CN104183272B - A kind of core board self-test of stamp hole encapsulation and burning device, method - Google Patents
A kind of core board self-test of stamp hole encapsulation and burning device, method Download PDFInfo
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- CN104183272B CN104183272B CN201410407802.4A CN201410407802A CN104183272B CN 104183272 B CN104183272 B CN 104183272B CN 201410407802 A CN201410407802 A CN 201410407802A CN 104183272 B CN104183272 B CN 104183272B
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Abstract
The invention discloses a kind of core board self-test of stamp hole encapsulation and burning device, method, device includes test board, stamp hole pad interface module, the stamp hole pad interface module has some thimbles, the thimble is corresponded with the stamp hole and contacted, the test board includes SPI FLASH memory modules, stamp hole pad interface hardware check module, the stamp hole pad interface module electrically connects with the SPI FLASH memory modules, and the stamp hole pad interface module also electrically connects with the stamp hole pad interface hardware check module.Self-test and burning device by using stamp hole package interface plate of the present invention, hardware detection can be carried out to core board at once after the completion of core plate weld, whether normal detect core board hardware, if it was found that processing of being done over again at once if failure welding product, and by all the problem of being related to bga device failure welding, solved in the external coordination process segment, can ensure that the quality of core board, greatly improve production efficiency.
Description
Technical field
The present invention relates to the core board self-test of core board technical field, more particularly to a kind of encapsulation of stamp hole to fill with burning
Put, method.
Background technology
The side of core board four of stamp hole encapsulation is metallized semi-pore, and the core board that stamp hole encapsulates subsequently is referred to as into core
Core.Wherein, most of core board is multi-layer sheet, including control module, NAND FLASH memory modules and DDR2 SDRAM
(DDR2 SDRAM:Double-Data-Rate Two Synchronous Dynamic Random Access Memory second
For double data rate Synchronous Dynamic Random Access Memory) memory module, and often there is BGA (BGA：Ball Grid Array
The PCB of ball grid array structure, it is a kind of package method that integrated circuit uses organic support plate) packaging, to processing, welding
Technological requirement is very high, and cost is also very high.
At present, after the completion of core plate weld, core board patch is welded on pcb board, is assembled into complete product, then to complete
Product is detected and burning program.Following defect be present in it：
First, product once goes wrong, not only be difficult fault point and failure cause, will also be to many pads
The core board of pin carries out sealing-off, expends staff's plenty of time, reduces production efficiency.Moreover, during sealing-off, core
Plate is easy to that production cost can be added by artificial damage.
Secondly, after core board is completed, after computer need to being connected, burning program could be carried out, used extremely not square
Just, not only requirement to burning personnel is high, it is necessary to grasp the relevant knowledges such as computer, and due to need the program code of burning compared with
Greatly, recordable time is also longer, and efficiency is extremely low.
The content of the invention
Based on this, the defects of the invention reside in prior art is overcome, there is provided one kind can realize that hardware check is surveyed and be burnt with program
Record, and can improve product qualification rate and production efficiency, and can reduce the core board self-test of the stamp hole encapsulation of production cost with
Burning device.
Its technical scheme is as follows：A kind of core board self-test of stamp hole encapsulation and burning device, including test board, stamp hole
Pad interface module, the stamp hole pad interface module have some thimbles, and the thimble corresponds with the stamp hole
Contact, the test board include SPI FLASH memory modules, stamp hole pad interface hardware check module, the stamp eyelet welding
Disk interface module electrically connects with the SPI FLASH memory modules, the stamp hole pad interface module also with the stamp hole
Pad interface hardware check module electrically connects.
Technical scheme is further illustrated below：
Preferably, the test board also includes USB HOST interface modules, and the USB HOST interface modules are used to obtain U
Program in disk, the USB HOST interface modules electrically connect with the stamp hole pad interface module.
Preferably, the test board also includes indicating module, the indicating module and the stamp hole pad interface module
Electrical connection, the indicating module include hardware detection state indicator module and/or burning program state indicator module, the hardware
Detection state indicator module is used to show whether the hardware detection of core board is normal, and described program program state indicating module is used for
Showing program, whether burning is successful.
Preferably, the stamp hole pad interface hardware check module includes some resistance, between thimble described in each two
It is connected with the resistance.
Preferably, in addition to power module, the power module electrically connect with the test board, core board respectively.
