CN104191534B - A kind of crystal bar diced system - Google Patents

A kind of crystal bar diced system Download PDF

Info

Publication number
CN104191534B
CN104191534B CN201410449275.3A CN201410449275A CN104191534B CN 104191534 B CN104191534 B CN 104191534B CN 201410449275 A CN201410449275 A CN 201410449275A CN 104191534 B CN104191534 B CN 104191534B
Authority
CN
China
Prior art keywords
crystal bar
wire plane
ambulatory splint
diced system
movable supporting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201410449275.3A
Other languages
Chinese (zh)
Other versions
CN104191534A (en
Inventor
马志明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yancheng chuangyong New Energy Investment Co.,Ltd.
Original Assignee
Suzhou Luotelan New Material Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzhou Luotelan New Material Technology Co Ltd filed Critical Suzhou Luotelan New Material Technology Co Ltd
Priority to CN201410449275.3A priority Critical patent/CN104191534B/en
Publication of CN104191534A publication Critical patent/CN104191534A/en
Application granted granted Critical
Publication of CN104191534B publication Critical patent/CN104191534B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Crystals, And After-Treatments Of Crystals (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

The present invention relates to a kind of crystal bar diced system of improvement, this crystal bar diced system comprises wire plane formed by a, parallel arrangement equidistant by Metal Cutting silk; Above described wire plane, have a pair with the ambulatory splint of described wire plane orthogonal, have a clamping plate controller regulate the folding of described ambulatory splint and move up and down; At this place-limited edge to crystal bar axial displacement restricted on the inwall of described ambulatory splint; In the below of described wire plane, there are one piece and the parallel plane movable supporting plate of wire; In the both sides of described gripper shoe, the location-plate that a pair, device is identical with above-mentioned ambulatory splint structure.This crystal bar diced system does not need to fix crystal bar with colloid and wafer can be cut, and simplifies work flow, increases work efficiency; Meanwhile, improve the work flow that crystal bar is transported to wire plane, effectively reduce crystal bar damage.

