CN104218186B - The method for packing of display device and display device - Google Patents
The method for packing of display device and display device Download PDFInfo
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- CN104218186B CN104218186B CN201310209846.1A CN201310209846A CN104218186B CN 104218186 B CN104218186 B CN 104218186B CN 201310209846 A CN201310209846 A CN 201310209846A CN 104218186 B CN104218186 B CN 104218186B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
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- Electroluminescent Light Sources (AREA)
Abstract
The invention discloses method for packing and the display device of a kind of display device.The method for packing of display device comprises the following steps: provide a first substrate, and first substrate has a viewing area and a non-display area, and non-display area is around viewing area；Thering is provided a glueing material to be arranged on first substrate, wherein glueing material forms a closed curve around the periphery of viewing area of first substrate, and closed curve has a sintering and the terminal district being connected with sintering；A shading piece is provided at least to cover terminal district；One heating source directive shading piece is provided, and mobile heating source is to the sintering of glueing material；And persistently scanned glueing material one week district to terminal by heating source along closed curve by sintering.
Description
Technical field
The present invention is about the method for packing of a kind of display device and display device, organic especially with regard to one
The method for packing of luminous display unit and organic light-emitting display device.
Background technology
Organic Light Emitting Diode (Organic Light-Emitting Diode, OLED) has self-luminous, height
Brightness, high contrast, volume are frivolous, low power consumption and the advantage such as response speed is fast, therefore, the most gradually apply
In all kinds of display image systems, such as organic light-emitting display device.Wherein, active matrix organic light emission
Although display device cost costly, technique more complicated, but be applicable to large scale, high-resolution high letter
The true color of breath capacity shows, therefore, it has also become the main flow of organic light-emitting display device.
The method for packing of existing a kind of organic electroluminescence display panel is to use a glass cement (such as frit glue) envelope
In packing technique stops the intrusion display floater of air and aqueous vapor, it is to avoid air and the intrusion of aqueous vapor and cause
The fault of display floater.Wherein, first the method for packing of organic electroluminescence display panel comprises the steps of,
By a glass cement F(Frit) coat the periphery of a cover plate 11, as shown in Figure 1A；Then, thunder is used
Penetrate pre-sintering process, make glass cement F produce glazing (glazing)；Afterwards, entire upper backboard (Figure 1A
Do not show) on cover plate 11 and glass cement F；Finally, then carry out the technique that laser sintering seals, make
Glass cement F is remelted, by cover plate 11 and back plate seals, so to complete the packaging technology of display floater.
On be set forth in use laser presintering in the technique making glass cement glazing, being to be incident upon by a laser beam
The one sintering SZ of glass cement F, and after run-down, return sintering SZ.But, can be in sintering
Producing the breach U of an arcuation in SZ, as shown in Figure 1B, the breach U of this arcuation will cause follow-up thunder
Penetrate the failure of sintering sealing technology, such as, cause the poor sealing of display floater because of breach U.
Inquiring in the occurrence cause of breach U and can find, glass cement F scans at sintering SZ endogenous cause of ill laser
The difference of heat time heating time and by non-uniform heat flux and cooling, cause the temperature distributing disproportionation of glass cement F, product
Raw difference.Wherein, the glass cement F on the left of the SZ of Figure 1B sintering is longer for heat time heating time, thus creates
Glazing, and the glass cement F on the right side of the SZ of sintering is shorter for heat time heating time, therefore do not produce glazing.Due to initial
The inconsistent of glass cement F change of district SZ creates thermal stress, and this thermal stress will result in the glass cement of glazing
The linkage interface of F and the glass cement F of non-glazing occurs in that the state of stripping, thus creates breach U.
Therefore, how to provide method for packing and the display device of a kind of display device, can avoid producing existing
The arcuation breach of pre-sintering process, and then improve the yields of display device packaging technology, it has also become important
One of problem.
Summary of the invention
The purpose of the present invention is a kind of arcuation breach avoiding producing pre existing sintering process of offer, and then
Improve method for packing and the display device of the display device of the yields of display device packaging technology.
