CN104185387B - Casing - Google Patents

Abstract

The invention discloses a casing, including a metal substrate and a plastic substrate. The plastic substrate is arranged on the metal substrate, and has an upper surface and a lower surface which are opposite to each other, and a through hole which penetrates through the upper surface and the lower surface. The lower surface is attached to the metal substrate, and the through hole has a first annular wall face and a second annular wall face which are connected with each other. One end of the first annular wall face is connected with the lower surface, and the second annular wall face is connected with the upper surface. An included angle between the second annular wall face and the upper surface is an obtuse angle. Potential difference between the abovementioned plastic substrate and the metal substrate can be reduced, so that charges on the plastic substrate can be stably guided to the metal substrate. Thus, the problem of static electricity of the casing is solved.

Description

Casing

Technical field

The present invention relates to a kind of casing, particularly to a kind of casing with protection structure.

Background technology

With scientific and technological progress, various electronic products start in the life be widely used for people.Produced with portable electronic As a example product, user can carry portable electronic product and in Yu Jiazhong, office or the vehicles, even outdoor use, With the advantage making it have convenience.Therefore, the electronics that portable electronic product often becomes indispensable in people's life produces The one of product.

In order to mitigate the weight of portable electronic product, and maintain its rigidity, can adopt in terms of casing plastic casing with And the combination of metal shell is being assembled.Plastic casing is outside metal shell.Although plastic casing is more light and handy, growing Under time uses, plastic casing easily can produce abrasion, and then destroys its texture.In this regard, in order to wear-resistant, can outside plastic casing Plating layer of metal layer, to lift plastic casing wearability and texture.

Although this housing is relatively light in weight, more wear-resisting and texture on more attractive in appearance, need by plastic casing come every From electronic building brick with electrodeposition of metals being electrically insulated between the two.But, in this kind of design, because electrodeposition of metals is no any Earthing mechanism, will lead to this electrodeposition of metals can accumulate substantial amounts of electrostatic.If user reaches one in electrodeposition of metals accumulation electrostatic Contacting metal shell body during definite value, then because the static value of user itself and the static value of electrodeposition of metals have a potential difference, Meeting and then lead to user to have the sensation of electric shock.

Therefore, how the electrostatic problem of housing, actually industry problem urgently to be resolved hurrily will be eliminated.

Content of the invention

In view of above problem, it is an object of the invention to proposing a kind of casing, and then solve its electrostatic problem.

According to one of one embodiment of the invention casing, it comprises a metal substrate and a plastic substrate.Plastic cement base Plate on metal substrate, plastic substrate have a upper surface relative to each other and a lower surface and run through upper surface and One perforation of lower surface.Lower surface is attached at metal substrate, and perforation has one first ring-like wall being connected with each other and one the Two ring-like walls.First ring-like wall connects lower surface, and the second ring-like wall connects upper surface.Second ring-like wall and upper surface Accompany an obtuse angle.

So, accompany an obtuse angle by the second ring-like wall and upper surface, to reduce between plastic substrate and metal substrate Potential difference, and make the electric charge on plastic substrate can stably guide metal substrate.So, it is possible to resolve casing in prior art Electrostatic problem.Furthermore, metal substrate can be not required to implement electric carving technique again, and the electric charge of plastic substrate can stably be directed at Metal Substrate Plate, and then save manufacturing cost and time.

Describe the present invention below in conjunction with the drawings and specific embodiments, but not as a limitation of the invention.

Brief description

Fig. 1 is the decomposing schematic representation of the casing according to one embodiment of the invention；

Fig. 2 is the schematic perspective view of the casing according to one embodiment of the invention；

Fig. 3 be Fig. 2 in along 3-3 line cutting casing cut-away view.

Wherein, reference

10 casings

100 metal substrates

110 anodization

200 plastic substrates

210 upper surfaces

212 metal sputtering layers

220 lower surfaces

230 perforation

232 first ring-like walls

2320 first ora terminalis

2322 second ora terminalis

234 second ring-like walls

2340 the 3rd ora terminalis

2342 the 4th ora terminalis

240 points

2402 summits

2404 lead angles

242 points

244 points

2442 summits

246 points

D1 first distance

D2 second distance

D3 the 3rd distance

D4 the 4th distance

R diameter

W width

θ obtuse angle

Specific embodiment

Hereinafter the narration detailed features of the present invention and advantage in detail in embodiments, its content be enough to make any be familiar with Relevant art understands that the technology contents of the present invention are simultaneously implemented according to this, and invented according to this specification content, claim Scope and accompanying drawing, any be familiar with relevant art and can be readily understood upon the related purpose of the present invention and advantage.Below example Be further describe the present invention viewpoint, but non-anyways to limit scope of the invention.

