CN104143690A - Manufacturing method for antenna - Google Patents
Manufacturing method for antenna Download PDFInfo
- Publication number
- CN104143690A CN104143690A CN201410375503.7A CN201410375503A CN104143690A CN 104143690 A CN104143690 A CN 104143690A CN 201410375503 A CN201410375503 A CN 201410375503A CN 104143690 A CN104143690 A CN 104143690A
- Authority
- CN
- China
- Prior art keywords
- antenna
- preparation
- dielectric substrate
- substrate
- electrocondution slurry
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title abstract description 11
- 239000000758 substrate Substances 0.000 claims abstract description 71
- 239000002002 slurry Substances 0.000 claims abstract description 66
- 238000010023 transfer printing Methods 0.000 claims abstract description 11
- 238000012546 transfer Methods 0.000 claims abstract description 7
- 239000011248 coating agent Substances 0.000 claims abstract description 4
- 238000000576 coating method Methods 0.000 claims abstract description 4
- 238000002360 preparation method Methods 0.000 claims description 35
- 239000003292 glue Substances 0.000 claims description 32
- 238000000034 method Methods 0.000 claims description 24
- 238000010521 absorption reaction Methods 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 8
- -1 polypropylene Polymers 0.000 claims description 8
- 239000003822 epoxy resin Substances 0.000 claims description 5
- 239000000945 filler Substances 0.000 claims description 5
- 230000005404 monopole Effects 0.000 claims description 5
- 229920000647 polyepoxide Polymers 0.000 claims description 5
- 229920001577 copolymer Polymers 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- 229920000058 polyacrylate Polymers 0.000 claims description 4
- 239000004814 polyurethane Substances 0.000 claims description 4
- 229920002635 polyurethane Polymers 0.000 claims description 4
- 239000002202 Polyethylene glycol Substances 0.000 claims description 3
- XNGIFLGASWRNHJ-UHFFFAOYSA-N o-dicarboxybenzene Natural products OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000003960 organic solvent Substances 0.000 claims description 3
- 229920001223 polyethylene glycol Polymers 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 3
- 238000001179 sorption measurement Methods 0.000 claims description 3
- 229920002302 Nylon 6,6 Polymers 0.000 claims description 2
- 239000004698 Polyethylene Substances 0.000 claims description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 2
- 239000004743 Polypropylene Substances 0.000 claims description 2
- 239000004793 Polystyrene Substances 0.000 claims description 2
- 229920001400 block copolymer Polymers 0.000 claims description 2
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- 229920000728 polyester Polymers 0.000 claims description 2
- 229920000573 polyethylene Polymers 0.000 claims description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 2
- 229920001155 polypropylene Polymers 0.000 claims description 2
- 229920002223 polystyrene Polymers 0.000 claims description 2
- 239000004800 polyvinyl chloride Substances 0.000 claims description 2
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 2
- 229920005573 silicon-containing polymer Polymers 0.000 claims description 2
- 229920001971 elastomer Polymers 0.000 abstract description 6
- 239000011230 binding agent Substances 0.000 abstract description 3
- 238000012856 packing Methods 0.000 abstract 2
- 239000011347 resin Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 19
- 238000007639 printing Methods 0.000 description 10
- 229910052709 silver Inorganic materials 0.000 description 10
- 239000004332 silver Substances 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 239000002245 particle Substances 0.000 description 7
- 238000002474 experimental method Methods 0.000 description 6
- 238000011031 large-scale manufacturing process Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- 239000011231 conductive filler Substances 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 239000002159 nanocrystal Substances 0.000 description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 3
- 239000004926 polymethyl methacrylate Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 230000032683 aging Effects 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- OIFBSDVPJOWBCH-UHFFFAOYSA-N Diethyl carbonate Chemical compound CCOC(=O)OCC OIFBSDVPJOWBCH-UHFFFAOYSA-N 0.000 description 1
- KMTRUDSVKNLOMY-UHFFFAOYSA-N Ethylene carbonate Chemical compound O=C1OCCO1 KMTRUDSVKNLOMY-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- JCOZRYLPDMUROC-UHFFFAOYSA-N [N].CNC=O Chemical compound [N].CNC=O JCOZRYLPDMUROC-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- IEJIGPNLZYLLBP-UHFFFAOYSA-N dimethyl carbonate Chemical compound COC(=O)OC IEJIGPNLZYLLBP-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 208000010727 head pressing Diseases 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000011112 process operation Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
Landscapes
- Details Of Aerials (AREA)
Abstract
The invention discloses a manufacturing method for an antenna. The manufacturing method includes the following step of (1) slurrying, wherein metallic packing and a resin binding agent are fully stirred and mixed to manufacture electric conduction slurry, wherein the mass fraction of the metallic packing is 50-80%; the step of (2) coating, wherein a groove of a substrate is filled with the electric conduction slurry and is in an antenna pattern shape; the step of (3) adsorbing, wherein the electric conduction slurry in the groove is adsorbed to the surface of a rubber head through the rubber head, and the rubber head can cover the area where the groove is located due to the enough superficial area; the step of (4) transfer printing, wherein the electric conduction slurry on the surface of the rubber head is printed on the dielectric substrate of the antenna in a transfer mode, so that electric conduction network patterns are formed on the surface of the dielectric substrate of the antenna; the step of (5) solidifying, wherein the dielectric substrate of the antenna is solidified for 0.25 h-2 h in the environment at the temperature of 60 DEG C-250 DEG C, and the electric conduction slurry is solidified to obtain the antenna finally. According to the manufacturing method for the antenna, the manufacturing process is simple and easy to control, the cost is low, and the manufacturing method is suitable for mass production.
