CN104157773B - A kind of LED injecting glue mould - Google Patents
A kind of LED injecting glue mould Download PDFInfo
- Publication number
- CN104157773B CN104157773B CN201410423900.7A CN201410423900A CN104157773B CN 104157773 B CN104157773 B CN 104157773B CN 201410423900 A CN201410423900 A CN 201410423900A CN 104157773 B CN104157773 B CN 104157773B
- Authority
- CN
- China
- Prior art keywords
- injecting glue
- pin
- type
- led
- dismounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000003292 glue Substances 0.000 title claims abstract description 226
- 210000002816 gill Anatomy 0.000 claims abstract description 34
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 238000009434 installation Methods 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 15
- 238000007789 sealing Methods 0.000 description 10
- 230000007547 defect Effects 0.000 description 4
- 238000012423 maintenance Methods 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 208000027418 Wounds and injury Diseases 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 2
- 238000011900 installation process Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/2602—Mould construction elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Coating Apparatus (AREA)
Abstract
The invention relates to a kind of LED injecting glue mould, its structure includes fixed form and the multiple injecting glue faller gills being rotatably connected on fixed form, injecting glue faller gill includes several injecting glue pins, injecting glue pin includes syringe and syringe needle, described syringe includes the cylindrical tube being sequentially connected with from top to bottom, dismounting portion and fixed part, described cylindrical tube is also connected with described syringe needle, the height in the dismounting portion of adjacent injecting glue pin on each injecting glue faller gill, wherein, it is type-A injecting glue pin that dismounting portion is above being adjacent the injecting glue pin in the dismounting portion of two injecting glue pins, remaining injecting glue pin is B type injecting glue pin, type-A injecting glue pin is arranged at the middle part of injecting glue faller gill.Dismounting and the installation of the invention are the most convenient, dismount ultrahigh in efficiency, it is possible to greatly reduce the consuming of time and manpower, improve production efficiency, reduce production cost.
Description
Technical field
The invention relates to LED encapsulation technology field, is specifically related to a kind of LED injecting glue mould.
Background technology
The encapsulation of LED is exactly to be combined by certain Technology with assemblies such as contact conductor, base or lens by chip
Together, the process of the luminescent device that can be used directly is made.The potting process of LED includes die bond, bonding wire, envelope
Glue, toasting, cut, test, pack, wherein, sealing is exactly to use epoxy resin to inject to be complete the LED of die bond, bonding wire
Semi-finished product are encapsulated, for ensure sealing quality and improve sealing efficiency, sealing process typically use small volume, can be close
Collection is installed, injecting glue uniform injecting glue pin.
In prior art, injecting glue pin generally comprises syringe needle and syringe, and syringe needle is split-type structural with syringe, and syringe needle leads to
Cross hammer pressure fixing on syringe, when so syringe is intact syringe needle damages, it is only necessary to change syringe needle, repeatable utilize pin
Cylinder, reduces spillage of material and maintenance cost, but, this syringe needle and syringe split-type design, also bring following defect: first,
When installing syringe needle, the regularity of syringe needle hardly results in control with concordant degree；Second, during sealing, syringe needle is by huge
In the case of big injection pressure and the impulsive force of material, syringe needle easily comes off with syringe, so that the syringe needle dropped is the most slotting
Bad mould bar, is also easy to cause the few defect such as glue, bubble of sealing, has a strong impact on product quality；3rd, several injecting glues are being installed
On the injecting glue mould of pin, if wherein certain syringe has damage or needs maintenance etc. to need dismounting, owing to injecting glue pin is installed more
Intensive, the syringe of this damage can not directly be disassembled by extracting tool, but by row's note at this syringe place to be removed
Plastic pin starts dismounting one by one from one end, until dismounting is to this syringe position to be removed, will after then being dismounted by this syringe again
Above-mentioned other injecting glue pins disassembled install successively, and this disassembly process is the most inconvenient, need to take a substantial amount of time, especially treat
When the syringe of dismounting is positioned at the middle part of entire row injecting glue pin, needs to spend substantial amounts of disassembly and assembly time and manpower to expend, dismount efficiency pole
Low, it is substantially reduced production efficiency, is unfavorable for industrialized application.
Summary of the invention
The purpose of the invention is to avoid above-mentioned weak point of the prior art to also provide for a kind of LED injecting glue
Mould, the disassembly process of the injecting glue pin on this LED injecting glue mould is simple, convenient, fast, greatly reduces the consumption of disassembly and assembly time and manpower
Take, improve production efficiency, reduce production cost；It addition, the injecting glue pin on this LED injecting glue mould is integral type molding, it is possible to ensure
Regularity when syringe needle is installed and concordant degree, and it is prevented from coming off of syringe needle, improving product quality, protection mould bar is the most impaired
Wound.
