CN104137231A - Adhesive tape film, and adhesive tape - Google Patents
Adhesive tape film, and adhesive tape Download PDFInfo
- Publication number
- CN104137231A CN104137231A CN201380011399.7A CN201380011399A CN104137231A CN 104137231 A CN104137231 A CN 104137231A CN 201380011399 A CN201380011399 A CN 201380011399A CN 104137231 A CN104137231 A CN 104137231A
- Authority
- CN
- China
- Prior art keywords
- adhesive tape
- methyl
- film
- adhesive
- acrylic acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002390 adhesive tape Substances 0.000 title claims abstract description 153
- 239000012790 adhesive layer Substances 0.000 claims abstract description 132
- 239000002985 plastic film Substances 0.000 claims abstract description 45
- 229920006255 plastic film Polymers 0.000 claims abstract description 45
- -1 polysiloxanes Polymers 0.000 claims description 117
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical class CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 115
- 229920000642 polymer Polymers 0.000 claims description 115
- 229920001296 polysiloxane Polymers 0.000 claims description 63
- 239000000853 adhesive Substances 0.000 claims description 61
- 230000001070 adhesive effect Effects 0.000 claims description 61
- 239000004065 semiconductor Substances 0.000 claims description 28
- 230000003746 surface roughness Effects 0.000 claims description 23
- 238000005520 cutting process Methods 0.000 claims description 20
- 238000012360 testing method Methods 0.000 claims description 19
- 239000010410 layer Substances 0.000 claims description 18
- 238000005191 phase separation Methods 0.000 claims description 13
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 12
- 239000004800 polyvinyl chloride Substances 0.000 claims description 12
- 238000003754 machining Methods 0.000 claims description 10
- 238000002156 mixing Methods 0.000 claims description 5
- 239000000758 substrate Substances 0.000 abstract 3
- 230000000903 blocking effect Effects 0.000 abstract 1
- 239000010408 film Substances 0.000 description 107
- 239000000178 monomer Substances 0.000 description 62
- NIXOWILDQLNWCW-UHFFFAOYSA-N Acrylic acid Chemical class OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 49
- 239000002585 base Substances 0.000 description 42
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 32
- 239000003431 cross linking reagent Substances 0.000 description 25
- 238000004519 manufacturing process Methods 0.000 description 21
- 239000000463 material Substances 0.000 description 21
- 238000000034 method Methods 0.000 description 20
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 18
- 239000004014 plasticizer Substances 0.000 description 18
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 16
- 238000011156 evaluation Methods 0.000 description 16
- 239000013078 crystal Substances 0.000 description 15
- 230000000694 effects Effects 0.000 description 14
- 238000010438 heat treatment Methods 0.000 description 13
- 238000004873 anchoring Methods 0.000 description 12
- 229910052799 carbon Inorganic materials 0.000 description 12
- 239000003054 catalyst Substances 0.000 description 12
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 11
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 11
- 125000000217 alkyl group Chemical group 0.000 description 11
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 11
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 10
- 125000005250 alkyl acrylate group Chemical group 0.000 description 10
- 125000000753 cycloalkyl group Chemical group 0.000 description 10
- 238000010200 validation analysis Methods 0.000 description 10
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 239000003795 chemical substances by application Substances 0.000 description 8
- 238000004132 cross linking Methods 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 8
- 238000012545 processing Methods 0.000 description 8
- 238000010521 absorption reaction Methods 0.000 description 7
- 229920001577 copolymer Polymers 0.000 description 7
- 229920000728 polyester Polymers 0.000 description 7
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 238000005267 amalgamation Methods 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 6
- 150000002148 esters Chemical class 0.000 description 6
- 230000009477 glass transition Effects 0.000 description 6
- XNGIFLGASWRNHJ-UHFFFAOYSA-N o-dicarboxybenzene Natural products OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 6
- 239000000523 sample Substances 0.000 description 6
- 238000001179 sorption measurement Methods 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 6
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- 230000000007 visual effect Effects 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 4
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 4
- 229910002601 GaN Inorganic materials 0.000 description 4
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 4
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 4
- 229910019142 PO4 Inorganic materials 0.000 description 4
- 229920002367 Polyisobutene Polymers 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical class [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 230000000996 additive effect Effects 0.000 description 4
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 4
- XXROGKLTLUQVRX-UHFFFAOYSA-N allyl alcohol Chemical compound OCC=C XXROGKLTLUQVRX-UHFFFAOYSA-N 0.000 description 4
- 238000004458 analytical method Methods 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000002788 crimping Methods 0.000 description 4
- 230000006378 damage Effects 0.000 description 4
- 230000000254 damaging effect Effects 0.000 description 4
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 4
- 239000011259 mixed solution Substances 0.000 description 4
- 230000000877 morphologic effect Effects 0.000 description 4
- GYDSPAVLTMAXHT-UHFFFAOYSA-N pentyl 2-methylprop-2-enoate Chemical compound CCCCCOC(=O)C(C)=C GYDSPAVLTMAXHT-UHFFFAOYSA-N 0.000 description 4
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 4
- 235000021317 phosphate Nutrition 0.000 description 4
- 229910010271 silicon carbide Inorganic materials 0.000 description 4
- 230000002269 spontaneous effect Effects 0.000 description 4
- JNXDCMUUZNIWPQ-UHFFFAOYSA-N trioctyl benzene-1,2,4-tricarboxylate Chemical compound CCCCCCCCOC(=O)C1=CC=C(C(=O)OCCCCCCCC)C(C(=O)OCCCCCCCC)=C1 JNXDCMUUZNIWPQ-UHFFFAOYSA-N 0.000 description 4
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 3
- 238000004566 IR spectroscopy Methods 0.000 description 3
- WMFOQBRAJBCJND-UHFFFAOYSA-M Lithium hydroxide Chemical compound [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 229920001519 homopolymer Polymers 0.000 description 3
- 150000007974 melamines Chemical class 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 3
- 239000010452 phosphate Substances 0.000 description 3
- 238000001028 reflection method Methods 0.000 description 3
