CN104179320A - Ceramic plate wet adhering installing method - Google Patents
Ceramic plate wet adhering installing method Download PDFInfo
- Publication number
- CN104179320A CN104179320A CN201410439492.4A CN201410439492A CN104179320A CN 104179320 A CN104179320 A CN 104179320A CN 201410439492 A CN201410439492 A CN 201410439492A CN 104179320 A CN104179320 A CN 104179320A
- Authority
- CN
- China
- Prior art keywords
- ceramic wafer
- ceramic plate
- leveling
- hammer
- permanent magnet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Apparatuses For Generation Of Mechanical Vibrations (AREA)
- Floor Finish (AREA)
Abstract
The invention discloses a ceramic plate wet adhering installing method. The ceramic plate wet fixing installing method includes the steps of a, adhering one end of a Z-shaped adhesive member to the back surface of a ceramic plate; immersing the ceramic plate in water for full immersion wetting after an epoxy resin adhesive is completely dried; b, flatting or leveling uneven portions of a basic layer of the wall and watering for sufficiently wetting; c, evenly smearing a cement mortar layer on the back surface of the ceramic plate in step a, laying and adhering the ceramic plate with the cement mortar layer on the basic layer of the wall from bottom to top, and leveling with an electric leveling hammer during laying; d, pointing with cement slurry of the same color with the ceramic plate. According to the ceramic plate wet adhering installing method, the Z-shaped adhesive member is adhered to the back surface of the ceramic plate before the ceramic plate is immersed and wrapped in the cement mortar layer after the ceramic plate is mounted, so that the combination degree and tension between the ceramic plate and the cement mortar layer are enhanced, and the falling of the ceramic plate can be avoided due to the separation from the cement mortar layer.
Description
Technical field
The present invention relates to building decoration technology field, be specifically related to a kind of ceramic wafer wet combining method mounting method.
Background technology
Ceramic wafer has the feature of " large, thin, light ", and its sound insulation, fire prevention, watertightness performance are strong, ornamental strong, is a kind of ornament materials of very environmental protection and energy saving.The mounting means of existing ceramic wafer is mainly to adopt wet combining method,, by manually cement mortar being spread upon to the back of ceramic wafer, ceramic wafer is pasted on the wall or ground.The quality of the installation quality of the ceramic wafer that this method is installed depends primarily on workman's experience and technical level, and its installation quality is difficult to ensure.And because the area of ceramic wafer is large and thin, workman, in the time of the applying mortar of ceramic wafer back, is difficult to smear evenly, make mounted ceramic wafer easily produce hollowing phenomenon, easily come off in use.Because ceramic wafer is conventionally all very thin, it cannot punch as common stone material, timber, by steel suspension member and wall connecting, therefore, does not also have a kind of good method can solve ceramic wafer now the phenomenon that easily produces hollowing and come off is installed.
?
Summary of the invention
For above-mentioned deficiency of the prior art, the invention provides a kind of ceramic wafer wet combining method mounting method, utilize this mounting method that ceramic wafer is installed, can make that ceramic wafer can preferably and building be fixed and difficult coming off.