The purpose of the invention is achieved through the following technical solutions:
Provide a kind of LED injecting glue mould, including fixed form and the multiple injecting glue faller gills being rotatably connected on fixed form, injecting glue
Faller gill includes several injecting glue pins, and injecting glue pin includes that syringe and syringe needle, described syringe include the cylinder being sequentially connected with from top to bottom
Cylinder, dismounting portion and fixed part, described cylindrical tube is also connected with described syringe needle, the dismounting portion of adjacent injecting glue pin on injecting glue faller gill
Height, wherein, it is type-A note that the height in dismounting portion is above being adjacent the injecting glue pin in the dismounting portion of two injecting glue pins
Plastic pin, remaining injecting glue pin is B type injecting glue pin, and type-A injecting glue pin is arranged at the middle part of injecting glue faller gill.
Wherein, syringe is one-body molded with syringe needle.
Wherein, the middle part of injecting glue faller gill is provided with at least two type-A injecting glue pin.
Wherein, it is provided only with a B type injecting glue pin between adjacent two type-A injecting glue pins.
Wherein, it is provided with two B type injecting glue pins between adjacent two type-A injecting glue pins.
Wherein, the height in the dismounting portion of all type-A injecting glue pins is equal.
Wherein, the type-A injecting glue pin on two injecting glue rows that the type-A injecting glue pin on arbitrary injecting glue faller gill is adjacent is handed over
Wrong setting.
Wherein, the dismounting portion of injecting glue pin is set to hexagon.
Wherein, the height in the dismounting portion of type-A injecting glue pin be adjacent two B type injecting glue pins dismounting portion height it
Between difference be all higher than the holding section of dismounting jig.
Wherein, the fixed part of injecting glue pin is provided with the external screw thread for being rotatably connected in fixed form.
The beneficial effect of the invention:
A kind of LED injecting glue mould of the invention, including fixed form and the multiple injecting glue pins being rotatably connected on fixed form
Row, injecting glue faller gill includes several injecting glue pins, and injecting glue pin includes that syringe and syringe needle, described syringe include the most successively
Cylindrical tube, dismounting portion and the fixed part connected, described cylindrical tube is also connected with described syringe needle, adjacent injecting glue on injecting glue faller gill
The height in the dismounting portion of pin, wherein, the height in dismounting portion is above being adjacent the injecting glue in the dismounting portion of two injecting glue pins
Pin is type-A injecting glue pin, and remaining injecting glue pin is B type injecting glue pin, and type-A injecting glue pin is arranged at the middle part of injecting glue faller gill.This
The height in the dismounting portion of adjacent injecting glue pin on the injecting glue faller gill of bright creation, the dismounting portion of type-A injecting glue pin is above and it
The dismounting portion of two adjacent B type injecting glue pins, makes between the B type injecting glue pin that the dismounting portion of type-A injecting glue pin is adjacent
Clearance space increase, when in injecting glue faller gill certain injecting glue pin damage or need maintenance etc. need dismounting time, especially work as needs
When the injecting glue pin of dismounting is positioned in the middle of injecting glue faller gill, dismounting jig can pass through the clearance space of this increase and block easily
Holding the dismounting portion at type-A injecting glue pin, then 360 degree rotate freely and then can quickly be disassembled by type-A injecting glue pin, to tear open
Unload the B type injecting glue pin between type-A injecting glue, use said method by the type-A injecting glue closest with this B type injecting glue pin
After pin dismounting, use said method dismounting B type injecting glue pin the most equally.Compared with prior art, the invention should
The dismounting of injecting glue pin and installation on LED injecting glue mould are the most convenient, dismount ultrahigh in efficiency, it is possible to greatly reduce the consumption of time and manpower
Take, improve production efficiency, reduce production cost.
The invention uses integrated injecting glue pin, i.e. syringe needle is one-body molded with syringe, and it is energy during sealing
Enough effectively preventing coming off of syringe needle, protection mould bar is injury-free, meanwhile, need not additionally mounted pin in the process installing injecting glue pin
Head, simplifies the installation process of injecting glue pin, and ensure that the regularity of syringe needle and concordant degree, occurs few during preventing sealing
Glue or air blister defect, it is ensured that product quality.
Accompanying drawing explanation
Utilize accompanying drawing that innovation and creation are described further, but the embodiment in accompanying drawing does not constitute and appoints the invention
What limits, for those of ordinary skill in the art, on the premise of not paying creative work, it is also possible to according to the following drawings
Obtain other accompanying drawing.