- 238000001228 spectrum Methods 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 2
- GPZYYYGYCRFPBU-UHFFFAOYSA-N 6-Hydroxyflavone Chemical compound C=1C(=O)C2=CC(O)=CC=C2OC=1C1=CC=CC=C1 GPZYYYGYCRFPBU-UHFFFAOYSA-N 0.000 description 2
- DXPPIEDUBFUSEZ-UHFFFAOYSA-N 6-methylheptyl prop-2-enoate Chemical group CC(C)CCCCCOC(=O)C=C DXPPIEDUBFUSEZ-UHFFFAOYSA-N 0.000 description 2
- LVGFPWDANALGOY-UHFFFAOYSA-N 8-methylnonyl prop-2-enoate Chemical compound CC(C)CCCCCCCOC(=O)C=C LVGFPWDANALGOY-UHFFFAOYSA-N 0.000 description 2
- QZCLKYGREBVARF-UHFFFAOYSA-N Acetyl tributyl citrate Chemical compound CCCCOC(=O)CC(C(=O)OCCCC)(OC(C)=O)CC(=O)OCCCC QZCLKYGREBVARF-UHFFFAOYSA-N 0.000 description 2
- KRKNYBCHXYNGOX-UHFFFAOYSA-K Citrate Chemical compound [O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O KRKNYBCHXYNGOX-UHFFFAOYSA-K 0.000 description 2
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 2
- 244000043261 Hevea brasiliensis Species 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 240000006240 Linum usitatissimum Species 0.000 description 2
- 235000004431 Linum usitatissimum Nutrition 0.000 description 2
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical class OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- WQDUMFSSJAZKTM-UHFFFAOYSA-N Sodium methoxide Chemical compound [Na+].[O-]C WQDUMFSSJAZKTM-UHFFFAOYSA-N 0.000 description 2
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 description 2
- 239000001361 adipic acid Substances 0.000 description 2
- 235000011037 adipic acid Nutrition 0.000 description 2
- 238000000418 atomic force spectrum Methods 0.000 description 2
- 229940067597 azelate Drugs 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- ZFMQKOWCDKKBIF-UHFFFAOYSA-N bis(3,5-difluorophenyl)phosphane Chemical compound FC1=CC(F)=CC(PC=2C=C(F)C=C(F)C=2)=C1 ZFMQKOWCDKKBIF-UHFFFAOYSA-N 0.000 description 2
- HQABUPZFAYXKJW-UHFFFAOYSA-N butan-1-amine Chemical compound CCCCN HQABUPZFAYXKJW-UHFFFAOYSA-N 0.000 description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000012790 confirmation Methods 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 2
- KBLWLMPSVYBVDK-UHFFFAOYSA-N cyclohexyl prop-2-enoate Chemical compound C=CC(=O)OC1CCCCC1 KBLWLMPSVYBVDK-UHFFFAOYSA-N 0.000 description 2
- JQVDAXLFBXTEQA-UHFFFAOYSA-N dibutylamine Chemical compound CCCCNCCCC JQVDAXLFBXTEQA-UHFFFAOYSA-N 0.000 description 2
- 239000000975 dye Substances 0.000 description 2
- 238000006735 epoxidation reaction Methods 0.000 description 2
- MTZQAGJQAFMTAQ-UHFFFAOYSA-N ethyl benzoate Chemical compound CCOC(=O)C1=CC=CC=C1 MTZQAGJQAFMTAQ-UHFFFAOYSA-N 0.000 description 2
- 125000004494 ethyl ester group Chemical group 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 235000004426 flaxseed Nutrition 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000001530 fumaric acid Substances 0.000 description 2
- 229920000578 graft copolymer Polymers 0.000 description 2
- 230000009931 harmful effect Effects 0.000 description 2
- MDNFYIAABKQDML-UHFFFAOYSA-N heptyl 2-methylprop-2-enoate Chemical compound CCCCCCCOC(=O)C(C)=C MDNFYIAABKQDML-UHFFFAOYSA-N 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 239000012948 isocyanate Substances 0.000 description 2
- 150000002513 isocyanates Chemical class 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000011976 maleic acid Substances 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- UNBDCVXGGDKSCP-UHFFFAOYSA-N methyl 2-methylidenetetradecanoate Chemical compound CCCCCCCCCCCCC(=C)C(=O)OC UNBDCVXGGDKSCP-UHFFFAOYSA-N 0.000 description 2
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 2
- 229920003052 natural elastomer Polymers 0.000 description 2
- 229920001194 natural rubber Polymers 0.000 description 2
- YGPZXPHFJSYIKP-UHFFFAOYSA-N nonadecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCCCCCCCCOC(=O)C(C)=C YGPZXPHFJSYIKP-UHFFFAOYSA-N 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- WQDGUYZIAJKLAB-UHFFFAOYSA-N octan-2-yl nitrite Chemical compound CCCCCCC(C)ON=O WQDGUYZIAJKLAB-UHFFFAOYSA-N 0.000 description 2
- YOTGRUGZMVCBLS-UHFFFAOYSA-N pentadecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCCCCOC(=O)C(C)=C YOTGRUGZMVCBLS-UHFFFAOYSA-N 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 229920001610 polycaprolactone Polymers 0.000 description 2
- 239000004632 polycaprolactone Substances 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 238000004321 preservation Methods 0.000 description 2
- 229940116351 sebacate Drugs 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-L sebacate(2-) Chemical compound [O-]C(=O)CCCCCCCCC([O-])=O CXMXRPHRNRROMY-UHFFFAOYSA-L 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 235000012424 soybean oil Nutrition 0.000 description 2
- 239000003549 soybean oil Substances 0.000 description 2
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 description 2
- ATZHWSYYKQKSSY-UHFFFAOYSA-N tetradecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCCCOC(=O)C(C)=C ATZHWSYYKQKSSY-UHFFFAOYSA-N 0.000 description 2
- VXUYXOFXAQZZMF-UHFFFAOYSA-N titanium(IV) isopropoxide Chemical compound CC(C)O[Ti](OC(C)C)(OC(C)C)OC(C)C VXUYXOFXAQZZMF-UHFFFAOYSA-N 0.000 description 2
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 2
- 125000005591 trimellitate group Chemical group 0.000 description 2
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 2
- KRLHYNPADOCLAJ-UHFFFAOYSA-N undecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCOC(=O)C(C)=C KRLHYNPADOCLAJ-UHFFFAOYSA-N 0.000 description 2
- NPNPZTNLOVBDOC-UHFFFAOYSA-N 1,1-difluoroethane Chemical compound CC(F)F NPNPZTNLOVBDOC-UHFFFAOYSA-N 0.000 description 1
- BMVXCPBXGZKUPN-UHFFFAOYSA-N 1-hexanamine Chemical compound CCCCCCN BMVXCPBXGZKUPN-UHFFFAOYSA-N 0.000 description 1
- IMSODMZESSGVBE-UHFFFAOYSA-N 2-Oxazoline Chemical compound C1CN=CO1 IMSODMZESSGVBE-UHFFFAOYSA-N 0.000 description 1
- MMEDJBFVJUFIDD-UHFFFAOYSA-N 2-[2-(carboxymethyl)phenyl]acetic acid Chemical compound OC(=O)CC1=CC=CC=C1CC(O)=O MMEDJBFVJUFIDD-UHFFFAOYSA-N 0.000 description 1
- BOZRCGLDOHDZBP-UHFFFAOYSA-N 2-ethylhexanoic acid;tin Chemical compound [Sn].CCCCC(CC)C(O)=O BOZRCGLDOHDZBP-UHFFFAOYSA-N 0.000 description 1
- NOWKCMXCCJGMRR-UHFFFAOYSA-N Aziridine Chemical compound C1CN1 NOWKCMXCCJGMRR-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000004125 X-ray microanalysis Methods 0.000 description 1
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 description 1
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 1
- XQBCVRSTVUHIGH-UHFFFAOYSA-L [dodecanoyloxy(dioctyl)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCCCCCC)(CCCCCCCC)OC(=O)CCCCCCCCCCC XQBCVRSTVUHIGH-UHFFFAOYSA-L 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 150000004703 alkoxides Chemical class 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 238000003556 assay Methods 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229920005549 butyl rubber Polymers 0.000 description 1
