CN104198265A - Stress and current coupled thermal cycling device for testing lead-free solder joints - Google Patents
Stress and current coupled thermal cycling device for testing lead-free solder joints Download PDFInfo
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- CN104198265A CN104198265A CN201410331008.6A CN201410331008A CN104198265A CN 104198265 A CN104198265 A CN 104198265A CN 201410331008 A CN201410331008 A CN 201410331008A CN 104198265 A CN104198265 A CN 104198265A
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- free solder
- solder joint
- lead
- stress
- copper cash
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- Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
- Testing Of Devices, Machine Parts, Or Other Structures Thereof (AREA)
Abstract
A stress and current coupled thermal cycling device for testing lead-free solder joints is simple and reasonable in structure, convenient in use and safe in application, the greatest advantage is that: the stress and current coupled thermal cycling device can load stress and current, and overcomes the limitation of time efficiency sample study under single conditions in the prior art, and by adjusting the stress and the current, coupling under two-field conditions is studied for simulation of the actual service process of the solder joints.
Description
Technical field
The present invention is many coupled aging devices in a kind of actual solder joint military service process, specifically a kind of stress that Lead-Free Solder Joint uses and thermocirculator of current coupling tested.
Background technology
Solder joint in actual military service process because periodically temperature variation and current switching all can experience thermal cycle effect.Thermal Cycling temperature retention time is the principal element that affects interface compound growth; After experience thermal cycle, the empty quantity at SnAgCu/Cu interface increases, and reduces interface bond strength, and then has reduced the low-cycle fatigue life of solder joint.In actual product, Lead-Free Solder Joint often suffers two or many field actions such as temperature field, electric field, stress field and magnetic field.Existing research shows, under hot shearing ringing, to obtain growth rate faster than the growth under single shear action for interface compound.Under strong magnetic field action, the growth rate of IMC layer is accelerated, and crystal orientation changes; The variation of Sn3Ag0.5Cu at different electromigration time median surface IMC studied in defending of south China science and engineering, found that: at 1.78 × 104A/cm
2, under the condition that loading temperature is 373K, with the passing of person's time, interface compound shows obvious polar effect, and anodic interface IMC thickens and is para-curve and changes, cathode interface attenuate.Visible, thermal cycling temperature field, stress field, electric current and magnetic field all have a significant effect to Lead-Free Solder Joint IMC growth behavior.Lack at present the special testing equipment of Lead-Free Solder Joint under many couplings, cause the experiment progress difficulty of the actual Service Environment of simulating solder joint large, under actual service condition, Lead-Free Solder Joint reliability consideration still less.
Summary of the invention
The technical issues that need to address of the present invention are the deficiencies that overcome figure viewed from behind technology, the stress and the current coupling ageing device that provide a kind of Lead-Free Solder Joint simple and reasonable, easy to use, application safety to use, the advantage of maximum of the present invention is loading stress and electric current, overcome the research of timeliness sample under single condition in the past, research under can two coupling conditions, by regulating stress and size of current, and then the actual military service process of simulating solder joint.
For realizing above-mentioned technical purpose, the technical solution adopted in the present invention is: a kind of stress that Lead-Free Solder Joint uses and thermocirculator of current coupling tested, by stress loading mechanism, the wire being connected with power-supply unit, treat temperature control heating mechanism that Lead-Free Solder Joint sample heats and for placing support and the composition for the treatment of Lead-Free Solder Joint sample, described stress loading mechanism comprises the many copper cash that are connected with wire and multiple counterweight, taking two copper cash as one group, and be arranged in the same radial alignment of support, the two ends for the treatment of Lead-Free Solder Joint sample connect respectively copper cash one end, the other end of copper cash is connected with counterweight, described temperature control heating mechanism is made up of Far infrared heating plate and temp probe, Far infrared heating plate setting corresponding to Lead-Free Solder Joint sample, temp probe is arranged on around Lead-Free Solder Joint sample, detect Lead-Free Solder Joint specimen temperature.
Described stress loading mechanism also comprises the guide wheel for supporting copper cash and rolling and arrange on support.
Described guide wheel is fluting bearing.
The invention has the beneficial effects as follows:
1, the design of coupling device has met researcher and has inquired into better the actual service condition of solder joint.The design of many coupling devices is used and has changed the service state of in the past only studying the solder joint under single condition, and this reliability to raising solder joint provides must theoretical foundation.
2, by close current gauge tap or remove stress loading counterweight and all can realize any two and be coupled, amount of heat, the size in stress loading size and magnetic field is all adjustable, test as required under different condition, change gradually amount of heat, stress loading size and magnetic field size, create the fine setting condition in test, and then the actual military service process of simulating solder joint.
3, on support, be provided with the guide wheel of slip, ensure that copper cash is in stress loading process, along with the increase of counterweight, position can not change, and reduced by the impact of friction force, makes the change of stress intensity even, can not make experimental situation change inhomogeneous, make experimental result accurate.
Brief description of the drawings
Fig. 1 is structural representation of the present invention;
In figure: 1, stress loading mechanism, 101, copper cash, 102, counterweight, 103, guide wheel, 2, wire, 3, temperature control heating mechanism, 301, Far infrared heating plate, 302, temp probe, 4, support.
