electronics binoculars, POS terminal, Medical Devices (such as electrothermometer, sphygmomanometer, blood-glucose meter, electrocardiogram measuring device, diagnostic ultrasound equipment, fujinon electronic video endoscope), fish finder, various sensing equipment, metrical instrument class (such as vehicle, aircraft, the metrical instrument class of boats and ships), the electronic equipments such as flight simulator.
< moving body >
Figure 12 is the stereogram of the automobile of the example roughly illustrated as moving body.Automobile 506 is equipped with the oscillator 2 as electronic device of the present invention.Such as, as shown in the drawing, as in the automobile 506 of moving body, car body 507 is equipped with electronic control unit 508, the built-in oscillator 2 of this electronic control unit 508 also controls tire 509 etc.In addition, oscillator 2 can also be widely used in the electronic control unit (ECU:electronic control unit) of battery monitor and car body attitude control systems etc. of Keyless door taboo, alarm, auto-navigation system, air conditioning for automobiles, anti-lock braking system (ABS), air bag, system for monitoring pressure in tyre (TPMS:Tire Pressure Monitoring System), engine controller, hybrid vehicle and electric automobile in addition.
Claims (13)
1. a vibrating elements, is characterized in that, this vibrating elements has:
Base portion;
Shaker arm, it has the 1st interarea and the 2nd interarea that are in positive inverse relation each other, and extension from described base portion; And
Side, it is connected with described 1st interarea and described 2nd interarea in the end of described shaker arm,
Described side has gradient relative to the vertical line of described 1st interarea or described 2nd interarea, be set to the inclined plane of described 2nd interarea from described 1st interarea always, and be crystal face.
2. vibrating elements according to claim 1, is characterized in that,
Described side is that logical overetched mistake etches formation.
3. vibrating elements according to claim 1 and 2, is characterized in that,
When the angle of setting the extended line on described inclined plane and described 1st interarea or described 2nd interarea to intersect is as θ, the gradient of described side is in the scope of 84 Dus of ≦ θ≤88 degree.
4. vibrating elements according to claim 1 and 2, is characterized in that,
Described shaker arm comprises:
Execute weight portion; And
Arm, it is configured at described in plan view executes between weight portion and described base portion,
The end in weight portion is executed described in described side is arranged at.
5. vibrating elements according to claim 4, is characterized in that,
When the angle of setting the extended line on described inclined plane and described 1st interarea or described 2nd interarea to intersect is as θ, the gradient of described side is in the scope of 84 Dus of ≦ θ≤88 degree.
6. vibrating elements according to claim 1 and 2, is characterized in that,
In plan view, the connecting portion of described inclined plane and described 1st interarea and described inclined plane and distance L between the connecting portion of described 2nd interarea meet the relation of 0 μm of < L≤100 μm.
7. vibrating elements according to claim 6, is characterized in that,
Described distance L meets the relation of 3 μm of < L≤10 μm.
8. a resonator device, is characterized in that, this resonator device has:
Vibrating elements described in claim 1 or 2; And
Comprise the container of lid and substrate,
Be equipped with described vibrating elements in the above-described container.
9. resonator device according to claim 8, is characterized in that,
The inclined plane of described vibrating elements tilts towards the narrower side in interval in described vibrating elements and the interval of described lid and the interval of described vibrating elements and described substrate.
10. a resonator device, is characterized in that, this resonator device has:
Vibrating elements described in claim 1 or 2; And
Circuit.
11. 1 kinds of electronic equipments, is characterized in that, this electronic equipment has the vibrating elements described in claim 1 or 2.
12. 1 kinds of moving bodys, is characterized in that, this moving body has the vibrating elements described in claim 1 or 2.