- NDWWLJQHOLSEHX-UHFFFAOYSA-L calcium;octanoate Chemical compound [Ca+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O NDWWLJQHOLSEHX-UHFFFAOYSA-L 0.000 description 1
- 150000001718 carbodiimides Chemical class 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- JBSLOWBPDRZSMB-FPLPWBNLSA-N dibutyl (z)-but-2-enedioate Chemical group CCCCOC(=O)\C=C/C(=O)OCCCC JBSLOWBPDRZSMB-FPLPWBNLSA-N 0.000 description 1
- 238000007688 edging Methods 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 210000000981 epithelium Anatomy 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- GIWKOZXJDKMGQC-UHFFFAOYSA-L lead(2+);naphthalene-2-carboxylate Chemical compound [Pb+2].C1=CC=CC2=CC(C(=O)[O-])=CC=C21.C1=CC=CC2=CC(C(=O)[O-])=CC=C21 GIWKOZXJDKMGQC-UHFFFAOYSA-L 0.000 description 1
- VQPKAMAVKYTPLB-UHFFFAOYSA-N lead;octanoic acid Chemical compound [Pb].CCCCCCCC(O)=O VQPKAMAVKYTPLB-UHFFFAOYSA-N 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 description 1
- GEMHFKXPOCTAIP-UHFFFAOYSA-N n,n-dimethyl-n'-phenylcarbamimidoyl chloride Chemical compound CN(C)C(Cl)=NC1=CC=CC=C1 GEMHFKXPOCTAIP-UHFFFAOYSA-N 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 235000019198 oils Nutrition 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 150000002902 organometallic compounds Chemical class 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 1
- 229920002493 poly(chlorotrifluoroethylene) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 239000005023 polychlorotrifluoroethylene (PCTFE) polymer Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002742 polystyrene-block-poly(ethylene/propylene) -block-polystyrene Polymers 0.000 description 1
- 229920000346 polystyrene-polyisoprene block-polystyrene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 description 1
- 229920001935 styrene-ethylene-butadiene-styrene Polymers 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- YBRBMKDOPFTVDT-UHFFFAOYSA-N tert-butylamine Chemical compound CC(C)(C)N YBRBMKDOPFTVDT-UHFFFAOYSA-N 0.000 description 1
- 125000002769 thiazolinyl group Chemical group 0.000 description 1
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- YNJBWRMUSHSURL-UHFFFAOYSA-N trichloroacetic acid Chemical compound OC(=O)C(Cl)(Cl)Cl YNJBWRMUSHSURL-UHFFFAOYSA-N 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- CHJMFFKHPHCQIJ-UHFFFAOYSA-L zinc;octanoate Chemical compound [Zn+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O CHJMFFKHPHCQIJ-UHFFFAOYSA-L 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/283—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polysiloxanes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/304—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl halide (co)polymers, e.g. PVC, PVDC, PVF, PVDF
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/203—Adhesives in the form of films or foils characterised by their carriers characterised by the structure of the release feature on the carrier layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/24—All layers being polymeric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/51—Elastic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2405/00—Adhesive articles, e.g. adhesive tapes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2427/00—Presence of halogenated polymer
- C09J2427/006—Presence of halogenated polymer in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
- C09J2433/005—Presence of (meth)acrylic polymer in the release coating
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2483/00—Presence of polysiloxane
- C09J2483/005—Presence of polysiloxane in the release coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesive Tapes (AREA)
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Dicing (AREA)
Abstract
Provided is an adhesive tape film comprising a non-adhesive layer provided on a substrate film. This adhesive tape film effectively prevents over-adhesion due to heat of a fixing base (when performing dicing by attachment to the base by negative pressure suction), effectively suppresses blocking in the roll form by providing the non-adhesive layer on the substrate film, does not exhibit tearing or splitting when unwinding out of the roll form, exhibits good affinity between the non-adhesive layer and the substrate film, and has good conformability to deformations such as stretching. Further disclosed is an adhesive tape including such an adhesive tape film. This adhesive tape film is provided with a non-adhesive layer on one surface of a plastic film, wherein the surface of said non-adhesive layer has an uneven structure, and, measured by an atomic force microscope, the elastic modulus at 80 DEG C in the convex portions of said non-adhesive layer surface is 0.2GPa or greater.
Description
Technical field
The present invention relates to film and adhesive tape for adhesive tape.
Background technology
For the adhesive tape using in semi-conductive cutting, in when cutting, for fixing wafer, the face contrary with wafer closed surface need to be fixed on base.This fixing conventionally undertaken by the negative pressure of vacuum suction etc.
Carry out this utilize negative pressure fixedly time, due to the melting of the adhesive tape that has excessively applied the state of negative pressure, caused because of the heating in when cutting, adhesive tape and base are excessively closely sealed sometimes.If occur this excessively closely sealed, remove with base fixedly time treatability variation, produce the semiconductor manufacturing process that for example comprises cutting such problem that can not go on smoothly.
In order to eliminate this excessively closely sealed problem; report has following technology: in base film and this two-layer crystal column surface boundary belt forming of adhesive phase, the surperficial center line surface roughness Ra contrary with adhesive phase of base film controlled to the size (patent documentation 1) for regulation.
But, for the base film of the adhesive tape using in semi-conductive cutting, require the distinctive expansion of semiconductor fabrication process (stretching) characteristic and difference in height to follow characteristic.That is, the base film of the adhesive tape using in semi-conductive cutting need to can stretch well in expansion operation, in addition, need to follow well semi-conductive difference in height.As the base film that meets such requirement, select the base film being formed by the large material of percentage elongation.But the surface state of this base film is easily subject to the impact of temperature.Therefore, even the surperficial center line surface roughness Ra of base film is controlled to the size for regulation reporting as patent documentation 1, also there is following problem: due to the variations in temperature of temperature, process unit, the big or small center line surface roughness Ra that is controlled as regulation significantly changes, and cannot show the effect of the invention of recording in patent documentation 1.
