CN104239645A - Design method and system for anti-vibration reliability of micro assembly component - Google Patents
Design method and system for anti-vibration reliability of micro assembly component Download PDFInfo
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Abstract
The invention relates to a design method and a system for the anti-vibration reliability of a micro assembly component. The design method comprises the following steps of building a vibration characteristic simulation finite element model according to a structure of the micro assembly component; obtaining a corresponding relation between different weld joint widths and a first natural frequency according to the vibration characteristic simulation finite element model, and further acquiring a weld joint critical width corresponding to a preset critical frequency; calculating to obtain welding critical power and a welding electrode critical angle according to the weld joint critical width, designing seam welding key process parameters of the micro assembly component, and carrying out seam welding processing on the micro assembly component according to the determined welding critical power and the welding electrode critical angle. According to the design method, the vibration characteristic simulation finite element model is built to carry out vibration simulative emulation to confirm the weld joint critical width, and the seam welding key process parameters can be confirmed by adopting the weld joint critical width as a criterion, so that compared with the traditional micro assembly component design method, the anti-vibration reliability of the micro assembly component is improved.
Description
Technical field
The present invention relates to electronic reliability design field, particularly relate to a kind of micro-assembled components antivibration Reliability Design method and system.
Background technology
Along with scientific development and social progress, more and more higher to the integration level necessitates of electronic product.Micro-assembled components refers to the superintegrated function element being carried out by the materials such as electronic devices and components metal encapsulating, and electronic devices and components wherein can be protected to avoid atmosphere vapour to corrode.Present micro-assembled components mainly adopts parallel seam welding technique to carry out welded encapsulation.
For ensureing the antivibration reliability of micro-assembled components, product should be optimized design in the welded structure of development to parallel seam welding metal-packaged shell, avoids micro-assembled components metal-packaged shell to there is resonance risk in 20 ~ 2000Hz frequency range.Traditional micro-assembled components parallel seam welding Optimization Design is carried out with seam Welding applicability for the impermeability of subassembly product, by engineer testing optimization seam welding electrode angle, weld width to meet the bubble-tight requirement of micro-assembled components, but under can not eliminating vibration environment, metal-packaged shell possibility resonance causes the risk ftractureed, and there is the shortcoming that antivibration reliability is low.
Summary of the invention
Based on this, be necessary for the problems referred to above, a kind of micro-assembled components antivibration Reliability Design method and system improving antivibration reliability is provided.
A kind of micro-assembled components antivibration Reliability Design method, comprises the following steps:
Vibration characteristics emulation finite element model is set up according to the encapsulating structure of micro-assembled components;
The corresponding relation curve of different weld width and corresponding first natural frequency is extracted according to described vibration characteristics emulation finite element model;
According to the corresponding relation curve of different weld width and corresponding first natural frequency, obtain the weld seam critical width that the threshold frequency preset is corresponding;
Welding critical power and welding electrode critical angle is obtained according to the computational analysis of described weld seam critical width;
According to described welding critical power and welding electrode critical angle, the process of seam Welding is carried out to micro-assembled components.
A kind of micro-assembled components antivibration Reliability Design system, comprising:
Build module, for setting up vibration characteristics emulation finite element model according to the encapsulating structure of micro-assembled components;
Extraction module, for extracting the corresponding relation curve of different weld width and corresponding first natural frequency according to described vibration characteristics emulation finite element model;
Acquisition module, for the corresponding relation curve according to different weld width and corresponding first natural frequency, obtains the weld seam critical width that default threshold frequency is corresponding;
Processing module, for obtaining welding critical power and welding electrode critical angle according to the computational analysis of described weld seam critical width;
Seam weldering module, for carrying out the process of seam Welding according to described welding critical power and welding electrode critical angle to micro-assembled components.
Above-mentioned micro-assembled components antivibration Reliability Design method and system, vibration characteristics emulation finite element model is set up according to the encapsulating structure of micro-assembled components, obtain the corresponding relation curve of different weld width and first natural frequency according to vibration characteristics emulation finite element model, and then obtain weld seam critical width corresponding to default threshold frequency.Welding critical power and welding electrode critical angle is calculated according to weld seam critical width, the parallel seam welding key process parameter of micro-assembled components is designed, according to the welding critical power determined and welding electrode critical angle, seam weldering process is carried out to micro-assembled components.By set up vibration characteristics emulation finite element model carry out vibration simulation emulation determine weld seam critical width, and with weld seam critical width for criterion determination weld seam key process parameter, compared with traditional micro-assembled components packaging technology method for designing, improve the antivibration reliability of micro-assembled components.