Description
[technical field]
The present invention relates to a kind of preparation method of antenna.
[background technology]
Current electronic communication is just towards wireless, miniaturization and portable future development.For a lot of article objects, people wish to carry out rapidly and identification accurately, and the read-write of the information of carrying out.But traditional bar code inclusion information amount is few, and reading efficiency is low; By contrast, adopt REID in a wider context, in shorter time, to read more information.
RFID tag forms by the chip as information carrier with as the antenna that signal transmitting receives medium conventionally.Common antenna has two-dimensional antenna, is printed in one plane, connects chip and forms RFID tag.During the preparation of two-dimensional antenna, conventionally adopt the methods such as platings-etching, mechanical stamping, silk screen printing, at the upper formation antenna pattern of two dimensional surface dielectric substrate film (as polyethylene glycol phthalic acid ester film, i.e. PET film), make two-dimensional antenna.It is comparatively loaded down with trivial details that the method relates to operation, and manufacturing speed is slower, is not suitable for large-scale production.And this printing preparing two-dimentional configuration antenna in the plane, be difficult to technically guarantee the radiofrequency signal of all directions to make correct response, easily there is skip or mispronounce.
Along with the development of technology, there is signal response performance to be better than the dimensional antenna of two-dimensional antenna.Dimensional antenna realizes by the simple bending of metal material traditionally, but this method make efficiency is lower, and is not suitable for the preparation of miniature antenna.In recent years, the way that foreign scholar also proposes to print electrically conductive ink on curved surface realizes preparation dimensional antenna, also has subsequently scholar to propose on the substrate of 3D shape transfer printing metal and adds and electroplate or the method for evaporation is also successfully prepared three-dimensional omni-directional monopole antenna.In addition, at three-dimensional substrate electroplating surface metal, in conjunction with certain photoetching process, can realize the preparation of dimensional antenna equally, but these methods are because manufacturing speed causes the cost of manufacture of antenna higher more slowly, are not suitable for large-scale production.
[summary of the invention]
Technical problem to be solved by this invention is: make up above-mentioned the deficiencies in the prior art, propose a kind of preparation method of antenna, operation is simple and easy, with low cost, is applicable to large-scale production.
Technical problem of the present invention is solved by following technical scheme:
A preparation method for antenna, comprises the following steps: 1) slurrying step: metallic stuffing and resinoid bond are fully uniformly mixed, make metallic stuffing mass fraction at the electrocondution slurry of 50%～80% scope; 2) coating step: described electrocondution slurry is filled in the groove of substrate, the groove of described substrate is antenna pattern shape; 3) adsorption step: adopt glue head the electrocondution slurry in described groove to be adhered to the surface of described glue head, the surface area of described glue head enough cover the region at fluted place; 4) transfer step: the electrocondution slurry of described glue head surface is transferred in antenna dielectric substrate, thereby forms conductive network pattern on described antenna dielectric substrate surface; 5) curing schedule: described antenna dielectric substrate is placed in the temperature environment of 60 ℃～250 ℃ and solidifies 0.25～2h, described electrocondution slurry is solidified, finally make antenna.
