CN104201268A - Manufacturing method for infrared light emitting diode with embedded extended electrode - Google Patents
Manufacturing method for infrared light emitting diode with embedded extended electrode Download PDFInfo
- Publication number
- CN104201268A CN104201268A CN201410433711.8A CN201410433711A CN104201268A CN 104201268 A CN104201268 A CN 104201268A CN 201410433711 A CN201410433711 A CN 201410433711A CN 104201268 A CN104201268 A CN 104201268A
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- emitting diode
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 24
- 238000001704 evaporation Methods 0.000 claims abstract description 25
- 239000000758 substrate Substances 0.000 claims abstract description 25
- 230000008020 evaporation Effects 0.000 claims abstract description 23
- 238000005260 corrosion Methods 0.000 claims abstract description 17
- 230000007797 corrosion Effects 0.000 claims abstract description 17
- 239000007769 metal material Substances 0.000 claims abstract description 15
- 239000002184 metal Substances 0.000 claims abstract description 6
- 239000010410 layer Substances 0.000 claims description 151
- 239000000463 material Substances 0.000 claims description 37
- 238000000034 method Methods 0.000 claims description 24
- 239000011241 protective layer Substances 0.000 claims description 9
- 238000001259 photo etching Methods 0.000 claims description 8
- 238000001039 wet etching Methods 0.000 claims description 6
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 5
- 229910000980 Aluminium gallium arsenide Inorganic materials 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 6
- 150000001875 compounds Chemical class 0.000 description 16
- 230000003628 erosive effect Effects 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 230000012010 growth Effects 0.000 description 3
- 239000000470 constituent Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- TVEXGJYMHHTVKP-UHFFFAOYSA-N 6-oxabicyclo[3.2.1]oct-3-en-7-one Chemical compound C1C2C(=O)OC1C=CC2 TVEXGJYMHHTVKP-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/40—Materials therefor
- H01L33/405—Reflective materials
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Devices (AREA)
Abstract
The invention discloses a manufacturing method for an infrared light emitting diode with an embedded extended electrode. The manufacturing method for the infrared light emitting diode with the embedded extended electrode includes that forming a corrosion resisting layer, an armoring layer, an ohmic contact layer, a first current extension layer, a first limit layer, an active layer, a second limit layer and a second current extension layer on an epitaxial substrate in sequence; forming a metal reflector layer on the second current extension layer through evaporation; bonding a metal reflecting layer to a base plate; removing the epitaxial substrate and corrosion resisting layer to expose the armoring layer; forming an extended electrode pattern channel in the surface of the armoring layer, wherein the channel is deep enough to expose the ohmic contact layer; evaporating metal material in the channel to form the extended electrode; manufacturing a bonding pad electrode at the surface of the armoring layer, and communicating the bonding pad electrode with the extended electrode; evaporating a back electrode at the back of the base plate, removing protecting layers of the bonding pad electrode and extended electrode, and shredding to obtain the infrared light emitting diode with the embedded extended electrode. The manufacturing method for the infrared light emitting diode with the embedded extended electrode is capable of improving the reliability of the extended electrode, obtaining better current extension effect and improving the light emitting efficiency of the infrared light emitting diode.
Description
Technical field
The present invention relates to LED technology field, refer in particular to a kind of infrarede emitting diode manufacture method with embedded expansion electrode.
Background technology
Infrarede emitting diode has the little and high reliability of low-power consumption, size, is widely used in the fields such as communication, sensoring.In prior art, the epitaxial structure that adopts metallo-organic compound vapor phase epitaxial growth to have quantum well is obtained higher internal quantum efficiency; Meanwhile, adopt the flip-chip manufacture crafts such as metallic mirror and surface coarsening, promote the external quantum efficiency of infrarede emitting diode.
Described flip-chip manufacture craft adopts expansion electrode to improve current expansion effect conventionally, to obtain higher luminous efficiency.But, prior art overwhelming majority flip-chip manufacture craft all adopts expansion electrode to be directly formed at epitaxial loayer upper surface, this technique, in the time of erosion removal epitaxial loayer or surface coarsening epitaxial loayer, easily causes the epitaxial loayer under lateral erosion expansion electrode, causes the unsettled and caducous problem of expansion electrode.
Summary of the invention
The object of the present invention is to provide a kind of infrarede emitting diode manufacture method with embedded expansion electrode, easily cause the lateral erosion of the epitaxial loayer under expansion electrode to solve traditional manufacturing technique, cause the unsettled and caducous problem of expansion electrode, and make infrarede emitting diode obtain better current expansion effect, improve luminous efficiency and reliability.
