CN104170021B - Conductive composition and the circuit substrate that conducting film is formed with by it - Google Patents

Conductive composition and the circuit substrate that conducting film is formed with by it Download PDF

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CN104170021B
CN104170021B CN201380014122.XA CN201380014122A CN104170021B CN 104170021 B CN104170021 B CN 104170021B CN 201380014122 A CN201380014122 A CN 201380014122A CN 104170021 B CN104170021 B CN 104170021B
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conductive composition
circuit substrate
film
conductive
light
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CN104170021A (en
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福岛和信
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Taiyo Holdings Co Ltd
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Taiyo Holdings Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D201/00—Coating compositions based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/61—Additives non-macromolecular inorganic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0806—Silver
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/05—Alcohols; Metal alcoholates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/07—Aldehydes; Ketones
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0514—Photodevelopable thick film, e.g. conductive or insulating paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Polymers & Plastics (AREA)
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  • Chemical Kinetics & Catalysis (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Manufacturing & Machinery (AREA)
  • Paints Or Removers (AREA)
  • Non-Insulated Conductors (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

The present invention provides the conductive composition for forming the conducting film with good electrical by new light calcining technology, and by the conductive composition, productivity ratio is good and is cost effectively formed the circuit substrate of conductor circuit.A kind of conductive composition, it is characterised in that its be for calcined by the light irradiation, conductive composition containing electrically conductive microparticle in a solvent, wherein, the conductive composition contains photoreaction initiator or light acid producing agent.In preferred embodiment, said conductive composition also contains dispersant, in addition, aforementioned solvents are organic solvent, water or their mixture.By using flash lamp etc. to be coated with said conductive composition and drying and the film that obtains carries out light irradiation, be formed with the circuit substrate of conductor circuit so as to be made through the calcining of said conductive composition.

Description

Conductive composition and the circuit substrate that conducting film is formed with by it
Technical field
The circuit substrate of conducting film is formed with the present invention relates to conductive composition and by it, more specifically, is related to Conductor circuit pattern for printed circuit board (PCB), it is formed at the front substrate of plasma display, leading on back substrate Conductive composition that the formation of body circuit pattern etc. has, being calcined by using the light irradiation of flash lamp.
Background technology
All the time, thermohardening type conductive resin composition on film substrate, glass substrate etc. by being coated with or printing Brush and make its heat cure, so as to be widely used in the circuit pattern of the electrode of resistive touch panel, printed circuit board (PCB) etc. Formed.In addition, for the formation of the conductive pattern in plasma display, fluorescent display tube, electronic component etc., generally making Formed with the conductive paste containing extremely large amount of metal powder or glass powder, by silk screen print method to carry out pattern.
However, it is necessary to heating under high temperature, calcining in this method, therefore there is substrate and be defined in and be not affected by high temperatures Material shortcoming.For example, cellulose (paper), polyethylene terephthalate (PET), polyester and other many plastics etc. Cost is lower or substrate of flexibility can not be resistant to these temperature mostly.Equally, other compositions on the substrate such as organic semiconductor Also decompose at high temperature sometimes.
As the method for solving these problems, the technology of so-called light calcining is developed in recent years, and is attracted attention.For example, Patent Document 1 discloses following method：The dispersion of nano particle at least containing particle diameter less than 1 μm is enterprising in base material Row pattern printing, radiation pulses light, and a part of nano particle for including most of metal nanoparticle is shown conduct The behavior of so-called black matrix, shows high electromagnetic radiation absorptivity, and the thermal mass (thermal mass) of particle is small, so that particle quilt Quick heating, fusing, solidification, form circuit pattern.In the case of this method, because the thermal conductivity of substrate is poor, and pulsed illumination Length is shorter, is only capable of conducting minimal energy to substrate, therefore can solve existing utilization heat cure, the method for calcining The problem of.
Prior art literature
Patent document
Patent document 1：Japanese Unexamined Patent Application Publication 2008-522369 publications
The content of the invention
Problems to be solved by the invention
According to foregoing so-called smooth calcining technology, the problem of existing utilization heat cure, the method for calcining can be solved, but The problem of in the presence of being difficult to obtain good electrical characteristics, present situation is not yet widely practical.