The present invention also provides a kind of side for the core board self-test and burning device for employing stamp hole encapsulation of the present invention
Method, comprise the following steps：
The test board is electrically connected by stamp hole pad interface module with the stamp hole of core board；
Program in the SPI FLASH memory modules is imported into the DDR2 SDRAM memory modules of the core board
In；
Hardware detection is carried out to core board by the stamp hole pad interface hardware check module；
Program in USB flash disk is read by USB HOST interface modules, and is written to the NAND FLASH storage moulds of core board
In block.
Preferably, the test board is being passed through into stamp hole pad interface module and the stamp hole electrical connecting step of core board
Also include step afterwards：By the core after all stamp holes of core board electrically connect with the stamp hole pad interface module
Plate is powered.
Preferably, after hardware detection step is carried out to core board by the stamp hole pad interface hardware check module
Also include step：The hardware detection state of core board is indicated with hardware detection state indicator module.
Preferably, the program in USB flash disk is read by USB HOST interface modules, and it is written to the NAND of core board
Include step in FLASH memory modules after step：Burning program state is indicated with burning program state indicator module.
Preferably, hardware detection step bag is carried out to core board by the stamp hole pad interface hardware check module
Include：It will be connected successively between each two stamp hole with resistance, the hardware detection state of core board obtained by loopback test.
The principle to preceding solution, effect etc. illustrate below：
1st, the self-test by using stamp hole package interface plate of the present invention and burning device, can be in core plate weld
After the completion of at once to core board carry out hardware detection, detection core board hardware it is whether normal, if failure welding product are found at once
Do over again processing, and by the core board of bga device failure welding, solved in the external coordination process segment, core board can be improved
Quality, greatly improve the production efficiency of core board.
2nd, USB flash disk information is read by USB HOST interface modules, and is written to the NAND FLASH memory modules of core board
In, can the core board qualified to hardware check be automatically performed burning program step, save production stage, substantially increase production
Efficiency.
3rd, the self-test of stamp hole package interface plate of the present invention and burning device cost are low, simple to operate, to operator
Member requires low, and the hardware that a people can carry out multiple core boards simultaneously using multiple devices simultaneously is tested oneself and USB flash disk burning program
Operation, is suitable for the detection and burning of batch core board, production efficiency is high.
4th, using USB flash disk by the NANDFLASH memories of burning program to core board, it is not necessary to computer and off line is burnt
Record, it is easy to use, also will not be by field of employment because the limitation of the reason such as voltage instability, electromagnetic interference.
5th, due to the mechanism that the controller using core board can start from the SPI FLASH memories in test board, sheet
The self-test and burning device for inventing the stamp hole package interface design simply, and without setting up additional controller, it relies on core
The controller of plate coordinates test board to complete the self-test to core board and burning step.
Whether the 6th, test board is additionally provided with indicating module, for showing the hardware detection of core board normally with whether showing program
Burning success, whether the hardware detection state of core board and burning program can successfully be fed back to staff by it in time, so as to
Staff quickly enters to be operated in next step, improves the production efficiency of core panel products.
Brief description of the drawings
Fig. 1 is stamp hole package interface plate self-test described in the embodiment of the present invention and burning device and core board connection signal
Figure；
Fig. 2 is indicating module structural representation of the present invention.
Description of reference numerals：
10th, test board, 11, SPI FLASH memory modules, 12, stamp hole pad interface module, 13, stamp hole pad connects
Mouthful hardware check module, 14, USB HOST interface modules, 15, indicating module, 151, hardware detection state indicator module, 152,
Burning program state indicator module, 16, power module, 20, core board, 21, CPU, 22, NAND FLASH memory modules, 23,
DDR2 SDRAM memory modules, 24, stamp hole.
Embodiment
Embodiments of the invention are described in detail below in conjunction with the accompanying drawings：
As shown in figure 1, core board self-test and the burning device of stamp hole encapsulation of the present invention, including test board 10,
Stamp hole pad interface module 12, the stamp hole pad interface module 12 have some thimbles, the thimble and the stamp
Hole 24 corresponds contact, and the test board 10 includes SPI FLASH (SPI：Serial peripheral interface go here and there
Row peripheral interface) memory module 11, the pad interface hardware check module 13 of stamp hole 24, the stamp hole pad interface mould
Block 12 electrically connects with the SPI FLASH memory modules 11, the stamp hole pad interface module 12 also with the stamp eyelet welding
Disk interface hardware selftest module 13 electrically connects.