Fig. 1 is enforcement 1 structural representation of a kind of LED injecting glue mould of the invention.
Fig. 2 is the structural representation of the injecting glue pin of the invention.
Fig. 3 is enforcement 2 structural representation of a kind of LED injecting glue mould of the invention.
Reference in Fig. 1 to Fig. 3:
1-fixed form,
2-A type injecting glue pin,
3-B type injecting glue pin,
4-syringe needle,
5-syringe, 51-fixed part, 52-dismounting portion, 53-cylindrical tube.
Detailed description of the invention
With the following Examples the invention is further described.
Embodiment 1
One of detailed description of the invention of a kind of LED injecting glue mould of the present invention, as depicted in figs. 1 and 2, including fixed form 1
With the multiple injecting glue faller gills being rotatably connected on fixed form 1, injecting glue faller gill includes several injecting glue pins, and injecting glue pin includes syringe 5 He
Syringe needle 4, described syringe 5 includes cylindrical tube 53, dismounting portion 52 and the fixed part 51 being sequentially connected with from top to bottom, described cylindrical drum
Body 53 is also connected with described syringe needle 4, and on injecting glue faller gill, the dismounting portion 52 of adjacent injecting glue pin is highly, wherein, and dismounting portion 52
The injecting glue pin in the dismounting portion 52 of two injecting glue pins being highly above being adjacent is type-A injecting glue pin 2, remaining injecting glue pin
For B type injecting glue pin 3, and type-A injecting glue pin 2 is arranged at the middle part of injecting glue faller gill.The dismounting portion 52 of injecting glue pin is for just
Retain injecting glue pin in disassembling jig, facilitate dismounting and the installation of injecting glue pin.Wherein, the dotted line in Fig. 2 is expressed as running through whole
The glue injection cavities of injecting glue pin.
Concrete, the middle part of each injecting glue faller gill is provided with at least two type-A injecting glue pin 2, and adjacent two type-A
A B type injecting glue pin 3 it is provided only with, as in figure 2 it is shown, the dismounting portion 52 of type-A injecting glue pin 2 is adjacent between injecting glue pin 2
B type injecting glue pin 3 between clearance space increase, when in injecting glue faller gill, certain injecting glue pin damages or needs maintenance etc. to need to tear open
During dress, dismounting jig can pass through the clearance space of this increase and be held in the dismounting portion of type-A injecting glue pin 2 easily
52, then 360 degree rotate freely and then can quickly be disassembled by type-A injecting glue pin 2, to the B between dismounting type-A injecting glue 2
Type injecting glue pin 3, after using said method first to be dismantled by the type-A injecting glue pin 2 adjacent with this B type injecting glue pin 3, adopts the most again
With above-mentioned same method dismounting B type injecting glue pin 3.Injecting glue pin dismounting on LED injecting glue mould in the present embodiment and installation pole
It is convenient, especially when the injecting glue pin needing dismounting is positioned in the middle of injecting glue faller gill, relative to traditional needs from injecting glue faller gill
One end dismantle injecting glue pin one by one until the dismounting mode of the injecting glue pin that need to dismount, the injecting glue pin removal efficiency of the invention
High, it is possible to greatly reduce the consuming of time and manpower, improve production efficiency, reduce production cost.
Concrete, for simplifying the course of processing of injecting glue pin and realizing the production in enormous quantities of injecting glue pin processing, all type-A are noted
The dismounting portion 52 of plastic pin 2 is the most equal, and the dismounting portion 52 of all B type injecting glue pins 3 is the most equal.
During the sealing of LED, due to injection pressure and the impulsive force of injecting glue material, the syringe needle 4 on injecting glue pin is easy to
Coming off, for can effectively prevent coming off of syringe needle 4, the slotting wound of the syringe needle 4 that protection mould bar is not dropped, syringe 5 is arranged with syringe needle 4
It is formed in one, meanwhile, integrated injecting glue pin, need not additionally mounted syringe needle 4 in the process installing injecting glue pin, simplify note
The installation process of plastic pin, and ensure that the regularity peace homogeneous of syringe needle 4, few glue or bubble occur during preventing sealing
Defect, it is ensured that product quality.
The fixed form 1 of LED injecting glue mould is fixed with multiple injecting glue faller gill, injecting glue row all includes type-A injecting glue pin 2
With B type injecting glue pin 3, wherein, the type-A injecting glue pin 2 on arbitrary injecting glue faller gill is adjacent the type-A injecting glue pin on injecting glue row
2 are crisscross arranged.So when the injecting glue pin dismantled on any injecting glue faller gill the most not by the shadow of the injecting glue pin on other injecting glue faller gills
Ring, facilitate the dismounting of injecting glue pin on whole injecting glue mould.