The present invention be in view of this problem of the prior art and make, its basic object is to calcine skill by new light Art come provide for formed with good electrical conducting film conductive composition.
It is further an object that providing by the conductive composition, productivity ratio is good and has been cost effectively formed The circuit substrate of electrically conductive film.
The solution used to solve the problem
The present inventor etc. is had found to reach object defined above, and the technology of conductive composition is being calcined using light irradiation In, using photoreaction initiator or light acid producing agent, the electrical characteristics thus, it is possible to improve conductive composition.
That is, according to the present invention, there is provided a kind of conductive composition, it is characterised in that it is for being carried out by light irradiation Calcining, the conductive composition containing electrically conductive microparticle in a solvent, wherein, the conductive composition contains light reaction and drawn Send out agent or light acid producing agent.
In a preferred embodiment, said conductive composition also contains dispersant, in addition, aforementioned solvents are organic molten Agent, water or their mixture.
In addition, according to the present invention, there is provided a kind of circuit substrate, it is characterised in that with conducting film, and the conducting film is pair Be coated with foregoing applying conductive composition and drying and the film that obtains carries out what light irradiation was formed.
The effect of invention
The conductive composition of the present invention is the conductive composition for being calcined by light irradiation as previously described, most It is characterised by greatly, it contains photoreaction initiator or light acid producing agent.Thus, it is possible to form the circuit with good electrical The conducting films such as pattern.
Although may not necessarily say it is clear and definite, it is considered that this is because, photoreaction initiator have absorb light energy and by The property excited, therefore, by being coexisted with photoreaction initiator, can improve the absorption of the light energy of electrically conductive microparticle in itself Rate.Thus, particle is rapidly heated, melts, calcined, so as to play good electric conductivity.
On the other hand, it is believed that when composition contains light acid producing agent, light acid producing agent is used as electrically conductive microparticle Surface conditioning agent and work, so as to play good electric conductivity.
In addition, using the present invention conductive composition method in the case of, on base material pattern printing lead Conductive composition carries out light irradiation, so as to form conductor circuit, good and provide shape at low cost therefore, it is possible to productivity ratio Into the circuit substrate for having conductor circuit.Moreover, according to the method for the conductive composition using the present application, can be only to base Material conducts minimal energy, therefore has the advantages that the base material that can be used is not limited.
Embodiment
Hereinafter, each constituent on the conductive composition of the present invention is illustrated.
The electrically conductive microparticle used in conductive composition as the present invention, can include silver-colored (Ag), golden (Au), nickel (Ni), copper (Cu), aluminium (Al), tin (Sn), lead (Pb), zinc (Zn), iron (Fe), platinum (Pt), iridium (Ir), osmium (Os), palladium (Pd), rhodium (Rh), the metal such as simple substance and its alloy such as ruthenium (Ru), tungsten (W), molybdenum (Mo)；Tin oxide (SnO2), yttrium oxide (In2O3), ITO (oxygen Change indium tin；Indium Tin Oxide) etc. metal oxide；Carbon black etc., they can be used alone or with of more than two kinds mixed The form for closing powder is used.In addition, for the oxidation for preventing electrically conductive microparticle, the dispersiveness improved in composition, preferably using Aliphatic acid carried out processing.Among aliphatic acid, particularly preferred carbon number be 6~8 low-carbon carboxylic acid, specifically preferably caproic acid, Enanthic acid, octanoic acid, sorbic acid, benzoic acid, salicylic acid, m-hydroxybenzoic acid, the length of the level of P-hydroxybenzoic acid.
It is used as electrically conductive microparticle, preferably Cu, Ag, Al, more preferably Ag.
On the shape of said conductive particulate, spherical, flakey, dendritic crystalline etc. can be used variously-shaped, in this hair In bright conductive composition, the primary particle size of electrically conductive microparticle is preferably shorter than 1 μm, more preferably below 300nm, further more Preferably below 100nm, is especially more preferably below 60nm, most preferably below 20nm.
The primary particle size of above-mentioned electrically conductive microparticle is by being calculated with random 10 electrically conductive microparticles of electron microscope observation Average grain diameter.
