CN104201155A - Chip assembling tool - Google Patents

Chip assembling tool Download PDF

Info

Publication number
CN104201155A
CN104201155A CN201410487124.7A CN201410487124A CN104201155A CN 104201155 A CN104201155 A CN 104201155A CN 201410487124 A CN201410487124 A CN 201410487124A CN 104201155 A CN104201155 A CN 104201155A
Authority
CN
China
Prior art keywords
chip
circuit board
assembly tooling
mainboard
chip assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201410487124.7A
Other languages
Chinese (zh)
Inventor
杨陈波
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ANHUI LANHAI MECHANICAL AND ELECTRICAL EQUIPMENT Co Ltd
Original Assignee
ANHUI LANHAI MECHANICAL AND ELECTRICAL EQUIPMENT Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ANHUI LANHAI MECHANICAL AND ELECTRICAL EQUIPMENT Co Ltd filed Critical ANHUI LANHAI MECHANICAL AND ELECTRICAL EQUIPMENT Co Ltd
Priority to CN201410487124.7A priority Critical patent/CN104201155A/en
Publication of CN104201155A publication Critical patent/CN104201155A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0008Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15Position of the PCB during processing
    • H05K2203/1572Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides

Abstract

The invention discloses a chip assembling tool. Chips comprise first chips and second chips; the first chips are positioned on a front surface of a circuit board; and the second chips are positioned on a reverse surface of the circuit board. The chip assembling tool comprises a main board (1) and a clamping plate (2), wherein the clamping plate (2) is hinged to one end of the main board (1); a plurality of positioning grooves (3) which are recessed downwards are formed in the upper surface of the main board (1) at intervals; the first chips are placed in the positioning grooves (3); the clamping plate (2) is provided with a plurality of through grooves (6); a circuit board is placed on the positioning grooves so that the first chips can be mounted; and the clamping plate (2) can cover a reverse surface of the circuit board so that the second chips are mounted on the circuit board through the through grooves (6). By the chip assembling tool, the chips on two sides of the circuit board can be assembled simultaneously. The chip assembling tool is convenient to operate; and the work efficiency is improved.

