CN104170043B - For having the chiller of the switch strengthening busbar joint cooling - Google Patents
For having the chiller of the switch strengthening busbar joint cooling Download PDFInfo
- Publication number
- CN104170043B CN104170043B CN201380012342.9A CN201380012342A CN104170043B CN 104170043 B CN104170043 B CN 104170043B CN 201380012342 A CN201380012342 A CN 201380012342A CN 104170043 B CN104170043 B CN 104170043B
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- CN
- China
- Prior art keywords
- vaporizer
- main contact
- heat
- busbar joint
- condenser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H9/00—Details of switching devices, not covered by groups H01H1/00 - H01H7/00
- H01H9/52—Cooling of switch parts
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
- H02G5/00—Installations of bus-bars
- H02G5/10—Cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H9/00—Details of switching devices, not covered by groups H01H1/00 - H01H7/00
- H01H9/52—Cooling of switch parts
- H01H2009/523—Cooling of switch parts by using heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H9/00—Details of switching devices, not covered by groups H01H1/00 - H01H7/00
- H01H9/52—Cooling of switch parts
- H01H2009/526—Cooling of switch parts of the high voltage switches
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Installation Of Bus-Bars (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Providing a kind of chiller for switch, this switch has at least one main contact that the terminal with chopper is connected, and busbar joint is connected to main contact.Chiller includes the vaporizer relevant to main contact.Condenser is positioned at height more higher than vaporizer.Heat pipe structure is connected with making vaporizer and condenser fluid.Hot transfer structure couples with busbar joint so that heat removes from described busbar joint.Working fluid is to be heated to steam condition in vaporizer, and steam is sent to condenser and makes the working fluid of condensation return to vaporizer passively to cool down at least one main contact by heat pipe structure.
Description
Technical field
The present invention relates to switch disconnector, and more particularly, it relates to strengthen along electric current
The chiller of other focus cooling in path.
Background technology
Switch structure has the electric current raised according to the heat exceeding surrounding room temperature and limits.Logical
The most desirably the maximum temperature of the hottest point on switch main bus is restricted to 105 DEG C (rise
The ambient temperature of the high hypothesis more than 40 DEG C 65 DEG C), as passed through standard
Indicated by IEEE37.20.2.Owing to producing heat, common centre and high-voltage metal bag
Cover switching device and there is the maximum continuous current rated value of about 3000A.It is preferably this electricity
Stream rated value increases to about 4000A.
Owing to these switches must be arc resistant fault, therefore make by switch compartment interior
It is extremely difficult that the heat loss that rated current produces dissipates.At present by from current path to
Encapsulate and then arrive radiation and the convection current dissipation heat loss of surrounding.This heat transfer process
It is inefficient, and therefore switch product is limited by heat commonly by its rated current
System.
Accordingly, it is desirable to provide for switch chiller, its cool down main contact and also
Reduce the temperature along the current path including busbar joint to increase.
Summary of the invention
It is an object of the invention to realize above-mentioned needs.According to the principle of the present invention, by providing
For having at least one main contact of the terminal constructing and being arranged connected to chopper
The chiller of switch achieve this purpose, busbar joint is connected to main contact.Cooling dress
Put and include structure and be arranged as the vaporizer relevant to main contact.Condenser is positioned at than steaming
Send out at the higher height of device.Heat pipe structure is connected with making vaporizer and condenser fluid.Heat passes
Structure is sent to couple with busbar joint so that heat removes from busbar joint.Working fluid is in evaporation
To be heated to steam condition in device, heat pipe structure constructs and is arranged as being sent to steam
Condenser and make the working fluid of condensation return to vaporizer passively in case cooling at least
One main contact.
Another aspect according to embodiment, it is provided that for the hot transfer structure of switch,
This switch have structure and be arranged connected to breaker terminals one or more masters touch
Head, and busbar joint is connected to main contact.Each busbar joint includes being arranged in parallel
At least one pair of first bus is to limit space therebetween.Hot transfer structure includes: multiple fins,
And make fin be in multiple heat radiations of spaced relationship through described fin to engage fin
Device.Hot transfer structure structure and be arranged as being contained in the first bus between space in,
Making radiator along the first bus distribution heat, fin passes through free convection by heat transmission
To surrounding air.