Embodiment
As shown in the figure, a kind of stress that Lead-Free Solder Joint uses and thermocirculator of current coupling tested, on the stationary shaft of support two ends, fluting bearing is installed, and two fluting bearings are fixed in same radial alignment, with copper cash connect treat Lead-Free Solder Joint sample two bring in carry out solder joint stress field load, copper cash two ends loading counterweight carrys out the size of proof stress, counterweight size is fixing, can select as required to adjust, copper cash is fixed in same radial alignment, make to treat that the two ends of Lead-Free Solder Joint sample are stressed consistent, even if change the size of counterweight, change stress intensity, can need to adjust according to implementing, can there is not data deviation, treat that Lead-Free Solder Joint sample is placed in shelf central authorities, Far infrared heating plate is positioned at treats Lead-Free Solder Joint sample certain distance below, for rationally controlling the size variation of thermal cycling temperature, temp probe is positioned at treats Lead-Free Solder Joint sample around, carries out correction and the control of temperature, electric current provides by two-way voltage-stabilizing power supply, by the wire that is connected with copper cash to treating the energising of Lead-Free Solder Joint sample, can change as required and flow into the electric weight for the treatment of Lead-Free Solder Joint sample, carry out the loading of many coupling conditions of solder joint by said apparatus, and then the actual military service process of simulating solder joint.
The standard component that Selection of Bearings and stationary shaft match of slotting in the present invention, the bearing that makes to slot can rotate along stationary shaft, but can occurred level direction not move again, fluting bearing can need to arrange multiple according to experiment, the many copper cash of simultaneously arranging in pairs or groups, carry out stress intensity change, can be connected to the various piece for the treatment of Lead-Free Solder Joint sample, treat the each point stress intensity of Lead-Free Solder Joint sample by change, detect test specimen impact on Lead-Free Solder Joint experiment under various stress states.
In the present invention, copper cash option table is worn the copper cash of high-temperature insulation skin, with treat Lead-Free Solder Joint sample coupling part should be conduction to realize current load.
Claims (3)
1. test stress that Lead-Free Solder Joint uses and the thermocirculator of current coupling for one kind, it is characterized in that: by stress loading mechanism (1), the wire (2) being connected with power-supply unit, treat the temperature control heating mechanism (3) that Lead-Free Solder Joint sample heats and the support (4) for the treatment of Lead-Free Solder Joint sample for placing composition, described stress loading mechanism (1) comprises the many copper cash (101) that are connected with wire (2) and multiple counterweight (102), taking two copper cash (101) as one group, and be arranged in the same radial alignment of support (4), the two ends for the treatment of Lead-Free Solder Joint sample connect respectively copper cash (101) one end, the other end of copper cash (101) is connected with counterweight (102), described temperature control heating mechanism (3) is made up of Far infrared heating plate (301) and temp probe (302), Far infrared heating plate (301) setting corresponding to Lead-Free Solder Joint sample, temp probe (302) is arranged on around Lead-Free Solder Joint sample, detect Lead-Free Solder Joint specimen temperature.
2. a kind of stress that Lead-Free Solder Joint uses and thermocirculator of current coupling tested as claimed in claim 1, is characterized in that: described stress loading mechanism (1) also comprises for supporting copper cash (101) and at the upper guide wheel (103) that rolls and arrange of support (4).
3. a kind of stress that Lead-Free Solder Joint uses and thermocirculator of current coupling tested as claimed in claim 1, is characterized in that: described guide wheel (103) is fluting bearing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410331008.6A CN104198265A (en) | 2014-07-10 | 2014-07-10 | Stress and current coupled thermal cycling device for testing lead-free solder joints |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410331008.6A CN104198265A (en) | 2014-07-10 | 2014-07-10 | Stress and current coupled thermal cycling device for testing lead-free solder joints |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104198265A true CN104198265A (en) | 2014-12-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410331008.6A Pending CN104198265A (en) | 2014-07-10 | 2014-07-10 | Stress and current coupled thermal cycling device for testing lead-free solder joints |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105910918A (en) * | 2016-04-20 | 2016-08-31 | 西北工业大学 | In-situ test system for testing thermal-electric-force coupling performance of green electronic packaging material |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102081140A (en) * | 2010-12-03 | 2011-06-01 | 西安交通大学 | Device for testing metallic film failure behaviors under the coupling of force, heat, power and magnetism multi-field |
| CN103884928A (en) * | 2012-12-21 | 2014-06-25 | 中国科学院金属研究所 | Microelectronic product reliability test platform under force electrothermal multi-field coupling effect |
| CN203981480U (en) * | 2014-07-10 | 2014-12-03 | 河南科技大学 | A kind of stress that Lead-Free Solder Joint uses and thermocirculator of current coupling tested |
-
2014
- 2014-07-10 CN CN201410331008.6A patent/CN104198265A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102081140A (en) * | 2010-12-03 | 2011-06-01 | 西安交通大学 | Device for testing metallic film failure behaviors under the coupling of force, heat, power and magnetism multi-field |
| CN103884928A (en) * | 2012-12-21 | 2014-06-25 | 中国科学院金属研究所 | Microelectronic product reliability test platform under force electrothermal multi-field coupling effect |
| CN203981480U (en) * | 2014-07-10 | 2014-12-03 | 河南科技大学 | A kind of stress that Lead-Free Solder Joint uses and thermocirculator of current coupling tested |
Non-Patent Citations (2)
| Title |
|---|
| 李帅等: "Sn-3.0Ag-0.5Cu/Cu界面金属间化合物生长行为", 《材料热处理学报》 * |
| 齐丽华等: "热-剪切循环条件下Sn-3.5Ag-0.5Cu/Cu（Ni）界面化合物生长行为研究", 《稀有金属材料与工程》 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105910918A (en) * | 2016-04-20 | 2016-08-31 | 西北工业大学 | In-situ test system for testing thermal-electric-force coupling performance of green electronic packaging material |
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Application publication date: 20141210 |
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| RJ01 | Rejection of invention patent application after publication |