CN104144569A - Device for forming circuit on touch panel and circuit forming method - Google Patents
Device for forming circuit on touch panel and circuit forming method Download PDFInfo
- Publication number
- CN104144569A CN104144569A CN201310362150.2A CN201310362150A CN104144569A CN 104144569 A CN104144569 A CN 104144569A CN 201310362150 A CN201310362150 A CN 201310362150A CN 104144569 A CN104144569 A CN 104144569A
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- China
- Prior art keywords
- circuit
- substrate
- cylinder
- plane mould
- hot
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- Pending
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- 238000000034 method Methods 0.000 title claims abstract description 26
- 239000000758 substrate Substances 0.000 claims abstract description 56
- 238000005096 rolling process Methods 0.000 claims abstract description 13
- 238000007731 hot pressing Methods 0.000 claims abstract description 6
- 230000008569 process Effects 0.000 claims abstract description 5
- 230000006835 compression Effects 0.000 claims description 25
- 238000007906 compression Methods 0.000 claims description 25
- 230000003028 elevating effect Effects 0.000 claims description 9
- 230000007246 mechanism Effects 0.000 claims description 9
- 238000010792 warming Methods 0.000 claims description 5
- 238000003854 Surface Print Methods 0.000 claims description 3
- 238000006073 displacement reaction Methods 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 abstract description 2
- 238000007639 printing Methods 0.000 abstract description 2
- 230000002093 peripheral effect Effects 0.000 abstract 1
- 239000000463 material Substances 0.000 description 6
- 239000002994 raw material Substances 0.000 description 6
- 238000012545 processing Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- 238000007596 consolidation process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
The invention discloses a device for forming a circuit on a touch panel and a circuit forming method, which are used for printing the circuit on the surface of a flexible substrate, wherein the device is provided with a plane die which can be heated to a working temperature and is provided with a pressure surface for placing the substrate, a roller hot-pressing device is arranged above the plane die, the roller hot-pressing device can heat a roller to the working temperature, and the roller can rotate to form a rolling surface on the peripheral surface of the roller; the planar mold can be displaced by a sliding means and passes under the roller from a first position to a second position, and the substrate can be pressed on the pressed surface of the planar mold by the roller with the rolling surface thereof in the moving process of the planar mold, so that the two side surfaces of the substrate are hot pressed to form a circuit. The invention can improve the yield of circuit formation and reduce the storage cost.
Description
Technical field
The present invention is relevant with the device and the circuit forming method that form circuit on contact panel, and espespecially a kind of single cylinder and plane mould of utilizing carries out hot pressing processing procedure to form the device and method of circuit.
Background technology
Be usually used in forming on contact panel the technology of circuit as shown in Figure 6, it is with S shape pile warp twin-roll 70,71, with the printed circuit respectively of the two sides in panel material 6 by the panel material 6 once preheating; Wherein the distance of two cylinders 70,71 sets its pressure to these panel material 6 impressions as calculated, and side suitably strength impresses panel material 6 and do not damage it.
But the variable thickness of panel material 6, easily causes twin-roll 70,71 to be not quite similar to the power of its impression, and then affect the yield that circuit forms.On the other hand, with this known technology printed circuit, must be first by the preheating in advance of whole bundle panel material 6 raw materials, and just whole Raw material processings must be completed in single processing procedure, make it in response to the product of order production respective amount, if shipment amount is less than product output amount, can produce extra warehouse cost.
Summary of the invention
Main purpose of the present invention is to provide a kind of device and circuit forming method that forms circuit on contact panel, and it utilizes a drum apparatus on a plane mould, contact panel to be impressed to form circuit with hot pressing mode, has the effect that improves yield.
For reaching aforementioned object, the present invention by the following technical solutions:
On contact panel, form a device for circuit, for the surface printing circuit at the flexual substrate of a tool, this device includes:
One plane mould, it can be warming up to a working temperature, and it has a compression face, for this substrate, puts;
One cylinder hot-press arrangement, it is located at this plane mould top, and this cylinder hot-press arrangement can be warming up to a working temperature by a cylinder, and this cylinder rotatably forms a rolling surface in its side face;
This plane mould can be through a slippage means displacement, and passes through this cylinder below to a second place by a primary importance; And this substrate is rollably suppressed on the compression face of this plane mould with its rolling surface by this cylinder can in this plane mould moving process, make the both side surface of this substrate be subject to hot pressing to form circuit.