To achieve these goals, the technical solution used in the present invention is as follows:
Ceramic wafer wet combining method mounting method, comprises the steps:
A, select little, complete, the smooth ceramic wafer of aberration, adopt epobond epoxyn to stick on the back side of ceramic wafer one end of Z-type bond, every ceramic wafer is pasted 4 ~ 9 Z-type bonds; After epobond epoxyn is completely dry, ceramic wafer is immersed in the water, fully soak and soak, take out stand-by;
B, the rough part of body of wall basic unit is picked flat or adopted the cement mortar of 1:3 to carry out levelling, and it is fully wetting to water; Adopt ink fountain in body of wall basic unit, to eject vertical and horizontal control line;
C, get the ceramic wafer in step a, cement sand bed is evenly spread at the back side at ceramic wafer, the thickness of cement sand bed should still can wrap Z-type bond after ceramic wafer installs, by the ceramic wafer paving from bottom to top that is coated with cement sand bed in body of wall basic unit, limit paving ceramic wafer, limit adopts electronic leveling hammer to flatten;
D, by after a complete ceramic wafer paving whole face wall body, adopt the cement paste identical with ceramic wafer color to carry out jointing processing;
Wherein, described electronic leveling hammer comprises handle, hammer body, rechargeable battery pack, inverter, external connection socket, secured core, permanent magnet, rubber-buffer, leveling transmission body, leveling head rubber cushion cover; One end of described handle is fixedly connected with hammer body, and described rechargeable battery pack, inverter, external connection socket are arranged in handle, and inverter is electrically connected with rechargeable battery pack, and external connection socket is electrically connected with rechargeable battery pack; In described hammer body, be provided with a mounting groove, secured core is fixed in mounting groove, is wound with coil in the periphery of secured core, and the two ends of this coil are electrically connected with inverter, forms loop; In hammer body, be also provided with stopper slot, described permanent magnet is arranged in stopper slot, between the top of permanent magnet and stopper slot top, is provided with spring a, and bottom is fixedly connected with leveling transmission body; Between one side of described leveling transmission body and hammer body end, be also provided with multiple spring b, be enclosed with leveling head rubber cushion cover at the opposite side of leveling transmission body; Circumferentially be provided with clip for limiting along hammer body end, described rubber-buffer and clip for limiting are clasped.
Further, in step a, the contact area of described Z-type bond and ceramic wafer is greater than 30mm*30mm.
With respect to prior art, the present invention has following beneficial effect:
1, the present invention is before soaking ceramic wafer, adopt epobond epoxyn Z-type bond to be sticked on to the back side of ceramic wafer, this bond is wrapped in cement sand bed after ceramic wafer installs, increase conjugation and pulling force between ceramic wafer and cement sand bed, made ceramic wafer be difficult for separating with cement sand bed and coming off.
2, in the time that ceramic wafer paving is in body of wall basic unit, paving limit, limit adopts electronic leveling hammer to flatten, this electronic leveling hammer vibration frequency is high, the control of oscillation intensity capable of regulating, vibration can be delivered on ceramic wafer uniformly, pound out the space between ceramic wafer and cement sand bed, thereby make the fuller back side that is fitted in ceramic wafer of cement sand bed, further prevented coming off of ceramic wafer.
Brief description of the drawings
Fig. 1 is that ceramic wafer is arranged on the sectional view in body of wall basic unit;
Fig. 2 is that ceramic wafer is arranged on the stereogram in body of wall basic unit;
Fig. 3 is that ceramic wafer is arranged on the explosive view in body of wall basic unit;
Fig. 4 is electronic leveling hammer structural representation;
Fig. 5 is electricity leveling hammer hammehead structure schematic diagram.
Wherein, 1 is ceramic wafer, and 2 is Z-type bond, and 3 is cement sand bed, 4 is body of wall basic unit, and 5 is rechargeable battery pack, and 6 is inverter, and 7 is handle, 8 is hammer body, and 9 is tup, and 10 is secured core, and 11 is coil, 12 is spring a, and 13 is permanent magnet, and 14 is rubber-buffer, and 15 is external connection socket, 16 is external circuit, and 17 is stopper slot, and 18 is L-type cylinder connector, and 19 is spring b, 20 is leveling transmission body, and 21 is leveling head rubber cushion cover, and 22 is clip for limiting.
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments, the invention will be further described.
Referring to Fig. 1 ~ Fig. 3: ceramic wafer wet combining method mounting method, comprises the steps:
A, select little, complete, the smooth ceramic wafer of aberration 1, adopt epobond epoxyn to stick on the back side of ceramic wafer 1 one end of Z-type bond 2, every ceramic wafer 1 is pasted 4 ~ 9 Z-type bonds 2.Z-type bond 2 is made for metal material, and it is in advance in produce in factory moulding.Z-type bond 2 is bonded in the back side of ceramic wafer 1 by epobond epoxyn, epoxy resin has heat-resisting, decay resistance can make bond 2 and ceramic wafer 1 back side cohesive good, bonding more firm, is not easy to come off.In the present embodiment, the back side of every ceramic wafer 1 is evenly pasted with 5 Z-type bonds.After epobond epoxyn is completely dry, ceramic wafer 1 is immersed in the water, fully soak and soak, take out stand-by.For ceramic wafer 1 can fully be soaked, its water-immersed time should be greater than 2 hours.