For example, in when cutting, especially when laser cutting, the energy bringing due to laser processing and wafer heating.If wafer heating like this, even also exist as patent documentation 1, report like that the surperficial center line surface roughness Ra of base film is controlled to the size for stipulating, excessively closely sealed problem as described above also cannot be eliminated, and even can promote excessively closely sealed such problem.
In addition, in recent years, the size of the wafer using in semi-conductive cutting is maximizing, and the time of therefore cutting is elongated, its result, and it is large that the heating of wafer becomes, and it is more outstanding that the problems referred to above become.
In semi-conductive cutting, especially in LED cutting, the semiconductor crystal wafer using is that the material being highly brittle by gallium nitride, GaAs, carborundum etc. forms, therefore in order to prevent the breakage of this semiconductor crystal wafer, require the base film of adhesive tape to have further expansion (stretching) characteristic and difference in height to follow characteristic.Therefore,, for the adhesive tape of LED cutting, it is more outstanding that the problems referred to above become.
In addition, film surface is level and smooth conventionally, if such processing film is become to web-like, film occurs and contact with each other and closely sealed phenomenon, be i.e. adhesion.In having produced the volume of adhesion, sometimes there is film to carry out the inconvenience such as operation change difficulty of debatching.Especially, in the large film of percentage elongation, be conventionally added with plasticizer.In such film, plasticizer is separated out at film surface, thereby the slight void between film is landfilled, therefore, and the harmful effect apparition that adhesion causes.What film surface was implemented to utilize adhesive bondingly adds man-hour, and because this adhesive itself has adaptation, therefore, the harmful effect of adhesion becomes larger.
When the film of the web-like of adhesion is carried out to debatching, need unnecessary, for removing film closely sealed power each other.Owing to applying this unnecessary power, film extends and is out of shape, even if or film is indeformable also accumulates with the form of ess-strain.If by because film former thereby distortion as above is applied to adhesive tape, be difficult to follow adherend and fit.In addition, if by because film former thereby that accumulated ess-strain as above is applied to adhesive tape,, owing to fitting in the Spontaneous release that produces this ess-strain after adherend, there is the worry of adherend breakage.
While using adhesive tape in semiconductor machining, the material as the semiconductor crystal wafer of adherend by fragility forms, therefore can embrittlement or easily have damaged.Therefore, if by because film former thereby distortion as above is applied to adhesive tape, be difficult to follow semiconductor crystal wafer fine exquisiteness circuit pattern and fit.In addition, if by because film former thereby that accumulated ess-strain as above is applied to adhesive tape, fit in the Spontaneous release that produces this ess-strain after semiconductor crystal wafer, semiconductor crystal wafer is easily damaged.
Especially, the wafer for LED is that the material being highly brittle by gallium nitride, GaAs, carborundum etc. forms.Therefore, for the prevent adhesion of the adhesive tape of LED cutting etc. the particular importance that becomes.
As the prior art of prevent adhesion, can roughly list two kinds of technology.
A kind of prior art can list the technology (patent documentation 2) of implementing the physical treatments such as embossing processing at the back side of film.But in this technology, the concavo-convex stress concentrating structure that becomes forming at the back side of film, therefore when the form debatching from web-like, exists that this concavo-convexly fracture or the such problem of breakage occurs for starting point because debatching power film be take.
Another kind of prior art can list the technology (patent documentation 3) at the back side of film coating polyorganosiloxane release agent.But in this technology, polyorganosiloxane release agent, because its surface tension is low with the chemical affinity at the film back side, exists and is difficult to be blended in the such problem in the film back side.In addition, when the film that has been coated with overleaf polyorganosiloxane release agent is applied to adhesive tape, if the adhesive tape such as expand, stretch, the processing layer that sometimes utilizes polyorganosiloxane release agent to process cannot be followed stretching, may produce this processing layer and breaks and cause polluting such problem.It should be noted that, in order to improve the chemical affinity at polyorganosiloxane release agent and the film back side, although also there is the technology of coating cross-linking type polyorganosiloxane release agent, but the common percentage elongation of cross-linking type polysiloxanes is very little, while therefore the film that has been coated with overleaf cross-linking type polyorganosiloxane release agent being applied to adhesive tape, if the adhesive tape such as expand, stretch, have the processing layer that utilizes cross-linking type polyorganosiloxane release agent to process cannot follow stretching, cannot maintain the such problem of anchoring.
Prior art document
Patent documentation
Patent documentation 1: TOHKEMY 2009-239124 communique
Patent documentation 2: No. 2009/028069 brochure of International Publication
Patent documentation 3: TOHKEMY 2010-201836 communique
Summary of the invention
the problem that invention will solve
Problem of the present invention is to provide a kind of adhesive tape film, it for being provided with the adhesive tape film of non-adhesive layer on base film, its can effectively be suppressed at utilize negative-pressure adsorption be fixed on fixing when cut on base etc. appearance because of base heating etc. cause excessively closely sealed, in addition, by non-adhesive layer is set on base film, can effectively suppress the adhesion under web-like form, when from the debatching of web-like form, can not rupture or breakage, the amalgamation of this non-adhesive layer and this base film is good, to stretching, waits the tracing ability of distortion good.In addition, problem of the present invention is also to provide the adhesive tape that comprises this adhesive tape use film.
for the scheme of dealing with problems
Adhesive tape of the present invention is in the one side of plastic film, to possess the adhesive tape film of non-adhesive layer with film,
The surface of this non-adhesive layer has concaveconvex structure,
Modulus of elasticity at obtained by atomic force microscope 80 ℃ of the surperficial convex portion of this non-adhesive layer is more than 0.2GPa.
In a preferred embodiment, the arithmetic mean surface roughness Ra of above-mentioned non-adhesive layer is more than 0.1 μ m.
In a preferred embodiment, above-mentioned non-adhesive layer is the mixed layer of polysiloxanes and (methyl) acrylic acid series polymeric compounds.
In a preferred embodiment, the calculating Tg of above-mentioned (methyl) acrylic acid series polymeric compounds is more than 10 ℃.
In a preferred embodiment, the SP value of above-mentioned (methyl) acrylic acid series polymeric compounds is 9.0 (cal/cm
3)
0.5～12.0 (cal/cm
3)
0.5.
In a preferred embodiment, the mixing ratio of the polysiloxanes in above-mentioned non-adhesive layer and (methyl) acrylic acid series polymeric compounds is counted polysiloxanes with weight ratio: (methyl) acrylic acid series polymeric compounds=1:50～50:1.
In a preferred embodiment, above-mentioned non-adhesive layer has phase separation structure.
In a preferred embodiment, the non-adhesive test peeling force of above-mentioned non-adhesive layer is less than 1.0N/20mm.
In a preferred embodiment, the thickness of above-mentioned non-adhesive layer is 0.01 μ m～10 μ m.