On the compounding amount of electrically conductive microparticle, reach overall more than the 5 mass % of conductive composition and 90 mass % with Under, be preferably more than 10 mass % and below 70 mass %, more preferably more than 15 mass % and below 50 mass % ratio It is suitable.When the compounding amount of electrically conductive microparticle is less than 5 mass %, become easily to produce linewidth shrink, the broken string of telegraph circuit, On the other hand, when being largely compounded more than 90 mass %, it becomes difficult to make stable good dispersion (paste), thus it is unexcellent Choosing.
As foregoing photoreaction initiator, as long as light energy can be absorbed and excite and generate the thing of such as free radical Matter, no matter how title can use, in addition it is also possible to use usual known light-initiated auxiliary agent, sensitizer.As specific Photoreaction initiator, alkyl phenyl ketone based compound, benzoin compound, acetophenone compound, anthraquinone chemical combination can be included Thing, thioxanthone compounds, benzophenone cpd, xanthone compound, tertiary amine compound, oxime ester based compound, acyl group oxidation Phosphine based compound, titanocenes compound etc..Among these, preferably alkyl phenyl ketone system and titanocenes compound.
As alkyl phenyl ketone series initiators, Alpha-hydroxy alkyl phenyl ketone based compound, alpha-aminoalkyl benzene can be included Base ketone based compound, ketal compound etc..
As the commercially available product of Alpha-hydroxy alkyl phenyl ketone series initiators, BASF Japan Ltd. manufactures can be included IRGACURE (registration mark) 127, IRGACURE184, IRGACURE2959, DAROCUR (registration mark) 1173 etc..
As alpha-aminoalkyl phenyl ketone series initiators, specifically, 2- methyl isophthalic acids-[4- (methyl mercapto) benzene can be included Base] -2- morpholinoes propane -1,2- benzyl -2- dimethylaminos -1- (4- morphlinophenyls)-butane -1- ketone, 2- (dimethylaminos Base) -2- [(4- aminomethyl phenyls) methyl] -1- [4- (4- morpholinyls) phenyl] -1- butanone, N, the α such as N- dimethylamino benzoylformaldoximes - Aminoacetophenone series initiators, as commercially available product, can include BASF Japan Ltd. manufactures IRGACURE369, IRGACURE379, IRGACURE907 etc..
As ketal series initiators, specifically, for example, acetophenone dimethyl ketal, benzil dimethyl contracting can be included Ketone etc., as commercially available product, can include IRGACURE651 of BASF Japan Ltd. manufactures etc..
As titanocenes compound, specifically, for example, double (cyclopentadienyl group)-bis- [2,6- bis- fluoro- 3- can be included (2- (1- pyrroles -1- bases) ethyl) phenyl] titanium, double (cyclopentadienyl groups)-bis- [the fluoro- 3- of 2,6- bis- ((2,5- dimethyl -1- pyrroles Cough up -1- bases) methyl) phenyl] titanium, double (cyclopentadienyl groups)-bis- [the fluoro- 3- of 2,6- bis- ((2- isopropyls -5- methyl isophthalic acids-pyrroles -1, 6- yls) methyl) phenyl] titanium, double (cyclopentadienyl groups)-bis- [the fluoro- 3- of 2,6- bis- ((3- trimethylsilyl -2,5- dimethyl -1- pyrroles Cough up -1- bases) methyl) phenyl] titanium, double (cyclopentadienyl groups)-bis- [the fluoro- 3- of 2,6- bis- ((2,5- dimethyl -3- (double (2- methoxyl groups Ethyl) amino methyl) -1- pyrroles -1- bases) methyl) phenyl] titanium, double (cyclopentadienyl groups)-bis- [((2,5- is double by the fluoro- 3- of 2,6- bis- (morpholinomethyl) -1- pyrroles -1- bases) methyl) phenyl] titanium, double (cyclopentadienyl groups)-bis- [fluoro- 4- (3- (1- of 2,3,5,6- tetra- Pyrroles -1- bases) propyl group) phenyl] titanium, double (cyclopentadienyl groups)-bis- [the fluoro- 3- of 2,6- bis- (2- (4,5,6,7- tetrahydrochysene-iso-indoles - 2- yls) ethyl) phenyl] titanium, double (cyclopentadienyl groups)-bis- [the fluoro- 3- of 2,6- bis- (6- (9- carbazole -9- bases) hexyl) phenyl] titanium, Double (cyclopentadienyl groups)-bis- [the fluoro- 3- of 2,6- bis- (3- (2,3,4,5,6,7,8,9- octahydro -1- carbazole -9- bases) propyl group) phenyl] It is titanium, double (cyclopentadienyl groups)-bis- [the fluoro- 3- of 2,6- bis- (2- (N- allyl methyls sulfuryl amino) ethyl) phenyl] titanium, double (η5- 2,4- cyclopentadiene -1- bases)-bis- (the fluoro- 3- of 2,6- bis- (1H- pyrroles -1- bases) phenyl) titaniums etc..As commercially available product, it can arrange Enumerating has IRGACURE784 of BASF Japan Ltd. manufactures of absorption etc. in visible region.
