CN104233291A - Intelligent semiconductor laser manufacturing and remanufacturing repairing technology for molds - Google Patents
Intelligent semiconductor laser manufacturing and remanufacturing repairing technology for molds Download PDFInfo
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- CN104233291A CN104233291A CN201410477476.4A CN201410477476A CN104233291A CN 104233291 A CN104233291 A CN 104233291A CN 201410477476 A CN201410477476 A CN 201410477476A CN 104233291 A CN104233291 A CN 104233291A
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Abstract
The invention discloses an intelligent semiconductor laser manufacturing and remanufacturing repairing technology for molds. The technology comprises the technological steps as follows: (1) surface pretreatment of the molds; (2) selection of alloy powder and adjustment of an automatic powder delivery device; (3) laser cladding of abrasion-resistant coatings; (4) flaw detection after cladding. By the aid of the technology, the abrasion resistance of the molds is significantly improved, and service lives of the molds are significantly prolonged; the technology is applied to manufacturing and repairing remanufacturing of the molds, the production cost is reduced, and the product quality is improved.
Description
Technical field
The present invention relates to field of laser cladding, be specially a kind of intelligent semiconductor laser manufacture for mould and manufacture renovation technique again.
Background technology
Mould is one of equipment important in forming process, it directly affects the quality of product, performance and production cycle, mould generally can be divided into forming mould and deforming moulds, forming mould is mainly used in the manufacture fields such as automobile, household electrical appliances, electronics and information industry, unicircuit, wide in variety, complex-shaped, manufactured materials is varied, and manufacturing process is complicated, the production cycle is long, cost is high.At present, the die life that China manufactures is only 50-100 ten thousand times, and the life-span is lower than external 160-300 ten thousand times, die manufacturing cycle still than state foreign minister 2-4 doubly, manufacture level still has larger gap compared with the developed country such as the U.S., Japan, many high terminal moulds still dependence on import, and imbalance between supply and demand is given prominence to.And in use, once mould lost efficacy, can only stop production and slow down, and add enterprise's production cost, and reduce the market competitiveness of enterprise.
Laser remanufacturing is a kind of advanced recovery technique of novel concept.By carrying out local manufacture fast, reconstruct, amendment, repair deficiency (shape reparation, repairing sizes, function reparation, enhancement function reparation), mended crack (the shallow-layer be full of cracks on Motorcycle Mould surface) and surface strengthening (surface easy to wear of new and old mould and roll) to waste and old valuable mould, extraordinary mould, form the top layer with gradient function, make the local of mould possess the characteristics such as wear-resisting, corrosion-resistant, shock-resistant.
Direct Laser Fabrication Technology is in fact computer-controlled three-dimensional laser cladding, its ultimate principle is the mixed metal powder that fusing is directly injected to focus, or directly solidify macromolecular material, according to the determined geological information of cad model under the control of computer delamination software, make x, y coordinate motion, laser beam carries out two-dimensional scan, worktable makes Z axis step motion by set(ting)value simultaneously, by the successively superposition of two dimensional surface, be piled into a 3D solid, directly obtain forming part (mould).This special formative method, compared with machining, can process any special, complicated Three-dimensional Entity Components, and utilize Direct Laser Fabrication Technology to make part, the positional precision of all manufacture areas is ± 0.05mm.According to shape and the structure of moulding part, lasing beam diameter can be selected between 0.15mm-1.5mm.Slice thickness can be selected between 0.05mm-0.3mm.
Due to the very high power density that laser has, can at instant melting refractory metal, produce metalwork and mould that conventional casting methods or cannot be difficult to acquisition, its intensity even exceedes the intensity that routine casting or forging method obtain, and the metal parts and mould with gradient performance can be produced, substantially reduce the cycle of development of new products exemplar, reduce R&D costs.For under the extreme conditions such as aerospace, space exploration, micro-electronic manufacturing, deep-sea detecting, polar expedition, development is needed to have extraordinary short run mould and the part of independent intellectual property right, Direct Laser Fabrication Technology is herein is provided original solution, has wide development space.