In view of the already present problem of prior art, a kind of present invention casing of proposition.Wherein casing is suitable to be applied to one to take Formula electronic installation（As a mobile computer, a tablet PC or a device for mobile communication）, but be not used to limit the present invention.

Refer to Fig. 1, Fig. 2 and Fig. 3, Fig. 1 is the decomposing schematic representation of the casing according to one embodiment of the invention.Fig. 2 is The schematic perspective view of casing according to an embodiment of the invention.Fig. 3 be Fig. 2 in along 3-3 line cutting casing cut-away view.

A kind of casing 10 of the present embodiment, it comprises a metal substrate 100 and a plastic substrate 200.Plastic substrate 200 On metal substrate 100.Plastic substrate 200 has a upper surface 210, a lower surface 220 and a perforation 230.In this reality Apply in example, the material of metal substrate 100 is aluminium, but be not used to limit the present invention.In other embodiments, metal substrate 100 Material is aluminium alloy.

In the present embodiment and other section Example, upper surface 210 and lower surface 220 are relative to each other.Plastic cement The lower surface 220 of substrate 200 is attached at metal substrate 100.Perforation 230 runs through upper surface 210 and lower surface 220.Perforation 230 There is the ring-like wall of one first being connected with each other 232 and one second ring-like wall 234.First ring-like wall 232 connects following table Face 220, the second ring-like wall 234 connects upper surface 210.It should be noted that the second ring-like wall 234 is pressed from both sides with upper surface 210 There is an obtuse angle θ.In the present embodiment and other section Example, upper surface 210 has more a metal sputtering layer 212.Gold The composition belonging to sputtered layer 212 is for a metal, and this metal sputtering layer 212 is to be formed on upper surface 210 by the mode of sputter. Therefore, metal sputtering layer 212 can have electric conductivity.

In the present embodiment and other section Example, metal substrate 100 has more an anodization 110, face To lower surface 220.Anodization 110 is to be formed by the mode that anode is processed.

First ring-like wall 232 of perforation 230 described in detail below and the second ring-like wall 234.The present embodiment with And in others section Example, the first ring-like wall 232 has one first ora terminalis 2320 and one second ora terminalis 2322.First Ora terminalis 2320 and the second ora terminalis 2322 are relative to each other.First ora terminalis 2320 connects lower surface 210, and the second ora terminalis 2322 connects the Two ring-like walls 234.Between first ora terminalis 2320 and the second ora terminalis 2322 first is apart from D1 between 0.2 to 0.4 millimeter （mm）Between.In one embodiment, first is 0.3 millimeter apart from D1.The diameter R that perforation 230 is located at the first ring-like wall 232 is real It is 8 millimeters in matter.In the present embodiment and other section Example, the second ring-like wall 234 has one the 3rd ora terminalis 2340 and one the 4th ora terminalis 2342, and the 3rd ora terminalis 2340 and the 4th ora terminalis 2342 relative to each other.3rd ora terminalis 2340 is even Connect the first ring-like wall 232, and the 4th ora terminalis 2342 connects upper surface 210.In the present embodiment, the 4th ora terminalis 2342 perpendicular to The extended surface of the first ring-like wall 232 has a second distance D2, and second distance D2 is essentially 1.8 millimeters.3rd ora terminalis 2340 and the 4th are projected on metal substrate 100 between ora terminalis 2342 has one the 3rd apart from D3, and the 3rd is essentially 3 apart from D3 Millimeter.With respect to upper surface 210 and lower surface 220, the first ring-like wall 232 and the second ring-like wall 234 can be considered not Same inclined-plane, and upper surface 210 connects lower surface 220 by the first ring-like wall 232 and the second ring-like wall 234.It is event, Accompany the structure of an obtuse angle θ by the above-mentioned second ring-like wall 234 and upper surface 210, metal sputtering layer 212 can be made in the second ring The sputter of type wall 234 is more uniform, and reduces the impedance of plastic substrate 200.Furthermore, the electric charge of upper surface 210 can be stably Sequentially it is directed at metal substrate 100 via the first ring-like wall 232 and the second ring-like wall 234, and then avoid plastic substrate 200 electrostatic produces, and more can prevent from jumping electricity and produce spark.