Self-test and burning device by using stamp hole package interface plate of the present invention, by the stamp hole of core board with
The thimble of stamp hole pad interface module 12 is contradicted one by one, and hardware is carried out to core board 20 at once after the completion of the welding of core board 20
Detection, whether the detection hardware of core board 20 is normal, processing of being done over again at once if failure welding product are found, and by all BGA packages
There is failure welding the very corn of a subject plate and solved in the external coordination process segment in device, can improve the quality of core board 20, and improve
The production efficiency of core board.
In embodiments of the present invention, the test board 10 also includes USB HOST interface modules 14, the USBHOST interfaces
Module 14 provides USB interface, USB interface is connected with USB flash disk, for obtaining the program in USB flash disk, the USB HOST interface modules
14 electrically connect with the stamp hole pad interface module 12.
The test board 10 also includes indicating module 15, the indicating module 15 and the stamp hole pad interface module 12
Electrical connection, as shown in Fig. 2 the indicating module 15 includes hardware detection state indicator module 151 and/or burning program state refers to
Show module 152, the hardware detection state indicator module 151 is used to show whether the hardware detection of core board 20 is normal, described
Whether burning is successful for showing program for burning program state indicator module 152.
The stamp hole pad interface hardware check module 13 includes some resistance, is connected between thimble described in each two
The resistance.Using the method for loopback test, pair form each hardware testing loop with resistance successively and test, when finding institute
After having test loop normal, then show that the hardware detection of core board is normal, otherwise, if discovery one test loop of any of which
Test abnormal, then the hardware detection of teaching process personnel core board has failure.
The self-test of the stamp hole package interface plate also includes power module 16 with burning device, and the power module 16 divides
Do not electrically connected with the test board 10, core board 20.By using power module 16 civil power can be converted to test board 10 with
Voltage needed for core board 20.
The present invention also provides a kind of side for the core board self-test and burning device for employing stamp hole encapsulation of the present invention
Method, comprise the following steps：The test board 10 is passed through into stamp hole pad interface module 12 and the electricity of stamp hole 24 of core board 20
Connection；Program in the SPI FLASH memory modules 11 is imported into the DDR2 SDRAM memory modules of the core board 20
In 23；Hardware detection is carried out to core board 20 by the stamp hole pad interface hardware check module 13；Pass through USB HOST
Interface module 14 electrically connects with USB flash disk, reads the program in USB flash disk, and be written to the NAND FLASH memory modules 22 of core board 20
In.
Wherein, the test board 10 is being electrically connected by stamp hole pad interface module 12 and the stamp hole 24 of core board 20
Also include step after connecing step：When all stamp holes 24 of core board 20 electrically connect with the stamp hole pad interface module 12
The core board 20 is powered afterwards.
After hardware detection step is carried out to core board 20 by the stamp hole pad interface hardware check module 13 also
Including step：The hardware detection state hardware detection state indicator module 151 of core board 20 is indicated.Passing through USB HOST
Interface module 14 reads the program in USB flash disk, and is written in the NANDFLASH memory modules 22 of core board 20 after step including step
Suddenly：Burning program state burning program state indicator module 152 is indicated.
Carrying out hardware detection step to core board 20 by the stamp hole pad interface hardware check module 13 includes：According to
It is secondary to be connected between each two stamp hole 24 with resistance, the hardware detection state of core board 20 is obtained by loopback test.
Provide the self-test of stamp hole package interface plate and the more specifical embodiment of method for burn-recording again below:
9V-12V power supply adaptor one end is linked into the self-test of stamp hole package interface plate and the power supply of burning device
Module input, one end access 220V civil powers, core board 20 to be measured is positioned in neck, by 20 all stamp holes of core board
Completely attached to the thimble of the stamp hole pad interface module 12 on neck.After detecting that core board 20 completely attaches to, to core
It is electric on core 20.On core board 20 CPU 21 will can according to be arranged on stamp hole package interface plate starting switch selection from
SPI FLASH memory modules 11 start, and the program in SPI FLASH memory modules 11 will imported into the DDR2 of core board 20
Behaved in SDRAM memory modules, and start to test oneself to core board hardware adaptor.Wherein, DDR2 SDRAM storage moulds are judged
After program success in block and NANDFLASH memory modules read-write SPI FLASH memory modules 11, then carry out the hard of core board 20
Part carries out loopback test, if after test OK, will light hardware and tests oneself status indicator lamp.Pair then, with USB HOST interface modules
The USB flash disk of connection is written and read and file analysis, the NAND that will be recognized satisfactory burning file and enter on core board 20
In FLASH memory modules, after programming success, burning program status indicator lamp will be lighted.When above-mentioned hardware is tested oneself state and program
After the equal OK of program state, will lighting operation success indicator lamp, and drive simultaneously buzzer length ring a sound, with teaching process personnel
Core board hardware detection is normal, and burning program finishes.Otherwise, as long as any one link of whole testing process goes wrong,
Indicating module 15 all will be prompted to alarm and stop at once.Specifically, by lighting abnormality alarming indicator lamp, and drive simultaneously
The buzzer cycle of 1 second rings a sound, stops, totally 3 cycles, teaching process personnel's core board has failure.Postal of the present invention
The self-test of ticket hole package interface plate and the operation of method for burn-recording are extremely simple, time-consuming short, can improve stamp hole package interface plate
Self-test and the production efficiency of burning device.