High-power semiconductor laser, have that its volume is little, light and flexible, electro-optical efficiency are high, energy distribution is even, high with the specific absorption of material interaction, can the features such as closed-loop control be realized, the new type light source being laser manufacture and manufacturing again.Conventional high power CO
2laser is different, and high-performance semiconductor laser apparatus is incorporated into together with the form of optics by many semiconductor lasers.One piece of laser stripe array (bar bar), includes 20 to 25 independently bars, and typical size is about 10mm x 0.6mm x 0.1 mm.The power that industrially used this kind of laser stripe array obtains at present is about 50W.By the storehouse suitable to laser stripe array, within the scope of wavelength 790-980nm, just can obtain the power of several kilowatts.Semiconductor laser structure is compact, and they are easily integrated in existing system, and typical semi-conductor life span can reach 10, and 000 hour, electro-optical efficiency was up to 30-40%.By temperature sensor and whole plant integrated, by temperature-power closed-loop control, carry out automatic power adjustment, solve the problem of the corner capacity of heat transmission difference easy remelting in place, realize the intelligentized control method process for the treatment of temp.
Novel semi-conductor laser can adopt optical fiber flexible transfer, and semiconductor laser volume is little, lightweight, coordinate with robot and easily realizes complicated bent laser processing, realizes processing track intelligentized control method process.
The investigation and application of semiconductor laser strengthening and cladding novel material, die surface quality can be improved further, obtain that strengthening layer hardness is high, hardness evenly, crystalline grains ultra, obdurability be good, be out of shape the characteristics such as little, strengthening/repair layer wear resistance is high, has pollution-free, easy manipulation, saving material, the remarkable characteristic such as efficient for Making mold and manufacturing again.
Summary of the invention
Technical problem solved by the invention is to provide a kind of intelligent semiconductor laser manufacture for mould to manufacture renovation technique again.Technical problem solved by the invention realizes by the following technical solutions:
Intelligent semiconductor laser manufacture for mould manufactures a renovation technique again, comprises following processing step:
(1) die surface pre-treatment; Under room temperature, oil removing, rust cleaning are carried out to die surface, and clean with alcohol washes, adopt Dye inspectiong to test to it, require surperficial flawless, pore, impurity;
(2) selection of powdered alloy and the adjustment of automatic powder feeding device; Select the Co-based alloy powder that metallurgical consistency is good with matrix, Co-based alloy powder Chemical Composition is respectively by weight percentage: W1-5%, Fe2-10%, C0.15-0.55, Ni1-6%, Mo0.5-1.5%, Si0.5-1.5%, and surplus is Co.Regulate automatic powder feeding device, automatic powder feeding head powdered alloy out is just in time dropped in laser molten pool, regulate powder sending quantity, make the thickness of alloy powder coating reach 1 ~ 2mm;
(3) wear-resistant coating laser melting coating; Load laser process machine, this laser process machine is semiconductor laser machining tool (that is, comprising the machining tool of semiconductor laser).Under the feeding movement of the rotary motion of main shaft C and laser head x-ray axle coordinates, in a work step, powder feeding and laser melting coating synchronously carry out; The output rating of semiconductor laser laser apparatus is 5000W, the distance on the surface of the column from the laser beam exit of semiconductor laser to hydraulic support is 300mm, laser scanning linear velocity is 500mm/min, and laser beam is the rectangular light spot (long is 15mm, and wide is 3mm) of 15*3mm; The mode carrying out scanning cladding carries out cladding, forms the laser cladding layer of even compact at die surface;
(4) flaw detection after cladding; With Dye inspectiong, die surface working position is tested, require working position flawless, pore.
Invention significantly improves wear resisting property and the work-ing life of mould; Manufacture again for Making mold and reparation and reduce production cost and improve the quality of product.
Embodiment
In order to make those skilled in the art can clearly understand technical scheme of the present invention, be described in detail below in conjunction with embodiment.
