CN104215188A - Wafer thickness measuring device applied to sapphire thinning device - Google Patents
Wafer thickness measuring device applied to sapphire thinning device Download PDFInfo
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- CN104215188A CN104215188A CN201410492384.3A CN201410492384A CN104215188A CN 104215188 A CN104215188 A CN 104215188A CN 201410492384 A CN201410492384 A CN 201410492384A CN 104215188 A CN104215188 A CN 104215188A
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- tangent displacement
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Abstract
The invention discloses a wafer thickness measuring device applied to a sapphire thinning device. The device comprises a cylinder executing mechanism, a controller connected with the cylinder executing mechanism, a communication module for transmitting data between the cylinder executing mechanism and the controller, and a human-computer interaction interface; the cylinder executing mechanism comprises an SMC (Sheet Molding Compound) sliding platform cylinder, and a contact type displacement sensor which is fixed to the SMC sliding platform cylinder through a fixing block; the contact type displacement sensor is equipped with a main probe and an expanding probe and used for transmitting the measured data information to a controller; the controller is used for comparing the received data information with the target data, and determining whether the processing is accurately done; the data transmission is performed between the human-computer interaction interface and the controller. The wafer thickness measuring device applied to the sapphire thinning device is on the basis of the PLC arrangement; the measurement precision is high; the stability is high; an automatic measuring device widely applies; in addition, the operation is simple and convenient.
Description
Technical field
The present invention relates to a kind of measurement mechanism, be specifically related to a kind of wafer measuring thickness device that is applied to sapphire stripping apparatus.
Background technology
In robotization control and measurement field, controller (PLC) and displacement transducer are widely used in commercial production, and along with the development of modernization industry, bringing into play more and more important effect, well-known, wafer is widely used in illumination, household electrical appliances, the fields such as environmental protection.
And at sapphire manufacture field, wafer thickness measure is one of most important branch, and wafer stripping apparatus is the core process equipment of production line, existing measuring equipment or measuring accuracy is inadequate, measurement complex process, does not meet the demand of modern production technique.Therefore, be badly in need of a kind of wafer measurer for thickness of high measurement accuracy.
Summary of the invention
Goal of the invention: the object of the invention is to solve the deficiencies in the prior art, a kind of wafer measuring thickness device based on PLC that is applied to sapphire stripping apparatus is provided.
Technical scheme: a kind of wafer measuring thickness device that is applied to sapphire stripping apparatus of the present invention, comprise cylinder actuating mechanism, the controller being connected with cylinder actuating mechanism, between cylinder actuating mechanism and controller, carry out communication module and the human-computer interaction interface of data transmission, described cylinder actuating mechanism comprises SMC slide unit cylinder, by fixed block, be fixed on the tangent displacement sensor of SMC slide unit cylinder, tangent displacement sensor is provided with main probe and expanding probe, described tangent displacement sensor is passed to controller by the data message of measurement by communication module, controller contrasts the data message of receiving and target data judge whether processing accurately completes, between described human-computer interaction interface and controller, carry out data transmission.
Wherein, tangent displacement sensor has been mainly used in the collection of measurement data, and communication module is responsible for the data transmission between tangent displacement sensor and controller, and controller mainly completes analysis contrast of data etc.
Further, between described touch displacement transducer and communication module, by RS232C no-protocol, communicate by letter and carry out data transmission.
Further, the main probe measurement reference field of described tangent displacement sensor, the expanding probe of tangent displacement sensor is measured measured object, after the ventilation of SMC slide unit cylinder, fixed block drives main probe and the expanding probe of tangent displacement sensor to stretch out simultaneously, disposablely completes measurement.
Further, in described controller, be provided with the modifier register in order to continuous and circle collection data.
Beneficial effect: compared with prior art, the present invention has the following advantages:
(1) the present invention, by the modifier register of PLC, can realize continuous sampling and the circulating sampling of data, stable to guarantee sapphire stripping apparatus, works reliably, prevents because measuring error is excessive, and cannot enter down technique one.
