CN104181980A - High-temperature integrated server and high-temperature integrated server cluster - Google Patents

Abstract

The invention provides a high-temperature integrated server and a high-temperature integrated server cluster. The high-temperature integrated server comprises a case, a main board, a power adapter plate, a hard disk, a power supply and a fan group, wherein the main board, the power adapter plate and the hard disk are arranged inside the case; the power supply and the fan group are arranged outside the case; a power supply interface is formed in a case body of the case; the power supply is connected with the power adapter plate through the power supply interface; the power adapter plate is respectively and electrically connected with the main board, the hard disk and the fan group; an air inlet of the fan group is communicated with the inside of the case; an exhaust opening of the fan group faces an external environment where the case is positioned; the fan group dissipates the heat from the inside of the case in an air drafting mode. Due to the adoption of the structural mode of the invention, the density of the server can be improved, so the server can adapt to the higher ambient temperature; in addition, the integral power consumption of the server cluster can also be reduced.

Description

High temperature integrated server and high temperature integrated server cluster

technical field

The invention belongs to the technical field of server structures, and in particular relates to a high-temperature integrated server and a cluster of high-temperature integrated servers.

Background technique

As shown in Figure 1, it is a schematic diagram of the structure of a traditional single server. A motherboard, a power supply, a hard disk, and a fan are arranged inside the server chassis. To achieve the effect of heat dissipation.

With the rapid development of computer technology, the amount of information to be processed is increasing. Therefore, in order to improve the computing speed of the server, multiple servers are often integrated, that is, a certain service is provided through the server cluster.

For server clusters, when a single server adopts the structure shown in Figure 1, it has the problems of low server density and large space occupied by the server cluster; moreover, each server dissipates heat through its own fan, which has the disadvantage of high overall power consumption; In addition, due to the limited power of the fans configured on a single server, the overall heat dissipation effect of the server cluster is not ideal, and generally it can only adapt to the ambient temperature of 35 degrees Celsius.

Contents of the invention

Aiming at the defects existing in the prior art, the present invention provides a high-temperature integrated server and a high-temperature integrated server cluster. By using the structure of the present invention, the server density can be increased, the server can adapt to a higher ambient temperature, and the server cluster can also be reduced. overall power consumption.

The technical scheme that the present invention adopts is as follows:

The present invention provides a high-temperature integrated server, including a chassis, a mainboard, a power adapter board, a hard disk, a power supply, and a fan group; wherein, the mainboard, the power adapter board, and the hard disk are installed inside the chassis; The power supply and the fan group are installed outside the chassis; a power supply interface is installed on the chassis body; the power supply is connected to the power adapter board through the power supply interface; the power adapter board are respectively electrically connected to the motherboard, the hard disk, and the fan group; and, the air inlet of the fan group communicates with the inside of the case, and the air outlet of the fan group faces the external environment where the case is located; The fan group dissipates the heat inside the chassis by drafting.

Preferably, the power supply interface is installed on the front panel of the chassis; or, the power supply interface is installed on the rear panel of the chassis.

Preferably, the fan group includes more than one fan arranged side by side.

The present invention also provides a high-temperature integrated server cluster, including two or more of the above-mentioned high-temperature integrated servers; two or more of the high-temperature integrated servers share the same fan group and the same power supply.

Preferably, the high-temperature integrated server cluster is composed of each high-temperature integrated server arranged in parallel up and down.

The beneficial effects of the present invention are as follows:

The high-temperature integrated server and the high-temperature integrated server cluster provided by the present invention install the power supply and the fan group outside the chassis. By using the structural method of the present invention, the server density can be increased, the server can adapt to a higher ambient temperature, and the server can also be reduced. The overall power consumption of the cluster.

Description of drawings

FIG. 1 is a schematic diagram of a traditional server structure;

Among them, 1-1 power supply; 1-2 motherboard; 1-3 fan; 1-4 hard disk;

Fig. 2 is a schematic structural diagram of a high-temperature integrated server provided by the present invention;

Among them, 2-1 power adapter board; 2-2 main board; 2-3 front power supply interface; 2-4 hard disk; 2-5 joint parts;

FIG. 3 is a schematic structural diagram of a high-temperature integrated server cluster provided by the present invention;

Among them, 3-1 high temperature integrated server; 3-2 fan group.