In a preferred embodiment, the maximum elongation rate of measuring according to JIS-K-7127 of above-mentioned plastic film is more than 100%.
In a preferred embodiment, the thickness of above-mentioned plastic film is 20 μ m～200 μ m.
In a preferred embodiment, above-mentioned plastic film comprises polyvinyl chloride.
Other execution mode of the present invention provides adhesive tape.Adhesive tape of the present invention possesses adhesive phase at adhesive tape of the present invention with the face contrary with above-mentioned non-adhesive layer of the above-mentioned plastic film in film.
In a preferred embodiment, above-mentioned adhesive phase comprises at least one (methyl) acrylic acid series polymeric compounds.
In a preferred embodiment, the SP value of above-mentioned adhesive phase is 9.0 (cal/cm
3)
0.5～12.0 (cal/cm
3)
0.5.
In a preferred embodiment, on the surface of above-mentioned adhesive phase, possesses release liner.
In a preferred embodiment, adhesive tape of the present invention is for semiconductor machining.
In a preferred embodiment, adhesive tape of the present invention is for LED cutting purposes.
the effect of invention
According to the present invention, a kind of adhesive tape film can be provided, it for being provided with the adhesive tape film of non-adhesive layer on base film, its can effectively be suppressed at utilize negative-pressure adsorption be fixed on fixing when cut on base etc. appearance because of base heating etc. cause excessively closely sealed, in addition, by non-adhesive layer is set on base film, can effectively suppress the adhesion under web-like form, when from the debatching of web-like form, can not rupture or breakage, the amalgamation of this non-adhesive layer and this base film is good, to stretching, waits the tracing ability of distortion good.In addition, the present invention can also provide and comprise the adhesive tape of film for this adhesive tape.
Accompanying drawing explanation
Fig. 1 illustrates the SEM photo of the face side state of the non-adhesive layer in film for adhesive tape of the present invention.
Fig. 2 illustrates the SEM photo of the sectional side state of the non-adhesive layer in film for adhesive tape of the present invention.
Fig. 3 is with the SEM photo of adhesive tape of the present invention with the sectional side state of the non-adhesive layer in film is explanatorily shown.
Embodiment
<<1. adhesive tape film >>
Adhesive tape of the present invention possesses non-adhesive layer with film in the one side of plastic film.
<1-1. plastic film >
To plastic film, there is no particular limitation, can comprise suitable resin material arbitrarily.As such resin material, can preferably list such as polyvinyl chloride, polyolefin, polyester, polyimides, polyamide etc., can more preferably list polyvinyl chloride, polyolefin, can further preferably list polyvinyl chloride.The stress relaxation of polyvinyl chloride is excellent, therefore can be especially aptly for adhesive tape film, and described adhesive tape can be used in the adhesive tape using in the semiconductor machining such as LED cutting with film.
As the ratio that contains of the above-mentioned resin material in plastic film, can set any suitable ratio that contains according to object/purposes.As this ratio that contains, for example, be preferably 50 % by weight～100 % by weight, more preferably 60 % by weight～100 % by weight, more preferably 70 % by weight～100 % by weight.
In plastic film, also can comprise plasticizer.The ratio that contains of the plasticizer in plastic film is preferably 0.5 % by weight～50 % by weight with respect to the above-mentioned resin material in this plastic film, more preferably 1.0 % by weight～40 % by weight.By comprise plasticizer with the above-mentioned ratio that contains in plastic film, the tracing ability of the distortion such as stretching is become to better.
As above-mentioned plasticizer, for example can list: phthalic acid ester system, trimellitate system (DIC Corporation system, W-700, trioctyl trimellitate (TOTM) etc.), (the J-PLUS Co. of adipate ester system, Ltd system, D620, dioctyl adipate, diisononyl adipate etc.), phosphate system (tricresyl phosphate etc.), adipic acid is ester, citrate (citroflex A-4 etc.), sebacate, azelate, maleate, benzoic ether, polyethers is polyester, epoxy is polyester (epoxidised soybean oil, epoxidation linseed wet goods), polyester (the low molecular weight polycaprolactone ester being formed by carboxylic acid and glycol etc.) etc.In the present invention, preferably using ester is plasticizer.Plasticizer can be only a kind, can be also two or more.
In not damaging the scope of effect of the present invention, in plastic film, also can comprise other suitable compositions arbitrarily.
The maximum elongation rate of measuring according to JIS-K-7127 of plastic film is preferably more than 100%, and more preferably 200%～1000%.By use, demonstrate the plastic film of such maximum elongation rate, can give adhesive tape of the present invention and use film with appropriate extensibility, for example, when adhesive tape of the present invention is used for to adhesive tape with film, can improve the tracing ability to adherend.
The thickness of plastic film is preferably 20 μ m～200 μ m, more preferably 40 μ m～150 μ m, more preferably 50 μ m～100 μ m.The thickness of plastic film during lower than 20 μ m, has the worry of treatability variation, especially having laminating operation when forming adhesive tape to become difficult worry.If the thickness of plastic film is greater than 200 μ m, there is the worry of the tracing ability variation that waits distortion to stretching.
The non-adhesive layer > of < 1-2.
Non-adhesive layer is as long as its surface has the concaveconvex structure of following provisions, and it forms to wait and is just not particularly limited, and as an example wherein, is the mixed layer of polysiloxanes and (methyl) acrylic acid series polymeric compounds.By making non-adhesive layer, be the mixed layer of polysiloxanes and (methyl) acrylic acid series polymeric compounds, the amalgamation of non-adhesive layer and plastic film improves, and adhesive tape of the present invention improves to the tracing ability of the distortion such as stretching with film and the adhesive tape that comprises it.
The surface of non-adhesive layer has concaveconvex structure.For this concaveconvex structure, particularly, more than the arithmetic mean surface roughness Ra of non-adhesive layer is preferably 0.1 μ m, 0.1 μ m～3.0 μ m more preferably, more preferably 0.2 μ m～2.0 μ m, is particularly preferably 0.3 μ m～2.0 μ m, most preferably is 0.5 μ m～2.0 μ m.By making the arithmetic mean surface roughness Ra of non-adhesive layer in above-mentioned scope, the absorption that can suppress to utilize negative pressure occurs fixedly time excessively closely sealed.