Embodiment 1
Intelligent semiconductor laser manufacture for mould manufactures a renovation technique again, comprises following processing step:
(1) die surface pre-treatment; Under room temperature, oil removing, rust cleaning are carried out to die surface, and clean with alcohol washes, adopt Dye inspectiong to test to it, require surperficial flawless, pore, impurity;
(2) selection of powdered alloy and the adjustment of automatic powder feeding device; Select the Co-based alloy powder that metallurgical consistency is good with matrix, Co-based alloy powder Chemical Composition is respectively by weight percentage: W2%, Fe5%, C0.5, Ni5%, Mo0.5%, Si1.5%, and surplus is Co.Regulate automatic powder feeding device, automatic powder feeding head powdered alloy out is just in time dropped in laser molten pool, regulate powder sending quantity, make the thickness of alloy powder coating reach 1.2mm;
(3) wear-resistant coating laser melting coating; Load laser process machine, this laser process machine is semiconductor laser machining tool (that is, comprising the machining tool of semiconductor laser).Under the feeding movement of the rotary motion of main shaft C and laser head x-ray axle coordinates, in a work step, powder feeding and laser melting coating synchronously carry out; The output rating of semiconductor laser laser apparatus is 5000W, the distance on the surface of the column from the laser beam exit of semiconductor laser to hydraulic support is 300mm, laser scanning linear velocity is 500mm/min, and laser beam is the rectangular light spot (long is 15mm, and wide is 3mm) of 15*3mm; The mode carrying out scanning cladding carries out cladding, forms the laser cladding layer of even compact at die surface;
(4) flaw detection after cladding; With Dye inspectiong, die surface working position is tested, require working position flawless, pore.
Embodiment 2
Intelligent semiconductor laser manufacture for mould manufactures a renovation technique again, comprises following processing step:
(1) die surface pre-treatment; Under room temperature, oil removing, rust cleaning are carried out to die surface, and clean with alcohol washes, adopt Dye inspectiong to test to it, require surperficial flawless, pore, impurity;
(2) selection of powdered alloy and the adjustment of automatic powder feeding device; Select the Co-based alloy powder that metallurgical consistency is good with matrix, Co-based alloy powder Chemical Composition is respectively by weight percentage: W4%, Fe4%, C0.42, Ni4%, Mo0.8%, Si0.6%, and surplus is Co.Regulate automatic powder feeding device, automatic powder feeding head powdered alloy out is just in time dropped in laser molten pool, regulate powder sending quantity, make the thickness of alloy powder coating reach 2mm;
(3) wear-resistant coating laser melting coating; Load laser process machine, this laser process machine is semiconductor laser machining tool (that is, comprising the machining tool of semiconductor laser).Under the feeding movement of the rotary motion of main shaft C and laser head x-ray axle coordinates, in a work step, powder feeding and laser melting coating synchronously carry out; The output rating of semiconductor laser laser apparatus is 5000W, the distance on the surface of the column from the laser beam exit of semiconductor laser to hydraulic support is 300mm, laser scanning linear velocity is 500mm/min, and laser beam is the rectangular light spot (long is 15mm, and wide is 3mm) of 15*3mm; The mode carrying out scanning cladding carries out cladding, forms the laser cladding layer of even compact at die surface;
(4) flaw detection after cladding; With Dye inspectiong, die surface working position is tested, require working position flawless, pore.
Embodiment 3
Intelligent semiconductor laser manufacture for mould manufactures a renovation technique again, comprises following processing step:
(1) die surface pre-treatment; Under room temperature, oil removing, rust cleaning are carried out to die surface, and clean with alcohol washes, adopt Dye inspectiong to test to it, require surperficial flawless, pore, impurity;
(2) selection of powdered alloy and the adjustment of automatic powder feeding device; Select the Co-based alloy powder that metallurgical consistency is good with matrix, Co-based alloy powder Chemical Composition is respectively by weight percentage: W5%, Fe5%, C0.25, Ni5%, Mo1.5%, Si1.5%, and surplus is Co.Regulate automatic powder feeding device, automatic powder feeding head powdered alloy out is just in time dropped in laser molten pool, regulate powder sending quantity, make the thickness of alloy powder coating reach 1.2mm;
(3) wear-resistant coating laser melting coating; Load laser process machine, this laser process machine is semiconductor laser machining tool (that is, comprising the machining tool of semiconductor laser).Under the feeding movement of the rotary motion of main shaft C and laser head x-ray axle coordinates, in a work step, powder feeding and laser melting coating synchronously carry out; The output rating of semiconductor laser laser apparatus is 5000W, the distance on the surface of the column from the laser beam exit of semiconductor laser to hydraulic support is 300mm, laser scanning linear velocity is 500mm/min, and laser beam is the rectangular light spot (long is 15mm, and wide is 3mm) of 15*3mm; The mode carrying out scanning cladding carries out cladding, forms the laser cladding layer of even compact at die surface;
(4) flaw detection after cladding; With Dye inspectiong, die surface working position is tested, require working position flawless, pore.