The beneficial effect that the present invention is compared with the prior art is:
Antenna preparation method of the present invention, preparing suitable electrocondution slurry is filled in substrate recess, groove arrangement becomes antenna pattern shape, the glue head of using by transfer printing is transferred to slurry in the dielectric substrate of two dimension or three-dimensional, slurry in dielectric substrate solidifies under uniform temperature condition, form seepage flow, the final conduction that realizes.Realized by this method the preparation of antenna, preparation process is simple and easy to control, with low cost, is applicable to large-scale production, is especially applicable to the preparation of dimensional antenna.And, thereby adhere to by glue head the process that slurry transfer printing forms antenna conductive network in dielectric substrate, the thickness that can keep preferably the pattern of conductive pattern and can conveniently control conductive network is at 10～50 microns, makes the antenna that makes better to the transmitting receptivity of radiofrequency signal.
[accompanying drawing explanation]
Fig. 1 is the schematic diagram of the antenna preparation process of the specific embodiment of the invention;
Fig. 2 is the shape schematic diagram of pattern of the surface transfer of the antenna that makes in the experiment 1 of the specific embodiment of the invention;
Fig. 3 is the S11 return loss plot of the antenna that makes in the experiment 1 of the specific embodiment of the invention;
Fig. 4 is the shape schematic diagram of pattern of the surface transfer of the antenna that makes in the experiment 2 of the specific embodiment of the invention;
Fig. 5 is the S11 return loss plot of the antenna that makes in the experiment 2 of the specific embodiment of the invention;
Fig. 6 is the shape schematic diagram of pattern of the surface transfer of the antenna that makes in the experiment 3 of the specific embodiment of the invention;
Fig. 7 is the S11 return loss plot of the antenna that makes in the experiment 3 of the specific embodiment of the invention.
[embodiment]
Below in conjunction with embodiment and contrast accompanying drawing the present invention is described in further details.
As shown in Figure 1, be the schematic diagram of the antenna preparation process of this embodiment.In conjunction with the process of Fig. 1 signal, the preparation method of antenna comprises the following steps:
1) preparation of electrocondution slurry.This embodiment electrocondution slurry used comprises metallic conduction filler and resinoid bond, and both mix by a certain percentage and fully stir, and get rid of the bubble in slurry as far as possible.In electrocondution slurry, the mass fraction of metallic stuffing is in 50%～80% scope.Particularly, for ag material, conductive filler accounts for 50%～80% of electrocondution slurry gross mass; And for copper product, conductive filler accounts for 70%～80% of electrocondution slurry gross mass.
Wherein, metallic conduction filler comprises silver powder particles, micron silver strip, copper powder particle, micron copper sheet, NANO CRYSTAL COPPER WIRE, one or more mixing in the silver-colored copper-clad particle of micron, the silver-colored copper-clad sheet of micron.Preferably, metallic stuffing is that micron order metallic stuffing and nano level metal filler (as nano-silver thread, nano-Ag particles, NANO CRYSTAL COPPER WIRE, nano copper particle) mix.Like this, and nanometer grade gold metal particles (as nano-silver thread, nano-Ag particles, NANO CRYSTAL COPPER WIRE, nano copper particle) there is at a lower temperature sintering, can reduce the contact resistance between micron order metallic stuffing, thereby can improve the conductivity of slurry, improving multiple is 1～2 times.
Wherein, resinoid bond comprises epoxy resin, the copolymer of one or more in polyacrylate, polyester, polyurethane, mixture, block copolymer.
Wherein, in electrocondution slurry, also can add organic solvent adjustment electrocondution slurry viscosity.Described organic solvent is one or more the mixing in ethylene glycol, glycerol, dimethyl carbonate, diethyl carbonate, ethylene carbonate, nitrogen-methylformamide, n-methlpyrrolidone, acetonitrile, methylethylketone, cyclohexanone, caprolactam, diethylene glycol.
2) coating step: described electrocondution slurry is filled in the groove of substrate, the groove of described substrate is antenna pattern shape.In this step, antenna pattern when antenna pattern can be corresponding preparation two-dimensional antenna, for follow-up preparation two-dimensional antenna.Antenna pattern while also can be corresponding preparation dimensional antenna, as spiral antenna pattern, for follow-up preparation dimensional antenna.
In this embodiment, the technique as shown in Fig. 1 top, is coated in substrate 300 surfaces by electrocondution slurry 100, makes its cover antenna pattern.Then movable scraper 400, the slurry of substrate surface is scraped from substrate, thereby only had the slurry in the groove of antenna pattern in substrate to be retained, and conductive filler is only filled in the groove of substrate.
3) adsorption step: adopt glue head the electrocondution slurry in described groove to be adhered to the surface of described glue head, the surface area of described glue head enough cover the region at fluted place.