Description

A kind of crystal bar diced system
Technical field
The present invention relates to a kind of slicing device, especially, is a kind of crystal bar diced system.
Background technology
In the industrial production, use slicer crystal bar to be cut into wafer one by one to carry out again packing, dispatching from the factory; Conventional method is first fixed on by crystal bar colloid in the brilliant holder of section, use the brilliant holder of travelling bogie clamping after isocolloid solidification, place it in wire plane, start wire plane and crystal bar is cut into wafer, lift brilliant holder after closing instrument, crystalline substance holder is put in glue removing pool together with wafer and cleans; This method is very complicated, needs viscose glue, removes photoresist, and travelling bogie easily occurs landing in handling process simultaneously, damages crystal bar, even accidents caused.
Summary of the invention
For the problems referred to above, the object of this invention is to provide a kind of crystal bar diced system of improvement, this crystal bar diced system does not need to fix crystal bar with colloid and wafer can be cut, and simplifies work flow, increases work efficiency; Meanwhile, improve the work flow that crystal bar is transported to wire plane, effectively reduce crystal bar damage.
For solving the problem, the technical solution used in the present invention is: this crystal bar diced system comprises wire plane formed by a, parallel arrangement equidistant by Metal Cutting silk; Above described wire plane, have a pair with the ambulatory splint of described wire plane orthogonal, have a clamping plate controller regulate the folding of described ambulatory splint and move up and down; At this place-limited edge to crystal bar axial displacement restricted on the inwall of described ambulatory splint; In the below of described wire plane, there are one piece and the parallel plane movable supporting plate of wire; Described movable supporting plate regulates it up and down and move left and right by gripper shoe controller; In the both sides of described gripper shoe, the location-plate that a pair, device is identical with above-mentioned ambulatory splint structure.
The invention has the beneficial effects as follows: be transported in wire plane by crystal bar by transport tape, regulate ambulatory splint to clamp crystal bar with clamping plate controller, and make the place-limited edge on its inwall block the two ends of crystal bar, described clamping plate lower limb is close to wire plane; Control clamping plate and regulate crystal bar position, make it be in directly over described gripper shoe; Start slicer, Metal Cutting silk rotates, and along with the incision of Metal Cutting silk, crystal bar vertically slides along ambulatory splint inwall, and described ambulatory splint opposing metallic silk plane is static; Regulate gripper shoe controller, crystal bar is moved down gradually with movable supporting plate; In the process that crystal bar moves down, described location-plate is close to gripper shoe and crystal bar, and the place-limited edge on location-plate inwall is stuck in the two ends of crystal bar; After crystal bar is cut, compact arranged wafer Shu Shuzhi is vertical on the supporting plate, regulates gripper shoe controller, gripper shoe is taken out from side direction horizontal in slicer, after being taken out by wafer bundle, regulates gripper shoe controller that gripper shoe is resetted.Do not need in whole process to fix crystal bar with colloid, eliminate viscose glue, remove photoresist, the work flow such as cleaning, simplify production technology, save the activity duration, effectively enhance productivity.
As preferably, the upper surface of described gripper shoe has a row and Metal Cutting silk groove one to one, when crystal bar is pressed in directly over gripper shoe, every strip metal cutting wire is just in time positioned at groove corresponding to support plate upper surface, Metal Cutting silk does not contact gripper shoe, can not cut to gripper shoe when operation.
As preferably, described clamping plate and location-plate inwall are densely covered with vertical bar shape lines, so that crystal bar vertically slides with comparatively less friction and do not produce horizontal displacement on inwall.
As preferably, crystal bar is transported in wire plane by a transport tape, makes crystal bar be transported to wire plane without the displacement on vertical direction from objective table, effectively prevents crystal bar from damaging.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of slicer in the embodiment of the present invention.
Fig. 2 is the structural representation of gripper shoe and location-plate in the embodiment of the present invention.
Fig. 3 is the schematic diagram of embodiment of the present invention middle clamp plate.
Detailed description of the invention:
Embodiment
In embodiment shown in Fig. 1 to Fig. 3, comprise the wire plane 3 that a, parallel arrangement equidistant by Metal Cutting silk forms; Above described wire plane 3, there is a pair ambulatory splint 1 vertical with described wire plane 3, have a clamping plate controller regulate the folding of described ambulatory splint 1 and move up and down; At this place-limited edge 11 to crystal bar axial displacement restricted on the inwall of described ambulatory splint 1; In the below of described wire plane 3, have the movable supporting plate 4 that a piece parallel with wire plane 3, the upper surface of described movable supporting plate 4 has a row and wire plane 3 groove 41 one to one; Described movable supporting plate is regulated up and down by gripper shoe controller and moves left and right; In the both sides of described gripper shoe, the location-plate that a pair, device is identical with above-mentioned ambulatory splint structure; Described ambulatory splint 1 and location-plate 2 inwall are densely covered with vertical bar shape lines.
Transport crystal bar 6 in wire plane 3 by transport tape 5, regulate ambulatory splint 1 to clamp crystal bar 6, and make the place-limited edge 11 on its inwall block the two ends of crystal bar 6, described ambulatory splint 1 lower limb is close to wire plane; Control clamping plate 1 and regulate crystal bar 6 position, make it be in directly over described gripper shoe 4; Now, every one metal wire plane 3 is just in time positioned at groove 41 corresponding to gripper shoe 4 upper surface, and wire plane 3 does not contact gripper shoe 4, can not cut to gripper shoe 4 when operation; Start slicer, Metal Cutting silk rotates, and along with the incision of Metal Cutting silk, crystal bar 6 vertically slides along ambulatory splint 1 inwall, and described ambulatory splint 1 opposing metallic silk plane 3 is static; Regulate gripper shoe controller, crystal bar 6 is moved down gradually with movable supporting plate 4; In the process that crystal bar 6 moves down, described location-plate 2 is close to gripper shoe 4 and crystal bar 6, and the place-limited edge 11 on location-plate 2 inwall is stuck in the two ends of crystal bar 6; Crystal bar 6 vertically slides along location-plate 2 inwall and does not produce horizontal displacement; After crystal bar is cut, compact arranged wafer Shu Shuzhi stands in gripper shoe 4, regulates gripper shoe controller, gripper shoe 4 is shifted out from side direction horizontal in slicer, after being taken out by wafer bundle, regulates gripper shoe controller that gripper shoe 4 is resetted.Do not need in whole process to fix crystal bar with colloid, eliminate viscose glue, remove photoresist, the work flow such as cleaning, simplify production technology, effectively enhance productivity.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.

Claims (2)

1. a crystal bar diced system, this crystal bar diced system comprises the wire plane (3) that a, parallel arrangement equidistant by Metal Cutting silk forms; It is characterized in that: in the top of described wire plane (3), there is a pair ambulatory splint (1) vertical with described wire plane (3), have a clamping plate controller regulate (1) folding of described ambulatory splint and move up and down; At this place-limited edge (11) to crystal bar axial displacement restricted on the inwall of described ambulatory splint (1); In the below of described wire plane (3), there is the movable supporting plate (4) that a piece parallel with wire plane (3); Described movable supporting plate (4) regulates it up and down and move left and right by gripper shoe controller; In the both sides of described movable supporting plate (4), the location-plate (2) that a pair, device is identical with above-mentioned ambulatory splint structure;
Described crystal bar diced system, the upper surface of described movable supporting plate (4) has a row and wire plane (3) groove (41) one to one; When crystal bar is pressed in directly over movable supporting plate (4), every wire plane (3) is just in time positioned at groove (41) corresponding to movable supporting plate (4) upper surface;
Described clamping plate (1) and location-plate (2) inwall are densely covered with vertical bar shape lines.
2. crystal bar diced system according to claim 1, is characterized in that: crystal bar is transported in wire plane (3) by a transport tape (5).
CN201410449275.3A 2014-09-05 2014-09-05 A kind of crystal bar diced system Active CN104191534B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410449275.3A CN104191534B (en) 2014-09-05 2014-09-05 A kind of crystal bar diced system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410449275.3A CN104191534B (en) 2014-09-05 2014-09-05 A kind of crystal bar diced system