For reaching above-mentioned purpose, comprise the following steps according to the method for packing of a kind of display device of the present invention:
Thering is provided a first substrate, first substrate has a viewing area and a non-display area, non-display area ring
Around viewing area, providing a glueing material to be arranged on first substrate, wherein glueing material is around the first base
The periphery of the viewing area of plate and form a closed curve, closed curve has a sintering and and sintering
The terminal district that is connected, a shading piece is provided at least to cover terminal district, provide a heating source directive shading
Part, and mobile heating source to the sintering of glueing material and continued along closed curve by heating source
Scanning glueing material one week district to terminal.
For reaching above-mentioned purpose, include a first substrate, one second base according to a kind of display device of the present invention
Plate and a glueing material.First substrate has a viewing area and a non-display area, non-display area
Around viewing area, second substrate is relative with first substrate and sets.Glueing material be arranged at first substrate with
Between second substrate, and form a closed curve around the periphery of viewing area of first substrate, first
Substrate, second substrate and glueing material form a confined space, and glueing material has at least one breach, lack
Mouth is positioned at the side of closed curve.
In one embodiment, glueing material comprises glass cement.
In one embodiment, the distance between shading piece and glueing material is less than or equal to 10 millimeters.
In one embodiment, shading piece has a groove, and groove at least exposes sintering.
In one embodiment, heating source has one first width when being irradiated in glueing material, and glueing material has
Having one second width, the first width is between the 80% to 120% of the second width.
In one embodiment, heating source between 3.5 watts to 8 watts, its scanning speed between 3 millimeters/
Second between 10 mm/second.
In one embodiment, after mobile heating source to sintering, method for packing further includes: to be heated
Shading piece is removed after closed curve scanning one distance in source.
In one embodiment, distance at least heating source is irradiated in one first width of glueing material.
In one embodiment, shading piece is a shading mask, and shading mask has a light-transparent pattern, printing opacity
Pattern is corresponding with closed curve.
In one embodiment, shading mask has at least one light-shielding pattern, and light-shielding pattern at least covers terminal
District.
In one embodiment, after mobile heating source to sintering, method for packing further includes: work as heating
Shade curtain is moved when scanning an offset distance along closed curve in source, makes shading mask be pointed to close song
Line.
In one embodiment, after mobile heating source to sintering, method for packing further includes: work as heating
Shade curtain is moved when scanning an offset distance along closed curve in source, makes light-shielding pattern will not cover closing
The terminal district of curve and the region not scanned.
In one embodiment, after the step in lasting run-down district to terminal, method for packing further includes:
Scanned again to sintering by terminal district by heating source.
In one embodiment, method for packing further includes: provide a second substrate to be correspondingly arranged in first substrate
And on glueing material；There is provided another heating source by the non-glueing material face directive glueing material of first substrate；
And persistently scan glueing material along closed curve one week by another heating source.
In one embodiment, when the quantity of breach is two, such breach lays respectively at the phase of glueing material
To both sides.
In one embodiment, such breach does not connects.
In one embodiment, the both sides of breach along closed curve central axis respectively with the one of first substrate
Surface forms one first angle and one second angle, the first angle between 10 ° and 40 °, the second angle
Between 30 ° and 70 °.
In one embodiment, the first angle is less than the second angle.
In one embodiment, display device is organic LED display device.
From the above, because of the method for packing of display device and the display device of the present invention, it is by a shading
Part at least covers terminal district, and provides a heating source directive shading piece, and mobile heating source is to glueing material
Sintering.It addition, more persistently scan glueing material one week along closed curve to terminal by heating source
District.Thereby, when heating source is moved on in sintering by shading piece, because all may be used in the whole region in sintering
It is irradiated to the light of identical time and identical energy, and the heating source of accumulation can make the temperature in sintering exceed
The glazing temperature of glueing material.Therefore so that the display device completing packaging technology will not produce pre existing
The arcuation breach of sintering process, and then the yields of display device packaging technology can be improved.
Accompanying drawing explanation
Accompanying drawing described herein is used for providing a further understanding of the present invention, constitutes of the application
Point, it is not intended that limitation of the invention.In the accompanying drawings:
Figure 1A is the sealing technology schematic diagram of a kind of existing display floater.