For reaching above-mentioned purpose, solution of the present invention is:
An infrarede emitting diode manufacture method with embedded expansion electrode, comprises the following steps:
One, in epitaxial substrate, form successively corrosion cutoff layer, roughened layer, ohmic contact layer, the first type current extending, the first type limiting layer, active layer, Second-Type limiting layer, Second-Type current extending from bottom to top;
Two, evaporation metal speculum on Second-Type current extending, forms metallic reflector;
Three, by the surface bond of metallic mirror on the substrate with conductivity;
Four, adopt wet etching to remove respectively epitaxial substrate, corrosion cutoff layer, expose roughened layer;
Five, adopt mask, photoetching process on roughened layer, to form the figure of expansion electrode, adopt wet etching to remove the graphics field of the expansion electrode of roughened layer, form the groove of expansion electrode figure on roughened layer surface, gash depth is to exposing ohmic contact layer;
Six, in groove, evaporation metal material forms expansion electrode;
Seven, adopt mask, photoetching, evaporation process to make pad electrode on roughened layer surface, and pad electrode is connected and communicate with expansion electrode;
Eight, form protective layer at expansion electrode and pad electrode region, remove the protective layer in alligatoring region;
Nine, the surface that appears region of employing coarsening solution etching roughened layer, forms surface coarsening pattern;
Ten, at substrate back evaporation back electrode, remove the protective layer of pad electrode, expansion electrode, after sliver, obtain having the infrarede emitting diode of embedded expansion electrode.
Further, metal material is filled full groove until maintain an equal level with roughened layer surface or higher than the upper surface of roughened layer.
Further, make pad electrode in roughened layer centre of surface region.
Further, groove is set to " one " font, is set to four, and in four grooves, evaporation metal material forms expansion electrode, and pad electrode is arranged on roughened layer centre of surface region, forms expansion electrode be connected respectively conducting with four grooves.
Further, groove is set to " ten " font, is set to four, and in four grooves, evaporation metal material forms expansion electrode, and pad electrode is arranged on roughened layer centre of surface region, forms expansion electrode be connected respectively conducting with four grooves.
Further, groove is set to " Г " font, is set to four, and in four grooves, evaporation metal material forms expansion electrode, and pad electrode is arranged on roughened layer centre of surface region, forms expansion electrode be connected respectively conducting with four grooves.
Further, the thickness of roughened layer is 1.5-2 μ m.
Further, roughened layer material comprises Al
xga
1-xas, (Al
yga
1-y)
0.5in
0.5p, 1>=x>=0,1>=y>=0.
Further, ohmic contact layer material comprises Al
xga
1-xas, (Al
yga
1-y)
0.5in
0.5p, 0.1>=x>=0,0.05>=y>=0.
Further, the thickness of ohmic contact layer is 50-200nm.
Further, the material of corrosion cutoff layer comprises AlGaInP, GaAs or AlGaAs.
Further, the thickness of corrosion cutoff layer is 50-100nm.
Further, the material of roughened layer is arsenide material, and the material that corrodes cutoff layer, ohmic contact layer is phosphide material.
Further, the material of roughened layer is phosphide material, and the material that corrodes cutoff layer, ohmic contact layer is arsenide material.
There is an infrarede emitting diode for embedded expansion electrode, in ray structure one side, ohmic contact layer is set, roughened layer is set on ohmic contact layer; On roughened layer, form groove, form expansion electrode in groove, expansion electrode contacts with ohmic contact layer and forms ohmic contact; Adopt mask, photoetching, evaporation process to make pad electrode on roughened layer surface, pad electrode is connected conducting with expansion electrode.
Further, ray structure comprises the first type current extending, the first type limiting layer, active layer, Second-Type limiting layer and Second-Type current extending; Active layer one side arranges the first type limiting layer, and the first type current extending is set on the first type limiting layer, on the first type current extending, ohmic contact layer is set, and roughened layer is set on ohmic contact layer; Active layer opposite side arranges Second-Type limiting layer, and Second-Type current extending is set on Second-Type limiting layer.
Further, on Second-Type current extending, metallic reflector is set.
Further, metallic reflector is bonded on substrate, and back electrode is set on substrate.