Another aspect according to embodiment, it is provided that the method for cooling switch.This switch
Have and be structured and arranged at least one main contact that the terminal with chopper is connected, Yi Jilian
Receive the busbar joint of main contact.The method makes vaporizer relevant to main contact.Condenser is fixed
Position is at height more higher than vaporizer.Heat pipe structure is with making vaporizer and condenser fluid even
Connect, and working fluid is arranged in vaporizer.Hot transfer structure is connected to mother by the method
Wire terminal.Heat is sent to working fluid to cause working fluid vaporizer from main contact
Evaporation, the steam of evaporation is sent to condenser via fluid conduit structure.Heat passes via heat
Structure is sent to remove from busbar joint.The working fluid condensed within the condenser is via fluid conduit systems
Structure returns to vaporizer passively.
When the accompanying drawing of the part being completely formed this description with reference to it considers following detailed
When describing with claims, other purpose of the present invention, feature and feature, Yi Jicao
The method made and the function of related elements of structure, the combination of parts and manufacture economy will
Become apparent.
Accompanying drawing explanation
By the detailed description below of the preferred embodiment of the present invention, in conjunction with the most identical
The accompanying drawing of reference instruction same parts, it will be more fully understood that the present invention.
Fig. 1 is to illustrate that the evaporative cooled with heat pipe structure form installed in the switch fills
The view put.
Fig. 2 is the view of the vertical bus being connected to the horizontal bus at busbar joint, according to
The hot transfer structure of embodiment is shown to be inserted in the space between horizontal bus.
Fig. 3 is that the cross section of the hot transfer structure of the Fig. 2 illustrating and being connected to busbar joint regards
Figure.
Fig. 4 is the hot transfer structure as the connection between busbar joint and heat pipe structure
View.
Fig. 5 is the hot transfer structure as the connection between busbar joint and heat pipe structure
Another embodiment.
Fig. 6 is the hot transfer structure as the connection between busbar joint and heat pipe structure
Another embodiment.
Fig. 7 is to be sent to dissipating of vaporizer at main contact as by heat from busbar joint
The view of another embodiment of the hot transfer structure of hot device.
Detailed description of the invention
With reference to Fig. 1, generally with 10 instructions with the chiller of the form of hot-pipe system,
Being shown as owned together, the entitled of CO-PENDING " has evaporative cooled device
Switch " the U.S. Patent application acting on behalf of Reference Number US 11033-31-553 disclosed in,
Its content comprises in this manual by way of reference at this.Hot-pipe system 10 is used for
The coldest not destroying in the case of the safety requirements certainly accommodating compartment of switch 14
But main contact 12.System 10 includes the vaporizer 15 relevant to each main contact 12 and connection
The heat pipe structure 16 being connected between vaporizer 15 and condenser 17.Condenser 17 is positioned at
At height more higher than vaporizer 15.The heat of main contact 12 causes in vaporizer 15
Working fluid evaporation and steam are directed into condenser 17.Due to the heat friendship with surrounding air
Changing, steam condensation is returned to liquid and gaseous working fluid via heat pipe by condenser 17
Structure 16 returns to vaporizer 15 to complete cooling circulation.This evaporative cooled reduces
Heat at main heating source and allow higher rated current.But, due to the electricity increased
Stream flowing, the heat loss along current path with other electricity parts becomes by thermal limit, especially
It is generally with the busbar joint being connected to main contact 12 or the cable connector of 18 instructions
Place.
With reference to Fig. 2, for cooling down the chiller of the extra focus at busbar joint 18
First embodiment adds the heat transmission of surrounding air.Thus, chiller is to arrange
In space 22 between a pair first horizontal bus 24 being arranged in parallel generally with 20
The hot transfer structure of instruction.Horizontal bus 24 is connected to second, vertical bus 26 to be to limit
Busbar joint 18.Vertical bus 26 electrically connects with main contact 12 in a conventional manner.Therefore,
Hot transfer structure 20 is used together to reduce at busbar joint 18 with the hot-pipe system of Fig. 1
Heat.