Figure 1B is the schematic top plan view of arcuation breach produced by a kind of existing display floater.
Fig. 2 is the flow chart of steps of the method for packing of a kind of display device of present pre-ferred embodiments.
The difference of the method for packing of the display device of Fig. 3 A to Fig. 3 C respectively present pre-ferred embodiments is shown
It is intended to.
Fig. 3 D is the partial top schematic diagram of the display device of the method for packing through the present invention.
Fig. 3 E is the temperature relation schematic diagram with scanning distance of glueing material.
Fig. 3 F is another steps flow chart of the method for packing of a kind of display device of present pre-ferred embodiments
Figure.
Fig. 3 G is another schematic diagram of the method for packing of the display device of present pre-ferred embodiments.
Fig. 4 A and Fig. 4 B, Fig. 5 A and Fig. 5 B, Fig. 6 A to Fig. 6 D are respectively present pre-ferred embodiments
The different schematic diagrams of method for packing of display device.
Fig. 7 A is the schematic side view of the display device through packaging technology of the present invention.
Fig. 7 B is the partial top schematic diagram of the display device of Fig. 7 A.
Fig. 7 C is the cross-sectional schematic of the straight line A-A of Fig. 7 B.
Drawing reference numeral illustrates:
11: cover plate
2: display device
21: first substrate
211: surface
22: glueing material
23: second substrate
231: first surface
232: second surface
A-A: straight line
DA: viewing area
NDA: non-display area
EZ: terminal district
F: glass cement
L, La: heating source
LS, LS1: shading piece
L1: solid line
L2: dotted line
NP: light-shielding pattern
O: confined space
P: light-transparent pattern
RM: laser module
S01～S09: step
SZ: sintering
T: groove
T: the glazing time
U, U1, U2: breach
W1: the first width
W2: the second width
θ 1: the first angle
θ 2: the second angle
Detailed description of the invention
Hereinafter with reference to correlative type, the method for packing of the display device according to present pre-ferred embodiments is described
And display device, the most identical assembly will be illustrated with identical reference marks.
Please respectively refer to shown in Fig. 2 and Fig. 3 A to Fig. 3 C, wherein, Fig. 2 is present pre-ferred embodiments
The flow chart of steps of method for packing of a kind of display device, and Fig. 3 A to Fig. 3 C is respectively the present invention relatively
The different schematic diagrams of the method for packing of the display device of good embodiment.First one it is mentioned that, the display of the present invention
The method for packing of device is applied to encapsulate an organic LED display device.
As in figure 2 it is shown, the method for packing of display device includes that step S01 is to step S06.In this, step
S01 is that the pre-sintering process of display device is first described to step S06.
First, step S01 is: provide a first substrate 21, and first substrate 21 has a viewing area
A DA and non-display area NDA, non-display area NDA are around viewing area DA.
Then, carrying out step S02 is: provide a glueing material 22 to be arranged on first substrate 21, its
Middle glueing material 22 is surrounded on the periphery of the viewing area DA of first substrate 21 and forms a closed curve,
Closed curve has a sintering SZ and terminal district EZ(Fig. 3 A and the figure being connected with sintering SZ
3B does not shows).In this, as shown in Figure 3A, so-called " closed curve " represent that glueing material 22 is in the
Form a whole circle on the non-display area NDA of one substrate 21 and be not turned off.Wherein, glueing material 22
At least can comprise glass cement (frit).It addition, glueing material 22 is formed in the periphery of first substrate 21
Closed curve be for example and without limitation to a tetragon (also can form other shapes of closed curve).Separately
Outward, the present invention is not particularly limited the position of sintering SZ and terminal district EZ.In this, the present embodiment
The sintering SZ of glueing material 22 and terminal district EZ is the long limit being such as positioned at tetragon (closed curve)
On, certainly, sintering SZ and terminal district EZ may be alternatively located on minor face or the corner of tetragon.Wherein,
Sintering SZ refers to that light beam is irradiated to the region of glueing material 22 at first, and terminal district EZ refers to around closing
During curve one week, the region being finally connected with sintering SZ.