Preferably, this plane mould is located on a slide device, for driving this plane mould to move.
Preferably, this primary importance and this second place lay respectively at the both sides of this cylinder hot-press arrangement.
Preferably, this cylinder hot-press arrangement has a height adjustable elevating mechanism.
The invention provides a kind of circuit forming method that uses said apparatus, it includes: the flexual substrate of a tool is placed on the compression face of a plane mould; This plane mould is moved towards a second place direction by a primary importance; This plane mould is passed through cylinder when below of this cylinder hot-press arrangement, with the rolling surface of this cylinder, suppresses this substrate on this plane mould compression face, makes the both side surface of this substrate impress to form circuit; This plane mould moves to the second place; And take off the substrate that forms circuit.
Preferably, the method also includes: in this plane mould, move to after the second place, then this plane mould is moved towards this primary importance by this second place, for this substrate, can be impressed for the second time.
Preferably, this cylinder hot-press arrangement has a height adjustable elevating mechanism, and the method includes: corresponding to the thickness of this substrate, use this elevating mechanism to adjust this cylinder apart from the height of the compression face of this plane mould.
The invention has the advantages that with cylinder substrate is suppressed on a compression face, can reach consolidation and suppress substrate and improve the yield that circuit forms.In addition, contact panel is not preheating in advance before being processed to form circuit, and can first raw material be cut into row processing again after the substrate of preliminary dimension, accordingly can be according to the quantity of order, raw material are cut out to appropriate substrate, with device of the present invention, be processed into product again, to avoid the unnecessary product of output, produce extra warehouse cost.
Accompanying drawing explanation
Fig. 1 is schematic perspective view of the present invention.
Fig. 2,3,4 is use view of the present invention.
Fig. 5 is the flow chart of circuit forming method of the present invention.
Fig. 6 is the use view of usual means.
Embodiment
Refer to Fig. 1, it is the device that forms circuit on contact panel provided by the present invention, for the surface printing circuit at the flexual substrate of a tool, this device includes a plane mould 1, and its end face is the compression face 11 that can put for a substrate (not shown); This plane mould 1 can be warming up to a working temperature, so that substrate placed on it increases pliability because being heated.This plane mould 1 can slippage means carry out displacement, and in the present embodiment, this plane mould 1 is located on a slide device 2, and as shown in the figure, this slide device 2 includes a slide 21, and can be driven and carry out slippage along a track 22.
And plane mould 1 top is provided with a cylinder hot-press arrangement 3, cylinder hot-press arrangement 3 is provided with a support 31 in track 22 both sides, and be provided with a rotating cylinder 32 in this support 31, this cylinder 32 is horizontally placed on compression face 11 tops of plane mould 1, and its side face defines formation one rolling surface 321.In the present embodiment, cylinder hot-press arrangement 3 is provided with an elevating mechanism (not shown), can adjust cylinder 32 apart from the height of plane mould 1 compression face 11 in order to the thickness of corresponding this substrate.
And the present invention is when carrying out the circuit printing of contact panel, as shown in Figure 2, first substrate 4 is placed on the compression face 11 of plane mould 1, now substrate 4 is by the warm that is subject to being conducted by plane mould 1, thereby promote temperature and to produce surface softening a little, and increase its pliability.Then as Fig. 2 arranges in pairs or groups as shown in Fig. 3, with slide device 2, drive plane mould 1 to move, make its along track 22 by a primary importance 50 cylinder 32 below to second places 51 of passing through, in the present embodiment, primary importance 50 and the second place 51 lay respectively at the both sides of cylinder hot-press arrangement 3, and in the moving process of plane mould 1, during substrate 4 process cylinder 32, can be subject to cylinder 32 rollably suppresses on the compression face 11 of plane mould 1 with its rolling surface 321, and make the upper of substrate 4, lower two sides are all subject to oppressing strength, now cylinder 32 can rise to through heating a working temperature, softening substrate 4 when its this substrate 4 of roll extrusion, make substrate 4 easily impression shaping when being impressed.And substrate 4 is driven after cylinder hot-press arrangement 3 by slide device 2 on plane mould 11, it is subject to the press power of cylinder 32, and make its upper and lower two sides be subject to respectively the impression of the rolling surface 321 of cylinder 32 and the compression face 11 of plane mould 1, to form circuit in this two sides.
