CN104198264A - Magnetic force and stress coupled thermal cycling device for testing lead-free solder joints - Google Patents
Magnetic force and stress coupled thermal cycling device for testing lead-free solder joints Download PDFInfo
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- CN104198264A CN104198264A CN201410330922.9A CN201410330922A CN104198264A CN 104198264 A CN104198264 A CN 104198264A CN 201410330922 A CN201410330922 A CN 201410330922A CN 104198264 A CN104198264 A CN 104198264A
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- China
- Prior art keywords
- free solder
- lead
- solder joint
- stress
- copper cash
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Abstract
A magnetic force and stress coupled thermal cycling device for testing lead-free solder joints is simple and reasonable in structure, convenient in use and safe in application, the greatest advantage is that: the magnetic force and stress coupled thermal cycling device can load magnetic force and stress, and overcomes the limitation of time efficiency sample study under single conditions in the prior art, and by adjusting the magnetic force and the stress, simulation of the actual service process of the solder joints can be performed.
Description
Technical field
The present invention is many coupled aging devices in a kind of actual solder joint military service process, specifically a kind of stress that Lead-Free Solder Joint uses and thermocirculator of magnetic couple tested.
Background technology
Solder joint in actual military service process because periodically temperature variation and current switching all can experience thermal cycle effect.Thermal Cycling temperature retention time is the principal element that affects interface compound growth; After experience thermal cycle, the empty quantity at SnAgCu/Cu interface increases, and reduces interface bond strength, and then has reduced the low-cycle fatigue life of solder joint.In actual product, Lead-Free Solder Joint often suffers two or many field actions such as temperature field, electric field, stress field and magnetic field.Existing research shows, under hot shearing ringing, to obtain growth rate faster than the growth under single shear action for interface compound.Under strong magnetic field action, the growth rate of IMC layer is accelerated, and crystal orientation changes; The variation of Sn3Ag0.5Cu at different electromigration time median surface IMC studied in defending of south China science and engineering, found that: at 1.78 * 104A/cm
2, under the condition that loading temperature is 373K, with the passing of person's time, interface compound shows obvious polar effect, and anodic interface IMC thickens and is para-curve and changes, cathode interface attenuate.Visible, thermal cycling temperature field, stress field, electric current and magnetic field all have a significant effect to Lead-Free Solder Joint IMC growth behavior.Lack at present the testing equipment of Lead-Free Solder Joint special use under many couplings, cause the experiment progress difficulty of the actual Service Environment of simulating solder joint large, under actual service condition, Lead-Free Solder Joint reliability consideration still less.
Summary of the invention
The technical issues that need to address of the present invention are the deficiencies that overcome figure viewed from behind technology, stress that a kind of test Lead-Free Solder Joint simple and reasonable, easy to use, application safety uses and the thermocirculator of magnetic couple are provided, the advantage of maximum of the present invention is can loading stress and magnetic force, overcome the research of timeliness sample under single condition in the past, stress and magnetic force are all adjustable, and then the actual military service process of simulating solder joint.
For realizing above-mentioned technical purpose, the technical solution adopted in the present invention is: a kind of stress that Lead-Free Solder Joint uses and thermocirculator of magnetic couple tested, by stress loading mechanism, treat the temperature control heating mechanism that Lead-Free Solder Joint sample heats, for placing, treat the support of Lead-Free Solder Joint sample and form around the polylith magnet for the treatment of the setting of Lead-Free Solder Joint sample, described stress loading mechanism comprises many copper cash and a plurality of counterweight, take two copper cash as one group, and be arranged in the same radial alignment of support, the two ends for the treatment of Lead-Free Solder Joint sample connect respectively copper cash one end, the other end of copper cash is connected with counterweight, described temperature control heating mechanism is comprised of Far infrared heating plate and temp probe, Far infrared heating plate setting corresponding to Lead-Free Solder Joint sample, temp probe is arranged on around Lead-Free Solder Joint sample, detect Lead-Free Solder Joint specimen temperature.
Described stress loading mechanism also comprises the guide wheel for supporting copper cash and rolling and arrange on support.
Described guide wheel is fluting bearing.
The invention has the beneficial effects as follows:
1, the design of coupling device has met the actual service condition that researcher inquires into solder joint better.The design of many coupling devices is used to have changed and was only studied the service state of the solder joint under single condition in the past, and this reliability to raising solder joint provides must theoretical foundation.
2, by unloading magnet or removing stress loading counterweight and all can realize two couplings adjusting in real time, by said apparatus, carry out the loading of many coupling conditions of solder joint, amount of heat, the size in stress loading size and magnetic field is all adjustable, test as required under different condition, change gradually amount of heat, stress loading size and magnetic field size, create the fine setting condition in test.And then the actual military service process of simulating solder joint.
3, on support, be provided with the guide wheel of slip, guarantee that copper cash is in stress loading process, along with the increase of counterweight, position can not change, and reduced by the impact of friction force, makes the change of stress intensity even, can not make experimental situation change inhomogeneous, make experimental result accurate.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention;
In figure: 1, stress loading mechanism, 101, copper cash, 102, counterweight, 103, guide wheel, 2, magnet, 3, temperature control heating mechanism, 301, Far infrared heating plate, 302, temp probe, 4, support.