With reference to Fig. 2 and Fig. 3, hot transfer structure 20 include multiple through multiple fins 30 also
And multiple radiators 28 that multiple fins 30 are bonded together.Fin 30 be metal also
And be the relation separated.Fin 30 is substantially opposite radiator 28 and laterally arranges.As
Shown in Fig. 3, each radiator 28 is metal wire, heat pipe or have with vertically female
Other the hot transmission member of the end 32 that line 26 engages.Radiator 28 reduces at bus
Temperature peak at joint 18, and distribute heat along bus 24,26.Fin 30
The heat being added surrounding air by free convection transmits (arrow H).Hereby it is achieved that
The passive cooling of busbar joint 18.But, if followed by such as fans force air
Ring, then heat removes it is possible to become actively.
Owing to radiator 28 and fin 30 are metals and contact with bus 24,26,
Therefore they are positioned at and the identical voltage potential of bus 24,26.If hot transfer structure 20
The most not by bus 24,26 around, then the tip at fin 30 is formed high electric field.
Utilizing the geometry of hot transfer structure 20, bus 24,26 around provides shielding effect
Fruit is to reduce electric field.
With reference to Fig. 4-Fig. 6, it is shown that for cooling down the hot transfer structure of busbar joint 18
Second embodiment.Second embodiment includes that the heat dissipated by Alma Mater's joint 18 guides
To the hot-pipe system 10 (Fig. 1) for cooling down main contact 12.This second embodiment can
To be fabricated to there is rounded edges, and/or cover with insulating plastic layer (such as, epoxy resin).
Furthermore, it is possible to improve its heat conductivity by short heat pipe being embedded the inside of this structure.
With reference to Fig. 4, it is connected in mother with the hot transfer structure of the form of metal connecting structure 36
Between wire terminal 18 (or its smooth bus 24,26) and circular heat tubular construction 16.
Vaporizer 15 UNICOM that the end 38 of heat pipe structure 16 is relevant to same main contact 12.Heat pipe
End 40 and condenser 17 (Fig. 1) UNICOM of structure 16.Thus, at busbar joint 18
The focus at the place auxiliary evaporator acting on heat pipe structure 16.This method provide minimum
Thermal resistance.But, between busbar joint 18 and heat pipe structure 16, there is no electric insulation.Thus,
The electrically insulative portion 42 of heat pipe structure 16 is arranged between attachment structure 36 and condenser 17.
Until busbar joint 18, heat pipe structure 16 can connect up closely along bus, and by
The most directly contact in being respectively provided with identical voltage potential.Even can by associating bus with
Heat pipe pipeline is to simplify this system further.
As it is used herein, " heat pipe structure " 16 generally means that vaporizer 15 is with cold
Single conduit tube component (such as, flexible pipe, pipe, pipeline etc.) between condenser 17 or
Carrying connects with being in the vacuum-tight seal of the working fluid of condensing state or evaporating state
The network of guide-tube structure.Such as, and as shown in Figure 6, heat pipe structure 16 is permissible
Make the steam can be via master including the supervisor 19 of the liquid return pipe 21 wherein with separation
Tube passage can return to vaporizer 15 via liquid return pipe by condenser and liquid.
With reference to Fig. 5, it is shown that with another of the hot transfer structure of the form of attachment structure 36 '
Individual embodiment.Busbar joint 18 (or its bus 24 or 26) and heat pipe structure 16 it
Between attachment structure 36 ' be made up of the electrically insulating material with good thermal conductance.In this case,
The insulated part 42 ' of heat pipe structure 16 can be positioned just at after main contact (Fig. 1),
And this heat pipe structure 16 may be located at earth potential at this above point.Can be by providing such as
Electric insulation attachment structure 36 at Fig. 6 " shown in metal-cored 37 improve electric insulations connect
The heat conductivity of structure 36 '.Spiral shell can be passed through in metal-cored the 37 of the material of such as aluminum or copper
Nail 39 is connected to bus 24 or 26.Epoxy resin layer 41 essentially around metal-cored 37 with
Guarantee the dielectric safety of peripheral parts.Epoxy resin fixture 43 can be by using screw 39
Heat pipe structure 16 is clamped to epoxy resin layer 41.Metal-cored 37 can be single, solid
Component or multiple little heat pipe or radiator can be included.Again, Fig. 5's and Fig. 6
The heating of embodiment median generatrix joint is used as auxiliary evaporator.