Modulus of elasticity at obtained by atomic force microscope (AFM) 80 ℃ of the surperficial convex portion of non-adhesive layer is more than 0.2GPa, more preferably more than 0.4GPa, more preferably more than 0.8GPa, more than being particularly preferably 1.0GPa.The upper limit of the modulus of elasticity at obtained by atomic force microscope 80 ℃ of the surperficial convex portion of non-adhesive layer is not particularly limited, and is preferably below 5.0GPa, more preferably below 4.0GPa, more preferably below 3.0GPa.Modulus of elasticity at obtained by atomic force microscope 80 ℃ of the surperficial convex portion of non-adhesive layer is in above-mentioned scope time, in the surperficial small concaveconvex structure of non-adhesive layer, especially the hardness of convex portion at high temperature also appropriateness uprise, therefore, thermal endurance uprises, can effectively be suppressed at utilize negative pressure by adhesive tape of the present invention with thin film adsorbs be fixed on fixing when cut on base etc. appearance because of base heating etc. cause excessively closely sealed.It should be noted that, the assay method of the modulus of elasticity at obtained by atomic force microscope 80 ℃ of the surperficial convex portion of non-adhesive layer will be narrated in the back.
When non-adhesive layer is the mixed layer of polysiloxanes and (methyl) acrylic acid series polymeric compounds, the calculating Tg of (methyl) acrylic acid series polymeric compounds in non-adhesive layer is more than 10 ℃, be preferably more than 20 ℃, more preferably more than 30 ℃, more preferably more than 45 ℃.The upper limit to the calculating Tg of (methyl) acrylic acid series polymeric compounds in non-adhesive layer is not particularly limited, and is preferably below 200 ℃, more preferably below 150 ℃, more preferably below 100 ℃.The calculating Tg of above-mentioned by making (methyl) acrylic acid series polymeric compounds is in above-mentioned scope, the thermal endurance at the surperficial small concaveconvex structure place of non-adhesive layer uprises, can effectively be suppressed at utilize negative pressure by adhesive tape of the present invention with thin film adsorbs be fixed on fixing when cut on base etc. appearance because of base heating etc. cause excessively closely sealed.
In the present invention, copolymer ((methyl) acrylic acid series polymeric compounds in above-mentioned non-adhesive layer etc.) " calculating Tg " refers to the calculating glass transition temperature that utilizes Fox calculating formula to obtain to the Tg of the construction unit of the monomer from formation copolymer.Fox formula be as follows, copolymer glass transition temperature Tg (℃) with the glass transition temperature Tg that forms the monomer homopolymers that homopolymerization forms separately of copolymer
i(℃) between relational expression.It should be noted that, in following Fox formula, Tg (℃) represent glass transition temperature, the W of copolymer
ithe weight fraction, the Tg that represent monomer i
i(℃) represent the glass transition temperature of the homopolymers of monomer i.
1/(273+Tg)＝Σ(W
i/(273+Tg
i))
Wherein, as the glass transition temperature Tg of homopolymers
i(℃), particularly, can use the value of recording in " Polymer Handbook 3rd Edition " (A WILEY-INTERSCIENCE PUBLICATION, 1989).
When non-adhesive layer comprises (methyl) acrylic acid series polymeric compounds, the SP value of (methyl) acrylic acid series polymeric compounds in non-adhesive layer is preferably 9.0 (cal/cm
3)
0.5～12.0 (cal/cm
3)
0.5, 9.5 (cal/cm more preferably
3)
0.5～11.5 (cal/cm
3)
0.5, 9.5 (cal/cm more preferably
3)
0.5～11.0 (cal/cm
3)
0.5.SP value is the solubility parameter of calculating according to Small formula.The method that the calculating of SP value can utilize known document (for example Journal of Applied Chemistry, 3,71,1953. etc.) to record is carried out.
Non-adhesive layer preferably has phase separation structure.Non-adhesive layer, by having phase separation structure, can form small concaveconvex structure effectively on the surface of this non-adhesive layer.This is speculated as substantially: the situation that for example non-adhesive layer is the mixed layer of polysiloxanes and (methyl) acrylic acid series polymeric compounds of take is example, and the ambulant difference of material of the polysiloxanes while generating due to phase separation structure, (methyl) acrylic acid series polymeric compounds generates concavo-convex.Formation due to this concaveconvex structure, adhesive tape of the present invention can be suppressed at film the absorption that utilizes negative pressure and occur fixedly time excessively closely sealed, and can effectively suppress the adhesion under web-like form, fracture or damaged occurs in the time of can suppressing the form debatching from web-like.
Non-adhesive layer preferably contains and comprises polysiloxanes more than the rich polysiloxanes phase of (methyl) acrylic acid series polymeric compounds and comprise (methyl) acrylic acid series polymeric compounds more than richness (methyl) the acrylic acid series polymeric compounds phase of polysiloxanes.Non-adhesive layer more specifically, preferably with mutually independently phase separation structure comprise above-mentioned rich polysiloxanes phase and above-mentioned richness (methyl) acrylic acid series polymeric compounds phase, more preferably above-mentioned rich polysiloxanes is present in air interface side (opposition side of plastic film) mutually, and above-mentioned richness (methyl) acrylic acid series polymeric compounds is present in plastic film side mutually.By thering is such phase separation structure, owing to being present in the rich polysiloxanes phase of air interface side, adhesion is inhibited effectively, by being present in richness (methyl) the acrylic acid series polymeric compounds phase of plastic film side, the amalgamation of non-adhesive layer and plastic film improves, and distortion tracing ability improves.By as described below the polysiloxanes in non-adhesive layer and the mixing ratio of (methyl) acrylic acid series polymeric compounds being regulated, can form such phase separation structure.
Non-adhesive layer have phase separation structure situation, contain as above comprise polysiloxanes more than the rich polysiloxanes phase of (methyl) acrylic acid series polymeric compounds and comprise (methyl) acrylic acid series polymeric compounds more than the situation of richness (methyl) the acrylic acid series polymeric compounds phase of polysiloxanes, can observe by suitable method arbitrarily.As such observational technique, such as listing: the method for using the electron microscopes such as transmission electron microscope (TEM), scanning electron microscope (SEM), field emission type scanning electron microscope (FE-SEM) to carry out morphologic observation to non-adhesive layer cross section.2 layers of isolating construction can carry out identification by the depth of morphologic observation image.In addition, also can list following method: utilize the INFRARED ABSORPTION light splitting based on total reflection method, from non-adhesive layer air interface side to inside, change the probe light degree of depth on one side, observe the changes of contents of silicon contained in composition, carbon etc. on one side, observe thus.In addition, also can list the method for utilizing X-ray microanalysis instrument, x-ray photoelectron power spectrum to observe.In addition, also can suitably combine these methods observes.