The size of the suffered compacting strength from cylinder 32 rolling surfaces 321 of aforesaid substrate 4 is decided by that cylinder 32 is apart from the height of plane mould 1 compression face 11, detailed says, cylinder 32 is less apart from the height of compression face 11, and the strength of cylinder 32 compacting substrates 4 will be larger.Therefore, thickness that can counterpart substrate 4, and adjust cylinder 32 apart from the height of compression face 11 by the elevating mechanism of cylinder hot-press arrangement 3, suitably to adjust the compacting strength of 32 pairs of substrates 4 of cylinder.
The invention has the advantages that with cylinder substrate is suppressed on a compression face, can reach consolidation and suppress substrate and improve the yield that circuit forms.In addition, contact panel is not preheating in advance before being processed to form circuit, and can first raw material be cut into row processing again after the substrate of preliminary dimension, accordingly can be according to the quantity of order, raw material are cut out to appropriate substrate, with device of the present invention, be processed into product again, to avoid the unnecessary product of output, produce extra warehouse cost.
And as shown in Figure 5, the invention provides a kind of circuit forming method that uses said apparatus, it includes:
The flexual substrate of one tool is placed on the compression face of a plane mould;
This plane mould is moved towards a second place by a primary importance;
This plane mould is passed through cylinder when below of this cylinder hot-press arrangement, with the rolling surface of this cylinder, suppresses this substrate on the compression face of this plane mould, makes the both side surface of this substrate impress to form circuit;
This plane mould moves to the second place;
And take off the substrate that forms circuit.
In said method, in the present embodiment, also include the thickness corresponding to this substrate, utilize the elevating mechanism of cylinder hot-press arrangement to adjust this cylinder apart from the height of this plane mould compression face, to set suitable impression strength, and at plane mould 1, driven and while being moved towards the second place 51 by primary importance 50 as shown in Figure 2,3, substrate 4 pass through this cylinder hot-press arrangement 3 cylinder 32 belows and suppressed on the compression face 11 of plane mould 1 by it, make this substrate 4 both side surface form circuit.
In addition, in the present embodiment, the method is also included in plane mould and moves to after the second place 51, again plane mould 1 is moved towards primary importance 50 along track 22 by the second place 51, as shown in Figure 4, substrate 4 is impressed for the second time when passing through cylinder hot-press arrangement 3 again, strengthens its circuit and forms effect.
The above is preferred embodiment of the present invention and the know-why used thereof; for a person skilled in the art; in the situation that not deviating from the spirit and scope of the present invention; the apparent changes such as any equivalent transformation based on technical solution of the present invention basis, simple replacement, within all belonging to protection range of the present invention.
Claims (7)
1. on contact panel, form the device of circuit, the surface printing circuit at the flexual substrate of a tool, is characterized in that, this device includes:
One plane mould, it can be warming up to a working temperature, and it has a compression face, for this substrate, puts;
One cylinder hot-press arrangement, it is located at this plane mould top, and this cylinder hot-press arrangement can be warming up to a working temperature by a cylinder, and this cylinder rotatably forms a rolling surface in its side face;
This plane mould can be through a slippage means displacement, and passes through this cylinder below to a second place by a primary importance; And this substrate is rollably suppressed on the compression face of this plane mould with its rolling surface by this cylinder can in this plane mould moving process, make the both side surface of this substrate be subject to hot pressing to form circuit.
2. according to the device that forms circuit on contact panel claimed in claim 1, it is characterized in that, described plane mould is located on a slide device, for driving described plane mould to move.
3. according to the device that forms circuit on contact panel claimed in claim 1, it is characterized in that, described primary importance and the described second place lay respectively at the both sides of described cylinder hot-press arrangement.