The manufacture method of 13. 1 kinds of vibrating elements, is characterized in that, this manufacture method comprises following operation:
Prepared substrate;
Form the mask corresponding with the profile of vibrating elements on the substrate; And
The described substrate in the region of exposing from described mask is etched,
Etch as follows in the operation of described etching: the time of this etching is than long by etching the time making described substrate through.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013-131937 | 2013-06-24 | ||
| JP2013131937A JP2015008353A (en) | 2013-06-24 | 2013-06-24 | Vibration element, vibration device, electronic apparatus, moving body, and method of manufacturing vibration element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104242867A true CN104242867A (en) | 2014-12-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410283130.0A Pending CN104242867A (en) | 2013-06-24 | 2014-06-23 | Resonator element, resonator device, electronic apparatus, moving object, and method of manufacturing resonator element |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US9425768B2 (en) |
| JP (1) | JP2015008353A (en) |
| CN (1) | CN104242867A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105789140A (en) * | 2015-01-13 | 2016-07-20 | 精工爱普生株式会社 | Vibration element, vibration element manufacturing method, electronic device, electronic apparatus, and moving object |
| CN108631749A (en) * | 2017-03-24 | 2018-10-09 | 精工爱普生株式会社 | Vibration device, oscillator, gyro sensor, electronic equipment and moving body |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6155897B2 (en) * | 2013-06-24 | 2017-07-05 | セイコーエプソン株式会社 | Vibrating piece, vibrator, electronic device, electronic device, and moving object |
| US9287882B2 (en) * | 2013-11-07 | 2016-03-15 | Kyocera Crystal Device Corporation | Temperature compensated crystal oscillator |
| TWI634742B (en) * | 2013-11-16 | 2018-09-01 | 精工愛普生股份有限公司 | Resonator blank, resonator, oscillator, electronic apparatus, and mobile object |
| US10110198B1 (en) * | 2015-12-17 | 2018-10-23 | Hrl Laboratories, Llc | Integrated quartz MEMS tuning fork resonator/oscillator |
| JP6959873B2 (en) * | 2018-01-22 | 2021-11-05 | エスアイアイ・クリスタルテクノロジー株式会社 | Piezoelectric vibrating piece and piezoelectric vibrator, and manufacturing method |
| WO2019188078A1 (en) * | 2018-03-30 | 2019-10-03 | 株式会社村田製作所 | Vibration element |
| JPWO2021117272A1 (en) * | 2019-12-09 | 2021-06-17 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101142742A (en) * | 2005-04-18 | 2008-03-12 | 株式会社大真空 | Piezoelectric vibration piece and piezoelectric vibration device |
| CN101772888A (en) * | 2007-08-06 | 2010-07-07 | 日本电波工业株式会社 | Tuning-fork type crystal resonator and method of frequency adjustment thereof |
| CN102025341A (en) * | 2009-09-11 | 2011-04-20 | 精工爱普生株式会社 | Resonator element, resonator, oscillator, and electronic device |
| CN102195610A (en) * | 2010-03-16 | 2011-09-21 | 精工爱普生株式会社 | Resonator element, piezoelectric device, and electronic device |
| JP2011205430A (en) * | 2010-03-25 | 2011-10-13 | Seiko Epson Corp | Electronic component |
| JP2013078043A (en) * | 2011-09-30 | 2013-04-25 | Citizen Finetech Miyota Co Ltd | Method of manufacturing piezoelectric vibrator |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5277690A (en) * | 1975-12-24 | 1977-06-30 | Seiko Epson Corp | Turning fork type crystal resonator |
| JP2001156584A (en) | 1999-11-30 | 2001-06-08 | Sony Corp | Piezoelectric element and its manufacturing method |
| JP4547788B2 (en) | 2000-03-15 | 2010-09-22 | セイコーエプソン株式会社 | Package structure of piezoelectric vibrator |