Description

Chip assembly tooling
Technical field
The present invention relates to electronic device assembly tooling, particularly, relate to a kind of chip assembly tooling.
Background technology
Chip is the chief component in circuit board, though its volume is little, powerful.In the time of board production, because chip has pin, the many and easily bending of pin number, therefore the assembling of chip is difficult for.In the time of assembling chip, operating personnel can carry out auxiliary operation by frock at present, improve installation effectiveness.But existing frock can only be carried out chip fitting operation to the one side of circuit board, reverse circuit plate after one side installs, then another side is carried out to chip assembling, waste time and energy.
Summary of the invention
The object of this invention is to provide a kind of chip assembly tooling, this chip assembly tooling can be assembled the chip of the both sides of circuit board simultaneously, easy to operate, increases work efficiency.
To achieve these goals, the invention provides a kind of chip assembly tooling, described chip comprises the first chip that is positioned at circuit board front and the second chip that is positioned at circuit board reverse side, and described chip assembly tooling comprises mainboard and clamping plate; Described clamping plate are articulated with one end of described mainboard; The upper surface of described mainboard is arranged at intervals with multiple location notchs to lower recess and described location notch for placing described the first chip; On described clamping plate, be provided with multiple grooves; Wherein, described circuit board is placed on described location notch so that the first chip to be installed, described clamping plate can be covered in described circuit board reverse side so that described the second chip be installed on described circuit board by described groove.
Preferably, described chip assembly tooling also comprises fixed head, and described fixed head is removably installed on the upper surface of described mainboard, and described location notch is positioned on described fixed head.
Preferably, the shape of described fixed head and the shape of described circuit board match.
Preferably, described chip assembly tooling also comprises baffle plate, and described baffle plate is vertically installed on the upper surface of described mainboard and described baffle plate is provided with at least two reference columns, and described reference column is for fixing described circuit board.
Preferably, in the direction of the upper surface perpendicular to described mainboard, the height of described baffle plate is not more than the height sum of described circuit board and fixed head.
Preferably, described reference column is threaded rod, is provided with the screwed hole matching with described threaded rod on described baffle plate.
Preferably, described removably is for being threaded or snap assembled.
By technique scheme, clamping plate and the mainboard of chip assembly tooling provided by the invention are hinged, make the clamping plate can be around hinge through to press close to or away from mainboard; On mainboard, be provided with multiple location notchs and be used for placing the first chip, same, on clamping plate, be also provided with multiple grooves and be used for installing the second chip; When installation, first the first chip is placed in location notch, then circuit board to be assembled is covered on location notch, and be threaded connection or weld the front that the first chip in location notch is mounted to circuit board; Then clamping plate are turned to the position of fitting with circuit board reverse side, then the second chip is placed in the groove on clamping plate and is fixed to circuit board reverse side, last rotary clamp plate takes out the circuit board that assembles chip.Whole process all operates in frock, has avoided the hand-held chip of operating personnel to cause bending even to damage to chip pin.Meanwhile, use this chip assembly tooling to assemble the chip of circuit board both sides simultaneously, add the earth and improved production efficiency, reduced production cost.
Other features and advantages of the present invention are described in detail the embodiment part subsequently.
Brief description of the drawings
Accompanying drawing is to be used to provide a further understanding of the present invention, and forms a part for specification, is used from explanation the present invention, but is not construed as limiting the invention with embodiment one below.In the accompanying drawings:
Fig. 1 is the structural representation of the chip assembly tooling in the preferred embodiment of the present invention.
Description of reference numerals
1-mainboard 2-clamping plate
3-location notch 4-fixed head
5-reference column 6-groove
Embodiment
Below in conjunction with accompanying drawing, the specific embodiment of the present invention is elaborated.Should be understood that, embodiment described herein only, for description and interpretation the present invention, is not limited to the present invention.
Referring to Fig. 1, a kind of chip assembly tooling provided by the invention, chip comprises the first chip that is positioned at circuit board front and the second chip that is positioned at circuit board reverse side, chip assembly tooling comprises mainboard 1 and clamping plate 2; Clamping plate 2 are articulated with one end of mainboard 1; The upper surface of mainboard 1 is arranged at intervals with multiple location notchs 3 to lower recess and location notch 3 for placing the first chip; On clamping plate 2, be provided with multiple grooves 6; Wherein, circuit board is placed on location notch 3 so that the first chip to be installed, clamping plate 2 can be covered in circuit board reverse side so that the second chip be installed on circuit board by groove 6.
Clamping plate 2 are hinged with mainboard 1, and like this, clamping plate 2 can rotate or away from mainboard 1 around hinge portion; On mainboard 1, be provided with multiple location notchs 3 and be used for placing the first chip, same, on clamping plate 2, be also provided with multiple grooves 6 and be used for installing the second chip; When installation, first the first chip is placed in location notch 3, then circuit board to be assembled is covered on location notch 3, and be threaded connection or weld the front that the first chip in location notch 3 is mounted to circuit board; Then clamping plate 2 are turned to the position of fitting with circuit board reverse side, then the second chip is placed in the groove 6 on clamping plate 2 and is fixed to circuit board reverse side, last rotary clamp plate 2 takes out the circuit board that assembles chip.Whole process all operates in frock, has avoided the hand-held chip of operating personnel to cause bending even to damage to chip pin.Meanwhile, use this chip assembly tooling to assemble the chip of circuit board both sides simultaneously, add the earth and improved production efficiency, reduced production cost.
It is laminar that available circuit plate and chip are all, for the ease of the laying and taking out of circuit board and chip, preferably, also as shown in Figure 1, chip assembly tooling also comprises fixed head 4, and fixed head 4 is removably installed on the upper surface of mainboard 1, and location notch 3 is positioned on fixed head 4.First side chip to be installed on circuit board is positioned in the location notch 3 on fixed head 4, then circuit board is kept flat to fixed head 4 and covered on the chip in location notch 3.Fixed head 4 is protruding state on the upper surface of mainboard 1 like this, for operating personnel fetch circuit board and chip brought greatly convenient.For the mounting means between fixed head 4 and mainboard 1, it can be the fixed form between any two kinds of sheet materials in this area.In the present embodiment, between circuit board and chip, take the mode being threaded, axially align by the screwed hole on screwed hole and chip on circuit board, being equipped with threaded connector, fastening (threaded connector can be for threaded rod herein again, also can be bolt, can also be screw).This being threaded is convenient to installation and removal.Certainly, being connected between circuit board and chip also can adopt welding manner, in this connected mode, can carry out soldering by corresponding with pad on chip the welding hole on circuit board again.
In above-mentioned assembling process, for the undersized generation that causes supporting full wafer circuit board so that the cracked situation of circuit board that prevents fixed head 4, preferably, the shape of fixed head 4 and the shape of circuit board match.Fixed head 4 just can provide uniform support force to circuit board various piece like this, stressed evenly to ensure circuit board.
Simultaneously, operating personnel complete manual circuit board being covered on fixed head 4, and when this step that the installing hole of the chip in location notch 3 on the installing hole on circuit board and fixed head 4 is axially aligned, because causing circuit board, the smooth surface of circuit board often on fixed head 4, occurs sliding, so not only reduce chip has been arranged on to the efficiency on circuit board, and can cause occurring scar on the surface of circuit board to such an extent as to reduced the qualification rate of product.Preferably, chip assembly tooling also comprises baffle plate, and baffle plate is vertically installed on the upper surface of mainboard 1 and baffle plate is provided with at least two reference columns 5, and reference column 5 is for fixing circuit board.Like this, when assembling chip, need only the end that circuit board is placed on fixed head 3 and board edge is resisted against to reference column 5, just can limit better circuit board position, fully avoided circuit board to occur the generation of the situation of sliding.
In addition, reference column 5 can be any shaped element that can play positioning action, can be that threaded rod can be also latch.For the ease of the installation and removal of the parts of this chip assembly tooling, and taking cost into account, preferably, reference column 5 is threaded rod, is provided with the screwed hole matching with threaded rod on baffle plate.Owing to being to be threaded between reference column 5 and baffle plate, therefore can change the threaded rod of different thicknesses to the circuit board of different thin and thicks, thicker circuit board need to use thicker threaded rod to coordinate with it can play corresponding position-limiting action.
In addition, in the present invention, for fear of clamping plate 2 and fixed head 4, in clamping circuit boards, baffle plate causes obstruction to this process, and preferably, the height of baffle plate is not more than the height sum of circuit board and fixed head 4.Like this, screw thread just can make the installing hole on circuit board axially overlap with the groove 6 on clamping plate 2 when installing or welding the second chip, now places and install the second chip more smooth and easy, otherwise causes assembling difficulty owing to not coordinating.
In technique scheme, mentioned removably can be for being threaded or snap assembled, other alternative modes that removably connect that also can be known to the skilled person.
Below describe by reference to the accompanying drawings the preferred embodiment of the present invention in detail; but; the present invention is not limited to the detail in above-mentioned execution mode; within the scope of technical conceive of the present invention; can carry out multiple simple variant to technical scheme of the present invention, these simple variant all belong to protection scope of the present invention.
It should be noted that in addition, each concrete technical characterictic described in above-mentioned embodiment, in reconcilable situation, can combine by any suitable mode, for fear of unnecessary repetition, the present invention is to the explanation no longer separately of various possible compound modes.
In addition, also can carry out combination in any between various execution mode of the present invention, as long as it is without prejudice to thought of the present invention, it should be considered as content disclosed in this invention equally.