Claims (1)
1. the intelligent semiconductor laser manufacture for mould manufactures a renovation technique again, it is characterized in that comprising following processing step:
(1) die surface pre-treatment; Under room temperature, oil removing, rust cleaning are carried out to die surface, and clean with alcohol washes, adopt Dye inspectiong to test to it, require surperficial flawless, pore, impurity;
(2) selection of powdered alloy and the adjustment of automatic powder feeding device; Select the Co-based alloy powder that metallurgical consistency is good with matrix, Co-based alloy powder Chemical Composition is respectively by weight percentage: W1-5%, Fe2-10%, C0.15-0.55, Ni1-6%, Mo0.5-1.5%, Si0.5-1.5%, and surplus is Co; Regulate automatic powder feeding device, automatic powder feeding head powdered alloy out is just in time dropped in laser molten pool, regulate powder sending quantity, make the thickness of alloy powder coating reach 1 ~ 2mm;
(3) wear-resistant coating laser melting coating; Load laser process machine, this laser process machine is semiconductor laser machining tool (that is, comprising the machining tool of semiconductor laser); Under the feeding movement of the rotary motion of main shaft C and laser head x-ray axle coordinates, in a work step, powder feeding and laser melting coating synchronously carry out; The output rating of semiconductor laser laser apparatus is 5000W, the distance on the surface of the column from the laser beam exit of semiconductor laser to hydraulic support is 300mm, laser scanning linear velocity is 500mm/min, and laser beam is the rectangular light spot (long is 15mm, and wide is 3mm) of 15*3mm; The mode carrying out scanning cladding carries out cladding, forms the laser cladding layer of even compact at die surface;
(4) flaw detection after cladding; With Dye inspectiong, die surface working position is tested, require working position flawless, pore.
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| CN201410477476.4A CN104233291A (en) | 2014-09-18 | 2014-09-18 | Intelligent semiconductor laser manufacturing and remanufacturing repairing technology for molds |
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| CN201410477476.4A CN104233291A (en) | 2014-09-18 | 2014-09-18 | Intelligent semiconductor laser manufacturing and remanufacturing repairing technology for molds |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106702371A (en) * | 2015-07-15 | 2017-05-24 | 昆山鑫昌泰模具科技有限公司 | Laser cladding technology capable of prolonging life of H13 hot forging die |
| CN106756988A (en) * | 2016-11-18 | 2017-05-31 | 甘肃兰煤机械制造有限公司 | The method for strengthening repairing mine mechanical surface using optical-fiber laser |
| CN111922623A (en) * | 2020-08-07 | 2020-11-13 | 和县卜集振兴标准件厂 | Maintenance method of zinc-based alloy stamping die |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102677045A (en) * | 2012-05-22 | 2012-09-19 | 山东能源机械集团大族再制造有限公司 | Laser cladding method |
| CN103469198A (en) * | 2013-06-05 | 2013-12-25 | 武汉团结点金激光科技有限公司 | Laser remanufacturing and restoring technology of automobile transmission gear hot-forging die |
-
2014
- 2014-09-18 CN CN201410477476.4A patent/CN104233291A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102677045A (en) * | 2012-05-22 | 2012-09-19 | 山东能源机械集团大族再制造有限公司 | Laser cladding method |
| CN103469198A (en) * | 2013-06-05 | 2013-12-25 | 武汉团结点金激光科技有限公司 | Laser remanufacturing and restoring technology of automobile transmission gear hot-forging die |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106702371A (en) * | 2015-07-15 | 2017-05-24 | 昆山鑫昌泰模具科技有限公司 | Laser cladding technology capable of prolonging life of H13 hot forging die |
| CN106756988A (en) * | 2016-11-18 | 2017-05-31 | 甘肃兰煤机械制造有限公司 | The method for strengthening repairing mine mechanical surface using optical-fiber laser |
| CN111922623A (en) * | 2020-08-07 | 2020-11-13 | 和县卜集振兴标准件厂 | Maintenance method of zinc-based alloy stamping die |
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Application publication date: 20141224 |