Accompanying drawing explanation
Fig. 1 is the process flow diagram of micro-assembled components antivibration Reliability Design method in an embodiment;
Fig. 2 is the corresponding relation curve synoptic diagram of parallel weld width and corresponding first natural frequency in an embodiment;
Fig. 3 is the structural drawing of micro-assembled components antivibration Reliability Design system in an embodiment.
Embodiment
For enabling above-mentioned purpose of the present invention, feature and advantage become apparent more, are described in detail the specific embodiment of the present invention below in conjunction with accompanying drawing.Set forth a lot of detail in the following description so that fully understand the present invention.But the present invention can be much different from alternate manner described here to implement, those skilled in the art can when without prejudice to doing similar improvement when intension of the present invention, therefore the present invention is by the restriction of following public specific embodiment.
Unless otherwise defined, all technology used herein and scientific terminology are identical with belonging to the implication that those skilled in the art of the present invention understand usually.The object of term used in the description of the invention herein just in order to describe specific embodiment, is not intended to be restriction the present invention.
A kind of micro-assembled components antivibration Reliability Design method, as shown in Figure 1, comprises the following steps:
Step S110: set up vibration characteristics emulation finite element model according to the encapsulating structure of micro-assembled components.
Micro-assembled components can be specifically HIC (hybrid integrated circuit, hydrid integrated circuit), microwave hybrid integrated circuit, microwave components or SiP (System In a Package, system in package) assembly etc., encapsulating material can be metal, plastics or pottery etc.
Wherein in an embodiment, step S110 comprises step 11 to step 13.
Step 11: set up corresponding solid model according to the encapsulating structure of micro-assembled components.
Step 12: set up according to solid model and initially emulate finite element model, and the emulation modal parameter extracting initial emulation finite element model.Emulation modal parameter is used for modelling verification and correction.
The first eight rank Mode Shape and the first eight rank natural frequency that modal parameter specifically can comprise micro-assembled components is emulated in the present embodiment.
The natural frequency of micro-assembled components meets secular equation
|[K]-ω
2[M]|＝0，
Wherein, [K] is the global stiffness matrix of micro-assembled components, the gross mass matrix that [M] is micro-assembled components, ω
2for the resonance frequency of micro-assembled components.
Be appreciated that the concrete data verifying characterisitic parameter are not unique, can adjust according to actual conditions.
Step 13: the modal test test parameter extracting micro-assembled components, contrast with emulation modal parameter, and according to modal test test parameter, initial emulation finite element model is revised, until emulation modal parameter mates with modal test test parameter, obtain vibration characteristics emulation finite element model.
Accordingly, modal test test parameter also comprises the first eight rank Mode Shape and the first eight rank natural frequency of micro-assembled components.
Specifically can carry out modal test under the outer pin rigid constraint condition of micro-assembled components, equidistant displacing force can be adopted to hammer method into shape, modal test is carried out to the micro-assembled components be arranged on elastic restraint vibration test fixture.Degree of will speed up sensor is arranged on the preset reference point of vibrating fatigue damage sensitizing range of micro-assembled components, when displacing force hammer knocks the hammer point of micro-assembled components, gathers force signal and the signal for faster of reference point, and then obtains corresponding frequency response function.
The first eight rank Mode Shape of micro-assembled components and the first eight rank natural frequency is extracted according to frequency response function analysis.The frequency response function that test obtains is imported in model analysis software, carries out modal idenlification, after rejecting false mode, obtain the first eight rank eigenfrequncies and vibration models of micro-assembled components.According to Kind of Modal Confidence Factor MAC value and the natural frequency value of eight first order modes, when the first eight first order mode is orthogonal, utilize the first eight first order mode matching frequency response function.