It is above-mentioned to list representational photoreaction initiator class, but as long as being the light irradiation generation by using flash lamp etc. The material of free radical activity kind or the material for contributing to it to increase the effect of kind of (propagating species), are not just limited In aforementioned substances.The compounding amount of photoreaction initiator (is also photoreaction initiator and light containing light-initiated auxiliary agent and during sensitizer Trigger the total amount of auxiliary agent and sensitizer) relative to photoreaction initiator and the gross mass of conductive particle, it is 0.01~30 matter It is appropriate to measure %, preferably 0.05~15 mass %, more preferably 0.1~5 mass % scope.Photoreaction initiator is matched somebody with somebody When mixed amount is more than 0.01 mass %, the effect of the present invention can be obtained well.But, during more than 30 mass %, it can hinder Calcining, it is not preferable.
As foregoing smooth acid producing agent, as long as light energy can be absorbed and excite and generate for example sour material, no matter How title can use.As specific light acid producing agent, for example, it can include diazol, salt compounded of iodine, bromide, chlorine The salt such as salt, sulfonium salt, selenium salt, pyralium salt, thiapyran salt, pyridiniujm；Three (trihalomethyl group)-s-triazine (such as 2, 4,6- tri- (trichloromethyl)-s-triazine), double (trichloromethyl)-equal three of 2- [2- (5- methylfuran -2- bases) vinyl] -4,6- Double (the trichloromethyl)-s-triazine of piperazine, 2- [2- (furans -2- bases) vinyl] -4,6-, 2- (4- methoxyphenyls) -4,6- double (three Chloromethyl) halogenated compound such as-s-triazine, double (the trichloromethyl)-s-triazine of 2- methyl -4,6-；The 2- bromobenzyl base esters of sulfonic acid；It is sub- Sulfamate (iminosulfonate)；1- oxo -2- diazo naphthoquinone -4- sulfonate derivatives；N- hydroxy imides=sulphur Acid esters；Three (methanesulfonyloxy group) benzene derivatives；Double sulfonyidiazomethanes classes；Sulfonyl carbonyl alkanes；Sulfonyl carbonyl Diazomethane class；Two sulphones；Iron-arene complexes etc..These light acid producing agents may be used singly or in combin 2 More than kind.
As the commercially available product of light acid producing agent, Union Carbide Corporation manufactures can be included OPTOMER SP-150, SP-151, SP- of CYRACURE UVI-6950, UVI-6970, ADEKA CORPORATION manufactures 152nd, the Degacere of CI-2855, Degussa company manufacture of SP-170, SP-171, Nippon Soda Co., Ltd. manufacture The triarylsulfonium salts such as KI85B, unsubstituted or substituted aryl diazol, diaryl group iodized salt.In addition, as sulfonic acid, PAI-101 (more than, be trade name) of Midori Kagaku Co., Ltd.s manufacture etc. can be included.