Then, carrying out step S03 is: provide a shading piece LS at least to cover terminal district EZ.In this,
The shading piece LS of Fig. 3 A covers terminal district EZ(therefore terminal district EZ does not shows), but expose sintering SZ.
In the present embodiment, shading piece LS is a dark slide, and can such as be arranged at carrying first substrate 21
On one microscope carrier or be arranged on a light beam heating module, or other.It addition, shading piece LS and glued material
Distance between material 22 is less than or equal to 10 millimeters (mm).Shading piece LS also can contact glueing material
22。
Then, step S04 is carried out: provide a heating source L directive shading piece LS, and mobile heating source L
Sintering SZ to glueing material 22.In this, as shown in Figure 3A, heating source be such as but not limited to by
The laser beam (laser beam) of one laser module RM is produced, and is irradiated on shading piece LS, and
Its optical axis is substantially perpendicular to shading piece LS.Because shading piece LS covers terminal district EZ, therefore heating source L is not
It is irradiated on glueing material 22.Afterwards, as shown in Figure 3 B, heating source L is moved and scans to initial
District SZ.Wherein, the laser light watt level of the heating source L of the laser that the present invention uses is between 1 watt (W)
Between 20 watts, and its scanning speed is between 0.5 mm/second (mm/s) to 20 mm/second, and
User can be according to its demand from Row sum-equal matrix.In the present embodiment, it is with heating source L as 3.5W, and scans
As a example by speed is 3mm/s.Wherein, when heating source L is the biggest, and its scanning speed can be the fastest.It is worth mentioning
, owing to, in prior art, speed is the slowest, the breach of generation the least (but when scanning speed is
Breach is there are still during 0.5mm/s), therefore, can carry during the method for packing of display device of the application present invention
The scanning speed of high presintering, thereby can reduce the station time and accelerate the speed of production of packaging technology.
Afterwards, carrying out step S05 is: persistently swept along closed curve by sintering SZ by heating source L
Retouch glueing material 22 1 weeks district EZ to terminal.As shown in Figure 3 C, heating source L is moved to by shading piece LS
After the SZ of sintering, sintering SZ can be to after persistently scanning glueing material 22 1 weeks along closed curve
Reach terminal district EZ.It is specifically intended that after mobile heating source L to sintering SZ, thermal source to be added
L can remove shading piece LS after closed curve scanning one distance, and this distance at least heating source L shines
Penetrate the width (the i.e. first width W1) in glueing material 22.Specifically, heating source L scans through
Sintering SZ after persistently scanning glueing material 22 along closed curve, so that it may shading piece LS is removed,
Shading piece LS is made not cover glueing material 22.It addition, as shown in Figure 3 C, heating source L is irradiated in glue
There is during condensation material 22 one first width W1, and glueing material 22 has one second width W2, and
One width W1 is between the 80% to 300% of the second width W2.Thereby, energy can be concentrated to make gluing
Material 22 produces glazing effect.
Finally, after heating source L continues step S05 of run-down district EZ to terminal, then walk
Rapid S06, step S06 is: scanned to sintering SZ by terminal district EZ by heating source L, with really again
The glueing material 22 saving portion from damage can glazing completely.Thereby complete the pre-sintering process of glueing material 22.Cause
This, as shown in Figure 3 D, after the pre-sintering process of the glueing material 22 of the present invention, will not produce
The arcuation breach of the pre existing sintering process of Figure 1B, but produce the result of Fig. 3 D, below will say again
Bright.
Referring again to shown in Figure 1B, owing to the glass cement F on the left of the S of Figure 1B sintering is longer for heat time heating time,
Therefore energy enough can create glazing effect, and the glass cement F on the right side of the S of sintering is shorter for heat time heating time,
Energy is not enough to produce glazing, therefore causes the inconsistent of S both sides, sintering temperature, thus produces thermal stress
And produce breach U.
Therefore, refer to shown in Fig. 3 E, to illustrate why not the present invention can produce pre existing sintering process
Arcuation breach.Wherein, solid line L1 is the temperature after glueing material 22 receives heating source L, and dotted line L2
Intensity size for heating source L.It addition, vertical coordinate is temperature, and the scanning that abscissa is heating source L
Distance.Additionally, t is glueing material 22 receive heating source L after, can produce the time of glazing, in other words,
If overtime t, the most absorbable sufficient glazing energy of glueing material 22.