In this embodiment, technique as shown in Fig. 1 lower right, glue head 500 is moved to directly over the antenna pattern groove of substrate 300, by air compressor (not shown in the figures meaning out), pressurize, glue head 500 is along substrate vertical direction toward pressing down (as shown by arrow A), glue head is generally flexible material, as rubber or silica gel, under pressurization situation, slurry close contact in the distortion of glue head and groove, thereby the electrocondution slurry in absorption groove, then glue head 500 is vertically mentioned (as shown by arrow B), thereby the electrocondution slurry in groove 100 is adhered to the surface of glue head 500.
4) transfer step: the electrocondution slurry of described glue head surface is transferred in antenna dielectric substrate, thereby forms conductive network pattern on described antenna dielectric substrate surface.
Wherein, antenna dielectric substrate is generally hard material, and base material is Merlon, polyacrylate, polyurethane, polypropylene, polyethylene, polyphenylene sulfide, poly-(butadiene-styrene) copolymer, polystyrene, dimethyl silicone polymer, nylon 66, polyethylene glycol phthalic acid ester, polyvinyl chloride, glass or pottery.
In this embodiment, for preparing the situation of three-dimensional omni-directional monopole antenna, antenna dielectric substrate is the dielectric substrate of semi-spherical shape or half-oval shaped.Technique as shown in Fig. 1 lower left, glue head 500 is moved to directly over hemisphere substrate 700, by air compressor, pressurize, glue head 500 is along hemisphere substrate 700 vertical directions toward pressing down, soft glue head 500 produces distortion, with hemisphere substrate 700 close contacts, thereby the electrocondution slurry that is adsorbed on glue head 500 surfaces is transferred to the surface of hemisphere substrate 700.Although be the preparation process of dimensional antenna in this embodiment, operation during preparation two-dimensional antenna is also similar, and just antenna dielectric substrate is two dimensional surface shape.
5) curing schedule: described antenna dielectric substrate is placed in the temperature environment of 60 ℃～250 ℃ and solidifies 0.25～2h, described electrocondution slurry is solidified, finally make antenna.
In this step (not illustrating in Fig. 1), be that hemisphere substrate 700 that surface is printed on to electrocondution slurry is placed in the temperature environment of 60 ℃～250 ℃ and solidifies 0.25～2h, curing temperature is lower, and required time is longer.Generally speaking, at 150 ℃ of temperature, solidify 15min and just can make electrocondution slurry solidify, form conductive network, finally make the three-dimensional omni-directional monopole antenna of semi-spherical shape.Curing control by certain hour length within the scope of said temperature, can make comparatively stable conductive network.Conductive network resistivity is 10
-6～10
-3the Ω cm order of magnitude, it is after accelerated ageing in 1000 hours test, and its conductive characteristic still can remain unchanged substantially.Wherein, accelerated ageing test condition is 85 ℃, 85%RH (relative humidity).
By above-mentioned five steps, in this embodiment, make three-dimensional omni-directional monopole antenna.Owing to being fabricated on a hemisphere face, it all can respond to signal in all directions on sphere, has overcome preferably the shortcoming of the directional selectivity of two-dimensional antenna.
It should be noted that: this embodiment is a kind of brand-new method of preparing antenna that is different from prior art, the setting of parameter in preparation process, the setting of step is not easily expected, has following 2 points in should be noted that:
(1) electrocondution slurry is the material foundation of preparing antenna in this embodiment, its effect is mainly to construct conducting wire on two dimension or three-dimensional dielectric substrate surface, make its electromagnetic wave to a certain characteristic frequency have response, or the electromagnetic radiation energy of a certain frequency by this conductive network to external radiation, this just has certain requirement to the conductivity of electrocondution slurry.Certainly, in electrocondution slurry, the concentration of metallic stuffing is higher, is more conducive to improve the conductivity of antenna, but the electrocondution slurry of high concentration, and its sliminess is corresponding raising also.For step 3) absorption, step and the step 4 of printed conductive patterns) transfer printing process, the slurry that viscosity is high has stronger absorption in substrate recess, the slurry being adsorbed onto in printing process on shift printing rubber head will reduce relatively, and then also corresponding reducing of for example, slurry in dielectric substrate (hemisphere face), and be unfavorable for conduction.Through research, can be preferably when just in definite electrocondution slurry, the mass content of metallic stuffing is in 50%～80% scope by absorption print, transfer-print technology forms conductive network in dielectric substrate.