B, the rough part of body of wall basic unit is picked flat or adopted the cement mortar of 1:3 to carry out levelling, and it is fully wetting to water; Adopt ink fountain in body of wall basic unit, to eject vertical and horizontal control line.
C, get in step a fully moistening ceramic wafer 1, cement sand bed 3 is evenly spread at the back side at ceramic wafer 1, the thickness of cement sand bed 3 should still can wrap Z-type bond after ceramic wafer installs, by the ceramic wafer paving from bottom to top that is coated with cement sand bed in body of wall basic unit, limit paving ceramic wafer, limit adopts electronic leveling hammer to flatten.In the time of paving, if ceramic wafer causes wettability inadequate because placing too for a long time, need to again insert in water and soak.In the time that cement sand bed 3 is smeared at the back side of ceramic wafer 1, should note the cement mortar vibration compacting between Z-type bond 2 and the ceramic wafer back side.
D, by after a complete ceramic wafer 1 paving whole face wall body, adopt the cement paste identical with ceramic wafer 1 color to carry out jointing processing.
In order to make Z-type bond can more firmly be fixed on the back side of ceramic wafer, the contact area of Z-type bond and ceramic wafer is greater than 30mm*30mm.
Referring to Fig. 4 and Fig. 5: in step c, the electronic leveling hammer that ceramic wafer 1 is flattened comprises handle 7, hammer body 8, rechargeable battery pack 5, inverter 6, external connection socket 15, secured core 10, spring a12, permanent magnet 13, spring b19, rubber-buffer 14, leveling transmission body 20, leveling head rubber cushion cover 21.One end of handle 7 is fixedly connected with hammer body 8, forms a T-shaped structure.Rechargeable battery pack 5 and inverter 6 are arranged in handle 7, and inverter 6 is electrically connected with rechargeable battery pack 5, and the direct current of battery pack 1 is converted to alternating current.On handle 7, be provided with external connection socket 15, this external connection socket 15 can be electrically connected with external circuit 6, in order to give electric ceramic plate leveling hammer power supply and rechargeable battery pack 5 is charged.Electric ceramic plate leveling hammer can the preferential power supply that uses outside line, and does not have in electric and can charge in battery pack, and battery pack is not needing external circuit also can normally use after being full of electricity.In hammer body, be provided with a mounting groove, secured core 10 is T-shaped structure, and its horizontal segment is screwed in the top of mounting groove, its vertical section is cylinder, periphery in secured core 10 vertical sections is wound with coil 7, and the two ends of this coil 7 are connected with inverter 6, forms loop.In hammer body 8, also offer stopper slot 10, the opening of this stopper slot 10 is arranged at one end of hammer body 8.Permanent magnet 13 is arranged in stopper slot 10, and one end of permanent magnet 13 faces secured core 10, and it can be attracted or repel in the time that secured core 10 is magnetic.Spring a12 is arranged in stopper slot 10 and between permanent magnet 13 and secured core 10, one end of spring a12 withstands on stopper slot 10 tops, and the other end withstands on permanent magnet 13.The other end of permanent magnet 13 is fixedly connected with leveling transmission body 20 by L-type cylinder connector 12, drives leveling transmission body 20 to vibrate in the time that permanent magnet 13 does the reciprocating motion of vertical direction.Upside in leveling transmission body is provided with multiple spring b19, and one end of spring b19 is fixed in leveling transmission body 20, and the other end withstands on hammer body, and it plays cushioning effect in the time of leveling transmission body 20 up-down vibration.Spring a12 can arrange hook respectively on stopper slot bottom and permanent magnet top, and one end of spring a12 hangs over stopper slot 10, and the other end hangs on permanent magnet 13.Spring b19 can arrange hook respectively on leveling transmission body 20 upper surfaces and hammer body 8, and spring b19 one end hangs over stopper slot 10 tops, and the other end hangs in leveling transmission body 20.The clip for limiting 22 that is circumferentially provided with inverted T shape structure along the lower end of hammer body 8 is provided with the draw-in groove agreeing with mutually with it on rubber-buffer, and rubber-buffer is arranged on hammer body 8 by buckle mode.Outside in leveling transmission body 20 is surrounded by one deck leveling head rubber cushion cover 21, and one end of this leveling head rubber cushion cover 21 contacts with rubber-buffer 14, plays cushioning effect in the time of vibration.