Detailed ways

The present invention is described in detail below in conjunction with accompanying drawing:

As shown in Figure 2, the present invention provides a high-temperature integrated server, including a chassis, a mainboard, a power adapter board, a hard disk, a power supply, and a fan group; wherein, the mainboard, the power adapter board, and the hard disk are installed inside the chassis; the power supply and The fan group is installed outside the chassis; a power supply interface is installed on the chassis body, wherein the power supply interface can be installed on the front panel or the rear panel of the chassis. The power supply is connected to the power adapter board through the power supply interface; the power adapter board is electrically connected to the main board, the hard disk and the fan group; and the air inlet of the fan group is connected to the inside of the chassis, and the air outlet of the fan group faces the external environment where the chassis is located. ; The fan group dissipates the heat inside the chassis by means of ventilation. The fan group includes more than one fan arranged side by side. As shown in Figure 3, the fan group consists of three parallel fans.

Using the above-mentioned high-temperature integrated server, the present invention also provides a high-temperature integrated server cluster. The high-temperature integrated server cluster is composed of high-temperature integrated servers arranged in parallel up and down. As shown in Figure 3, it is a high-temperature integrated server cluster composed of six high-temperature integrated servers. In addition, the present invention does not limit the specific placement angle of the high-temperature integrated server cluster. According to different needs, it can be placed horizontally, vertically or at a certain angle to the horizontal.

In the present invention, the power supply and the fan group are independent outside the chassis, and provide power and heat dissipation for multiple high-temperature integrated servers. As shown in Figure 3, one fan group provides cooling functions for three high-temperature integrated servers, and one The power supply centrally provides power for 6 high-temperature integrated servers. The structure of centralized heat dissipation through the fan group has higher heat dissipation efficiency than traditional servers alone, and can operate normally in an environment of 45 degrees Celsius. In addition, when a traditional server fan fails, it is necessary to turn off the power and then open the server case to replace the fan. In the high-temperature integrated server cluster provided by the present invention, the fan group is installed outside the case. Therefore, the fan can be replaced under the working state of the high-temperature integrated server. group, avoiding the process of shutting down and restarting the high-temperature all-in-one server.

The high-temperature integrated server and the high-temperature integrated server cluster provided by the present invention install the power supply and the fan group outside the case so that multiple servers share the same fan group. By using the structure of the present invention, the server density can be increased and the server can adapt to Higher ambient temperature, but also can reduce the overall power consumption of the server cluster, and also has the advantage of easy maintenance of the fan group.

The above is only a preferred embodiment of the present invention, it should be pointed out that, for those of ordinary skill in the art, without departing from the principle of the present invention, some improvements and modifications can also be made, and these improvements and modifications can also be made. It should be regarded as the protection scope of the present invention.

Claims (5)

1. A high-temperature integrated server, characterized in that it includes a chassis, a motherboard, a power adapter board, a hard disk, a power supply, and a fan group; wherein, the motherboard, the power adapter board, and the hard disk are installed in the chassis inside; the power supply and the fan group are installed outside the chassis; a power supply interface is installed on the box body of the chassis; the power supply is connected to the power adapter board through the power supply interface; the power supply The adapter board is electrically connected to the motherboard, the hard disk, and the fan group respectively; and, the air inlet of the fan group communicates with the inside of the chassis, and the air exhaust port of the fan group faces the side where the chassis is located. External environment: the fan group dissipates the heat inside the chassis through drafting. 2. The high-temperature integrated server according to claim 1, wherein the power supply interface is installed on the front panel of the chassis; or, the power supply interface is installed on the rear panel of the chassis. 3. The high-temperature integrated server according to claim 1, wherein the fan group includes more than one fan arranged in parallel. 4. A high-temperature integrated server cluster, characterized in that it comprises two or more high-temperature integrated servers according to any one of claims 1-3; two or more of the high-temperature integrated servers share the same fan group, and, share the same power supply. 5. The high-temperature integrated server cluster according to claim 4, characterized in that, the high-temperature integrated server cluster is composed of each of the high-temperature integrated servers arranged in parallel up and down.