(2) antenna in this embodiment is realized by transfer-print technology, this printing, the concrete substrate that only needs to be fixedly carved with antenna pattern groove of bat printing technique, glue head and dielectric substrate that bat printing is used, on substrate antenna figure connected in star, apply and fill electrocondution slurry, then by air compressor, provide pressure for the glue head pressing down, make glue head surface and electrocondution slurry close contact, thus absorption electrocondution slurry.During transfer printing, again by the pressure of air compressor, the slurry on glue head is transferred to dielectric substrate surface.Whole process operation is simple, convenient and swift, can automation realize printing overall process, is applicable to large-scale production.Be printed on the lip-deep electrocondution slurry of dielectric substrate solidify as last non-conductive, but under uniform temperature condition, heat-treat, make adhesive cures, binding agent volume contraction in solidification process, contact probability between filler improves greatly, forms seepage flow, the final conduction that realizes.The curing temperature of the electrocondution slurry in this embodiment is arranged in the scope of 60 ℃～250 ℃, on the one hand, while solidifying in this temperature range, effective cured binders, guarantee final solidify to realize conduct electricity.On the other hand, this temperature range, lower than the melting temperature of dielectric substrate material, realizes solidify constantly same, and it is stable that the shape of dielectric substrate material keeps, and can not affect change antenna pattern.
This embodiment is prepared the method for antenna, and preparation process is simple and easy to control, with low cost, is applicable to large-scale production, is especially applicable to the preparation of dimensional antenna.And, thereby by glue head, adhere to the process that slurry transfer printing forms antenna conductive network in dielectric substrate, can keep preferably the pattern of conductive pattern, make the antenna that makes better to the transmitting receptivity of radiofrequency signal.In addition, thereby this embodiment can also be controlled by controlling the viscosity of electrocondution slurry the thickness of conductive network in dielectric substrate, the thickness of the conductive network of the antenna that realization makes is in the scope of 10～50 microns, with respect to only making thinner conductive network in prior art, in this embodiment, can make thicker conductive network and can control effectively to thickness, thereby further making the antenna that makes better to the transmitting receptivity of radiofrequency signal.The antenna that this embodiment makes can be by regulating antenna pattern shape, and as pin number, each pin spiral number of turns and pin mean breadth are adjusted the response frequency of antenna, realize the electromagnetic wave of 0.6～6GHz frequency range is produced to response.
As follows by the performance of the antenna that concrete this embodiment of experimental verification makes is set:
Test 1: two pin dimensional antenna
1.8 grams of flake silver powders and 1.8 grams of epoxy resin are fully uniformly mixed, obtain the conductive silver paste that silver content is 50 % by weight, by above-mentioned steps 2) to 4) absorption bat printing technique prepared conductive silver paste is printed to a PMMA hemisphere dielectric substrate surface, half bulb diameter is 24 millimeters.Being illustrated in figure 2 the shape of the pattern of hemisphere surface transfer printing, is two pins helical antenna shape, and the spiral number of turns of each pin is 2.6 circles, and the mean breadth of pin is 1.0mm.Be printed on the hemisphere dielectric substrate of antenna pattern after 150 ℃ solidify, hemisphere surface silver slurry forms conductive network, and whole hemisphere forms three-dimensional two pin helical antennas.By pin ground connection of antenna, another one pin, by 50 ohm of connecting line interconnection network analyzers, is measured the S11 return loss of antenna, and result as shown in Figure 3.There is stronger response in antenna, according to transverse axis frequency in figure and longitudinal axis amplitude information, calculating respective bandwidth and Q value is respectively 13% and 15.3 in 1.38GHz position.
Test 2: three pin dimensional antenna
3.6 grams of flake silver powders and 1.8 grams of epoxy resin are fully uniformly mixed, obtain the conductive silver paste that silver content is 66.7 % by weight, by above-mentioned steps 2) to 4) absorption bat printing technique prepared conductive silver paste is printed to a PMMA hemisphere dielectric substrate surface, half bulb diameter is 24 millimeters.Being illustrated in figure 4 the shape of the pattern of hemisphere surface transfer printing, is three pin helical antenna shapes, and the spiral number of turns of each pin is 1.1 circles, and the mean breadth of pin is 2.0mm.Be printed on the hemisphere dielectric substrate of antenna pattern after 150 ℃ solidify, hemisphere surface silver slurry forms conductive network, and whole hemisphere forms three-dimensional three pin helical antennas.By pin ground connection of antenna, another one pin, by 50 ohm of connecting line interconnection network analyzers, is measured the S11 return loss of antenna, and result as shown in Figure 5.There is stronger response in antenna, according to transverse axis frequency in figure and longitudinal axis amplitude information, calculating respective bandwidth and Q value is respectively 7.1% and 28.2 in 1.28GHz position.