In summary, the self-test of stamp hole package interface plate of the present invention has the following advantages that with burning device, method：
1st, the self-test by using stamp hole package interface plate of the present invention and burning device, can be welded in core board 20
Hardware detection is carried out to core board 20 at once after the completion of connecing, whether the detection hardware of core board 20 is normal, if finding failure welding product
Then do over again at once processing, and bga device failure welding the very corn of a subject plate is handled in the external coordination process segment, can improve
The quality of core board 20, and greatly improve production efficiency.
2nd, USB flash disk information is read by USB HOST interface modules 14, and is written to the NAND FLASH storages of core board 20
In module 22, can the core board 20 qualified to hardware check be automatically performed burning program step, save production stage, carry significantly
High production efficiency.
3rd, the self-test of stamp hole package interface plate of the present invention and burning device cost are low, simple to operate, to operator
Member requires low, and the hardware that a people can carry out multiple core boards 20 simultaneously using multiple devices simultaneously is tested oneself to be burnt with USB flash disk program
Record operation, is suitable for the detection and burning of batch core board 20, production efficiency is high.
4th, using USB flash disk by the NANDFLASH memories of burning program to core board 20, it is not necessary to which computer and off line are carried out
Burning, it is easy to use, also will not be by field of employment because the limitation of the reason such as voltage instability, electromagnetic interference.
5th, due to machine that the controller using core board 20 can start from the SPI FLASH memories in test board 10
System, the self-test and burning device design of stamp hole package interface of the present invention are simple, and without setting up additional controller, it is relied on
The controller of core board 20 coordinates test board 10 to complete the self-test to core board 20 and burning step.
Whether the 6th, test board 10 is additionally provided with indicating module 15, for showing the hardware detection of core board 20 normally with showing journey
Whether burning is successful for sequence, and whether the hardware detection state of core board 20 and burning program can successfully be fed back to work people by it in time
Member, operated in next step so that staff quickly enters, improve the production efficiency of the product of core board 20.
Embodiment described above only expresses the embodiment of the present invention, and its description is more specific and detailed, but simultaneously
Therefore the limitation to the scope of the claims of the present invention can not be interpreted as.It should be pointed out that for one of ordinary skill in the art
For, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the guarantor of the present invention
Protect scope.
Claims (9)
1. core board self-test and the burning device of a kind of stamp hole encapsulation, it is characterised in that connect including test board, stamp hole pad
Mouth mold block, the stamp hole pad interface module have some thimbles, and the thimble is corresponded with the stamp hole and contacted, institute
Stating test board includes SPI FLASH memory modules, stamp hole pad interface hardware check module, the stamp hole pad interface mould
Block electrically connects with the SPI FLASH memory modules, the stamp hole pad interface module also with the stamp hole pad interface
Hardware check module electrically connects；The test board also includes USB HOST interface modules, and the USB HOST interface modules are used for
The program in USB flash disk is obtained, the USB HOST interface modules electrically connect with the stamp hole pad interface module.
2. core board self-test and the burning device of stamp hole encapsulation according to claim 1, it is characterised in that the test
Plate also includes indicating module, and the indicating module electrically connects with the stamp hole pad interface module, and the indicating module includes
Hardware detection state indicator module and/or burning program state indicator module, the hardware detection state indicator module are used to show
Show whether the hardware detection of core board is normal, whether burning is successful for showing program for described program program state indicating module.
3. core board self-test and the burning device of the stamp hole encapsulation according to any one of claim 1 to 2, the stamp hole
Pad interface hardware check module includes some resistance, and the resistance is connected between thimble described in each two.