The direct current of rechargeable battery pack 5 is converted to alternating current by inverter 6, and supply with the coil 7 being wrapped on secured core 10.A frequency of alternating current is a sinusoidal cycles curve, therefore, the once transformation of both positive and negative polarity of alternating current in a frequency, after coil 7 energisings, the magnetic field that secured core produces also can convert Primary field direction in one-period.Because permanent magnet 13 pole orientation are fixed, therefore,, after coil 7 energising, secured core produces attraction to permanent magnet or the magnetic field of repulsion, permanent magnet is produced near or away from the motion of secured core, this athletic performance is that permanent magnet drives the reciprocal vibration of leveling transmission body.
Now taking permanent magnet near one end of secured core as the arctic, be that the South Pole is example away from one end of secured core.After coil 7 energisings, the magnetic field that it is the arctic that secured core 10 produces near one end of permanent magnet, secured core and permanent magnet produce repulsive interaction, and permanent magnet 13 drives leveling transmission body 20 to produce the motion away from secured core; Now, spring a12 and spring b19 are stretched; In the time that electric current both positive and negative polarity changes, the magnetic direction that secured core 10 produces also changes, its one end near permanent magnet is magnetic field, the South Pole, contrary with permanent magnet 13 magnetic poles, the motion that permanent magnet 13 drives leveling transmission body 20 to produce near secured core, now, contracting spring a12 and spring b19 are compressed at stopper slot 10.In frequency of alternating current, electric current both positive and negative polarity once changes, therefore, and permanent magnet 13 reciprocating motion once in a frequency period.This reciprocating motion of permanent magnet 13 makes to flatten transmission body 20 and leveling head rubber cushion cover 21 produces vibration, when use, by means of spirit level, can the ceramic wafer after wet combining be vibrated and be beaten, high-frequency automatic vibration can better make the air in ceramic wafer and cement sand bed outwards overflow, thereby reaches effect sturdy and leveling.
The vibration frequency of leveling transmission body 20 equals AC current frequency.Leveling transmission body 20 oscillation intensitys are directly proportional to alternating current flow valuve, and are directly proportional to permanent magnet 13 distances with secured core 10.Therefore leveling hammer oscillation intensity can be passed through distance between regulating winding supply and AC size of current and secured core 10 and permanent magnet 13, or secured core 10 exterior loop 7 winding turns regulate.
In order to prevent that too fast vibration frequency and excessively strong oscillation intensity from directly acting on ceramic wafer, cause the cracked of ceramic wafer, in leveling, transmission body 20 places are surrounded by leveling head rubber cushion cover 21, and between leveling transmission body 20 and hammer body 8, be provided with rubber-buffer 14, the cushioning effect while playing vibration.
In the present invention, only in one end of hammer body, rubber leveling head is set, the other end of hammer body is common tup 5, can use according to actual needs automatic rubber leveling head or manual common tup 5 to flatten ceramic wafer when use.
Finally it should be noted that, above embodiment is only in order to illustrate technical scheme of the present invention but not restriction technologies scheme, although applicant has been described in detail the present invention with reference to preferred embodiment, those of ordinary skill in the art is to be understood that, those are modified or are equal to replacement technical scheme of the present invention, and do not depart from aim and the scope of the technical program, all should be encompassed in the middle of claim scope of the present invention.