(2) the present invention is based on PLC and arrange, PLC is powerful, and stability is high, can be widely used in the every field such as automatic measurement system, industrial process automation, and simple operation flexibly, and human-computer interaction interface is attractive in appearance.
(3) can reach ± 1 μ m of measuring accuracy of the present invention, measuring accuracy is high, and stability is very high, does not allow to be subject to external interference, thereby guarantees the steady operation of stripping apparatus.
(4) in the present invention, two probes of tangent displacement sensor can stretch out measurement simultaneously, not only can improve measurement efficiency, can solve again the not high problem of measuring accuracy causing due to topworks's poor repeatability.
Accompanying drawing explanation
Fig. 1 is the hardware logic block diagram in the embodiment of the present invention;
Fig. 2 is automatic measurement procedure figure of the present invention;
Fig. 3 is measurement of the present invention topworks schematic diagram.
Embodiment
Below technical solution of the present invention is elaborated by reference to the accompanying drawings.
As shown in Figure 1 to Figure 3, a kind of wafer measuring thickness device that is applied to sapphire stripping apparatus of the present invention, comprise cylinder actuating mechanism, the controller being connected with cylinder actuating mechanism (PLC), between cylinder actuating mechanism and controller, carry out communication module and the human-computer interaction interface of data transmission, described cylinder actuating mechanism comprises SMC slide unit cylinder 3, by fixed block, be fixed on the tangent displacement sensor of SMC slide unit cylinder 3, tangent displacement sensor is provided with main probe 1 and expanding probe 2, described tangent displacement sensor is passed to controller by the data message of measurement by communication module, controller contrasts the data message of receiving and target data judge whether processing accurately completes, between described human-computer interaction interface and controller, carry out data transmission.
Between above-mentioned tangent displacement sensor and communication module, by RS232C no-protocol, communicate by letter and carry out data transmission, main probe 1 measurement datum of tangent displacement sensor, the expanding probe 2 of tangent displacement sensor is measured measured object, after 3 ventilations of SMC slide unit cylinder, fixed block drives main probe 1 and the expanding probe 2 of tangent displacement sensor to stretch out simultaneously, disposablely completes measurement.
In the present embodiment, the GT2 tangent displacement sensor that tangent displacement sensor adopts KEYENCE company to produce, the FX3U-232ADP communication module that communication module adopts MITSUBISHI company to produce.
Specific works principle of the present invention is as follows:
Open after human-computer interaction interface (HMI) software, enter and measure interface, click starts to measure, SMC slide unit cylinder 3 moves down, after the magnetic sensor of cylinder is opened, main probe 1 and the expanding probe 2 of tangent displacement sensor start to stretch out, tangent displacement sensor is carried out the thickness of measuring wafer, click data reads button again, the data of the data register meeting display measurement on human-computer interaction interface (HMI), communication module sends measurement data information to PLC, PLC contrasts according to thickness information and the desired value measured again, with judgement processing, whether accurately complete, the process of its judgement is as follows:
Controller (PLC) sends SR by communication module to tangent displacement sensor, 01,000 ASCII character, if send normally, serial ports returns to SR, 01,000 gives PLC, PLC is carrying out ASCII character conversion by the data of transmission, and the data that read and target data are contrasted, if in error range, system is thought and is machined, if error is excessive, system prompt mismachining tolerance is excessive, and stops current work flow.
Each wafer is equipped with data register, by the modifier register of PLC, can realize continuous sampling and the circulating sampling of data, stable to guarantee sapphire stripping apparatus, work, prevents because measuring error is excessive, and cannot enter down technique one reliably, and the data message gathering shows by interpersonal interactive interface data, so that operating personnel's recording and tracking timely.
Claims (4)
1. a wafer measuring thickness device that is applied to sapphire stripping apparatus, it is characterized in that: comprise cylinder actuating mechanism, the controller being connected with cylinder actuating mechanism, between cylinder actuating mechanism and controller, carry out communication module and the human-computer interaction interface of data transmission, described cylinder actuating mechanism comprises SMC slide unit cylinder, by fixed block, be fixed on the tangent displacement sensor of SMC slide unit cylinder, tangent displacement sensor is provided with main probe and expanding probe, described tangent displacement sensor is passed to controller by the data message of measurement by communication module, controller contrasts the data message of receiving and target data judge whether processing accurately completes, between described human-computer interaction interface and controller, carry out data transmission.