Judge that whether emulation modal parameter is consistent with modal test test parameter, if not, then initial emulation finite element model is revised, and acquisition emulation modal parameter judges again again; If so, vibration characteristics emulation finite element model is then obtained.Correction model being carried out to natural frequency specifically can comprise: finite element grid type and density correction, border degree of freedom constraint condition correction, the correction of interracial contact mode, mechanical parameters correction.Adopt the Mode Shape of Mode Shape pairing comparision to model one by one to revise, take into account corresponding natural frequency result in makeover process, to ensure that Mode Shape and natural frequency are all consistent with measured result simultaneously.By contrast simulation modal parameter and modal test test parameter, model is revised, improve the accuracy of model.
Step S120: the corresponding relation curve extracting different weld width and corresponding first natural frequency according to vibration characteristics emulation finite element model.
Choosing of weld width value can be determined according to the shell sizes of micro-assembled components or seam Welding technical controlling scope.Seam Welding is specially parallel seam welding technique.In the present embodiment, weld width selection range is 5% ~ 100% of micro-assembled components outer shell cavity wall thickness, or weld width value is 200 microns ~ 1000 microns.Can choose concrete width value within the scope of above-mentioned two kinds, value quantity is not unique.
According to vibration characteristics emulation finite element model, vibration characteristics emulation is carried out to micro-assembled components, obtain the natural frequency f on micro-assembled components first rank corresponding when different weld width
1.Obtain weld width w
iwith corresponding first natural frequency f
1corresponding relation curve.
Step S130: according to the corresponding relation curve of different weld width and corresponding first natural frequency, obtains the weld seam critical width that the threshold frequency preset is corresponding.
The threshold frequency f preset
0specifically can determine according to the frequency range of micro-assembled components vibration test examination.In the present embodiment, threshold frequency is according to obtaining the frequency range of described micro-assembled components vibration test, specifically comprises step 31 to step 32.
Step 31: the frequency range extracting micro-assembled components random vibration test.
By the vibration test check requirements of GJB548B standard, the random vibration test frequency range of micro-assembled components is 20HZ ~ 2000Hz, can prestore frequency range.Be appreciated that the standard of frequency range is not unique.
Step 32: using the higher limit of frequency range and predeterminated frequency margin value sum as threshold frequency f
0.
The concrete value of predeterminated frequency margin value equally also can adjust according to actual conditions, and presetting antivibration margin value in the present embodiment is 10% of the higher limit of getting frequency range.Such as, when the random vibration test frequency range of micro-assembled components is 20HZ ~ 2000Hz, the higher limit of frequency range is 2000Hz, is added by the higher limit 2000Hz of 20HZ ~ 2000Hz just obtains threshold frequency, i.e. 2200Hz with default antivibration margin value 200Hz.
Wherein in an embodiment, obtaining weld seam critical width corresponding to threshold frequency preset is, weld width corresponding when the corresponding first natural frequency extracting micro-assembled components equals threshold frequency, as weld seam critical width.
According to the weld width w obtained in step S120
iwith corresponding first natural frequency f
1corresponding relation curve, obtain the corresponding first natural frequency f of micro-assembled components
1weld width corresponding when reaching 2200Hz, obtains weld seam critical width w
0.
Step S140: obtain welding critical power and welding electrode critical angle according to the computational analysis of weld seam critical width.
Welding electrode angle θ and weld width w is inversely proportional to, and welding electrode angle is less, the contact area of micro-assembled components cover plate and shell is larger, and reach enough weld strengths then needs higher bonding power, and therefore welding electrode angle θ and bonding power P also inversely.The corresponding relation of welding electrode angle and weld width, bonding power can be tested in advance respectively by test, the welding electrode angle that calculating weld seam critical width is corresponding, obtain welding electrode critical angle θ
0, then according to welding electrode critical angle θ
0calculate welding critical power P
0.
Step S150: the process of seam Welding is carried out to micro-assembled components according to welding critical power and welding electrode critical angle.
Seam weldering key process parameter according to determining in step S140 carries out seam weldering process to micro-assembled components.Particularly, be more than or equal to weld seam critical width for criterion with weld width, carry out welding electrode angle when seam weldering designs and can not be greater than welding electrode angle critical value, bonding power can not be less than bonding power critical value.
Wherein in an embodiment, step S140 can comprise step 41 and step 42.
Step 41: extract the seam weldering critical temperature value preset.
Seam weldering critical temperature value can be selected according to welded encapsulation temperature control requirement.Bonding power is higher, and the heat of generation is more, arranges seam weldering critical temperature value butt seam welding temperature and controls.