Claims (2)
1. ceramic wafer wet combining method mounting method, is characterized in that, comprises the steps:
A, select little, complete, the smooth ceramic wafer of aberration, adopt epobond epoxyn to stick on the back side of ceramic wafer one end of Z-type bond, every ceramic wafer is pasted 4 ~ 9 Z-type bonds; After epobond epoxyn is completely dry, ceramic wafer is immersed in the water, fully soak and soak, take out stand-by;
B, the rough part of body of wall basic unit is picked flat or adopted the cement mortar of 1:3 to carry out levelling, and it is fully wetting to water; Adopt ink fountain in body of wall basic unit, to eject vertical and horizontal control line;
C, get the ceramic wafer in step a, cement sand bed is evenly spread at the back side at ceramic wafer, the thickness of cement sand bed should still can wrap Z-type bond after ceramic wafer installs, by the ceramic wafer paving from bottom to top that is coated with cement sand bed in body of wall basic unit, limit paving ceramic wafer, limit adopts electronic leveling hammer to flatten;
D, by after a complete ceramic wafer paving whole face wall body, adopt the cement paste identical with ceramic wafer color to carry out jointing processing;
Wherein, described electronic leveling hammer comprises handle, hammer body, rechargeable battery pack, inverter, external connection socket, secured core, permanent magnet, rubber-buffer, leveling transmission body, leveling head rubber cushion cover; One end of described handle is fixedly connected with hammer body, and described rechargeable battery pack, inverter, external connection socket are arranged in handle, and inverter is electrically connected with rechargeable battery pack, and external connection socket is electrically connected with rechargeable battery pack; In described hammer body, be provided with a mounting groove, secured core is fixed in mounting groove, is wound with coil in the periphery of secured core, and the two ends of this coil are electrically connected with inverter, forms loop; In hammer body, be also provided with stopper slot, described permanent magnet is arranged in stopper slot, between the top of permanent magnet and stopper slot top, is provided with spring a, and bottom is fixedly connected with leveling transmission body; Between one side of described leveling transmission body and hammer body end, be also provided with multiple spring b, be enclosed with leveling head rubber cushion cover at the opposite side of leveling transmission body; Circumferentially be provided with clip for limiting along hammer body end, described rubber-buffer and clip for limiting are clasped.
2. ceramic wafer wet combining method mounting method according to claim 1, is characterized in that, in step a, the contact area of described Z-type bond and ceramic wafer is greater than 30mm*30mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410439492.4A CN104179320B (en) | 2014-09-01 | 2014-09-01 | Ceramic wafer wet combining method installation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410439492.4A CN104179320B (en) | 2014-09-01 | 2014-09-01 | Ceramic wafer wet combining method installation method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104179320A true CN104179320A (en) | 2014-12-03 |
| CN104179320B CN104179320B (en) | 2016-05-25 |
Family
ID=51960637
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410439492.4A Expired - Fee Related CN104179320B (en) | 2014-09-01 | 2014-09-01 | Ceramic wafer wet combining method installation method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104179320B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105569304A (en) * | 2015-12-24 | 2016-05-11 | 曹颖 | Sand-applying and wet-paving process for stone material |
| CN111335579A (en) * | 2020-03-20 | 2020-06-26 | 赵鹏付 | Ceramic plate flue installation process and application thereof |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003043835A1 (en) * | 2001-11-20 | 2003-05-30 | Ceramicas Granell, S.L. | Base for fixing interchangeable ceramic panels |
| KR20040085084A (en) * | 2004-05-19 | 2004-10-07 | 이성희 | Finishing material for building using natural stone |
| KR100541669B1 (en) * | 2005-08-03 | 2006-01-10 | 주식회사 진솔엔지니어링건축사사무소 | Wet tile construction method for building |