Gross mass of the compounding amount relative to light acid producing agent and conductive particle of this smooth acid producing agent, is 0.01~30 Quality %, preferably 0.05~15 mass %, more preferably 0.1~5 mass % scope is appropriate.Light acid producing agent is matched somebody with somebody When mixed amount is more than 0.01 mass %, the effect of the present invention can be obtained well.But, during more than 30 mass %, it can hinder Calcining, it is not preferable.
In the conductive composition of the present invention, in order to form stable paste, add suitable preferably into electrically conductive microparticle Dispersant.As dispersant, the compound with the polar group for having compatibility with electrically conductive microparticle, macromolecule can be used Compound, the oxygenatedchemicals such as phosphoric acid ester, the copolymer containing acidic group, the polycarboxylate of hydroxyl, polysiloxanes, long-chain Salt of polyaminoamide and acid esters etc..In commercially available dispersant, as the material that can suitably use, BYK (notes can be included Volume trade mark) -101, -103, -108, -110, -112, -130, -184, -2001, -2020 (they being BYK Japan KK manufactures) Deng.The compounding amount of this dispersant is suitable for 0.1~10 mass %, preferably 1~5 mass % of total composition.
The present invention conductive composition in, as the solvent for dispersed electro-conductive particulate, can use organic solvent, Water.As the concrete example of organic solvent, the ketone such as can include MEK, cyclohexanone；Toluene, dimethylbenzene, durol Etc. aromatic hydrocarbon；Cellosolve, methyl cellosolve, carbitol, methyl carbitol, butyl carbitol, propylene glycol monomethyl ether, dipropyl The glycol ethers such as glycol monomethyl ether, DPE, Triethylene glycol ethyl ether；Ethyl acetate, butyl acetate, cellosolve second The acetic acid such as acid esters, butyl cellosolve acetate, carbitol acetate, acetate of butyl carbitol, propylene glycol methyl ether acetate Esters；The alcohols such as ethanol, propyl alcohol, ethylene glycol, propane diols, terpinol (α-terpineol), isobornyl cyclohexanol；Octane, decane Deng aliphatic hydrocarbon；The oil series solvent such as petroleum ether, naphtha, hydrogenated naphtha, solvent naphtha, these can be used alone or Person is applied in combination two or more.Among these, from environmental sanitation aspect, preferably alcohols and water, particularly from scattered From the viewpoint of stability, preferred alcohols.
As long as the compounding ratio of solvent is results in the ratio of the amount of the paste of fine dispersion stability, just without special Limit, be 20~80 mass % of total composition, preferably 30~75 mass %, more preferably 40~70 mass % are preferable 's.When the compounding ratio of solvent is more than 80 mass %, drying needs the time, and worries to produce to be led by the evaporation of volatile ingredient The problem of in the environmental sanitation of cause, it is not preferable.
In addition, in the conductive composition of the present invention, can also be with the ratio for the amount for not damaging effect of the present invention, according to need Mobility donor, stabilizer, defoamer, levelling agent, antiblocking agent, silane coupler, thickener, thixotroping are added on a small quantity The various additives such as agent, inorganic filler, colouring agent.
In the manufacture of circuit substrate, pass through coating side known to silk screen print method, ink-jet, bar coater, knife type coater etc. The conductive composition constituted as previously described is coated on base material by method, is dried at e.g., from about 50~100 DEG C, forms regulation The film of pattern.During pattern is formed, masking method, resist etc. can be used.
Thereafter, to irradiation lights such as the film flash lamps of foregoing predetermined pattern.Now, most nano particle in film I.e. electrically conductive microparticle shows the behavior as so-called black matrix, shows bloom S. E. A., and the thermal mass of particle is small, so that Grain is rapidly heated, melted, calcining, and forms the conducting film of circuit pattern.
As above-mentioned base material, it can be not particularly limited to use various materials.Specifically, cellulose can be used The resinous thins such as (paper) film, polypropylene (PP) film, polyester film, Kapton, glass baseplate, ceramic base material, The base materials such as BT (Bismaleimide Triazine) base material, glass epoxide base material, glass polyimide base material, phenolic group material, paper phenol.
As polyester film, polyethylene terephthalate (PET) film, PEN can be included (PEN) film etc..
Among these base materials, conductive composition of the invention is preferred for resinous thin, resiniferous base material.