In the present embodiment and other section Example, plastic substrate 200 have four points 240,242,244, 246.Point 240,242,244,246 is averagely arranged at the second ring-like wall 234, and point 240,242,244,246 All extend towards the first ring-like wall 232., point 240,244 is located at perforation 230 respectively taking point 240,244 as a example Opposite sides.Point 240 has a summit 2402, and summit 2402 is contacted with metal substrate 100.Point 244 has a top Point 2442, summit 2442 is contacted with metal substrate 100.Have one the 4th apart from D4 between summit 2402 and summit 2442, the Four are substantially 2 millimeters apart from D4.Furthermore, point 240 has two lead angles 2404, and lead angle 2404 is away from the second ring-like wall 234, lead angle 2404 structure so can make sputter more uniform, and reduces impedance.In the present embodiment, point 240,242, 244th, 246 it is respectively provided with a width W, width W is essentially 3 millimeters.Therefore, the electric charge of upper surface 210 also can be via point 240th, 242,244,246 stable delivery are to metal substrate 100, and then avoid the electrostatic of plastic substrate 200 to produce.However, it is most advanced and sophisticated The number in portion 240,242,244,246 is not used to limit the present invention.In other embodiments, the number of point can be 1,2,3 Or more than 5 positive integer.

Comprehensive the above, in the casing of the present invention, because the first ring-like wall and upper surface accompany an obtuse angle, plastic cement base Potential difference between plate and metal substrate can reduce, and to reduce impedance, and makes the electric charge on plastic substrate can stably be directed at gold Belong to substrate.So, it is possible to resolve the electrostatic problem of casing in prior art, more can prevent from jumping electricity and produce pyrophoric problem.Again Person, metal substrate can be not required to implement electric carving technique again, and the electric charge of plastic substrate can stably be directed at metal substrate, so can save Save manufacturing cost and time.

Certainly, the present invention also can have other various embodiments, in the case of without departing substantially from present invention spirit and its essence, ripe Know those skilled in the art and work as and various corresponding changes and deformation can be made according to the present invention, but these corresponding changes and change Shape all should belong to the protection domain of appended claims of the invention.

Claims (9)

1. a kind of casing is it is characterised in that comprise：

One metal substrate；And

One plastic substrate, on this metal substrate, this plastic substrate have a upper surface relative to each other and a lower surface, with And running through a perforation of this upper surface and this lower surface, this lower surface is attached at this metal substrate, and this perforation has phase each other One first ring-like wall even and one second ring-like wall, this first ring-like wall connects this lower surface, this second ring-like wall Face connects this upper surface, and wherein this second ring-like wall and this upper surface accompany an obtuse angle, this upper surface, this first ring-like wall And on this second ring-like wall, there is a metal sputtering layer.

2. casing according to claim 1 is it is characterised in that this first ring-like wall has one first ora terminalis and one Two ora terminalis, this first ora terminalis connects this lower surface, and this second ora terminalis connects this second ring-like wall, this first ora terminalis and this The distance between two ora terminalis are between 0.2 to 0.4 millimeter.

3. casing according to claim 1 is it is characterised in that this second ring-like wall has one the 3rd ora terminalis and one Four ora terminalis, the 3rd ora terminalis connects this first ring-like wall, and the 4th ora terminalis connects this upper surface, and the 4th ora terminalis is perpendicular to this The distance of the extended surface of the first ring-like wall is essentially 1.8 millimeters, is projected between the 3rd ora terminalis and the 4th ora terminalis The distance of this metal substrate is 3 millimeters.

4. casing according to claim 1 is it is characterised in that this perforation is located at a diameter of 8 millis of this first ring-like wall Rice.

5. casing according to claim 1 is it is characterised in that this plastic substrate has a point, located at this second ring Type wall simultaneously extends towards this first ring-like wall, and this point has a summit, and this apexes contact is in this metal substrate.

6. casing according to claim 5 is it is characterised in that this point has a lead angle, this lead angle be away from this Two ring-like walls.

7. casing according to claim 5 is it is characterised in that the width of this point is 3 millimeters.

8. casing according to claim 1 it is characterised in that this plastic substrate has four points, put down by those points May be contained within this second ring-like wall, and all extend towards this first ring-like wall, those points are respectively provided with a summit, should A little apexes contact are in this metal substrate.

9. casing according to claim 1 is it is characterised in that this metal substrate has an anodization, under this Surface.