Adopt after such scheme, the present invention forms the groove of expansion electrode on roughened layer surface, form expansion electrode by fill metal in groove, and expansion electrode is formed at ohmic contact layer, ohmic contact layer adopts the material system that is different from roughened layer, avoid the lateral erosion of roughening solution to ohmic contact layer, the buried design of expansion electrode and the design of the epitaxial structure of different material layer combine, thoroughly solve erosion removal epitaxial loayer or surface coarsening layer and caused the epitaxial loayer under lateral erosion expansion electrode, the technical problem that causes expansion electrode generation jagged edge or expansion electrode to come off.
By expansion electrode being produced on ohmic contact layer to form ohmic contact, pad electrode is produced on roughened layer, forms non-ohmic contact, and pad electrode is connected conducting with expansion electrode, obtains better current expansion effect.
Owing to there not being expansion electrode lateral erosion problem, so expansion electrode is around without electrode protection region, reduces the area that is in the light, and then increased lighting area.The present invention has improved luminous efficiency and the reliability of infrarede emitting diode.
Brief description of the drawings
Fig. 1 is the epitaxial structure schematic diagram of first embodiment of the invention;
Fig. 2 is the groove structure schematic diagram of first embodiment of the invention;
Fig. 3 is expansion electrode and the pad electrode structural representation of first embodiment of the invention;
Fig. 4 is the chip structure schematic diagram of first embodiment of the invention;
Fig. 5 is the groove structure schematic diagram of second embodiment of the invention;
Fig. 6 is expansion electrode and the pad electrode structural representation of second embodiment of the invention;
Fig. 7 is the chip structure schematic diagram of second embodiment of the invention.
Label declaration
Epitaxial substrate 1 is corroded cutoff layer 2
Roughened layer 3 ohmic contact layers 4
The first type current extending 5 first type limiting layers 6
Active layer 7 Second-Type limiting layers 8
Second-Type current extending 9 metallic reflectors 10
Silicon substrate 11 expansion electrodes 12
Groove 13 pad electrodes 14
Back electrode 15.
Embodiment
Below in conjunction with drawings and the specific embodiments, the present invention is described in detail.
Consult shown in Fig. 1 to Fig. 4 a kind of infrarede emitting diode first embodiment with embedded expansion electrode that the present invention discloses; Fig. 1 is the epitaxial structure of infrarede emitting diode, and this epitaxial structure is the intermediate of making the infrarede emitting diode with embedded expansion electrode.
Epitaxial structure is included in epitaxial substrate 1 upper surface and is followed successively by corrosion cutoff layer 2, roughened layer 3, ohmic contact layer 4, the first type current extending 5, the first type limiting layer 6, active layer 7, Second-Type limiting layer 8 and Second-Type current extending 9 from bottom to top.
Wherein, to adopt GaAs substrate and thickness be 300 μ m to epitaxial substrate 1.The material of corrosion cutoff layer 2 adopts (Al
0.5ga
0.5)
0.5in
0.5p tri-or five compounds of group.The thickness of corrosion cutoff layer 2 is 100nm.The constituent material of roughened layer 3 adopts Al
0.4ga
0.6as tri-or five compounds of group.The thickness range of roughened layer 3 is 2 μ m.The constituent material of ohmic contact layer 4 adopts Ga
0.5in
0.5p tri-or five compounds of group.The thickness of ohmic contact layer 4 is 100nm.The composition material of the first type current extending 5 is Al
0.2ga
0.8as tri-or five compounds of group, and thickness is 4 μ m; The material of the first type limiting layer 6 is Al
0.5ga
0.5as tri-or five compounds of group, and thickness is 400nm; The material of Second-Type limiting layer 8 is Al
0.5ga
0.5as tri-or five compounds of group, and thickness is 500nm; The material of Second-Type current extending 9 is Al
0.2ga
0.8a tri-or five compounds of group, and thickness is 6 μ m.Active layer 7 adopts the quantum well structure of AlGaInAs, AlGaAs tri-or five compounds of group alternating growths, and the logarithm of quantum well is 8 pairs, and emission wavelength is 850nm.
While using this epitaxial structure to make a kind of infrarede emitting diode with embedded expansion electrode, comprise the following steps:
One, on epitaxial substrate 1, form successively corrosion cutoff layer 2, roughened layer 3, ohmic contact layer 4, the first type current extending 5, the first type limiting layer 6, active layer 7, Second-Type limiting layer 8 and Second-Type current extending 9 from bottom to top.
Two, evaporation metal speculum on Second-Type current extending 9, forms metallic reflector 10.