As shown in FIGURE 3 E, the present invention is to avoid the heat time heating time in the SZ of sintering and the difference of temperature, makes
Sintering SZ will not produce the arcuation breach of pre existing sintering process.Specifically, it is to allow sintering SZ
Temperature can all exceed glueing material 22 can glazing temperature, or allow the heating source L of sintering SZ
Exceed the glazing time t of glueing material 22 sweep time.Therefore, referring again to shown in Fig. 3 B, heating is worked as
When source L is slowly moved on in the SZ of sintering by shading piece LS, the whole region in the SZ of sintering all can be shone
It is mapped to the heating source L of identical time and identical energy, and in the heating source L of accumulation can make sintering SZ
Temperature exceedes the glazing temperature of glueing material 22.Or, another kind of explanation is, the light in the SZ of sintering
Bundle all can exceed the glazing time t of glueing material 22 sweep time so that the heating source L of accumulation can make
Temperature in beginning district SZ is consistent, and all exceedes the glazing temperature of glueing material 22, therefore the present invention is in initial
The arcuation breach of pre existing sintering process will not be produced in district SZ.
Refer to shown in Fig. 3 F and Fig. 3 G, wherein, Fig. 3 F is a kind of display of present pre-ferred embodiments
Another flow chart of steps of the method for packing of device, and Fig. 3 G is the display device of present pre-ferred embodiments
Another schematic diagram of method for packing.
In addition to above-mentioned step S01 to step S06, the method for packing of display device more can include step
S07 is to step S09.In this, step S07 to step S09 is to illustrate to sinter sealing technology.
As shown in Fig. 3 F and Fig. 3 G, step S07 is: provide a second substrate 23 to be correspondingly arranged in first
On substrate 21 and glueing material 22.Wherein, second substrate 23 has a first surface 231 and with
The second surface 232 that one surface 231 is relative, first surface 231 is towards first substrate 21.
Then, step S08 is carried out: provide another heating source La by the non-glueing material face of first substrate 21
Directive glueing material 22.In this, the non-glueing material face of first substrate 21 refers to that first substrate 21 does not contains
There is the surface (i.e. the lower surface of the first substrate 21 of Fig. 3 G) of glueing material 22.But, heating source
La also can be by the second surface 232 directive glueing material 22 of second substrate 23.
Finally, step S09 is: persistently scan glueing material along closed curve by another heating source La
22 1 weeks.In this, the second surface 232 of second substrate 22 persistently scan glued material along closed curve
Expect 22 1 weeks, to complete the sintering sealing technology of display device 2.The display device 2 of the present embodiment is one
Organic LED display device, first substrate 21 can be the transparent substrates without film layer or for having optical filtering
The optical filtering substrate of layer or be that there is the substrate of touch-control circuit, and second substrate 22 can be an organic light emission substrate
(containing drive circuit and organic luminous layer).
It addition, refer to shown in Fig. 4 A and Fig. 4 B, it is respectively the display dress of present pre-ferred embodiments
Another schematic diagram of the method for packing put.
As shown in fig. 4 a and fig. 4b, primary difference is that with Fig. 3 A and Fig. 3 B, Fig. 4 A and Fig. 4 B
Shading piece LS there is a groove T, groove T exposes sintering SZ.In the present embodiment, shading piece
LS is still a dark slide, but it has groove T, groove T and exposes sintering SZ.Therefore, carry out above-mentioned
During step S04, as shown in Figure 4 B, move to glueing material 22 by shading piece LS as heating source L
During the SZ of sintering, heating source L may pass through groove T and directive sintering SZ.Additionally, the present embodiment
Other technical characteristic of the method for packing of display device is same as described above, repeats no more.
It addition, refer to shown in Fig. 5 A and Fig. 5 B, it is respectively the display dress of present pre-ferred embodiments
The another schematic diagram of the method for packing put.