With reference to Fig. 7, it is shown that for cooling down another of the hot transfer structure of busbar joint 18
Individual embodiment.By be arranged in parallel vertical bus 26 to parallel, horizontal bus 24
Between to the form of radiator 429 (such as, one or several parallel heat pipe)
Hot transfer structure guides the thermic load from busbar joint 18, down to main contact 12, arrives
Vaporizer 15 and to working fluid 44.Then from main contact 12 and busbar joint 18
Heat be sent to condenser in passive manner via the working fluid in heat pipe structure 16
17.Radiator is preferably metal or other conduction of heat drawing heat from bus 24,26
Property component.
In the embodiment of figure 1, only focus at main contact 26 is cold by heat pipe 16
But.The heat dissipated (at such as busbar joint 18) at other point along current path
Amount only by radiation, convection current or can draw away along the conduction of bus 24,26.
Owing to the cooling of main contact allows higher rated current, therefore this is no longer abundant, and such as
Already mentioned above, other focus occurs.The embodiment of Fig. 4-Fig. 7 cools down master via being used for
Heat is removed by the heat pipe structure 16 of contact 26 from busbar joint 18, and the enforcement of Fig. 2
Mode provides the cooling of the busbar joint 18 by convection current, to allow the increase of switch 14
Rated current.
The cooling system of this embodiment only can carry out little change to switch 14 and tie
Close.By the embodiment of Fig. 2, multiple hot transfer structures 20 have identical structure with
It it is cost-effective.By the embodiment of Fig. 4-Fig. 7, the bottom of bus 24,26
Can contact with heat pipe structure 16 and thus be cooled down efficiently.This allows to reduce bus
Size and save material cost.Even can be further with heat pipe structure by associating bus
Simplify this cooling system.This cooling means is also applied to other extra focus any.
In order to describe the principle of structure and function of the present invention purpose it has been illustrated and described that on
State preferred implementation, and describe and utilize the method for preferred implementation and the most inclined
Can be changed in the case of this principle.Therefore, the present invention includes being included in power below
Whole amendments in the spirit that profit requires.
Claims (17)
1., for a chiller for switch, described switch has and is structured and arranged to disconnected
At least one main contact that the terminal of road device connects, busbar joint is connected to described main contact,
Described chiller includes:
Vaporizer, described vaporizer is structured and arranged as relevant to described main contact,
Condenser, described condenser is positioned at height more higher than described vaporizer,
Heat pipe structure, described heat pipe structure fluidly connects described vaporizer and described condenser,
Hot transfer structure, described hot transfer structure couples with described busbar joint so that heat is from institute
State busbar joint to remove, and
Working fluid in described vaporizer, in order to be heated to steam condition, described heat pipe
Structure is structured and arranged as described steam being sent to described condenser and making condensation
Working fluid returns to described vaporizer passively to cool down at least one main contact described；
The hottest transfer structure includes:
Multiple fins, and
Multiple radiators, the plurality of radiator passes described fin to engage described wing
Sheet makes described fin be in spaced relationship,
Wherein said hot transfer structure is structured and arranged as being contained in described busbar joint
In space between a pair first buses so that described radiator divides along described first bus
Joining heat, described fin transfers heat into surrounding air by free convection.
Chiller the most according to claim 1, wherein said fin be metal also
And substantially transversely arrange relative to described radiator.
Chiller the most according to claim 1, combines with described busbar joint, the
One bus is to being connected to the second bus, and described second bus is structured and arranged as touching with main
Head connects.
Chiller the most according to claim 3, the end of the most each radiator
Couple with at least one in the second bus.