Three, the surface bond of metallic mirror is had to the silicon substrate 11 of conductivity.
Four, adopt wet etching to remove respectively epitaxial substrate 1, corrosion cutoff layer 2, expose roughened layer 3.
Five, adopt the techniques such as mask, photoetching on roughened layer 3, to form the figure of expansion electrode 12, adopt wet etching to remove expansion electrode 12 graphics fields of roughened layer 3, form the groove 13 with expansion electrode figure on roughened layer 3 surfaces, the degree of depth of groove 13 is to exposing ohmic contact layer 4, as shown in Figure 2.
Six, at the interior evaporation metal material of groove 13, form expansion electrode 12, and metal material is filled full groove 13 until maintain an equal level with roughened layer 3 surfaces or higher than the upper surface of roughened layer 3.
Seven, adopt the techniques such as mask, photoetching, evaporation to make pad electrode 14 in the central area on roughened layer 3 surfaces, and pad electrode 14 is connected and communicate with expansion electrode 12, as shown in Figure 3.
In the present embodiment, groove 13 is set to " one " font, be set to four, form expansion electrode 12 at four interior evaporation metal materials of groove 13, pad electrode 14 is arranged on roughened layer 3 centre of surface regions, forms expansion electrode 12 be connected respectively conducting with four grooves 13, and this structure fabrication is comparatively simple, convenient, obtain better current expansion effect.
Step 8, forms protective layer at expansion electrode 12 and pad electrode 14 regions, removes the protective layer in alligatoring region.
Step 9, the surface that appears region of employing coarsening solution etching roughened layer 3, forms surface coarsening pattern.
Step 10, at silicon substrate 11 back side evaporation back electrodes 15, removes the protective layer of pad electrode 13, expansion electrode 12, obtains having the infrarede emitting diode of embedded expansion electrode, as shown in Figure 4 after sliver.
A kind of infrarede emitting diode with embedded expansion electrode, active layer 7 one sides arrange the first type limiting layer 6, on the first type limiting layer 6, arrange on the first type current extending 5, the first type current extendings 5 ohmic contact layer 4 is set, roughened layer 3 is set on ohmic contact layer 4; On roughened layer 3, form groove 13, form expansion electrode 12 in groove 13, expansion electrode 12 contacts with ohmic contact layer 4 and forms ohmic contact; Adopt mask, photoetching, evaporation process to make pad electrode 14 on roughened layer 3 surfaces, pad electrode 14 is connected conducting with expansion electrode 12.
Active layer 7 opposite sides arrange Second-Type limiting layer 8, and Second-Type current extending 9 is set on Second-Type limiting layer 8; Metallic reflector 10 is set on Second-Type current extending 9; Metallic reflector 10 is bonded on silicon substrate 11, and back electrode 15 is set on silicon substrate 11.
As shown in Figures 5 to 7, a kind of infrarede emitting diode second embodiment with embedded expansion electrode that the present invention discloses, be different from the first embodiment:
It is 300 μ m that epitaxial substrate 1 adopts GaAs substrate and thickness.The material of corrosion cutoff layer 2 adopts GaAs tri-or five compounds of group, the thickness d of corrosion cutoff layer 2
2for 60nm.The material of roughened layer 3 adopts (Al
0.7ga
0.3)
0.5in
0.5p tri-or five compounds of group, the thickness of roughened layer 3 is 1.8 μ m.The material of ohmic contact layer 4 adopts Al
0.1ga
0.9as tri-or five compounds of group, the thickness of ohmic contact layer 4 is 90nm.The material of the first type current extending 5 is (Al
0.1ga
0.9)
0.5in
0.5p tri-or five compounds of group, and thickness is 4.5 μ m.The material of the first type limiting layer 6 is (Al
0.5ga
0.5)
0.5in
0.5p tri-or five compounds of group, and thickness is 500nm.The material of Second-Type limiting layer 8 is (Al
0.5ga
0.5)
0.5in
0.5p tri-or five compounds of group, and thickness is 550nm.The material of Second-Type current extending 9 is (Al
0.1ga
0.9)
0.5in
0.5p tri-or five compounds of group, and thickness is 5 μ m.Active layer 7 adopts the quantum well structure of AlGaInAs, AlGaAs tri-or five compounds of group alternating growths, and the logarithm of quantum well is 8 pairs, and emission wavelength is 850nm.