| JP4211578B2 (en) | 2003-11-13 | 2009-01-21 | セイコーエプソン株式会社 | Piezoelectric vibrating piece, manufacturing method thereof, piezoelectric device, mobile phone device using piezoelectric device, and electronic apparatus using piezoelectric device |
| JP2005151423A (en) | 2003-11-19 | 2005-06-09 | Seiko Epson Corp | Piezoelectric vibration chip and piezoelectric device and method of manufacturing them, and mobile telephone apparatus using piezoelectric device, and electronic apparatus using piezoelectric device |
| JP4631329B2 (en) * | 2004-07-01 | 2011-02-16 | パナソニック株式会社 | Angular velocity sensor and manufacturing method thereof |
| JP4741385B2 (en) | 2006-02-24 | 2011-08-03 | 京セラ株式会社 | Structure |
| JP2008022413A (en) | 2006-07-14 | 2008-01-31 | Epson Toyocom Corp | Piezoelectric vibration chip and piezoelectric device |
| JP5175128B2 (en) | 2008-04-04 | 2013-04-03 | 日本電波工業株式会社 | Tuning fork type piezoelectric vibrating piece and piezoelectric device |
| JP4709884B2 (en) * | 2008-09-29 | 2011-06-29 | 日本電波工業株式会社 | Piezoelectric vibrating piece and piezoelectric device |
| JP5760413B2 (en) * | 2010-12-08 | 2015-08-12 | セイコーエプソン株式会社 | Electronics |
| JP5839919B2 (en) * | 2011-09-28 | 2016-01-06 | エスアイアイ・クリスタルテクノロジー株式会社 | Piezoelectric vibrating piece, piezoelectric vibrator, oscillator, electronic device, and radio clock |
| JP2013078046A (en) | 2011-09-30 | 2013-04-25 | Citizen Finetech Miyota Co Ltd | Method of manufacturing piezoelectric vibrator, and piezoelectric vibrator |
| JP5864189B2 (en) | 2011-09-30 | 2016-02-17 | シチズンファインデバイス株式会社 | Piezoelectric vibrator and manufacturing method thereof |
| JP2013078045A (en) | 2011-09-30 | 2013-04-25 | Citizen Finetech Miyota Co Ltd | Piezoelectric vibrator and method of manufacturing the same |
| JP2015149590A (en) * | 2014-02-06 | 2015-08-20 | セイコーエプソン株式会社 | Method of manufacturing vibration element, vibration element, electronic device, electronic apparatus and mobile object |
-
2013
- 2013-06-24 JP JP2013131937A patent/JP2015008353A/en not_active Withdrawn
-
2014
- 2014-06-23 CN CN201410283130.0A patent/CN104242867A/en active Pending
- 2014-06-24 US US14/313,637 patent/US9425768B2/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101142742A (en) * | 2005-04-18 | 2008-03-12 | 株式会社大真空 | Piezoelectric vibration piece and piezoelectric vibration device |
| CN101772888A (en) * | 2007-08-06 | 2010-07-07 | 日本电波工业株式会社 | Tuning-fork type crystal resonator and method of frequency adjustment thereof |
| CN102025341A (en) * | 2009-09-11 | 2011-04-20 | 精工爱普生株式会社 | Resonator element, resonator, oscillator, and electronic device |
| CN102195610A (en) * | 2010-03-16 | 2011-09-21 | 精工爱普生株式会社 | Resonator element, piezoelectric device, and electronic device |
| JP2011205430A (en) * | 2010-03-25 | 2011-10-13 | Seiko Epson Corp | Electronic component |
| JP2013078043A (en) * | 2011-09-30 | 2013-04-25 | Citizen Finetech Miyota Co Ltd | Method of manufacturing piezoelectric vibrator |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105789140A (en) * | 2015-01-13 | 2016-07-20 | 精工爱普生株式会社 | Vibration element, vibration element manufacturing method, electronic device, electronic apparatus, and moving object |
| CN105789140B (en) * | 2015-01-13 | 2019-11-12 | 精工爱普生株式会社 | Vibrating elements and its manufacturing method, electronic device, electronic equipment and moving body |
| CN108631749A (en) * | 2017-03-24 | 2018-10-09 | 精工爱普生株式会社 | Vibration device, oscillator, gyro sensor, electronic equipment and moving body |
| CN108631749B (en) * | 2017-03-24 | 2023-10-10 | 精工爱普生株式会社 | Vibration device, oscillator, gyro sensor, electronic apparatus, and moving body |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2015008353A (en) | 2015-01-15 |
| US20140375178A1 (en) | 2014-12-25 |
| US9425768B2 (en) | 2016-08-23 |
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