Chiller the most according to claim 4, the most each radiator is metal wire
Or heat pipe.
6., for a chiller for switch, described switch has and is structured and arranged to disconnected
At least one main contact that the terminal of road device connects, busbar joint is connected to described main contact,
Described chiller includes:
Vaporizer, described vaporizer is structured and arranged as relevant to described main contact,
Condenser, described condenser is positioned at height more higher than described vaporizer,
Heat pipe structure, described heat pipe structure fluidly connects described vaporizer and described condenser,
Hot transfer structure, described hot transfer structure couples with described busbar joint so that heat is from institute
State busbar joint to remove, and
Working fluid in described vaporizer, in order to be heated to steam condition, described heat pipe
Structure is structured and arranged as described steam being sent to described condenser and making condensation
Working fluid returns to described vaporizer passively to cool down at least one main contact described；
Wherein said hot transfer structure includes described busbar joint is connected to described heat pipe structure
The metal connecting structure of a part make the heat from described main contact Yu described busbar joint
Amount is sent to described condenser by described heat pipe structure.
7., for a chiller for switch, described switch has and is structured and arranged to disconnected
At least one main contact that the terminal of road device connects, busbar joint is connected to described main contact,
Described chiller includes:
Vaporizer, described vaporizer is structured and arranged as relevant to described main contact,
Condenser, described condenser is positioned at height more higher than described vaporizer,
Heat pipe structure, described heat pipe structure fluidly connects described vaporizer and described condenser,
Hot transfer structure, described hot transfer structure couples with described busbar joint so that heat is from institute
State busbar joint to remove, and
Working fluid in described vaporizer, in order to be heated to steam condition, described heat pipe
Structure is structured and arranged as described steam being sent to described condenser and making condensation
Working fluid returns to described vaporizer passively to cool down at least one main contact described；
Wherein said hot transfer structure includes described busbar joint is connected to described heat pipe structure
Electric insulation and the heat conductivity attachment structure of a part so that from described main contact and institute
The heat stating busbar joint is sent to described condenser by described heat pipe structure.
Chiller the most according to claim 7, wherein said heat conductivity connects knot
The heat conductivity part of structure includes metal-cored.
9., for a chiller for switch, described switch has and is structured and arranged to disconnected
At least one main contact that the terminal of road device connects, busbar joint is connected to described main contact,
Described chiller includes:
Vaporizer, described vaporizer is structured and arranged as relevant to described main contact,
Condenser, described condenser is positioned at height more higher than described vaporizer,
Heat pipe structure, described heat pipe structure fluidly connects described vaporizer and described condenser,
Hot transfer structure, described hot transfer structure couples with described busbar joint so that heat is from institute
State busbar joint to remove, and
Working fluid in described vaporizer, in order to be heated to steam condition, described heat pipe
Structure is structured and arranged as described steam being sent to described condenser and making condensation
Working fluid returns to described vaporizer passively to cool down at least one main contact described；
Wherein, described busbar joint is connected to described main contact, described mother by least one pair of bus
Line limits space betwixt, and wherein said hot transfer structure is included between described bus
Space in and extend at least one heat conductivity of described main contact from described busbar joint
Radiator.
Chiller the most according to claim 9, at least one radiator wherein said
Be arranged on the bus of described busbar joint between.
11. 1 kinds of hot transfer structures for switch, described switch has structure and is arranged as
It is connected to one or more main contacts of the terminal of chopper, and busbar joint is connected to institute
State main contact, each busbar joint include at least one pair of first bus of being arranged in parallel with
Limiting space therebetween, described hot transfer structure includes:
Multiple fins, and
Multiple radiators, the plurality of radiator makes through described fin to engage described fin
Described fin is in the relation at interval,
Wherein said hot transfer structure is structured and arranged as being contained in described first bus pair
Between space in so that described radiator along described first bus distribution heat, described
Fin transfers heat into surrounding air by free convection.
12. structures according to claim 11, wherein said fin be metal and
Substantially transversely arrange relative to described radiator.