Non-adhesive layer has the rich polysiloxanes phase that is present in air interface side (opposition side of plastic film) and is present in the situation of phase separation structure of richness (methyl) acrylic acid series polymeric compounds phase of plastic film side, if utilizing negative pressure this non-adhesive layer to be absorbed and fixed to fixing this is fixed and generates heat with base while cut etc. with base, because this sends out heat load thermogenetic, the surface texture of this phase separation structure is destroyed, especially destroyed with the surface texture of fixing this phase separation structure that contacts more convex portion with base of this of heating, may cause that rich (methyl) acrylic acid series polymeric compounds exposes in air interface side in this convex portion.But adhesive tape of the present invention is with film because the modulus of elasticity at obtained by atomic force microscope 80 ℃ of the surperficial convex portion of non-adhesive layer is in above-mentioned scope, therefore, the hardness appropriateness of convex portion that is subject to heat load is high, thereby thermal endurance uprises.Therefore, can effectively be suppressed at utilize negative pressure by adhesive tape of the present invention with thin film adsorbs be fixed on fixing while cut etc. with base appearance because of base heating etc. cause excessively closely sealed.
When non-adhesive layer is the mixed layer of polysiloxanes and (methyl) acrylic acid series polymeric compounds, the mixing ratio of the polysiloxanes in non-adhesive layer and (methyl) acrylic acid series polymeric compounds is preferably polysiloxanes in weight ratio: (methyl) acrylic acid series polymeric compounds=1:50～50:1, polysiloxanes more preferably: (methyl) acrylic acid series polymeric compounds=1:30～30:1, polysiloxanes more preferably: (methyl) acrylic acid series polymeric compounds=1:10～10:1, be particularly preferably polysiloxanes: (methyl) acrylic acid series polymeric compounds=1:5～5:1, most preferably be polysiloxanes: (methyl) acrylic acid series polymeric compounds=1:3～5:1.If not the polysiloxanes in adhesive layer containing proportional excessive, with the chemical affinity step-down at the plastic film back side, have and be difficult to the worry that merges with the plastic film back side.In addition, if not the polysiloxanes in adhesive layer containing proportional excessive, make adhesive tape with film or comprise it adhesive tape time, to stretching, wait the tracing ability variation of distortion, have non-adhesive layer to break and the worry that causes polluting.If not (methyl) acrylic acid series polymeric compounds in adhesive layer containing proportional excessive, the worry that has non-adhesive layer to play a role as acrylic adhesive, has the worry of easy generation adhesion.
As polysiloxanes, can adopt suitable polysiloxanes arbitrarily.As such polysiloxanes, for example, can list: using platinum series compound as catalyst, make by addition reaction, to solidify to form the addition type polysiloxane that fissility epithelium obtains containing thiazolinyl polydialkysiloxane and poly-diakyl hydrogen polysiloxanes; Use tin series catalysts, make the condensed type polysiloxanes that obtains containing methylol polydialkysiloxane reacts with poly-diakyl hydrogen polysiloxanes etc.As the example of addition type polysiloxane, for example, can list: SHIN-ETSU SILICONE Co., " KS-776A " that Ltd manufactures, " KS-839L " etc.As the example of condensed type polysiloxanes, for example, can list: SHIN-ETSU SILICONE Co., " KS723A/B " that Ltd manufactures etc.In addition,, when manufacturing polysiloxanes, except platinum group catalyst, tin series catalysts, can also suitably use other crosslinking agents, crosslinking accelerator etc.In addition, as the proterties of polysiloxanes, can be categorized into: no-solvent type that be dissolved in the type in the organic solvents such as toluene, the emulsion-type that their emulsions are formed, only comprises polysiloxanes etc.In addition, except addition type polysiloxane, condensed type polysiloxanes, can use polysiloxanes/acrylic acid-grafted polymer, polysiloxanes/acrylic acid block polymer etc.As polysiloxanes/acrylic acid-grafted polymer, such as listing: SYMAC GS-30, GS101, US-270, US-350, US-380 (above for Toagosei Co., Ltd manufactures) etc.As polysiloxanes/acrylic acid block polymer, such as listing: MODIPER FS700, FS710, FS720, FS730, FS770 (above for Japan Oil Co manufactures) etc.
As (methyl) acrylic acid series polymeric compounds, can adopt (methyl) acrylic acid series polymeric compounds being applicable to arbitrarily.It should be noted that, in the present invention, " (methyl) acrylic acid " refers to " acrylic acid and/or methacrylic acid ".
(methyl) acrylic acid series polymeric compounds is the polymer forming by comprising the monomer component of (methyl) acrylic monomer as principal monomer.Form containing more than ratio is preferably 50 % by weight of (methyl) acrylic monomer in the monomer component of above-mentioned (methyl) acrylic acid series polymeric compounds, 70 % by weight～100 % by weight more preferably, more preferably 90 weight～100 % by weight, are particularly preferably 95 % by weight～100 % by weight.Monomer in above-mentioned monomer component can be only a kind, can be also two or more.
As (methyl) acrylic monomer, can preferably list (methyl) acrylate, (methyl) acrylic acid.
As (methyl) acrylate, such as listing: (methyl) alkyl acrylate of the alkyl that carbon number is 1～30 (also comprising cycloalkyl), hydroxyl (methyl) acrylate etc.(methyl) acrylate can be only a kind, can be also two or more.
(methyl) alkyl acrylate of the alkyl that is 1～30 as carbon number (also comprising cycloalkyl), for example, can list: (methyl) methyl acrylate, (methyl) ethyl acrylate, (methyl) propyl acrylate, (methyl) isopropyl acrylate, (methyl) butyl acrylate, (methyl) isobutyl acrylate, (methyl) sec-butyl acrylate, (methyl) tert-butyl acrylate, (methyl) acrylic acid pentyl ester ((meth) acrylic acid pentyl), (methyl) acrylic acid pentyl ester ((meth) acrylic acid amyl), (methyl) Hexyl 2-propenoate, (methyl) cyclohexyl acrylate, (methyl) acrylic acid heptyl ester, (methyl) acrylic acid-2-ethyl caproite, (methyl) 2-ethyl hexyl acrylate, (methyl) Isooctyl acrylate monomer, (methyl) acrylic acid ester in the ninth of the ten Heavenly Stems, (methyl) acrylic acid ester in the different ninth of the ten Heavenly Stems, (methyl) decyl acrylate, (methyl) isodecyl acrylate, (methyl) acrylic acid undecyl ester, (methyl) dodecylacrylate, (methyl) tridecyl acrylate, (methyl) acrylic acid myristyl ester, (methyl) acrylic acid pentadecyl ester, (methyl) acrylic acid stearyl, (methyl) acrylic acid nonadecyl ester, (methyl) acrylic acid eicosyl ester, (methyl) alkyl acrylate of the alkyl that the carbon numbers such as (methyl) lauryl acrylate are 1～30 (also comprising cycloalkyl) etc.In the middle of these (methyl) acrylate, (methyl) alkyl acrylate of the alkyl (also comprising cycloalkyl) that preferably carbon number is 2～20, (methyl) alkyl acrylate of the alkyl that more preferably carbon number is 4～18 (also comprising cycloalkyl).