Step 42: obtain bonding power critical value and welding electrode angle critical value according to seam weldering critical width and seam weldering critical temperature value.
In the present embodiment, bonding power critical value comprises higher limit and lower limit.Welding electrode angle critical value is obtained according to seam weldering critical width, and the lower limit of bonding power, then according to the higher limit of seam weldering critical temperature value determination bonding power, specifically can test bonding power in advance and stitch the corresponding relation welding temperature, thus calculate power corresponding to seam weldering critical temperature value, obtain the higher limit of bonding power.
Accordingly, when carrying out seam weldering process in step S150, then require that welding electrode angle can not be greater than welding electrode angle critical value, bonding power is between lower limit and higher limit.Limit further bonding power by arranging seam weldering critical temperature value, when avoiding welding, temperature is too high causes micro-assembled components internal component damage.
To carry out parallel seam welding to the electronic package of Metal Packaging, from the natural frequency f of single-degree-of-freedom system and the relational expression of its rigidity of structure k and quality m
Known, rigidity of structure k is directly proportional to natural frequency f, be inversely proportional to weight m.Therefore, the key parameter affecting parallel seam welding metal shell structure rigidity k or natural frequency f is throat thickness between metal cover board and cavity and width, because parallel seam welding is a kind of solderless resistance-welding process, throat thickness can be ignored, and the key parameter therefore affecting parallel seam welding metal shell natural frequency f is weld width.
Above-mentioned micro-assembled components antivibration Reliability Design method, vibration characteristics emulation finite element model is set up according to the encapsulating structure of micro-assembled components, obtain the corresponding relation of different weld width and corresponding first natural frequency according to vibration characteristics emulation finite element model, and then obtain weld seam critical width corresponding to default threshold frequency.Welding critical power and welding electrode critical angle is calculated according to weld seam critical width, the parallel seam welding key process parameter of micro-assembled components is designed, according to the welding critical power determined and welding electrode critical angle, seam weldering process is carried out to micro-assembled components.By set up vibration characteristics emulation finite element model carry out vibration simulation emulation determine weld seam critical width, and with weld seam critical width for criterion determines the key process parameter stitching weldering, compared with traditional micro-assembled components method for designing, improve the antivibration reliability of micro-assembled components.
In order to the technical scheme of understanding above-mentioned micro-assembled components antivibration Reliability Design method better and the beneficial effect brought, carry out detailed explanation explanation below in conjunction with specific embodiment.
For the hermetically metal sealing parallel seam welding antivibration Reliability Design of hydrid integrated circuit (one of micro-assembled components), determine this hydrid integrated circuit level Hermetic Package antivibration Reliability Design index.According to standard " GJB548B-2005 microelectronic component Test Methods And Procedures ", its random vibration examination frequency range 20 ~ 2000Hz, determines the threshold frequency f of hydrid integrated circuit antivibration reliability
0=2200Hz.
Step 1: the vibration characteristics emulation finite element model setting up this hydrid integrated circuit.Adopt parallel seam welding technique to know the real situation sample, weld width gets w=200 μm, verifies with modal test, demonstrates the first eight rank Mode Shape and natural frequency, Modifying model Post RDBMS.
Step 2: the parallel different weld width w setting up hydrid integrated circuit
iwith first natural frequency f
1corresponding data relation.The parallel weld width w obtained
iwith corresponding first natural frequency f
1as shown in Figure 2, wherein horizontal ordinate represents corresponding first natural frequency f to corresponding data relationship
1, unit is Hz, and ordinate represents the weld width w of parallel seam welding
i, unit is micron.
Step 3: the data relationship corresponding with corresponding first natural frequency according to the weld width of the parallel seam welding of above-mentioned acquisition, the first natural frequency extracting hydrid integrated circuit reaches weld width corresponding to 2200Hz, i.e. this production joint critical width w
0=310 μm, meet the minimum weld width requirement of antivibration Reliability Design requirement as hydrid integrated circuit.
Step 4: this type hydrid integrated circuit parallel seam welding key process parameter of optimal design.According to the weld seam critical width value w obtained
0=310 μm, and welded encapsulation temperature control requirement optimal design affects the key process parameter of weld width w: bonding power P and welding electrode angle θ.
Step 5: the span according to the key process parameter obtained carries out parallel seam welding process to hydrid integrated circuit, realizes product and meets antivibration Reliability Design requirement.