Dismounting portion 52 for ease of injecting glue pin preferably coordinates with general dismounting jig, and the dismounting portion 52 of injecting glue pin is arranged
For hexagon, use hexagon spanner to be held on hexagon and carry out 360 degree of rotations and injecting glue pin can be dismounted, this clamping
Process is convenient, firm, stable, it is possible to improve the convenience of injecting glue pin dismounting further.
Concrete, the height in the dismounting portion of type-A injecting glue pin 2 is adjacent the height in the dismounting portion of two B type injecting glue pins 3
Difference between degree is all higher than the holding section of dismounting jig, makes the holding section of dismounting jig can be stuck in the dismounting of injecting glue pin completely
Portion 52, and leave certain space and suitably adjust for dismounting jig, it is ensured that stability during dismounting clamping.
Concrete, the fixed part 51 of injecting glue pin is provided with the external screw thread for being rotatably connected in fixed form 1.
Embodiment 2
The two of the detailed description of the invention of a kind of LED injecting glue mould of the present invention, as it is shown on figure 3, the major technique of the present embodiment
Scheme is same as in Example 1, the most unaccounted feature, uses the explanation in embodiment 1, no longer goes to live in the household of one's in-laws on getting married at this
State.The present embodiment is with the difference of embodiment 1, is provided with two B type injecting glues between two adjacent type-A injecting glue pins 2
Pin 3, the height in the dismounting portion of two B type injecting glue pins 3.Type-A injecting glue pin 2, the clamping of dismounting jig is dismounted at needs
Portion is stuck in the dismounting portion 52 of type-A injecting glue pin 2, and then 360 degree rotate freely and can quickly be disassembled by type-A injecting glue pin 2, if
B type injecting glue pin 3 between type-A injecting glue to be dismantled, uses said method first by the type-A adjacent with this B type injecting glue pin 3
After injecting glue pin 2 dismounting, use the B type injecting glue pin 3 that above-mentioned same method dismounting disassembling part is higher the most again, finally tear open
The B type injecting glue pin 3 that portion of unloading is relatively low.
Last it should be noted that, above example is only in order to illustrate the technical scheme of the invention, rather than to this
The restriction of bright creation protection domain, although having made to explain to the invention with reference to preferred embodiment, this area general
Logical it will be appreciated by the skilled person that the technical scheme of the invention can be modified or equivalent, without deviating from this
The spirit and scope of innovation and creation technical scheme.
Claims (10)
1. a LED injecting glue mould, it is characterised in that: include fixed form and the multiple injecting glue faller gills being rotatably connected on fixed form,
Injecting glue faller gill includes several injecting glue pins, and injecting glue pin includes what syringe and syringe needle, described syringe included being sequentially connected with from top to bottom
Cylindrical tube, dismounting portion and fixed part, described cylindrical tube is also connected with described syringe needle, and on injecting glue faller gill, adjacent injecting glue pin tears open
The height in dress portion, wherein, it is A class that the height in dismounting portion is above being adjacent the injecting glue pin in the dismounting portion of two injecting glue pins
Type injecting glue pin, remaining injecting glue pin is B type injecting glue pin, and type-A injecting glue pin is arranged at the middle part of injecting glue faller gill.
A kind of LED injecting glue mould the most according to claim 1, it is characterised in that: syringe is one-body molded with syringe needle.
A kind of LED injecting glue mould the most according to claim 1, it is characterised in that: the middle part of injecting glue faller gill is provided with at least two
Individual type-A injecting glue pin.
A kind of LED injecting glue mould the most according to claim 3, it is characterised in that: only set between adjacent two type-A injecting glue pins
It is equipped with a B type injecting glue pin.
A kind of LED injecting glue mould the most according to claim 3, it is characterised in that: arrange between adjacent two type-A injecting glue pins
There are two B type injecting glue pins.
A kind of LED injecting glue mould the most according to claim 3, it is characterised in that: the height in the dismounting portion of all type-A injecting glue pins
Spend equal.
A kind of LED injecting glue mould the most according to claim 1, it is characterised in that: the type-A injecting glue pin on arbitrary injecting glue faller gill
The type-A injecting glue pin on two injecting glue rows being adjacent is crisscross arranged.
A kind of LED injecting glue mould the most according to claim 1, it is characterised in that: the dismounting portion of injecting glue pin is set to hexagon.
A kind of LED injecting glue mould the most according to claim 1, it is characterised in that: the height in the dismounting portion of type-A injecting glue pin with
Difference between the height in the dismounting portion of its adjacent two B type injecting glue pins is all higher than the holding section of dismounting jig.