13. structures according to claim 11, combine with described busbar joint, described
First bus is to being connected to the second bus, and described second bus is structured and arranged as with main
Contact connects.
14. structures according to claim 13, the end of the most each radiator with
Second bus couples.
15. structures according to claim 14, the most each radiator be metal wire or
Heat pipe.
16. 1 kinds of methods cooling down switch, described switch has and is structured and arranged as with disconnected
At least one main contact that the terminal of road device connects, busbar joint is connected to described main contact,
Said method comprising the steps of:
Make vaporizer relevant to described main contact,
There is provided and be positioned at the condenser at than described vaporizer more high altitude,
The heat pipe structure being connected with making described vaporizer and described condenser fluid is provided, and
Described vaporizer provides working fluid,
Hot transfer structure is connected to described busbar joint,
Heat is sent to described working fluid to cause described working fluid from described main contact
Evaporating in described vaporizer, the steam of described evaporation is via described fluid conduit structure transmission
To described condenser,
Via described hot transfer structure, heat is removed from described busbar joint, and
Make the described working fluid condensed in described condenser via described fluid conduit structure
Return to described vaporizer passively；
Wherein said hot transfer structure includes: multiple fins and through described fin with engage
Described fin makes described fin be in multiple radiators of spaced relationship, the step of described connection
Rapid space between a pair bus of described busbar joint provides described hot transfer structure,
The step removing heat described in and includes utilizing described radiator along described bus distribution heat
Amount, described fin transfers heat into surrounding air by free convection.
17. 1 kinds of methods cooling down switch, described switch has and is structured and arranged as with disconnected
At least one main contact that the terminal of road device connects, busbar joint is connected to described main contact,
Said method comprising the steps of:
Make vaporizer relevant to described main contact,
There is provided and be positioned at the condenser at than described vaporizer more high altitude,
The heat pipe structure being connected with making described vaporizer and described condenser fluid is provided, and
Described vaporizer provides working fluid,
Hot transfer structure is connected to described busbar joint,
Heat is sent to described working fluid to cause described working fluid from described main contact
Evaporating in described vaporizer, the steam of described evaporation is via described fluid conduit structure transmission
To described condenser,
Via described hot transfer structure, heat is removed from described busbar joint, and
Make the described working fluid condensed in described condenser via described fluid conduit structure
Return to described vaporizer passively；
The step of the described hot transfer structure of wherein said connection provides and is connected by described busbar joint
To the heat conductivity attachment structure of a part for described heat pipe structure, and described in remove heat
Step include transferring heat into described heat pipe structure via described attachment structure.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/426,651 US8717746B2 (en) | 2012-03-22 | 2012-03-22 | Cooling apparatus for switchgear with enhanced busbar joint cooling |
| US13/426,651 | 2012-03-22 | ||
| PCT/EP2013/055997 WO2013139942A1 (en) | 2012-03-22 | 2013-03-21 | Cooling apparatus for switchgear with enhanced busbar joint cooling |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104170043A CN104170043A (en) | 2014-11-26 |
| CN104170043B true CN104170043B (en) | 2016-11-09 |
Family
ID=47915234
