CN104180204A - 一种半导体芯片组合发光灯具 - Google Patents

一种半导体芯片组合发光灯具 Download PDF

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CN104180204A
CN104180204A CN201310196313.4A CN201310196313A CN104180204A CN 104180204 A CN104180204 A CN 104180204A CN 201310196313 A CN201310196313 A CN 201310196313A CN 104180204 A CN104180204 A CN 104180204A
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semiconductor chip
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shell
illuminating lamp
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范文昌
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Priority to US13/920,131 priority patent/US20140347859A1/en
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • F21V31/005—Sealing arrangements therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/007—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array enclosed in a casing
    • F21V23/009—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array enclosed in a casing the casing being inside the housing of the lighting device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/87—Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/006—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/56—Cooling arrangements using liquid coolants
    • F21V29/58—Cooling arrangements using liquid coolants characterised by the coolants
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

本发明是一种半导体芯片组合发光灯具，属于灯具照明技术领域，本发明采用OGC光源，OGC光源是一种由液体油或固态蜡（oil）、玻璃容器或陶瓷容器(glass container)、芯片（chip）的组合体，利用三种材料英语单词的首字母的缩写简称命名为OGC光源，在半导体芯片发光照明时代里，是一次革命性的改变。本发明包括电源接口和外壳，电源接口与外壳连接，其特征在于：所述的电源接口内部设置有驱动电源，所述的外壳内部封装有散热材料，外壳的底部表面固接芯片，外壳的下端设置有透镜，且该芯片位于透镜的内部；所述的驱动电源与芯片相连接。本发明散热效果好，芯片使用寿命长；光通量高，光的利用率高。

Description

一种半导体芯片组合发光灯具
技术领域
本发明属于灯具照明技术领域，涉及一种半导体芯片组合发光灯具。
背景技术
近年来，半导体芯片发光时代的来临，大功率LED发展较快，在结构和性能上都有较大的改进，产量上升、价格下降；还开发出单颗功率为100W的超大功率白光LED。与前几年相比较，在发光效率上有长足的进步。例如，Edison公司前几年的20W白光LED，其光通量为700lm，发光效率为35lm/W。2007年开发的100W白光LED，其光通量为6000lm，发光效率为60lm/W。Cree公司新推出的XLampXR～E冷白光LED，其最高亮度挡QS在350mA时光通量可达107～114lm。这些性能良好的大功率LED给开发LED白光照明灯具创造了条件。
LED是个光电器件，其工作过程中只有15%～25%的电能转换成光能，其余的电能几乎都转换成热能，使LED的温度升高。在大功率LED中，散热是个大问题。例如，1个10W白光LED若其光电转换效率为20%，则有8W的电能转换成热能，若不加散热措施，则大功率LED的器芯温度会急速上升，当其结温（TJ）上升超过最大允许温度时（一般是150℃），大功率LED会因过热而损坏。因此在大功率LED灯具设计中，最主要的设计工作就是散热及提高它的光亮度的设计开发。
现有的大功率LED灯的散热方案如下：LED芯片铝基板连结组合成设计需要的功率时，按常规的封装的方式进行封装保护LED芯片的导线焊接点。在LED芯片工作时会产生高温，在不工作时温度下降，这时保护LED芯片焊点的胶会产生物理现象热胀冷缩，胶在胀缩循环时不断的拉动LED芯片导线的焊接点，经过长时间的作用就会把LED芯片的导线焊点拉断或拉松结束LED芯片的寿命。并且，传统的大功率LED灯的散热方法是用导热方式通过铝材的方式散热，这种方式散热性能差而且体积庞大价格昂贵。有不少新的金属散热方式，都能解决其散热问题就是没法解决提高它的光亮度，而金属散热的成本比较昂贵。
发明内容
针对背景技术中存在的不足，本发明的目的在于提供一种半导体芯片组合发光灯具，采用OGC光源，OGC光源是一种由液体油或固态蜡（oil）、玻璃容器或陶瓷容器(glass container)、芯片（chip）的组合体。
为实现上述目的，本发明提供了如下技术方案：一种半导体芯片组合发光灯具，包括电源接口和外壳，电源接口与外壳连接，所述的电源接口内部设置有驱动电源，所述的外壳内部封装有散热材料，外壳的底部表面固接芯片，外壳的下端设置有透镜，且该芯片位于透镜的内部；所述的驱动电源与芯片相连接。
上述的电源接口包括螺口灯头电源正极和螺口灯头电源负极，该螺口灯头电源负极通过灯体连接件与外壳相连接。
上述的外壳的上表面开设有开口，且开口上适配有密封件。
上述的外壳为玻璃容器或陶瓷容器。
上述的散热材料为液体油或固体腊。
上述的透镜的材质为玻璃或塑料。
本发明相比现有技术来说的有益效果：本发明利用二次散热，散热效果好；芯片使用寿命长；光通量高，光的利用率高。
附图说明
图1是本发明的采用液体油做散热材料的结构示意图；
图2是本发明的采用固体腊做散热材料的结构示意图。
图中标号含义：1.螺口灯头电源正极；2.螺口灯头电源负极；3.灯体连接件；4.外壳；5.芯片；6.透镜；7.液体油；8.密封件；9.驱动电源；10.固体腊。
具体实施方式
下面结合附图和实施例，对本发明的具体实施方式作为优选详细描述。以下实施例用于说明本发明，但不用来限制本发明的范围。
如图1-图2所示，一种半导体芯片组合发光灯具，包括电源接口和外壳4，电源接口与外壳4连接，所述的电源接口内部设置有驱动电源9，所述的外壳4内部封装有散热材料，外壳4的底部表面固接芯片5，外壳4的下端设置有透镜6，且该芯片5位于透镜6的内部；所述的驱动电源9与芯片5相连接。
作为优选，上述的电源接口包括螺口灯头电源正极1和螺口灯头电源负极2，该螺口灯头电源负极2通过灯体连接件3与外壳4相连接。
作为优选，上述的外壳4的上表面开设有开口，且开口上适配有密封件8。
作为优选，上述的外壳4为玻璃容器或陶瓷容器。
作为优选，上述的散热材料为液体油7或固体腊10。
作为优选，上述的透镜6的材质为玻璃或塑料。
本发明所述的OGC光源是一种由液体油或固态蜡（oil）、玻璃容器或陶瓷容器(glass container)、芯片（chip）的组合体，利用三种材料英语单词的首字母的缩写简称命名为OGC光源，在半导体芯片发光照明时代里，是一次革命性的改变。
封装：先在玻璃容器里装满液体油7或固体腊10，再用密封件8进行密封处理。
二次散热原理：用玻璃容器或陶瓷容器做外壳4，主要用于第一次散热的作用；用液体油7或固体腊10做为散热材料，用于二次散热的作用。
本发明的工作原理：本发明的芯片5通电后开始发光，光电转换时会产生大量的热能，热量通过玻璃容器的底部传递到液体油7或固态蜡10里，通过液体油7或固态蜡10把芯片5发光时产生的热量降底，提高发光的效率。
把芯片5的发热量通过玻璃容器、液体油或固态蜡自动散去，且温度保持在（45°-55°）+外境温度，是芯片5发光最佳的温度，并延长芯片的使用寿命。
用玻璃做芯片5的基板，基板即玻璃的下表面，这样就提高了芯片5的发光率30%-50%。由于芯片5的发光体是360°发光，用金属或陶瓷作基板它们不透明，把芯片5的光亮度遮挡了180°就减少了芯片5的光通量，用玻璃作基板，芯片5的发光没有受到多少遮挡，自然就提高了光通量。玻璃容器里用透明油，使玻璃和油形成一个整体，芯片5的光透过反面是就减少了截面，同时又提高了光的利用率。
以上所述仅是本发明的优选实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本发明技术原理的前提下，做出若干改进和变型也应视为本发明的保护范围。