Publications (2)

Publication Number Publication Date
CN104191534A CN104191534A (en) 2014-12-10
CN104191534B true CN104191534B (en) 2016-02-10

Family

ID=52076980

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410449275.3A Active CN104191534B (en) 2014-09-05 2014-09-05 A kind of crystal bar diced system

Country Status (1)

Country Link
CN (1) CN104191534B (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102079113A (en) * 2010-11-25 2011-06-01 保定天威英利新能源有限公司 Equipment and method for solving squaring quality problem of silicon ingot
CN201979619U (en) * 2011-01-12 2011-09-21 浙江瑞迪硅谷新能源科技有限公司 Sectional cutting clamp for single crystal rod
CN202240511U (en) * 2011-09-22 2012-05-30 威全机械工业股份有限公司 Silicon crystal block clamp carrying bench
CN202702425U (en) * 2012-08-20 2013-01-30 上海日进机床有限公司 Multi-wire cutting device
CN203792552U (en) * 2014-01-08 2014-08-27 浙江星宇能源科技有限公司 Clamp for cutting square silicon crystal rods
CN204036680U (en) * 2014-09-05 2014-12-24 苏州洛特兰新材料科技有限公司 A kind of crystal bar diced system

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011245601A (en) * 2010-05-28 2011-12-08 Noritake Co Ltd Wire saw device, and method for cutting by wire saw
JP2012232358A (en) * 2011-04-28 2012-11-29 Kyocera Corp Cutting method of single crystal body
KR20130017819A (en) * 2011-08-12 2013-02-20 주식회사 엘지실트론 Pre-heating apparatus for ingot
KR20130089359A (en) * 2012-02-02 2013-08-12 다이섹(주) Square cutting device for ingot
JP2013191646A (en) * 2012-03-13 2013-09-26 Okamoto Machine Tool Works Ltd Slicing method of prism-shaped ingot
JP5972754B2 (en) * 2012-10-31 2016-08-17 コマツNtc株式会社 Work cutting method with wire saw

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102079113A (en) * 2010-11-25 2011-06-01 保定天威英利新能源有限公司 Equipment and method for solving squaring quality problem of silicon ingot
CN201979619U (en) * 2011-01-12 2011-09-21 浙江瑞迪硅谷新能源科技有限公司 Sectional cutting clamp for single crystal rod
CN202240511U (en) * 2011-09-22 2012-05-30 威全机械工业股份有限公司 Silicon crystal block clamp carrying bench
CN202702425U (en) * 2012-08-20 2013-01-30 上海日进机床有限公司 Multi-wire cutting device
CN203792552U (en) * 2014-01-08 2014-08-27 浙江星宇能源科技有限公司 Clamp for cutting square silicon crystal rods
CN204036680U (en) * 2014-09-05 2014-12-24 苏州洛特兰新材料科技有限公司 A kind of crystal bar diced system

Also Published As

Publication number Publication date
CN104191534A (en) 2014-12-10

Similar Documents

Publication Publication Date Title
CN204278700U (en) Automatic film tearing device
JP2015188968A (en) Method and device for parting resin sheet
JP2016007842A (en) Scribe device
JP2014019044A (en) Break device for brittle material substrate
CN204021919U (en) A kind of guide tracked glass sheet fine positioning platform
CN104276751A (en) Bonded substrate processing apparatus
RU2015154033A (en) GRINDING MACHINE CHARACTERIZED BY AVAILABILITY OF THE GRINDING TOOL FOR PERFORMANCE OF GRINDING OF TWO WORKS
CN204036680U (en) A kind of crystal bar diced system
KR101397487B1 (en) Dividing apparatus
JP2016007844A (en) Scribe device
JP2017071224A (en) Substrate processing device
CN105060696A (en) Glass tube cutting device
CN104191534B (en) A kind of crystal bar diced system
KR20150050395A (en) Protective tape separating method and protective tape separating apparatus
TWI656003B (en) Substrate transfer system and method
JP6126396B2 (en) Substrate processing equipment
CN103753278A (en) Connecting rod clamping mechanism
KR20170063379A (en) Cutting apparatus
TWM530414U (en) Liquid crystal panel fold-cutting device
CN204400002U (en) Screw drive type circuit card rotary carrier
JP2015164895A (en) Parting device
CN204897727U (en) Glass shear machine
CN209113746U (en) A kind of big glass sheet automatic cutting device
CN204897732U (en) Glass shear machine of fastening
JP6435669B2 (en) Substrate processing equipment

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20201216

Address after: Room 1609, building 1, yanchuang building, Yanlong sub district office, Yandu District, Yancheng City, Jiangsu Province

Patentee after: Yancheng chuangyong New Energy Investment Co.,Ltd.

Address before: Room 4722, Tianlong building, no.378, Zhujiang South Road, Mudu Town, Wuzhong District, Suzhou City, Jiangsu Province

Patentee before: SUZHOU LUOTELAN NEW MATERIAL TECHNOLOGY Co.,Ltd.