2. the wafer side measuring thickness device that is applied to sapphire stripping apparatus according to claim 1, is characterized in that: between described touch displacement transducer and communication module, by RS232C no-protocol, communicated by letter and carried out data transmission.
3. the wafer measuring thickness device that is applied to sapphire stripping apparatus according to claim 1, it is characterized in that: the main probe measurement reference field of described tangent displacement sensor, the expanding probe of tangent displacement sensor is measured measured object, after the ventilation of SMC slide unit cylinder, fixed block drives main probe and the expanding probe of tangent displacement sensor to stretch out simultaneously, disposablely completes measurement.
4. the wafer measuring thickness device that is applied to sapphire stripping apparatus according to claim 1, is characterized in that: in described controller, be provided with the modifier register in order to continuous and circle collection data.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410492384.3A CN104215188B (en) | 2014-09-23 | 2014-09-23 | A kind of wafer measuring thickness device for being applied to sapphire stripping apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410492384.3A CN104215188B (en) | 2014-09-23 | 2014-09-23 | A kind of wafer measuring thickness device for being applied to sapphire stripping apparatus |
Publications (2)
| Publication Number | Publication Date |
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| CN104215188A true CN104215188A (en) | 2014-12-17 |
| CN104215188B CN104215188B (en) | 2017-06-16 |
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| CN201410492384.3A Active CN104215188B (en) | 2014-09-23 | 2014-09-23 | A kind of wafer measuring thickness device for being applied to sapphire stripping apparatus |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11248424A (en) * | 1998-03-02 | 1999-09-17 | Yamabun Denki:Kk | Device for measuring sheet thickness |
| CN2802440Y (en) * | 2005-06-23 | 2006-08-02 | 深圳市比克电池有限公司 | Thickness measuring device |
| CN202304756U (en) * | 2011-10-14 | 2012-07-04 | 深圳市正控科技有限公司 | Thickness measuring system |
| CN102829740A (en) * | 2012-09-12 | 2012-12-19 | 昆山允可精密工业技术有限公司 | Contact measuring apparatus |
| CN203375950U (en) * | 2013-08-09 | 2014-01-01 | 昆山允可精密工业技术有限公司 | A vertical wafer shape measuring apparatus |
| CN203375937U (en) * | 2013-08-09 | 2014-01-01 | 昆山允可精密工业技术有限公司 | A manual single-measuring head sheet thickness contact measurement device |
| CN103646903A (en) * | 2013-12-11 | 2014-03-19 | 中国电子科技集团公司第二研究所 | Wafer positioning and thickness measuring apparatus |
-
2014
- 2014-09-23 CN CN201410492384.3A patent/CN104215188B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11248424A (en) * | 1998-03-02 | 1999-09-17 | Yamabun Denki:Kk | Device for measuring sheet thickness |
| CN2802440Y (en) * | 2005-06-23 | 2006-08-02 | 深圳市比克电池有限公司 | Thickness measuring device |
| CN202304756U (en) * | 2011-10-14 | 2012-07-04 | 深圳市正控科技有限公司 | Thickness measuring system |
| CN102829740A (en) * | 2012-09-12 | 2012-12-19 | 昆山允可精密工业技术有限公司 | Contact measuring apparatus |
| CN203375950U (en) * | 2013-08-09 | 2014-01-01 | 昆山允可精密工业技术有限公司 | A vertical wafer shape measuring apparatus |
| CN203375937U (en) * | 2013-08-09 | 2014-01-01 | 昆山允可精密工业技术有限公司 | A manual single-measuring head sheet thickness contact measurement device |
| CN103646903A (en) * | 2013-12-11 | 2014-03-19 | 中国电子科技集团公司第二研究所 | Wafer positioning and thickness measuring apparatus |
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| CN104215188B (en) | 2017-06-16 |
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