CN104181980A - High-temperature integrated server and high-temperature integrated server cluster - Google Patents
High-temperature integrated server and high-temperature integrated server cluster Download PDFInfo
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- CN104181980A CN104181980A CN201310195411.6A CN201310195411A CN104181980A CN 104181980 A CN104181980 A CN 104181980A CN 201310195411 A CN201310195411 A CN 201310195411A CN 104181980 A CN104181980 A CN 104181980A
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- temperature integrated
- power supply
- fan group
- integrated server
- cabinet
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Abstract
The invention provides a high-temperature integrated server and a high-temperature integrated server cluster. The high-temperature integrated server comprises a case, a main board, a power adapter plate, a hard disk, a power supply and a fan group, wherein the main board, the power adapter plate and the hard disk are arranged inside the case; the power supply and the fan group are arranged outside the case; a power supply interface is formed in a case body of the case; the power supply is connected with the power adapter plate through the power supply interface; the power adapter plate is respectively and electrically connected with the main board, the hard disk and the fan group; an air inlet of the fan group is communicated with the inside of the case; an exhaust opening of the fan group faces an external environment where the case is positioned; the fan group dissipates the heat from the inside of the case in an air drafting mode. Due to the adoption of the structural mode of the invention, the density of the server can be improved, so the server can adapt to the higher ambient temperature; in addition, the integral power consumption of the server cluster can also be reduced.
Description
Technical field
The invention belongs to server architecture technical field, be specifically related to a kind of high-temperature integrated server and high-temperature integrated server cluster.
Background technology
As shown in Figure 1, Structural Tectonics schematic diagram for traditional separate unit server, arranges mainboard, power supply, hard disk and fan in machine box for server inside, by power supply, powers respectively to mainboard, hard disk and fan, by fan, reduce the environment temperature of cabinet inside, thereby reach the effect of heat radiation.
Along with developing rapidly of computer technology, need quantity of information to be processed increasing, therefore, for improving server operation speed, usually multiple servers is put together, that is: by server cluster, provide a certain service.
For server cluster, when separate unit server adopts structure shown in Fig. 1, the large problem that has that server density is low, server cluster takes up room; And each station server dispels the heat by the fan of self respectively, there is the deficiency that overall power consumption is high; In addition, the power limited of the fan configuring due to separate unit server, thus cause the undesirable problem of server cluster integral heat sink effect, be generally merely able to adapt to the environment temperatures of 35 degree Celsius.
Summary of the invention
The defect existing for prior art, the invention provides a kind of high-temperature integrated server and high-temperature integrated server cluster, the frame mode of the application of the invention, can increase server density, make server adapt to more high ambient temperature, but also can reduce the overall power of server cluster.
The technical solution used in the present invention is as follows:
The invention provides a kind of high-temperature integrated server, comprise cabinet, mainboard, Power conversion board, hard disk, power supply and blower group; Wherein, described mainboard, described Power conversion board and described hard disk are arranged on the inside of described cabinet; Described power supply and described fan group are arranged on the outside of described cabinet; On the casing of described cabinet, power supply interface is installed; Described power supply is connected with described Power conversion board by described power supply interface; Described Power conversion board is electrically connected to described mainboard, described hard disk and described fan group respectively; And the air inlet of described fan group is communicated with described cabinet inside, the exhaust outlet of described fan group is towards the external environment condition at described cabinet place; Described fan group is distributed the heat of described cabinet inside by exhausting mode.
Preferably, described power supply interface is arranged on the front panel of described cabinet; Or described power supply interface is arranged on the rear panel of described cabinet.
Preferably, described fan group comprises a fan being set up in parallel above.
The present invention also provides a kind of high-temperature integrated server cluster, comprises two above above-mentioned high-temperature integrated servers; Two the above high-temperature integrated servers share same described fan group, and, share same described power supply.
Preferably, described high-temperature integrated server cluster is contacted up and down to be arranged in parallel by each described high-temperature integrated server and forms.