By electronic package antivibration Reliability Design method provided by the invention, accurately make the antivibration Reliability Design threshold frequency of product, and be extracted the weld seam critical width w of product parallel seam welding easily by finite element simulation simulation means
0, and then by critical width w
0as weld seam Anti-vibration Design foundation, optimal design parallel seam welding key process parameter.By the design optimization of design phase to electronic component package seam Welding, realize the reliability application of electronic package in high-end product and highly reliable complete machine.
Present invention also offers a kind of micro-assembled components antivibration Reliability Design system, as shown in Figure 3, comprise and build module 110, extraction module 120, acquisition module 130, processing module 140 and seam weldering module 150.
Build module 110 for setting up vibration characteristics emulation finite element model according to the encapsulating structure of micro-assembled components.
Micro-assembled components can be specifically HIC, microwave hybrid integrated circuit, microwave components or SiP assembly etc., and encapsulating material can be metal, plastics or pottery etc.
Wherein in an embodiment, build module 110 and comprise the first establishment unit, the second establishment unit and amending unit.
First sets up unit is used for setting up corresponding solid model according to the encapsulating structure of micro-assembled components.
Second sets up unit is used for setting up according to solid model initially emulating finite element model, and extracts the emulation modal parameter of initial emulation finite element model.Emulation modal parameter is used for modelling verification and correction.
The first eight rank Mode Shape and the first eight rank natural frequency that modal parameter specifically can comprise micro-assembled components is emulated in the present embodiment.
The natural frequency of micro-assembled components meets secular equation
|[K]-ω
2[M]|＝0，
Wherein, [K] is the global stiffness matrix of micro-assembled components, the gross mass matrix that [M] is micro-assembled components, ω
2for the resonance frequency of micro-assembled components.
Be appreciated that the concrete data verifying characterisitic parameter are not unique, can adjust according to actual conditions.
Amending unit is for extracting the modal test test parameter of micro-assembled components, contrast with emulation modal parameter, and according to modal test test parameter, initial emulation finite element model is revised, until emulation modal parameter mates with modal test test parameter, obtain vibration characteristics emulation finite element model.
Accordingly, modal test test parameter comprises the first eight rank Mode Shape and the first eight rank natural frequency of micro-assembled components.The obtain manner of modal test test parameter is explained in detail explanation in step s 110, does not repeat at this.By contrast simulation modal parameter and modal test test parameter, model is revised, improve the accuracy of model.
Extraction module 120 is for extracting the corresponding relation of weld width value and corresponding first natural frequency according to vibration characteristics emulation finite element model.
Choosing of weld width value can be determined according to the shell sizes of micro-assembled components or seam Welding technical controlling scope.For parallel seam welding, in the present embodiment, weld width value is 5% ~ 100% of the enclosure cavity thickness of micro-assembled components, or weld width value is 200 microns ~ 1000 microns.
Acquisition module 130, for the corresponding relation curve according to different weld width and corresponding first natural frequency, obtains the weld seam critical width that default threshold frequency is corresponding.
The threshold frequency f preset
0specifically can determine according to the frequency range of micro-assembled components vibration test examination.In the present embodiment, threshold frequency is that micro-assembled components antivibration Reliability Design system also can comprise frequency abstraction module and frequency processing module according to obtaining the frequency range of described micro-assembled components vibration test.
Frequency abstraction module is for extracting the frequency range of micro-assembled components vibration-testing.
By the vibration test check requirements of GJB548B standard, the random vibration test frequency range of micro-assembled components is 20HZ ~ 2000Hz, can prestore frequency range.Be appreciated that the standard of frequency range is not unique.
Frequency processing module is used for the higher limit of frequency range and default antivibration margin value sum as threshold frequency.
The concrete value of predeterminated frequency margin value equally also can adjust according to actual conditions, and in the present embodiment, predeterminated frequency margin value is 10% of the higher limit of getting frequency range.When the random vibration test frequency range of micro-assembled components is 20HZ ~ 2000Hz, the higher limit of frequency range is 2000Hz, is added by the higher limit 2000Hz of 20HZ ~ 2000Hz just obtains threshold frequency, i.e. 2200Hz with default antivibration margin value 200Hz.