4. according to the device that forms circuit on contact panel claimed in claim 1, it is characterized in that, described cylinder hot-press arrangement has a height adjustable elevating mechanism.
5. use a circuit forming method that forms the device of circuit on contact panel as claimed in claim 1, it is characterized in that, the method includes: the flexual substrate of a tool is placed on the compression face of plane mould; This plane mould is moved towards the second place by primary importance; This plane mould is passed through cylinder when below of this cylinder hot-press arrangement, with the rolling surface of this cylinder, suppresses this substrate on the compression face of this plane mould, makes the both side surface of this substrate impress to form circuit; This plane mould moves to the second place; And take off the substrate that forms circuit.
6. according to circuit forming method claimed in claim 5, it is characterized in that, the method also includes: in described plane mould, move to after the described second place, more described plane mould is moved towards described primary importance by the described second place, for described substrate, impressed for the second time.
7. according to circuit forming method claimed in claim 5, it is characterized in that, described cylinder hot-press arrangement has a height adjustable elevating mechanism, and the method includes: corresponding to the thickness of described substrate, use described elevating mechanism to adjust the height of the described plane mould compression face of described cylinder distance.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102116142A TW201443720A (en) | 2013-05-07 | 2013-05-07 | Device for forming circuit on touch panel and circuit formation method |
| TW102116142 | 2013-05-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104144569A true CN104144569A (en) | 2014-11-12 |
Family
ID=51853608
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310362150.2A Pending CN104144569A (en) | 2013-05-07 | 2013-08-19 | Device for forming circuit on touch panel and circuit forming method |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN104144569A (en) |
| TW (1) | TW201443720A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0655827A (en) * | 1991-10-02 | 1994-03-01 | Matsushita Electric Ind Co Ltd | Print transfer method and offset printing machine to be used for that |
| US5343802A (en) * | 1991-10-02 | 1994-09-06 | Matsushita Electric Industrial Co., Ltd. | Offset printing method and offset printing machine for the same |
| DE19649116A1 (en) * | 1996-11-27 | 1998-05-28 | Gundokar Braumann | Housing or circuit board with conductive structure e.g. for computer housing |
| US20030181038A1 (en) * | 2002-03-19 | 2003-09-25 | Berg N. Edward | Process and apparatus for manufacturing printed circuit boards |
| CN102582297A (en) * | 2011-01-04 | 2012-07-18 | 罗伯特·博世有限公司 | Method used for manufacturing electronic circuit, printing roller and method for manufacturing the same |
| CN203399419U (en) * | 2013-05-07 | 2014-01-15 | 钟鑑基 | Device for forming circuit on touch panel |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI341983B (en) * | 2003-02-12 | 2011-05-11 | Nissha Printing | Touch panel |
| KR101156880B1 (en) * | 2010-02-26 | 2012-06-20 | 삼성전기주식회사 | The method and apparatus for the production of touch screen |
-
2013
- 2013-05-07 TW TW102116142A patent/TW201443720A/en not_active IP Right Cessation
- 2013-08-19 CN CN201310362150.2A patent/CN104144569A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0655827A (en) * | 1991-10-02 | 1994-03-01 | Matsushita Electric Ind Co Ltd | Print transfer method and offset printing machine to be used for that |
| US5343802A (en) * | 1991-10-02 | 1994-09-06 | Matsushita Electric Industrial Co., Ltd. | Offset printing method and offset printing machine for the same |
| DE19649116A1 (en) * | 1996-11-27 | 1998-05-28 | Gundokar Braumann | Housing or circuit board with conductive structure e.g. for computer housing |
| US20030181038A1 (en) * | 2002-03-19 | 2003-09-25 | Berg N. Edward | Process and apparatus for manufacturing printed circuit boards |
| CN102582297A (en) * | 2011-01-04 | 2012-07-18 | 罗伯特·博世有限公司 | Method used for manufacturing electronic circuit, printing roller and method for manufacturing the same |
| CN203399419U (en) * | 2013-05-07 | 2014-01-15 | 钟鑑基 | Device for forming circuit on touch panel |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201443720A (en) | 2014-11-16 |
| TWI469013B (en) | 2015-01-11 |
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|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20141112 |