Beneficial effect of the present invention is as follows:
High-temperature integrated server provided by the invention and high-temperature integrated server cluster, power supply and blower group is arranged on to the outside of cabinet, the frame mode of the application of the invention, can increase server density, make server adapt to more high ambient temperature, but also can reduce the overall power of server cluster.
Accompanying drawing explanation
Fig. 1 is traditional server architecture schematic diagram;
Wherein, 1-1 power supply; 1-2 mainboard; 1-3 fan; 1-4 hard disk;
Fig. 2 is high-temperature integrated server architecture schematic diagram provided by the invention;
Wherein, 2-1 Power conversion board; 2-2 mainboard; Power supply interface before 2-3; 2-4 hard disk; 2-5 attachment;
Fig. 3 is the structural representation of high-temperature integrated server cluster provided by the invention;
Wherein, 3-1 high-temperature integrated server; 3-2 fan group.
Embodiment
Below in conjunction with accompanying drawing, the present invention is described in detail:
As shown in Figure 2, the invention provides a kind of high-temperature integrated server, comprise cabinet, mainboard, Power conversion board, hard disk, power supply and blower group; Wherein, mainboard, Power conversion board and hard disk are arranged on the inside of cabinet; Power supply and blower group is arranged on the outside of cabinet; On the casing of cabinet, power supply interface is installed, wherein, power supply interface can be arranged on the front panel or rear panel of cabinet.Power supply is connected with Power conversion board by power supply interface; Power conversion board is electrically connected to mainboard, hard disk and fan group respectively; And the air inlet of fan group is communicated with cabinet inside, the exhaust outlet of fan group is towards the external environment condition at cabinet place; Fan group is distributed the heat of cabinet inside by exhausting mode.Fan group comprises a fan being set up in parallel above.As shown in Figure 3, fan group is comprised of three parallel fans.
Apply above-mentioned high-temperature integrated server, the present invention also provides a kind of high-temperature integrated server cluster, and high-temperature integrated server cluster is contacted up and down to be arranged in parallel by each high-temperature integrated server and forms.As shown in Figure 3, the high-temperature integrated server cluster for being formed by 6 high-temperature integrated servers.In addition, the present invention does not limit the concrete angles of high-temperature integrated server cluster, according to different demands, can horizontal, perpendicularly put or place at an angle with level.
In the present invention, power supply and blower group is independent outside at cabinet, and, concentrate and provide electric energy and heat radiation for many high-temperature integrated servers, in Fig. 3, a fan group is concentrated as three high-temperature integrated servers provide heat sinking function, and power supply is concentrated provides electric energy for 6 high-temperature integrated servers.The frame mode of concentrating heat radiation by fan group, higher compared with the independent radiating efficiency of traditional server, can in 45 degree environment Celsius, run well.In addition, when traditional server fan breaks down, need to close after tester in power-down state, open machine box for server and change fan, and high-temperature integrated server cluster provided by the invention, fan group is arranged on cabinet outside, therefore, can under high-temperature integrated server contention states, change fan group, avoid the process of high-temperature integrated server cycle power.
High-temperature integrated server provided by the invention and high-temperature integrated server cluster, power supply and blower group is arranged on to the outside of cabinet, make multiple servers share identical fan group, the frame mode of the application of the invention, can increase server density, make server adapt to more high ambient temperature, but also can reduce the overall power of server cluster, also there is convenient for maintaining fan group.
The above is only the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention; can also make some improvements and modifications, these improvements and modifications also should be looked protection scope of the present invention.
Claims (5)
1. a high-temperature integrated server, is characterized in that, comprises cabinet, mainboard, Power conversion board, hard disk, power supply and blower group; Wherein, described mainboard, described Power conversion board and described hard disk are arranged on the inside of described cabinet; Described power supply and described fan group are arranged on the outside of described cabinet; On the casing of described cabinet, power supply interface is installed; Described power supply is connected with described Power conversion board by described power supply interface; Described Power conversion board is electrically connected to described mainboard, described hard disk and described fan group respectively; And the air inlet of described fan group is communicated with described cabinet inside, the exhaust outlet of described fan group is towards the external environment condition at described cabinet place; Described fan group is distributed the heat of described cabinet inside by exhausting mode.