| CN201427301Y (en) * | 2009-06-29 | 2010-03-24 | 王胜余 | Multi-purpose electric tool hammer |
| CN102383562A (en) * | 2011-09-19 | 2012-03-21 | 山东宁建建设集团有限公司 | Culture stone outer wall inlay and adhering process and anti-leakage treatment method |
| CN202483152U (en) * | 2012-02-17 | 2012-10-10 | 熊国辉 | Electric rubber hammer |
| CN202882303U (en) * | 2012-11-16 | 2013-04-17 | 成都市第六建筑工程公司 | Cement decorative board wall |
| CN203347160U (en) * | 2013-07-22 | 2013-12-18 | 苏州苏明装饰股份有限公司 | Wet sticking structure for vitrified brick |
| CN103556808A (en) * | 2013-11-01 | 2014-02-05 | 熊国辉 | Electric rubber hammer |
-
2014
- 2014-09-01 CN CN201410439492.4A patent/CN104179320B/en not_active Expired - Fee Related
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003043835A1 (en) * | 2001-11-20 | 2003-05-30 | Ceramicas Granell, S.L. | Base for fixing interchangeable ceramic panels |
| KR20040085084A (en) * | 2004-05-19 | 2004-10-07 | 이성희 | Finishing material for building using natural stone |
| KR100541669B1 (en) * | 2005-08-03 | 2006-01-10 | 주식회사 진솔엔지니어링건축사사무소 | Wet tile construction method for building |
| CN201427301Y (en) * | 2009-06-29 | 2010-03-24 | 王胜余 | Multi-purpose electric tool hammer |
| CN102383562A (en) * | 2011-09-19 | 2012-03-21 | 山东宁建建设集团有限公司 | Culture stone outer wall inlay and adhering process and anti-leakage treatment method |
| CN202483152U (en) * | 2012-02-17 | 2012-10-10 | 熊国辉 | Electric rubber hammer |
| CN202882303U (en) * | 2012-11-16 | 2013-04-17 | 成都市第六建筑工程公司 | Cement decorative board wall |
| CN203347160U (en) * | 2013-07-22 | 2013-12-18 | 苏州苏明装饰股份有限公司 | Wet sticking structure for vitrified brick |
| CN103556808A (en) * | 2013-11-01 | 2014-02-05 | 熊国辉 | Electric rubber hammer |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105569304A (en) * | 2015-12-24 | 2016-05-11 | 曹颖 | Sand-applying and wet-paving process for stone material |
| CN105569304B (en) * | 2015-12-24 | 2018-01-09 | 曹颖 | A kind of stone material planting sand wet combining technique |
| CN111335579A (en) * | 2020-03-20 | 2020-06-26 | 赵鹏付 | Ceramic plate flue installation process and application thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104179320B (en) | 2016-05-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104179320B (en) | Ceramic wafer wet combining method installation method | |
| CN106655887B (en) | A kind of rubber support structure and its electricity generation system based on piezoelectric effect | |
| WO2011096660A3 (en) | Tapping applicator | |
| KR20120063182A (en) | Generater apparatus using film type of piezoelectric element and solarcell | |
| CN105957707A (en) | Manufacturing method of Halbach magnetic array and magnetizing device used by manufacturing method | |
| CN204081414U (en) | Electronic leveling hammer | |
| CN104153554B (en) | Electronic sheet material leveling hammer | |
| CN212401973U (en) | Waterproof type portable power source strorage device | |
| CN209851224U (en) | Magnetic force installation device | |
| CN104658785B (en) | Libra formula magnetic pole brusque-switch equipment | |
| CN110080501B (en) | A whitewash device for colorful imitative stone coating of environmental protection type | |
| CN211313250U (en) | Painting device for environment-friendly colorful stone-like coating | |
| CN207701149U (en) | A kind of tunnel double-lining trolley attached vibrator layering control device | |
| CN209030121U (en) | Compound piezoelectric generating device | |
| CN109252626A (en) | The construction techniques of inner wall surface | |
| CN209641642U (en) | A kind of pick-off unit and wafer case pick-off unit | |
| CN210018273U (en) | Green paint brush | |
| CN209577287U (en) | A kind of ultrasonic transduction device | |
| CN202095086U (en) | Electric loudspeaker | |
| CN207433828U (en) | A kind of unmanned plane Special shock absorber | |
| CN217759770U (en) | Ceramic tile convenient to aggregate erection | |
| CN204081366U (en) | A kind of ceramic wafer wet combining method mounting structure | |
| CN204448484U (en) | Concrete boat bulkhead vibrating device | |
| CN205657484U (en) | Novel music mr uses microphone support | |
| CN201523265U (en) | Device for short distance wireless power transmission |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160525 Termination date: 20180901 |