4. core board self-test and the burning device of stamp hole encapsulation according to claim 1, it is characterised in that also include electricity
Source module, the power module electrically connect with the test board, core board respectively.
5. core board self-test and the method for burn-recording of a kind of stamp hole encapsulation, it is characterised in that employ Claims 1-4 such as and appoint
The core board self-test of stamp hole encapsulation described in one and burning device, comprise the following steps：
The test board is electrically connected by stamp hole pad interface module with the stamp hole of core board；
Program in the SPI FLASH memory modules is imported into the DDR2SDRAM memory modules of the core board；
Hardware detection is carried out to core board by the stamp hole pad interface hardware check module；
Program in USB flash disk is read by USB HOST interface modules, and is written in the NAND FLASH memory modules of core board.
6. core board self-test and the method for burn-recording of stamp hole encapsulation according to claim 5, it is characterised in that by described in
Test board is by also including step after the stamp hole electrical connecting step of stamp hole pad interface module and core board：When core board
The core board is powered by all stamp holes after being electrically connected with the stamp hole pad interface module.
7. core board self-test and the method for burn-recording of stamp hole encapsulation according to claim 5, it is characterised in that passing through
Stating after stamp hole pad interface hardware check module carries out hardware detection step to core board also includes step：By the hard of core board
Part detects state and indicated with hardware detection state indicator module.
8. core board self-test and the method for burn-recording of stamp hole encapsulation according to claim 5, it is characterised in that passing through
USB HOST interface modules read the program in USB flash disk, and are written in the NAND FLASH memory modules of core board and are wrapped after step
Include step：Burning program state is indicated with burning program state indicator module.
9. core board self-test and the method for burn-recording of stamp hole encapsulation according to claim 5, it is characterised in that by described
Stamp hole pad interface hardware check module carries out hardware detection step to core board to be included：Successively by between each two stamp hole
Connected with resistance, the hardware detection state of core board is obtained by loopback test.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410407802.4A CN104183272B (en) | 2014-08-18 | 2014-08-18 | A kind of core board self-test of stamp hole encapsulation and burning device, method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410407802.4A CN104183272B (en) | 2014-08-18 | 2014-08-18 | A kind of core board self-test of stamp hole encapsulation and burning device, method |
Publications (2)
| Publication Number | Publication Date |
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| CN104183272A CN104183272A (en) | 2014-12-03 |
| CN104183272B true CN104183272B (en) | 2018-01-19 |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107505561A (en) * | 2017-09-01 | 2017-12-22 | 深圳合纵富科技有限公司 | A kind of detection instrument of stamp hole pcb board |
| CN108958747A (en) * | 2018-06-28 | 2018-12-07 | 南昌华勤电子科技有限公司 | A kind of computer equipment, the system and method that burning is carried out to the e-flash for storing EC program on computer equipment |
| CN110118925B (en) * | 2019-05-21 | 2021-08-06 | 威创集团股份有限公司 | Core board testing method and system |
| CN115166483A (en) * | 2022-07-01 | 2022-10-11 | 广州创龙电子科技有限公司 | Automated testing method and system for stamp hole core board |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101226223A (en) * | 2008-01-29 | 2008-07-23 | 电子科技大学 | Circuit board level self-test system |
| CN101776729A (en) * | 2009-12-10 | 2010-07-14 | 海洋王照明科技股份有限公司 | Portable automatic test fixture |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002099447A (en) * | 2000-09-22 | 2002-04-05 | Fujitsu Ltd | Processor |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101226223A (en) * | 2008-01-29 | 2008-07-23 | 电子科技大学 | Circuit board level self-test system |
| CN101776729A (en) * | 2009-12-10 | 2010-07-14 | 海洋王照明科技股份有限公司 | Portable automatic test fixture |
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Effective date of registration: 20210225 Address after: 510380 room 103, 1 / F, building 7, No. 3, luochonggang, Hedong Kengkou, Liwan District, Guangzhou City, Guangdong Province Patentee after: Guangzhou Xinwei Intelligent Technology Co.,Ltd. Address before: 510275 rooms 1113 and 1114, block B, Zhongda science and technology complex building, 135 Xingang West Road, Haizhu District, Guangzhou City, Guangdong Province Patentee before: GUANGZHOU TAIRUIJIE ELECTRONIC TECHNOLOGY Co.,Ltd. |