Groove 13 is set to " ten " font, be set to four, form expansion electrode 12 at four interior evaporation metal materials of groove 13, pad electrode 14 is arranged on roughened layer 3 centre of surface regions, form expansion electrode 12 with four grooves 13 and be connected respectively conducting, this structure makes embedded expansion electrode structure more stable, obtains better current expansion effect.
The foregoing is only preferred embodiment of the present invention, the not restriction to this case design, all equivalent variations of doing according to the design key of this case, all fall into the protection range of this case.
Claims (10)
1. an infrarede emitting diode manufacture method with embedded expansion electrode, is characterized in that, comprises the following steps:
One, in epitaxial substrate, form successively corrosion cutoff layer, roughened layer, ohmic contact layer, the first type current extending, the first type limiting layer, active layer, Second-Type limiting layer, Second-Type current extending from bottom to top;
Two, evaporation metal speculum on Second-Type current extending, forms metallic reflector;
Three, by the surface bond of metallic mirror on the substrate with conductivity;
Four, adopt wet etching to remove respectively epitaxial substrate, corrosion cutoff layer, expose roughened layer;
Five, adopt mask, photoetching process on roughened layer, to form the figure of expansion electrode, adopt wet etching to remove the graphics field of the expansion electrode of roughened layer, form the groove of expansion electrode figure on roughened layer surface, gash depth is to exposing ohmic contact layer;
Six, in groove, evaporation metal material forms expansion electrode;
Seven, adopt mask, photoetching, evaporation process to make pad electrode on roughened layer surface, and pad electrode is connected and communicate with expansion electrode;
Eight, form protective layer at expansion electrode and pad electrode region, remove the protective layer in alligatoring region;
Nine, the surface that appears region of employing coarsening solution etching roughened layer, forms surface coarsening pattern;
Ten, at substrate back evaporation back electrode, remove the protective layer of pad electrode, expansion electrode, after sliver, obtain having the infrarede emitting diode of embedded expansion electrode.
2. a kind of infrarede emitting diode manufacture method with embedded expansion electrode as claimed in claim 1, is characterized in that, metal material is filled full groove until maintain an equal level with roughened layer surface or higher than the upper surface of roughened layer.
3. a kind of infrarede emitting diode manufacture method with embedded expansion electrode as claimed in claim 1, is characterized in that, makes pad electrode in roughened layer centre of surface region.
4. a kind of infrarede emitting diode manufacture method with embedded expansion electrode as claimed in claim 1, it is characterized in that, groove is set to " one " font, be set to four, in four grooves, evaporation metal material forms expansion electrode, pad electrode is arranged on roughened layer centre of surface region, forms expansion electrode be connected respectively conducting with four grooves.
5. a kind of infrarede emitting diode manufacture method with embedded expansion electrode as claimed in claim 1, it is characterized in that, groove is set to " ten " font, be set to four, in four grooves, evaporation metal material forms expansion electrode, pad electrode is arranged on roughened layer centre of surface region, forms expansion electrode be connected respectively conducting with four grooves.
6. a kind of infrarede emitting diode manufacture method with embedded expansion electrode as claimed in claim 1, it is characterized in that, groove is set to " Г " font, be set to four, in four grooves, evaporation metal material forms expansion electrode, pad electrode is arranged on roughened layer centre of surface region, forms expansion electrode be connected respectively conducting with four grooves.
7. a kind of infrarede emitting diode manufacture method with embedded expansion electrode as claimed in claim 1, is characterized in that, roughened layer material comprises Al
xga
1-xas, (Al
yga
1-y)
0.5in
0.5p, 1>=x>=0,1>=y>=0; The thickness of roughened layer is 1.5-2 μ m.
8. a kind of infrarede emitting diode manufacture method with embedded expansion electrode as claimed in claim 1, is characterized in that, ohmic contact layer material comprises Al
xga
1-xas, (Al
yga
1-y)
0.5in
0.5p, 0.1>=x>=0,0.05>=y>=0; The thickness of ohmic contact layer is 50-200nm.
9. a kind of infrarede emitting diode manufacture method with embedded expansion electrode as claimed in claim 1, is characterized in that, the material of corrosion cutoff layer comprises AlGaInP, GaAs or AlGaAs; The thickness of corrosion cutoff layer is 50-100nm.
10. a kind of infrarede emitting diode manufacture method with embedded expansion electrode as claimed in claim 1, is characterized in that, the material of roughened layer is arsenide material, and the material that corrodes cutoff layer, ohmic contact layer is phosphide material; The material of roughened layer is phosphide material, and the material that corrodes cutoff layer, ohmic contact layer is arsenide material.