Claims (6)

1.一种半导体芯片组合发光灯具，包括电源接口和外壳，电源接口与外壳连接，其特征在于：所述的电源接口内部设置有驱动电源，所述的外壳内部封装有散热材料，外壳的底部表面固接芯片，外壳的下端设置有透镜，且该芯片位于透镜的内部；所述的驱动电源与芯片相连接。
2.根据权利要求1所述的半导体芯片组合发光灯具，其特征在于：所述的电源接口包括螺口灯头电源正极和螺口灯头电源负极，该螺口灯头电源负极通过灯体连接件与外壳相连接。
3.根据权利要求2所述的半导体芯片组合发光灯具，其特征在于：所述的外壳的上表面开设有开口，且开口上适配有密封件。
4.根据权利要求1或2或3所述的半导体芯片组合发光灯具，其特征在于：所述的外壳为玻璃容器或陶瓷容器。
5.根据权利要求1所述的半导体芯片组合发光灯具，其特征在于：所述的散热材料为液体油或固体腊。
6.根据权利要求1所述的半导体芯片组合发光灯具，其特征在于：所述的透镜的材质为玻璃或塑料。
CN201310196313.4A 2013-05-23 2013-05-23 一种半导体芯片组合发光灯具 Pending CN104180204A (zh)

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CN201310196313.4A CN104180204A (zh) 2013-05-23 2013-05-23 一种半导体芯片组合发光灯具
US13/920,131 US20140347859A1 (en) 2013-05-23 2013-06-18 Thermally efficient OGC lamp
EP13184685.9A EP2806210A1 (en) 2013-05-23 2013-09-17 Combined lamps with semiconductor chip.

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