Test 3: four pin dimensional antenna
5.4 grams of flake silver powders and 1.8 grams of epoxy resin are fully uniformly mixed, obtain the conductive silver paste that silver content is 75 % by weight, by above-mentioned steps 2) to 4) absorption bat printing technique prepared conductive silver paste is printed to a PMMA hemisphere dielectric substrate surface, half bulb diameter is 24 millimeters.Being illustrated in figure 6 the shape of the pattern of hemisphere surface transfer printing, is four pin helical antenna shapes, and the spiral number of turns of pin is 0.9 circle, and the mean breadth of pin is 1.5mm.Be printed on the hemisphere dielectric substrate of antenna pattern after 150 ℃ solidify, hemisphere surface silver slurry forms conductive network, and whole hemisphere forms three-dimensional four pin helical antennas.By pin ground connection of antenna, another one pin, by 50 ohm of connecting line interconnection network analyzers, is measured the S11 return loss of antenna, and result as shown in Figure 7.There is stronger response in antenna, according to transverse axis frequency in figure and longitudinal axis amplitude information, calculating respective bandwidth and Q value is respectively 23.1% and 8.7 in 1.70GHz position.
Above content is in conjunction with concrete preferred implementation further description made for the present invention, can not assert that specific embodiment of the invention is confined to these explanations.For general technical staff of the technical field of the invention, make without departing from the inventive concept of the premise some substituting or obvious modification, and performance or purposes identical, all should be considered as belonging to protection scope of the present invention.
Claims (10)
1. a preparation method for antenna, is characterized in that: comprise the following steps:
1) slurrying step: metallic stuffing and resinoid bond are fully uniformly mixed, make metallic stuffing mass fraction at the electrocondution slurry of 50%～80% scope;
2) coating step: described electrocondution slurry is filled in the groove of substrate, the groove of described substrate is antenna pattern shape;
3) adsorption step: adopt glue head the electrocondution slurry in described groove to be adhered to the surface of described glue head, the surface area of described glue head enough cover the region at fluted place;
4) transfer step: the electrocondution slurry of described glue head surface is transferred in antenna dielectric substrate, thereby forms conductive network pattern on described antenna dielectric substrate surface;
5) curing schedule: described antenna dielectric substrate is placed in the temperature environment of 60 ℃～250 ℃ and solidifies 0.25～2h, described electrocondution slurry is solidified, finally make antenna.
2. the preparation method of antenna according to claim 1, is characterized in that: described step 2), antenna pattern is three-dimensional spiral antenna pattern; Described step 4) in, antenna dielectric substrate is the dielectric substrate of semi-spherical shape or half-oval shaped; Described step 5) antenna finally making in is three-dimensional omni-directional monopole antenna.
3. the preparation method of antenna according to claim 1, it is characterized in that: absorption and described step 4 described step 3)) during middle transfer printing, described glue head is vertically toward pressing down, and pressurize by air compressor, make described glue head and described groove or described antenna dielectric substrate close contact, thereby electrocondution slurry is adhered to the surface of described glue head, or electrocondution slurry is transferred in antenna dielectric substrate.
4. the preparation method of antenna according to claim 1, it is characterized in that: described step 2), described electrocondution slurry is coated on substrate, adopts doctor blade substrate surface, thereby the slurry of described substrate surface is scraped from substrate, and slurry is only filled in the groove of substrate.
5. the preparation method of antenna according to claim 1, is characterized in that: described step 1), described metallic stuffing is the metallic stuffing being mixed to get by micron order metallic stuffing and nano level metal filler.
6. the preparation method of antenna according to claim 1, is characterized in that: described step 1), described resinoid bond is one or more copolymer, mixture, the block copolymer in epoxy resin, polyacrylate, polyester, polyurethane.
7. the preparation method of antenna according to claim 1, is characterized in that: described step 1), also comprise the process of adding organic solvent adjustment electrocondution slurry viscosity.
8. the preparation method of antenna according to claim 1, it is characterized in that: described step 4), the material of antenna dielectric substrate is Merlon, polyacrylate, polyurethane, polypropylene, polyethylene, polyphenylene sulfide, poly-(butadiene-styrene) copolymer, polystyrene, dimethyl silicone polymer, nylon 66, polyethylene glycol phthalic acid ester, polyvinyl chloride, glass or pottery.