Further, obtaining weld seam critical width corresponding to threshold frequency preset can be the weld width corresponding when equaling threshold frequency of the first natural frequency extracting micro-assembled components, as weld seam critical width.
Obtain the frequency equaling 2200Hz in the corresponding first natural frequency of micro-assembled components, according to the corresponding relation of weld width and natural frequency, weld width corresponding when the first natural frequency obtaining micro-assembled components reaches 2200Hz, obtains weld seam critical width.
Processing module 140 is for obtaining welding critical power and welding electrode critical angle according to the computational analysis of weld seam critical width.
Welding electrode angle and weld width are inversely proportional to, and welding electrode angle is less, larger with the cover plate contact area of micro-assembled components, reach enough weld strengths then needs higher bonding power, and therefore welding electrode angle and bonding power are also inversely.The corresponding relation of welding electrode angle and weld width, bonding power can be tested in advance respectively by test, calculate the welding electrode angle that weld seam critical width is corresponding, obtain welding electrode angle critical value, then calculate bonding power critical value according to welding electrode angle critical value.
Seam weldering module 150 is for carrying out seam weldering process according to welding critical power and welding electrode critical angle to micro-assembled components.
Seam weldering key process parameter according to determining carries out seam weldering process to micro-assembled components.Particularly, be more than or equal to weld seam critical width for criterion with weld width, carry out welding electrode angle when seam weldering designs and can not be greater than welding electrode angle critical value, bonding power can not be less than bonding power critical value.
Wherein in an embodiment, processing module 140 comprises temperature extraction unit and processing unit.
Temperature extraction unit is for extracting default seam weldering critical temperature value.
Seam weldering critical temperature value can be selected according to welded encapsulation temperature control requirement.Bonding power is higher, and the heat of generation is more, arranges seam weldering critical temperature value butt seam welding temperature and controls.
Processing unit is used for obtaining bonding power critical value and welding electrode angle critical value according to seam weldering critical width and seam weldering critical temperature value.
In the present embodiment, bonding power critical value comprises higher limit and lower limit.Welding electrode angle critical value is obtained according to seam weldering critical width, and the lower limit of bonding power, then according to the higher limit of seam weldering critical temperature value determination bonding power, specifically can test bonding power in advance and stitch the corresponding relation welding temperature, thus calculate power corresponding to seam weldering critical temperature value, obtain the higher limit of bonding power.
Accordingly, when seam weldering module 150 carries out seam weldering process, then require that welding electrode angle can not be greater than welding electrode angle critical value, bonding power is between lower limit and higher limit.Limit further bonding power by arranging seam weldering critical temperature value, when avoiding welding, temperature is too high causes micro-assembled components internal component damage.
Above-mentioned micro-assembled components antivibration Reliability Design system, build module 110 and set up vibration characteristics emulation finite element model according to the encapsulating structure of micro-assembled components, extraction module 120 obtains the corresponding relation of different weld width and corresponding first natural frequency according to vibration characteristics emulation finite element model, and acquisition module 130 obtains weld seam critical width corresponding to default threshold frequency according to weld width and the corresponding relation of corresponding first natural frequency.Processing module 140 calculates welding critical power and welding electrode critical angle according to weld seam critical width, designs the seam weldering key process parameter of micro-assembled components.Seam weldering module 150 carries out seam weldering process according to the welding critical power determined and welding electrode critical angle to micro-assembled components.By set up vibration characteristics emulation finite element model carry out vibration simulation emulation determine weld seam critical width, and with weld seam critical width for criterion determines seam weldering key process parameter, compared with traditional micro-assembled components method for designing, improve the antivibration reliability of micro-assembled components.
The above embodiment only have expressed several embodiment of the present invention, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.
Claims (9)
1. a micro-assembled components antivibration Reliability Design method, is characterized in that, comprise the following steps:
Vibration characteristics emulation finite element model is set up according to the encapsulating structure of micro-assembled components;
The corresponding relation curve of different weld width and corresponding first natural frequency is extracted according to described vibration characteristics emulation finite element model;
According to the corresponding relation curve of different weld width and corresponding first natural frequency, obtain the weld seam critical width that the threshold frequency preset is corresponding;
Welding critical power and welding electrode critical angle is obtained according to the computational analysis of described weld seam critical width;
According to described welding critical power and welding electrode critical angle, the process of seam Welding is carried out to micro-assembled components.