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201380012342.9A Active CN104170043B (en) | 2012-03-22 | 2013-03-21 | For having the chiller of the switch strengthening busbar joint cooling |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US8717746B2 (en) |
| EP (1) | EP2828873B1 (en) |
| CN (1) | CN104170043B (en) |
| CA (1) | CA2867671C (en) |
| WO (1) | WO2013139942A1 (en) |
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| US20150124381A1 (en) * | 2013-11-05 | 2015-05-07 | Chia Hsing Electrical Co., Ltd. | Switchboard copper busbar heat dissipating device |
| JP6875371B2 (en) | 2015-07-22 | 2021-05-26 | ジーエヌティー バイオテック アンド メディカルズ コーポレイション | PH sensitive linker for delivering therapeutic agents |
| DE112015006736T5 (en) | 2015-07-29 | 2018-04-05 | General Electric Company | An electrical connection device comprising a heat transfer device and method for producing the same |
| GB2542353A (en) * | 2015-09-15 | 2017-03-22 | Alstom Technology Ltd | A busbar assembly |
| CN106992446A (en) * | 2016-01-21 | 2017-07-28 | 浙江工业职业技术学院 | A kind of dustless falling temperature technique of controller switching equipment |
| US10153629B2 (en) * | 2016-07-21 | 2018-12-11 | Abb Schweiz Ag | Thermal cooling interface for electrical joints |
| WO2018150634A1 (en) * | 2017-02-20 | 2018-08-23 | 三菱電機株式会社 | Circuit breaker |
| US10270231B2 (en) * | 2017-06-20 | 2019-04-23 | Hamilton Sundstrand Corporation | Integrated contactor mounting post |
| US12107032B2 (en) | 2018-12-19 | 2024-10-01 | Abb Schweiz Ag | Cooling of power semiconductors |
| EP3742461B1 (en) | 2019-05-20 | 2022-02-23 | ABB Schweiz AG | Cooling apparatus for a medium voltage or high voltage switchgear |
| EP3889985A1 (en) | 2020-04-03 | 2021-10-06 | ABB Schweiz AG | Cooling apparatus for a medium voltage or high voltage switchgear |
| CN116321911A (en) * | 2021-12-03 | 2023-06-23 | 泰连服务有限公司 | Coolant system for a busbar assembly |
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| DE102007023980B3 (en) | 2007-05-23 | 2008-09-25 | Rittal Gmbh & Co. Kg | Power busbar assembly |
| EP2277365B1 (en) * | 2008-05-16 | 2011-11-02 | Parker-Hannifin Corporation | Modular high-power drive stack cooled with vaporizable dielectric fluid |
| IT1395697B1 (en) * | 2009-05-28 | 2012-10-19 | Abb Spa | CURRENT TRANSFORMER, PROTECTIVE DEVICE INCLUDING SUCH TRANSFORMER, AND RELATIVE SWITCH |
| IT1395698B1 (en) * | 2009-05-28 | 2012-10-19 | Abb Spa | COOLING DEVICE FOR A SWITCH, AND SWITCH INCLUDING THIS DEVICE. |
| ATE534175T1 (en) | 2009-07-27 | 2011-12-15 | Abb Research Ltd | POWER SWITCHGEAR |
| US8379374B2 (en) * | 2010-07-16 | 2013-02-19 | Rockwell Automation Technologies, Inc. | Bus to bus power interconnect |
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2012
- 2012-03-22 US US13/426,651 patent/US8717746B2/en active Active
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2013
- 2013-03-21 CN CN201380012342.9A patent/CN104170043B/en active Active
- 2013-03-21 WO PCT/EP2013/055997 patent/WO2013139942A1/en active Application Filing
- 2013-03-21 EP EP13711385.8A patent/EP2828873B1/en active Active
- 2013-03-21 CA CA2867671A patent/CA2867671C/en active Active
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| GB1390908A (en) * | 1971-01-30 | 1975-04-16 | Reyrolle Parsons Ltd | Electrical switchgear |
| US4005297A (en) * | 1972-10-18 | 1977-01-25 | Westinghouse Electric Corporation | Vacuum-type circuit interrupters having heat-dissipating devices associated with the contact structures thereof |
| DE3941388A1 (en) * | 1989-12-15 | 1991-06-20 | Sachsenwerk Ag | Active electric switch - has contact pin connected to cooler to ward off heat from operating current |
| CN101901725A (en) * | 2009-05-28 | 2010-12-01 | Abb公司 | Heatpipe for terminal of circuit breaker |
Also Published As
| Publication number | Publication date |
|---|---|
| US20130250490A1 (en) | 2013-09-26 |
| EP2828873A1 (en) | 2015-01-28 |
| CA2867671C (en) | 2019-06-18 |
| CA2867671A1 (en) | 2013-09-26 |
| CN104170043A (en) | 2014-11-26 |
| WO2013139942A1 (en) | 2013-09-26 |
| US8717746B2 (en) | 2014-05-06 |
| EP2828873B1 (en) | 2017-05-03 |
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