Embodiment
As shown in the figure, a kind of stress that Lead-Free Solder Joint uses and thermocirculator of magnetic couple tested, on the stationary shaft of support two ends, fluting bearing is installed, and two fluting bearings are fixed in same radial alignment, with copper cash, connect and to treat that Lead-Free Solder Joint sample two brings in the stress field of carrying out solder joint and load, copper cash two ends load the size that counterweight carrys out proof stress, counterweight size is fixing, can select as required to adjust, copper cash is fixed in same radial alignment, make to treat that the two ends of Lead-Free Solder Joint sample are stressed consistent, even if change the size of counterweight, change stress intensity, can need to adjust according to implementing, can there is not data deviation, in the middle of shelf, be welded with pair of horns metal trough, the size of distance is controlled by the magnet size of the demand of testing, and angle bar groove is used for placing magnet, by the magnet number of the distance between adjustment magnet or increase both sides, and then the size of controlling magnetic field intensity, treat that Lead-Free Solder Joint sample is positioned at the central authorities of both sides magnet, Far infrared heating plate is positioned at angle bar groove certain distance below, and for rationally controlling the size variation of thermal cycling temperature, temp probe is positioned at treats Lead-Free Solder Joint sample around, carries out correction and the control of temperature.
The standard component that Selection of Bearings and stationary shaft match of slotting in the present invention, the bearing that makes to slot can rotate along stationary shaft, but can occurred level direction not move again, fluting bearing can need to arrange a plurality of according to experiment, the many copper cash of simultaneously arranging in pairs or groups, carry out stress intensity change, can be connected to the various piece for the treatment of Lead-Free Solder Joint sample, by change, treat the each point stress intensity of Lead-Free Solder Joint sample, detect test specimen impact on Lead-Free Solder Joint experiment under various stress states.
In the present invention, copper cash option table is worn the copper cash of high-temperature insulation skin.
Claims (3)
1. test stress that Lead-Free Solder Joint uses and the thermocirculator of magnetic couple for one kind, it is characterized in that: by stress loading mechanism (1), treat the temperature control heating mechanism (3) that Lead-Free Solder Joint sample heats, for placing, treat the support (4) of Lead-Free Solder Joint sample and form around the polylith magnet (2) for the treatment of the setting of Lead-Free Solder Joint sample, described stress loading mechanism (1) comprises many copper cash (101) and a plurality of counterweight (102), take two copper cash (101) as one group, and be arranged in the same radial alignment of support (4), the two ends for the treatment of Lead-Free Solder Joint sample connect respectively copper cash (101) one end, the other end of copper cash (101) is connected with counterweight (102), described temperature control heating mechanism (3) is comprised of Far infrared heating plate (301) and temp probe (302), Far infrared heating plate (301) setting corresponding to Lead-Free Solder Joint sample, temp probe (302) is arranged on around Lead-Free Solder Joint sample, detect Lead-Free Solder Joint specimen temperature.
2. a kind of stress that Lead-Free Solder Joint uses and thermocirculator of magnetic couple tested as claimed in claim 1, is characterized in that: described stress loading mechanism (1) also comprises for supporting copper cash (101) and at the upper guide wheel (103) that rolls and arrange of support (4).
3. a kind of stress that Lead-Free Solder Joint uses and thermocirculator of magnetic couple tested as claimed in claim 1, is characterized in that: described guide wheel (103) is fluting bearing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410330922.9A CN104198264A (en) | 2014-07-10 | 2014-07-10 | Magnetic force and stress coupled thermal cycling device for testing lead-free solder joints |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410330922.9A CN104198264A (en) | 2014-07-10 | 2014-07-10 | Magnetic force and stress coupled thermal cycling device for testing lead-free solder joints |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104198264A true CN104198264A (en) | 2014-12-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410330922.9A Pending CN104198264A (en) | 2014-07-10 | 2014-07-10 | Magnetic force and stress coupled thermal cycling device for testing lead-free solder joints |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07234189A (en) * | 1994-02-23 | 1995-09-05 | Hitachi Ltd | Fine connection inspector |
| WO2002071032A1 (en) * | 2001-03-02 | 2002-09-12 | Smithkline Beecham Corporation | Method and apparatus to stress test medicament inhalation aerosol device by inductive heating |
| CN102183545A (en) * | 2011-01-31 | 2011-09-14 | 哈尔滨工业大学 | Infrared temperature measurement detection method for detecting solder joint reliability of circuit board |
| CN102621022A (en) * | 2012-03-22 | 2012-08-01 | 北京科技大学 | Thermal-force coupling fatigue test device and method |
| CN203981482U (en) * | 2014-07-10 | 2014-12-03 | 河南科技大学 | A kind of stress that Lead-Free Solder Joint uses and thermocirculator of magnetic couple tested |
-
2014
- 2014-07-10 CN CN201410330922.9A patent/CN104198264A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07234189A (en) * | 1994-02-23 | 1995-09-05 | Hitachi Ltd | Fine connection inspector |
| WO2002071032A1 (en) * | 2001-03-02 | 2002-09-12 | Smithkline Beecham Corporation | Method and apparatus to stress test medicament inhalation aerosol device by inductive heating |
| CN102183545A (en) * | 2011-01-31 | 2011-09-14 | 哈尔滨工业大学 | Infrared temperature measurement detection method for detecting solder joint reliability of circuit board |
| CN102621022A (en) * | 2012-03-22 | 2012-08-01 | 北京科技大学 | Thermal-force coupling fatigue test device and method |
| CN203981482U (en) * | 2014-07-10 | 2014-12-03 | 河南科技大学 | A kind of stress that Lead-Free Solder Joint uses and thermocirculator of magnetic couple tested |
Non-Patent Citations (1)
| Title |
|---|
| 李帅等: ""Sn-3.0Ag-0.5Cu/Cu界面金属间化合物生长行为"", 《材料热处理学报》 * |
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| C06 | Publication | ||
| PB01 | Publication | ||
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| RJ01 | Rejection of invention patent application after publication | ||
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Application publication date: 20141210 |