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|---|---|---|---|
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|---|---|---|---|
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Family
ID=52086533
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104617195A (en) * | 2015-02-06 | 2015-05-13 | 扬州乾照光电有限公司 | Near infrared LED and production method thereof |
| CN105870227A (en) * | 2016-06-12 | 2016-08-17 | 天津三安光电有限公司 | Infrared LED (Light-Emitting Diode) |
| CN106129211A (en) * | 2016-08-24 | 2016-11-16 | 南昌凯迅光电有限公司 | There is light emitting diode of embedded transparent expansion electrode structure and preparation method thereof |
| CN106129205A (en) * | 2016-08-24 | 2016-11-16 | 南昌凯迅光电有限公司 | A kind of LED chip of ito thin film structure and preparation method thereof |
| CN106299058A (en) * | 2016-08-30 | 2017-01-04 | 扬州乾照光电有限公司 | A kind of epitaxial wafer for upside-down mounting infrarede emitting diode |
| CN109713566A (en) * | 2019-03-01 | 2019-05-03 | 厦门乾照半导体科技有限公司 | A kind of VCSEL array structure and preparation method thereof |
| CN112289904A (en) * | 2020-09-16 | 2021-01-29 | 华灿光电(苏州）有限公司 | Manufacturing method of red light LED |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101207172A (en) * | 2007-11-30 | 2008-06-25 | 厦门三安电子有限公司 | Inversed trapezoid micro-structure high-brightness LED and making method thereof |
| US20090075412A1 (en) * | 2005-04-07 | 2009-03-19 | Samsung Electro-Mechanics Co., Ltd. | Vertical group iii-nitride light emitting device and method for manufacturing the same |
| CN101714600A (en) * | 2009-11-16 | 2010-05-26 | 厦门市三安光电科技有限公司 | Inversed AlGaInP based light-emitting diode and manufacturing method thereof |
| CN103456856A (en) * | 2013-09-05 | 2013-12-18 | 深圳市智讯达光电科技有限公司 | Inversion LED chip and ohmic contact electrode structure of inversion LED chip |
-
2014
- 2014-08-29 CN CN201410433711.8A patent/CN104201268A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090075412A1 (en) * | 2005-04-07 | 2009-03-19 | Samsung Electro-Mechanics Co., Ltd. | Vertical group iii-nitride light emitting device and method for manufacturing the same |
| CN101207172A (en) * | 2007-11-30 | 2008-06-25 | 厦门三安电子有限公司 | Inversed trapezoid micro-structure high-brightness LED and making method thereof |
| CN101714600A (en) * | 2009-11-16 | 2010-05-26 | 厦门市三安光电科技有限公司 | Inversed AlGaInP based light-emitting diode and manufacturing method thereof |
| CN103456856A (en) * | 2013-09-05 | 2013-12-18 | 深圳市智讯达光电科技有限公司 | Inversion LED chip and ohmic contact electrode structure of inversion LED chip |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104617195A (en) * | 2015-02-06 | 2015-05-13 | 扬州乾照光电有限公司 | Near infrared LED and production method thereof |
| CN104617195B (en) * | 2015-02-06 | 2017-10-17 | 扬州乾照光电有限公司 | A kind of near-infrared luminous diode and its production method |
| CN105870227A (en) * | 2016-06-12 | 2016-08-17 | 天津三安光电有限公司 | Infrared LED (Light-Emitting Diode) |
| CN105870227B (en) * | 2016-06-12 | 2017-07-14 | 天津三安光电有限公司 | Infrarede emitting diode |
| CN106129211A (en) * | 2016-08-24 | 2016-11-16 | 南昌凯迅光电有限公司 | There is light emitting diode of embedded transparent expansion electrode structure and preparation method thereof |
| CN106129205A (en) * | 2016-08-24 | 2016-11-16 | 南昌凯迅光电有限公司 | A kind of LED chip of ito thin film structure and preparation method thereof |
| CN106299058A (en) * | 2016-08-30 | 2017-01-04 | 扬州乾照光电有限公司 | A kind of epitaxial wafer for upside-down mounting infrarede emitting diode |
| CN109713566A (en) * | 2019-03-01 | 2019-05-03 | 厦门乾照半导体科技有限公司 | A kind of VCSEL array structure and preparation method thereof |
| CN112289904A (en) * | 2020-09-16 | 2021-01-29 | 华灿光电(苏州）有限公司 | Manufacturing method of red light LED |
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