9. the preparation method of antenna according to claim 1, is characterized in that: described step 5), the thickness of the conductive network pattern of described antenna is 10～50 microns.
10. the preparation method of antenna according to claim 1, is characterized in that: described step 5), described antenna produces response to the electromagnetic wave of 0.6～6GHz frequency range.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410375503.7A CN104143690A (en) | 2014-07-31 | 2014-07-31 | Manufacturing method for antenna |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410375503.7A CN104143690A (en) | 2014-07-31 | 2014-07-31 | Manufacturing method for antenna |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104143690A true CN104143690A (en) | 2014-11-12 |
Family
ID=51852815
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410375503.7A Pending CN104143690A (en) | 2014-07-31 | 2014-07-31 | Manufacturing method for antenna |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104143690A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105990675A (en) * | 2015-02-27 | 2016-10-05 | 赖中平 | Wireless antenna made of conductive ink without adhesive |
| CN107104521A (en) * | 2017-05-03 | 2017-08-29 | 西安电子科技大学 | A kind of nano-antenna design method based on solar energy collecting |
| CN109121331A (en) * | 2014-12-26 | 2019-01-01 | 比亚迪股份有限公司 | Communication apparatus metal shell and preparation method thereof |
| CN111860736A (en) * | 2019-04-30 | 2020-10-30 | 北京梦之墨科技有限公司 | Fabric label and manufacturing method thereof |
| CN111987175A (en) * | 2020-09-01 | 2020-11-24 | 深圳纳弘熠岦光学科技有限公司 | Transfer printing method of solar cell grid line and solar cell |
| CN112060750A (en) * | 2020-09-01 | 2020-12-11 | 深圳纳弘熠岦光学科技有限公司 | Method for constructing electrode grid line of solar cell |
| CN113394555A (en) * | 2020-03-13 | 2021-09-14 | 昆山哈勃电波电子科技有限公司 | Method for preparing antenna by adopting TDP silver paste transfer printing process |
| CN113561642A (en) * | 2021-07-08 | 2021-10-29 | Tcl华星光电技术有限公司 | Paste pad printing mechanism |
| CN114715842A (en) * | 2022-04-07 | 2022-07-08 | 西安交通大学 | Low-dimensional material transfer medium, preparation method and transfer method |
| CN115348743A (en) * | 2022-09-19 | 2022-11-15 | 广东绿展科技有限公司 | Method for printing circuit on curved carrier and curved printed circuit |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1784776A (en) * | 2003-11-11 | 2006-06-07 | 东丽工程株式会社 | Non-contact ID card and manufacturing method thereof |
| CN101488196A (en) * | 2004-02-23 | 2009-07-22 | 关卡系统股份有限公司 | Security tag and method for fabricating a tag |
| CN101888014A (en) * | 2009-05-12 | 2010-11-17 | 株式会社普罗威顿 | IC tag with antenna with and manufacture method |
| CN102280694A (en) * | 2010-04-27 | 2011-12-14 | 三美电机株式会社 | Patch antenna and method of making patch antenna |
| CN102290632A (en) * | 2010-06-15 | 2011-12-21 | 深圳富泰宏精密工业有限公司 | Electronic device shell and manufacturing method thereof |
| CN102437415A (en) * | 2010-08-12 | 2012-05-02 | 三管有限公司 | Method for manufacturing antenna by sintering metal and antenna manufactured by the method |
-
2014
- 2014-07-31 CN CN201410375503.7A patent/CN104143690A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1784776A (en) * | 2003-11-11 | 2006-06-07 | 东丽工程株式会社 | Non-contact ID card and manufacturing method thereof |
| CN101488196A (en) * | 2004-02-23 | 2009-07-22 | 关卡系统股份有限公司 | Security tag and method for fabricating a tag |
| CN101888014A (en) * | 2009-05-12 | 2010-11-17 | 株式会社普罗威顿 | IC tag with antenna with and manufacture method |
| CN102280694A (en) * | 2010-04-27 | 2011-12-14 | 三美电机株式会社 | Patch antenna and method of making patch antenna |
| CN102290632A (en) * | 2010-06-15 | 2011-12-21 | 深圳富泰宏精密工业有限公司 | Electronic device shell and manufacturing method thereof |
| CN102437415A (en) * | 2010-08-12 | 2012-05-02 | 三管有限公司 | Method for manufacturing antenna by sintering metal and antenna manufactured by the method |
Non-Patent Citations (1)
| Title |
|---|
| 王荣兵: "球面螺旋天线的研究和设计", 《西安电子科技大学硕士学位论文》 * |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109121331A (en) * | 2014-12-26 | 2019-01-01 | 比亚迪股份有限公司 | Communication apparatus metal shell and preparation method thereof |