As shown in Fig. 5 A and Fig. 5 B, primary difference is that with Fig. 3 A and Fig. 3 B, Fig. 5 A and Fig. 5 B
Sintering SZ and terminal district EZ(figure do not show) be in a corner of closed curve.Wherein, hide
Light part LS is still a dark slide, and covers terminal district EZ.Therefore, above-mentioned steps S04 and step are carried out
During S05, as shown in Figure 5 B, the sintering to glueing material 22 is moved as heating source L by shading piece LS
During SZ, heating source L is the same can persistently be scanned glueing material 22 1 weeks by sintering SZ along closed curve
District EZ to terminal.Additionally, other technical characteristic of the method for packing of the display device of the present embodiment is with above-mentioned
Identical, repeat no more.Special one is mentioned that, as shown in Figure 5A, heating source L penetrates on shading piece LS,
But, heating source L also can penetrate behind other position, then moves to sintering SZ, as long as not penetrating when starting
At glueing material 22.
It addition, please respectively refer to shown in Fig. 6 A, Fig. 6 B, Fig. 6 C and Fig. 6 D, it is respectively the present invention
The another schematic diagram of the method for packing of the display device of preferred embodiment.
As shown in Fig. 6 A and Fig. 6 B, primary difference is that with Fig. 3 A and Fig. 3 B, Fig. 6 A and Fig. 6 B
Shading piece LS be a shading mask, shading mask has a light-transparent pattern P, light-transparent pattern P and closing
Curve is corresponding.In this example it is shown that as a example by four corresponding four glueing materials 22 of light-transparent pattern P,
But it is not limited.It addition, shading piece LS is a transparent glass, and it is provided with light-transparent pattern P, wherein
Only light-transparent pattern P can allow light pass through, therefore light-transparent pattern P can make T sintering SZ expose, Yu Tu
During 6A, light-transparent pattern P and closed curve do not have complete para-position.It addition, in carrying out above-mentioned steps S04
Mobile heating source L to the sintering SZ of glueing material 22 after, as shown in Figure 6B, as heating source L
Move shading mask after scanning an offset distance (offset distance) along closed curve simultaneously, make
Light pattern P is pointed to closed curve.In other words, as shown in Figure 6A, beat at sintering SZ when laser light
Time, now terminal district EZ shielded (therefore terminal district EZ does not shows), when heating source L is by sintering SZ
Scan a field offset distance afterwards along closed curve, then move shading mask, make light-transparent pattern P and envelope
Closed curve para-position, makes whole closed curve and light-transparent pattern P para-position, as shown in Figure 6B.Wherein, skew
The width of distance at least glueing material 22.
It addition, as shown in Fig. 6 C and Fig. 6 D, primary difference is that with Fig. 6 A and Fig. 6 B, Fig. 6 C
And the shading piece LS1 of Fig. 6 D is still a shading mask, but this shading mask has at least one light-shielding pattern
NP, and light-shielding pattern NP at least covers terminal district EZ.In this, though shading piece LS1 referred to as shading piece,
But being light tight in place of in fact only having light-shielding pattern NP, remaining part is printing opacity.The screening of the present embodiment
Light mask is to have a light-shielding pattern NP, and as a example by covering terminal district EZ.Therefore, such as Fig. 6 C institute
Show, as heating source L directive light-shielding pattern NP, owing to light-shielding pattern NP covers terminal district EZ, therefore
Now terminal district EZ is not irradiated to by light.It addition, as shown in Figure 6 D, (move when heating source L moves
Go out terminal district EZ) and directive sintering SZ, and along closed curve scan an offset distance time, then can move
Dynamic shading piece LS1, makes light-shielding pattern NP will not cover the terminal district EZ of closed curve and does not scans
Region, therefore, heating source L is the same can persistently scan glueing material 22 1 weeks to terminal along closed curve
District EZ, then to sintering SZ, to complete pre-sintering process.
Additionally, other technical characteristic of the method for packing of the display device of the present embodiment can refer to above-mentioned, no
Repeat again.