It is preferably the light irradiation using flash lamp using the calcining of light irradiation.Flash lamp is in the pipe of quartz, glass etc. Luminous gas (Xe, Kr, Ar, Ne etc.) lamp is sealed with, is lighted with the μ s of μ s of fluorescent lifetime 1~5000 very short time, can It is irradiated with the spectrum in the wideband region with 200nm~1100nm wavelength.From the easness obtained, preferably it is sealed with Xe xenon flash lamp.
Embodiment
Hereinafter, embodiment and comparative example are shown, and the present invention is specifically described, but the present invention is not limited to following realities Apply example.It should be noted that following, unless otherwise noted, then " part " is quality criteria.
Embodiment 1~3 and comparative example 1
<The preparation of conductive paste>
Each composition in addition to silver powder is compounded according to the compounding ratio (mass ratio) shown in table 1,10 are mixed with mixer After minute, silver powder is compounded, is mixed 10 minutes with mixer, obtains each conductive paste of embodiment 1~3 and comparative example 1.
Table 1
<The measure of resistivity value>
The interval that about 2mm width is separated in PET film is implemented to cover with adhesive tape, with scraper plate applying conductive paste Afterwards, adhesive tape is peeled off, drying in 30 minutes is carried out at 80 DEG C using heated air circulation type drying oven.Use SURFCORDER (Kosaka Laboratory Ltd. manufactures, SE-30H) determines the thickness of the pattern obtained, uses MEASURING MICROSCOPE (manufacture of OLYMPUS Co., Ltd., STM-MJS) determines pattern width, uses DIGITAL MULTIMETER (manufacture of CUSTOM companies, CORPORATION CDM-26) determines pattern length 1cm resistance value.
Then, using photo with camera (FUJIFILM Corporation manufacture Pocketfujica 350Flash), 3mm high irradiance flash of light, then determines pattern length 1cm resistance value again above from pattern.
Resistivity value is calculated by the thickness, pattern width and resistance value of said determination.The result of acquisition is shown in following tables 2。
Table 2
As shown in table 2, the conductive paste of the embodiment 1~3 added with photoreaction initiator draws with being not added with light reaction The comparative example 1 of hair agent is compared, and resistivity value is reduced, and good result is shown as conductive material.
Embodiment 4 and 5
Each composition in addition to silver powder is compounded according to the compounding ratio (mass ratio) shown in table 3,10 are mixed with mixer After minute, silver powder is compounded, is mixed 10 minutes with mixer, obtains each conductive paste of embodiment 4,5.
For each conductive paste of acquisition, with foregoing same operation, electricity is determined by thickness, pattern width and resistance value Values of resistivity.It the results are shown in table 4.
Table 3
Table 4
As shown in table 4, the conductive paste of the embodiment 4,5 added with light acid producing agent is with being not added with light acid producing agent Comparative example 1 is compared, and resistivity value is reduced, and good result is shown as conductive material.

Claims (4)

1. a kind of manufacture method of circuit substrate, it is characterised in that with following process：
Will be comprising silver powder and solvent and comprising photoreaction initiator or light acid producing agent and comprising selected from oxygenatedchemicals, containing acid It is at least one kind of in the copolymer of base, the polycarboxylate of hydroxyl, the salt of polysiloxanes and long-chain polyaminoamide and acid esters The process for carrying out pattern printing on base material as the conductive composition of dispersant and forming the film of pattern；
Light irradiation is carried out so as to calcining to the film for having carried out pattern formation by using flash lamp, form calcining and Into circuit pattern conducting film process.
2. the manufacture method of circuit substrate according to claim 1, it is characterised in that as the pattern printing, use It is at least any of in silk screen print method, ink-jet, bar coater, knife type coater.
3. the manufacture method of circuit substrate according to claim 1, it is characterised in that the flash lamp glistens for xenon Lamp.
4. a kind of circuit substrate, it is characterised in that it is obtained by manufacture method according to any one of claims 1 to 3 Arrive.
CN201380014122.XA 2012-05-22 2013-05-08 Conductive composition and the circuit substrate that conducting film is formed with by it Active CN104170021B (en)

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