| CN105990675A (en) * | 2015-02-27 | 2016-10-05 | 赖中平 | Wireless antenna made of conductive ink without adhesive |
| CN107104521A (en) * | 2017-05-03 | 2017-08-29 | 西安电子科技大学 | A kind of nano-antenna design method based on solar energy collecting |
| CN111860736A (en) * | 2019-04-30 | 2020-10-30 | 北京梦之墨科技有限公司 | Fabric label and manufacturing method thereof |
| CN111860736B (en) * | 2019-04-30 | 2023-11-03 | 北京梦之墨科技有限公司 | Fabric label and manufacturing method thereof |
| CN113394555A (en) * | 2020-03-13 | 2021-09-14 | 昆山哈勃电波电子科技有限公司 | Method for preparing antenna by adopting TDP silver paste transfer printing process |
| CN112060750A (en) * | 2020-09-01 | 2020-12-11 | 深圳纳弘熠岦光学科技有限公司 | Method for constructing electrode grid line of solar cell |
| CN112060750B (en) * | 2020-09-01 | 2022-03-11 | 深圳纳弘熠岦光学科技有限公司 | Method for constructing electrode grid line of solar cell |
| CN111987175A (en) * | 2020-09-01 | 2020-11-24 | 深圳纳弘熠岦光学科技有限公司 | Transfer printing method of solar cell grid line and solar cell |
| CN113561642A (en) * | 2021-07-08 | 2021-10-29 | Tcl华星光电技术有限公司 | Paste pad printing mechanism |
| CN114715842A (en) * | 2022-04-07 | 2022-07-08 | 西安交通大学 | Low-dimensional material transfer medium, preparation method and transfer method |
| CN115348743A (en) * | 2022-09-19 | 2022-11-15 | 广东绿展科技有限公司 | Method for printing circuit on curved carrier and curved printed circuit |
| CN115348743B (en) * | 2022-09-19 | 2024-05-10 | 广东绿展科技有限公司 | Method for printing circuit on curved carrier and curved printed circuit |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104143690A (en) | Manufacturing method for antenna | |
| CN203967239U (en) | An inkjet printed all-paper UHF RFID antenna | |
| CN107146652B (en) | Copper conductive slurry and preparation method and application thereof | |
| CN201780602U (en) | Small-size high-gain electronic tag | |
| CN106782757A (en) | A kind of printable flexible conductive paste and its conductive circuit and preparation method | |
| CN109841426B (en) | Graphene-based flexible electrode and preparation method thereof | |
| CN112805340A (en) | High conductivity printable inks for highly stretchable soft electronics | |
| CN104505265A (en) | A method of manufacturing micro-supercapacitors using 3D printing technology | |
| CN109786027A (en) | The preparation method of high conductivity base metal thick film conductive paste | |
| CN202333136U (en) | Small-sized radio-frequency antenna molded through three-dimensional printing | |
| CN104885576B (en) | Flexible printed circuit substrate and its manufacture method | |
| CN106455311A (en) | Method for manufacturing double-sided flexible circuit by laser printing | |
| CN111814941A (en) | A screen-printed NFC fabric antenna tag | |
| CN101335374B (en) | Connection method for bridge of electronic label antenna | |
| CN102118918A (en) | Flexible transparent electronic circuit and preparation method thereof | |
| CN103473594B (en) | Flexible stretchable electronic tag and preparation method thereof | |
| CN107480753B (en) | Printed antenna label and manufacturing method thereof | |
| CN103022664B (en) | Three-dimensional antenna manufacture method | |
| CN102693447A (en) | A kind of manufacturing method of ultra-high frequency electronic label and ultra-high frequency electronic label | |
| CN106550548A (en) | Laser printing forming method of flexible circuit | |
| KR20100080109A (en) | Method for fabricating loop antenna | |
| CN203340402U (en) | Structure for strengthening surface contract strength of electronic circuit | |
| Cai et al. | High-performance electrically conductive adhesives with aluminum-doped zinc oxide (AZO) for various flexible electronic devices | |
| CN201503719U (en) | Polyimide insulation hot-melt adhesive film structure of FFC | |
| CN101335376B (en) | A kind of preparation method of electronic tag antenna |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20141112 |
|
| RJ01 | Rejection of invention patent application after publication |