Hereinafter, please respectively refer to shown in Fig. 7 A to Fig. 7 C, wherein, Fig. 7 A is for encapsulate work through the present invention
The schematic side view of the display device 2 of skill, Fig. 7 B is the partial top signal of the display device 2 of Fig. 7 A
Figure, and the cross-sectional schematic of the straight line A-A that Fig. 7 C is Fig. 7 B.
As shown in Figure 7 A, display device 2 includes first substrate 21, glueing material 22 and one
Two substrates 23.In this, display device 2 is organic LED display device.Wherein, first substrate
21 is one without the transparent substrates of film layer or to be to have the optical filtering substrate of filter layer or be to have the base of touch-control circuit
Plate, and second substrate 23 can be an organic light emission substrate (containing drive circuit and organic luminous layer).
First substrate 21 has a viewing area DA and a non-display area NDA, non-display area NDA
Around viewing area DA.
Second substrate 23 is relative with first substrate 21 and sets, and glueing material 22 is arranged at first substrate 21
And between second substrate 23, and form an envelope around the periphery of viewing area DA of first substrate 21
Closed curve, wherein, first substrate 21, second substrate 23 and glueing material 22 form a confined space O.
It addition, glueing material 22 has at least one breach, breach is positioned at the side of closed curve.At the present embodiment
In, as shown in Figure 7 B, the quantity of breach is two, and such breach U1, U2 lay respectively at glueing material 22
Opposite sides, and such breach U1, U2 be not for connect, thus first substrate 21, second substrate 23 and
Glueing material 22 can form confined space O.
It addition, as seen in figure 7 c, breach U1 along closed curve central axis and respectively with first substrate
One surface 211 of 21 forms one first angle, θ 1 and one second angle, θ 2, and wherein, the first angle, θ 1 is situated between
Between 10 ° and 40 °, the second angle, θ 2 is between 30 ° and 70 °.In this, the first angle, θ 1 and
Two angle, θ 2 can be different because of scanning speed when pre-wound is tied or the difference of heating source L.But, if
The scanning direction of heating source L during pre-wound knot be from right to left time, as seen in figure 7 c, then the first angle, θ 1
The second angle, θ 2 can be less than.
In sum, because of the method for packing of display device and the display device of the present invention, it is by a shading
Part at least covers terminal district, and provides a heating source directive shading piece, and mobile heating source is to glueing material
Sintering.It addition, more persistently scan glueing material one week along closed curve to terminal by heating source
District.Thereby, when heating source is moved on in sintering by shading piece, because all may be used in the whole region in sintering
It is irradiated to the light of identical time and identical energy, and the heating source of accumulation can make the temperature in sintering exceed
The glazing temperature of glueing material.Therefore so that the display device completing packaging technology will not produce pre existing
The arcuation breach of sintering process, and then the yields of display device packaging technology can be improved.
The foregoing is only illustrative, rather than be restricted person.Any spirit without departing from the present invention and model
Farmland, and the equivalent modifications carrying out it or change, be intended to be limited solely by scope of the presently claimed invention.
Claims (19)
1. the method for packing of a display device, it is characterised in that including:
A first substrate, described first substrate is provided to have a viewing area and a non-display area, described
Non-display area is around described viewing area；
Thering is provided a glueing material to be arranged on described first substrate, wherein said glueing material is around described
The periphery of the described viewing area of one substrate and form a closed curve, described closed curve has one and initiates
District and the terminal district being connected with described sintering, described glueing material has at least one breach, described
Breach is positioned at the side of described closed curve, and described breach is along the central axis difference of described closed curve
Form one first angle and one second angle with a surface of described first substrate, described first angle between
Between 10 ° and 40 °, described second angle is between 30 ° and 70 °；
A shading piece is provided at least to cover described terminal district；
Shading piece described in one heating source directive is provided, and mobile described heating source is to the institute of described glueing material
State sintering；And
Described glueing material is persistently scanned by described sintering along described closed curve by described heating source
One thoughtful described terminal district.
Method for packing the most according to claim 1, it is characterised in that described glueing material comprises glass
Glass glue.
Method for packing the most according to claim 1, it is characterised in that described shading piece and described glue
Distance between condensation material is less than or equal to 10 millimeters.
Method for packing the most according to claim 1, it is characterised in that described shading piece has a ditch
Groove, described groove at least exposes described sintering.