Claims (7)

1. a chip assembly tooling, described chip comprises the first chip that is positioned at circuit board front and the second chip that is positioned at circuit board reverse side, it is characterized in that, described chip assembly tooling comprises mainboard (1) and clamping plate (2); Described clamping plate (2) are articulated with one end of described mainboard (1); The upper surface of described mainboard (1) is arranged at intervals with multiple location notchs to lower recess (3) and described location notch (3) for placing described the first chip; On described clamping plate (2), be provided with multiple grooves (6);
Wherein, it is upper so that the first chip to be installed that described circuit board is placed in described location notch (3), described clamping plate (2) can be covered in described circuit board reverse side so that described the second chip be installed on described circuit board by described groove (6).
2. chip assembly tooling according to claim 1, it is characterized in that, described chip assembly tooling also comprises fixed head (4), described fixed head (4) is removably installed on the upper surface of described mainboard (1), and described location notch (3) is positioned on described fixed head (4).
3. chip assembly tooling according to claim 2, is characterized in that, the shape of described fixed head (4) and the shape of described circuit board match.
4. according to the chip assembly tooling described in any one in claim 2-3, it is characterized in that, described chip assembly tooling also comprises baffle plate, described baffle plate is vertically installed on the upper surface of described mainboard (1) and described baffle plate is provided with at least two reference columns (5), and described reference column (5) is for fixing described circuit board.
5. chip assembly tooling according to claim 4, is characterized in that, in the direction of the upper surface perpendicular to described mainboard (1), the height of described baffle plate is not more than the height sum of described circuit board and fixed head (4).
6. chip assembly tooling according to claim 4, is characterized in that, described reference column (5) is threaded rod, is provided with the screwed hole matching with described threaded rod on described baffle plate.
7. chip assembly tooling according to claim 2, is characterized in that, described removably is for being threaded or snap assembled.
CN201410487124.7A 2014-09-22 2014-09-22 Chip assembling tool Pending CN104201155A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410487124.7A CN104201155A (en) 2014-09-22 2014-09-22 Chip assembling tool

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410487124.7A CN104201155A (en) 2014-09-22 2014-09-22 Chip assembling tool

Publications (1)

Publication Number Publication Date
CN104201155A true CN104201155A (en) 2014-12-10

Family

ID=52086427

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410487124.7A Pending CN104201155A (en) 2014-09-22 2014-09-22 Chip assembling tool

Country Status (1)

Country Link
CN (1) CN104201155A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106425139A (en) * 2016-11-10 2017-02-22 上海安费诺永亿通讯电子有限公司 Fixture for welding metal mini-connector on antenna on mobile device
TWI822033B (en) * 2022-04-27 2023-11-11 大陸商宏啟勝精密電子(秦皇島)有限公司 Roll-to-roll component mounting machine and method for mounting component on flexible circuit board

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106425139A (en) * 2016-11-10 2017-02-22 上海安费诺永亿通讯电子有限公司 Fixture for welding metal mini-connector on antenna on mobile device
CN106425139B (en) * 2016-11-10 2018-07-31 上海安费诺永亿通讯电子有限公司 Micro metal connector welding jig in a kind of mobile device antenna
TWI822033B (en) * 2022-04-27 2023-11-11 大陸商宏啟勝精密電子(秦皇島)有限公司 Roll-to-roll component mounting machine and method for mounting component on flexible circuit board

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WD01 Invention patent application deemed withdrawn after publication
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20141210