2. high-temperature integrated server according to claim 1, is characterized in that, described power supply interface is arranged on the front panel of described cabinet; Or described power supply interface is arranged on the rear panel of described cabinet.
3. high-temperature integrated server according to claim 1, is characterized in that, described fan group comprises a fan being set up in parallel above.
4. a high-temperature integrated server cluster, is characterized in that, comprises two high-temperature integrated servers described in above claim 1-3 any one; Two the above high-temperature integrated servers share same described fan group, and, share same described power supply.
5. high-temperature integrated server cluster according to claim 4, is characterized in that, described high-temperature integrated server cluster is contacted up and down to be arranged in parallel by each described high-temperature integrated server and forms.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310195411.6A CN104181980A (en) | 2013-05-23 | 2013-05-23 | High-temperature integrated server and high-temperature integrated server cluster |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310195411.6A CN104181980A (en) | 2013-05-23 | 2013-05-23 | High-temperature integrated server and high-temperature integrated server cluster |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104181980A true CN104181980A (en) | 2014-12-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310195411.6A Pending CN104181980A (en) | 2013-05-23 | 2013-05-23 | High-temperature integrated server and high-temperature integrated server cluster |
Country Status (1)
| Country | Link |
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| CN (1) | CN104181980A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113238629A (en) * | 2021-05-17 | 2021-08-10 | 英业达科技有限公司 | Server |
| CN114110357A (en) * | 2021-10-15 | 2022-03-01 | 国网江苏省电力有限公司建设分公司 | Data comparison device based on edge calculation and use method thereof |
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| CN201725271U (en) * | 2010-08-30 | 2011-01-26 | 浪潮电子信息产业股份有限公司 | Optimized heat dissipation blade server |
| CN201725262U (en) * | 2010-08-30 | 2011-01-26 | 浪潮电子信息产业股份有限公司 | Novel cabinet capable of optimizing heat dissipation |
| CN102830779A (en) * | 2012-09-07 | 2012-12-19 | 浪潮电子信息产业股份有限公司 | Design method for optimizing heat dissipation and energy saving of computer system |
| CN202679818U (en) * | 2012-04-17 | 2013-01-16 | 百度在线网络技术（北京）有限公司 | Cabinet |
| CN203299694U (en) * | 2013-05-23 | 2013-11-20 | 北京天地超云科技有限公司 | High-temperature integrated servers and high-temperature integrated server cluster |
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2013
- 2013-05-23 CN CN201310195411.6A patent/CN104181980A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201725271U (en) * | 2010-08-30 | 2011-01-26 | 浪潮电子信息产业股份有限公司 | Optimized heat dissipation blade server |
| CN201725262U (en) * | 2010-08-30 | 2011-01-26 | 浪潮电子信息产业股份有限公司 | Novel cabinet capable of optimizing heat dissipation |
| CN202679818U (en) * | 2012-04-17 | 2013-01-16 | 百度在线网络技术（北京）有限公司 | Cabinet |
| CN102830779A (en) * | 2012-09-07 | 2012-12-19 | 浪潮电子信息产业股份有限公司 | Design method for optimizing heat dissipation and energy saving of computer system |
| CN203299694U (en) * | 2013-05-23 | 2013-11-20 | 北京天地超云科技有限公司 | High-temperature integrated servers and high-temperature integrated server cluster |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113238629A (en) * | 2021-05-17 | 2021-08-10 | 英业达科技有限公司 | Server |
| CN114110357A (en) * | 2021-10-15 | 2022-03-01 | 国网江苏省电力有限公司建设分公司 | Data comparison device based on edge calculation and use method thereof |
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| C06 | Publication | ||
| PB01 | Publication | ||
| EXSB | Decision made by sipo to initiate substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20141203 |
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| RJ01 | Rejection of invention patent application after publication |