Method for packing the most according to claim 1, it is characterised in that described heating source is irradiated in institute
Having one first width when stating glueing material, described glueing material has one second width, and described first is wide
Degree is between the 80% to 300% of described second width.
Method for packing the most according to claim 1, it is characterised in that in mobile described heating source extremely
After described sintering, described method for packing further includes:
After described closed curve scanning one distance, described shading piece is removed until described heating source.
Method for packing the most according to claim 6, it is characterised in that described distance at least heating
Source is irradiated in a width of described glueing material.
Method for packing the most according to claim 1, it is characterised in that described shading piece is a shading
Mask, described shading mask has a light-transparent pattern, and described light-transparent pattern is corresponding with described closed curve.
Method for packing the most according to claim 1, it is characterised in that described shading piece is a shading
Mask, described shading mask has at least one light-shielding pattern, and described light-shielding pattern at least covers described terminal
District.
Method for packing the most according to claim 8, it is characterised in that in mobile described heating source
After described sintering, described method for packing further includes:
Described shading mask is moved when described heating source scans an offset distance along described closed curve,
Described shading mask is made to be pointed to described closed curve.
11. method for packing according to claim 9, it is characterised in that in mobile described heating source
After described sintering, described method for packing further includes:
Described shading mask is moved when described heating source scans an offset distance along described closed curve,
Make the described terminal district that described light-shielding pattern will not cover described closed curve and the region not scanned.
12. method for packing according to claim 1, it is characterised in that in lasting run-down extremely
After the step in described terminal district, described method for packing further includes:
Scanned again to described sintering by described terminal district by described heating source.
13. method for packing according to claim 12, it is characterised in that further include:
A second substrate is provided to be correspondingly arranged on described first substrate and described glueing material；
There is provided another heating source by glueing material described in the non-glueing material face directive of described first substrate；And
Described glueing material is persistently scanned one week along described closed curve by another heating source described.
14. 1 kinds of display devices, it is characterised in that including:
One first substrate, has a viewing area and a non-display area, and described non-display area is around institute
State viewing area；
One second substrate is relative with described first substrate and set；And
One glueing material, is arranged between described first substrate and described second substrate, and around described
The periphery of the described viewing area of one substrate and form a closed curve, described first substrate, described second
Substrate and described glueing material form a confined space；
Wherein, described glueing material has at least one breach, and described breach is positioned at the one of described closed curve
Side, described breach along described closed curve central axis respectively with described first substrate one surface formed
One first angle and one second angle, described first angle between 10 ° and 40 °, described second jiao
Degree is between 30 ° and 70 °.
15. display devices according to claim 14, it is characterised in that when the quantity of described breach
When being two, described breach lays respectively at the opposite sides of described glueing material.
16. display devices according to claim 15, it is characterised in that described breach does not connects.
17. display devices according to claim 14, it is characterised in that described first angle is less than
Described second angle.
18. display devices according to claim 14, it is characterised in that described display device is for having
Machine light emitting display device.
19. display devices according to claim 14, it is characterised in that described glueing material is at least
Comprise a glass cement.
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101095247A (en) * | 2004-10-20 | 2007-12-26 | 康宁股份有限公司 | Optimization of parameters for sealing organic emitting light diode(oled) displays |
| EP1944817A2 (en) * | 2007-01-12 | 2008-07-16 | Samsung SDI Co., Ltd. | Method of manufacturing flat panel display device |
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| KR101065417B1 (en) * | 2009-05-20 | 2011-09-16 | 삼성모바일디스플레이주식회사 | Light irradiation device and fabrication method for organic light emitting diode display device using the same |
| KR101813906B1 (en) * | 2011-03-15 | 2018-01-03 | 삼성디스플레이 주식회사 | Display panel |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101095247A (en) * | 2004-10-20 | 2007-12-26 | 康宁股份有限公司 | Optimization of parameters for sealing organic emitting light diode(oled) displays |
| EP1944817A2 (en) * | 2007-01-12 | 2008-07-16 | Samsung SDI Co., Ltd. | Method of manufacturing flat panel display device |
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