A kind of LED injecting glue mould the most according to claim 1, it is characterised in that: the fixed part of injecting glue pin is provided with for revolving
It is connected to the external screw thread of fixed form.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410423900.7A CN104157773B (en) | 2014-08-21 | 2014-08-21 | A kind of LED injecting glue mould |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410423900.7A CN104157773B (en) | 2014-08-21 | 2014-08-21 | A kind of LED injecting glue mould |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104157773A CN104157773A (en) | 2014-11-19 |
| CN104157773B true CN104157773B (en) | 2016-11-16 |
Family
ID=51883227
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410423900.7A Active CN104157773B (en) | 2014-08-21 | 2014-08-21 | A kind of LED injecting glue mould |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104157773B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114023706B (en) * | 2022-01-06 | 2022-03-18 | 江苏明芯微电子股份有限公司 | Electronic chip magnetic field shielding structure capable of reducing occupied space |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201156549Y (en) * | 2008-02-02 | 2008-11-26 | 颜志华 | Non-carriage multi-point multi-row gluing machine |
| CN201572728U (en) * | 2009-11-16 | 2010-09-08 | 先进开发光电股份有限公司 | Matrix automatic adhesive dispenser and adhesive dispenser of semiconductor component |
| CN204088374U (en) * | 2014-08-21 | 2015-01-07 | 木林森股份有限公司 | A kind of LED injecting glue mould |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101939114A (en) * | 2008-02-08 | 2011-01-05 | 中央硝子株式会社 | Device and method for applying application liquid |
-
2014
- 2014-08-21 CN CN201410423900.7A patent/CN104157773B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201156549Y (en) * | 2008-02-02 | 2008-11-26 | 颜志华 | Non-carriage multi-point multi-row gluing machine |
| CN201572728U (en) * | 2009-11-16 | 2010-09-08 | 先进开发光电股份有限公司 | Matrix automatic adhesive dispenser and adhesive dispenser of semiconductor component |
| CN204088374U (en) * | 2014-08-21 | 2015-01-07 | 木林森股份有限公司 | A kind of LED injecting glue mould |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104157773A (en) | 2014-11-19 |
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Effective date of registration: 20170329 Address after: 343000 Ji'an city open area entrepreneurial Avenue Patentee after: JIANGXI MULINSEN LIGHTING CO.,LTD. Address before: Limited by Share Ltd No. 1 road 528415 Guangdong Linsen wood Linsen Zhongshan City Xiaolan Town Patentee before: MLS Co.,Ltd. |
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Address after: 343000 Business Avenue of Jingkai District, Ji'an City, Jiangxi Province Patentee after: JIAN MULINSEN PHOTOELECTRICITY Co.,Ltd. Address before: 343000 Business Avenue of Jingkai District, Ji'an City, Jiangxi Province Patentee before: JIANGXI MULINSEN LIGHTING CO.,LTD. |
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Address after: 343000 Ji'an city open area entrepreneurial Avenue Patentee after: Ji'an Mulinsen Industrial Co.,Ltd. Address before: 343000 Ji'an city open area entrepreneurial Avenue Patentee before: JIAN MULINSEN PHOTOELECTRICITY Co.,Ltd. |
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Effective date of registration: 20190812 Address after: 343000 No. 288 Nantang Road, Jinggangshan Economic and Technological Development Zone, Ji'an City, Jiangxi Province Patentee after: Ji'an Mulinsen Display Co.,Ltd. Address before: 343000 Ji'an city open area entrepreneurial Avenue Patentee before: Ji'an Mulinsen Industrial Co.,Ltd. |
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Effective date of registration: 20200731 Address after: 343000 No. 288 Nantang Road, Jinggangshan Economic and Technological Development Zone, Ji'an City, Jiangxi Province Patentee after: Ji'an Mulinsen Lighting Devices Co.,Ltd. Address before: 343000 No. 288 Nantang Road, Jinggangshan Economic and Technological Development Zone, Ji'an City, Jiangxi Province Patentee before: Ji'an Mulinsen Display Co.,Ltd. |
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| CP03 | Change of name, title or address |
Address after: 343000 No.288, Nantang Road, Jinggangshan economic and Technological Development Zone, Ji'an City, Jiangxi Province Patentee after: Ji'an Mulinsen Electronics Co.,Ltd. Address before: 343000 No.288, Nantang Road, Jinggangshan economic and Technological Development Zone, Ji'an City, Jiangxi Province Patentee before: Ji'an Mulinsen Lighting Devices Co.,Ltd. |
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| CP03 | Change of name, title or address |