2. micro-assembled components antivibration Reliability Design method according to claim 1, is characterized in that, the described encapsulating structure according to micro-assembled components sets up the step of vibration characteristics emulation finite element model, comprising:
Encapsulating structure according to described micro-assembled components sets up corresponding solid model;
Set up according to described solid model and initially emulate finite element model, and extract the emulation modal parameter of described initial emulation finite element model;
Extract the modal test test parameter of described micro-assembled components, contrast with described emulation modal parameter, and according to described modal test test parameter, described initial emulation finite element model is revised, until emulation modal parameter mates with described modal test test parameter, obtain described vibration characteristics emulation finite element model.
3. micro-assembled components antivibration Reliability Design method according to claim 1, is characterized in that, described threshold frequency is according to obtaining the frequency range of described micro-assembled components vibration test, specifically comprises the following steps:
Extract the frequency range of described micro-assembled components vibration test;
Using the higher limit of described frequency range and predeterminated frequency margin value sum as described threshold frequency.
4. micro-assembled components antivibration Reliability Design method according to claim 1, it is characterized in that, weld seam critical width corresponding to the threshold frequency preset of described acquisition is, weld width corresponding when the corresponding first natural frequency extracting described micro-assembled components equals described threshold frequency, as described weld seam critical width.
5. micro-assembled components antivibration Reliability Design method according to claim 1, is characterized in that, the described step obtaining welding critical power and welding electrode critical angle according to the computational analysis of described weld seam critical width, comprising:
Extract the seam weldering critical temperature value preset;
Described welding critical power and welding electrode critical angle is obtained according to described weld seam critical width and seam weldering critical temperature value.
6. a micro-assembled components antivibration Reliability Design system, is characterized in that, comprising:
Build module, for setting up vibration characteristics emulation finite element model according to the encapsulating structure of micro-assembled components;
Extraction module, for extracting the corresponding relation curve of different weld width and corresponding first natural frequency according to described vibration characteristics emulation finite element model;
Acquisition module, for the corresponding relation curve according to different weld width and corresponding first natural frequency, obtains the weld seam critical width that default threshold frequency is corresponding;
Processing module, for obtaining welding critical power and welding electrode critical angle according to the computational analysis of described weld seam critical width;
Seam weldering module, for carrying out the process of seam Welding according to described welding critical power and welding electrode critical angle to micro-assembled components.
7. will go the micro-assembled components antivibration Reliability Design system described in 6 according to right, it is characterized in that, described structure module comprises:
First sets up unit, for setting up corresponding solid model according to the encapsulating structure of described micro-assembled components;
Second sets up unit, initially emulates finite element model, and extract the emulation modal parameter of described initial emulation finite element model for setting up according to described solid model;
Amending unit, for extracting the modal test test parameter of described micro-assembled components, contrast with described emulation modal parameter, and according to described modal test test parameter, described initial emulation finite element model is revised, until emulation modal parameter mates with described modal test test parameter, obtain described vibration characteristics emulation finite element model.
8. will go the micro-assembled components antivibration Reliability Design system described in 6 according to right, it is characterized in that, described threshold frequency is according to obtaining the frequency range of described micro-assembled components vibration test; Described system also comprises:
Frequency abstraction module, for extracting the frequency range of described micro-assembled components vibration test;
Frequency processing module, for using the higher limit of described frequency range and predeterminated frequency margin value sum as described threshold frequency.
9. will go the micro-assembled components antivibration Reliability Design system described in 6 according to right, it is characterized in that, described processing module comprises:
Temperature extraction unit, for extracting default seam weldering critical temperature value;
Processing unit, for obtaining described welding critical power and welding electrode critical angle according to described weld seam critical width and seam weldering critical temperature value.
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| CN109523548A (en) * | 2018-12-21 | 2019-03-26 | 哈尔滨工业大学 | A kind of narrow gap weld seam Feature Points Extraction based on threshold limit value |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109523548A (en) * | 2018-12-21 | 2019-03-26 | 哈尔滨工业大学 | A kind of narrow gap weld seam Feature Points Extraction based on threshold limit value |
| CN109523548B (en) * | 2018-12-21 | 2023-05-05 | 哈尔滨工业大学 | Narrow-gap weld characteristic point extraction method based on critical threshold |
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