As hydroxyl (methyl) acrylate, such as listing: (methyl) 2-Hydroxy ethyl acrylate, (methyl) 2-hydroxypropyl acrylate, (methyl) acrylic acid-4-hydroxyl butyl ester etc.
In order fully to show effect of the present invention, the monomer component that forms above-mentioned (methyl) acrylic acid series polymeric compounds can contain be selected from hydroxyl monomer, containing at least a kind of carboxylic monomer.
As hydroxyl monomer, such as listing: allyl alcohol etc.Hydroxyl monomer can be only a kind, can be also two or more.
As containing carboxylic monomer, such as listing: (methyl) acrylic acid carboxylic ethyl ester, (methyl) acrylic acid carboxylic pentyl ester, crotonic acid, maleic acid, fumaric acid, itaconic acid etc.Containing carboxylic monomer, can be only a kind, can be also two or more.
In the situation that non-adhesive layer contains (methyl) acrylic acid series polymeric compounds, (methyl) acrylic acid series polymeric compounds in non-adhesive layer preferably, what form hydroxyl (methyl) acrylate in its monomer component contains ratio with respect to the total amount of the monomer component beyond this hydroxyl (methyl) acrylate, be preferably 2 % by weight～30 % by weight, more preferably 3 % by weight～25 % by weight, are particularly preferably 5 % by weight～20 % by weight.In the situation that non-adhesive layer contains (methyl) acrylic acid series polymeric compounds, total amount with respect to the monomer component beyond this hydroxyl (methyl) acrylate, form hydroxyl (methyl) in the monomer component of (methyl) acrylic acid series polymeric compounds in non-adhesive layer if acrylate contain ratio in above-mentioned scope, on the surface of non-adhesive layer, more effectively form small concaveconvex structure, by the formation of this concaveconvex structure, the absorption that adhesive tape of the present invention can further suppress to utilize negative pressure with film occurs fixedly time excessively closely sealed, and can more effectively suppress the adhesion under web-like form, in the time of can further suppressing the form debatching from web-like, there is fracture or damaged.
In the situation that non-adhesive layer contains (methyl) acrylic acid series polymeric compounds, (methyl) acrylic acid series polymeric compounds in non-adhesive layer preferably, can comprise (methyl) acrylic acid and/or (methyl) acrylate in the monomer component beyond hydroxyl (methyl) acrylate in the monomer component that forms it.Now, (methyl) acrylic acid is proportional in weight ratio with containing of (methyl) acrylate, (methyl) acrylic acid: (methyl) acrylate is preferably 0:100～20:80, more preferably 0:100～10:90, more preferably 0:100～5:95.
(methyl) acrylic acid and (methyl) are if containing of acrylate is proportional in above-mentioned scope, on the surface of non-adhesive layer, more effectively form small concaveconvex structure, by the formation of this concaveconvex structure, can further suppress adhesive tape of the present invention occurs fixedly time excessively closely sealed with film in the absorption that utilizes negative pressure, and can more effectively suppress the adhesion under the form of web-like, fracture or damaged occurs in the time of can further suppressing the form debatching from web-like.
(methyl) acrylic acid series polymeric compounds can be manufactured by any suitable polymerization.
In not damaging the scope of effect of the present invention, non-adhesive layer can comprise suitable additive arbitrarily.As such additive, such as listing: catalyst, ultra-violet absorber, filler, age resistor, tackifier, pigment, dyestuff, silane coupler etc.
The non-adhesive test peeling force of non-adhesive layer is preferably lower than 1.0N/20mm, more preferably less than 0.5N/20mm, further preferably lower than 0.2N/20mm.By making the non-adhesive test peeling force of non-adhesive layer in above-mentioned scope, the absorption that can further suppress to utilize negative pressure occurs fixedly time excessively closely sealed.In the present invention, the non-adhesive test peeling force of non-adhesive layer is measured according to method described later.
The thickness of non-adhesive layer is preferably 0.01 μ m～10 μ m, more preferably 0.1 μ m～5 μ m, 0.1 μ m～2 μ m more preferably.The thickness of non-adhesive layer during lower than 0.01 μ m, becomes and easily produces adhesion.If the thickness of non-adhesive layer is greater than 10 μ m, there is the worry of the tracing ability variation that waits distortion to stretching.If the thickness of non-adhesive layer is less than 0.01 μ m, there is worry, the manufacture that effect of the present invention is difficult to show to become difficult worry.
As the one side at plastic film, form the method for non-adhesive layer, for example, can list: the material by the non-adhesive layer of coated on one side at plastic film is also dried to form the method for non-adhesive layer.As the method for above-mentioned coating, such as listing: the method for using excellent painting machine, intaglio plate coating machine, spin coater, roll coater, blade coating machine, applicator etc.
<<2. adhesive tape >>
Adhesive tape of the present invention possesses adhesive phase at adhesive tape of the present invention with the face contrary with above-mentioned non-adhesive layer of the above-mentioned plastic film in film.
To the thickness of adhesive phase, there is no particular limitation, is preferably 1.0 μ m～30 μ m, more preferably 1.0 μ m～20 μ m, more preferably 3.0 μ m～15 μ m.When the thickness of adhesive phase is less than 1.0 μ m, there is the worry that cannot show sufficient bonding force.When the thickness of adhesive phase is greater than 30 μ m, according to purposes, there is bonding force worry excessive and that when peeling off etc., adherend is broken.
As the material of above-mentioned adhesive phase, in the scope of not damaging effect of the present invention, can adopt suitable adhesive arbitrarily.
As the material of adhesive phase, for example, can list: (methyl) acrylic acid series polymeric compounds; Natural rubber; Be grafted with the special natural rubber of the monomers such as methyl methacrylate; The synthetic rubber such as SBS, SBR, SEPS, SIS, SEBS, polybutene, polyisobutene (polyisobutene), polyisobutene (polyisobutylene), butyl rubber; Deng.The aspect that in the middle of these, cull to adherend from peeling off is few, have high cohesion, the transparency is excellent, preferably at least one (methyl) acrylic acid series polymeric compounds.
When adhesive phase comprises (methyl) acrylic acid series polymeric compounds, the containing ratio and can suitably set according to object of (methyl) acrylic acid series polymeric compounds in adhesive phase.
Above-mentioned (methyl) acrylic acid series polymeric compounds is the resin forming by comprising the monomer component of (methyl) acrylic monomer as principal monomer.Form containing more than ratio is preferably 50 % by weight of (methyl) acrylic monomer in the monomer component of above-mentioned (methyl) acrylic acid series polymeric compounds, 70 % by weight～100 % by weight more preferably, more preferably 90 % by weight～100 % by weight, are particularly preferably 95 % by weight～100 % by weight.Monomer in above-mentioned monomer component can be only a kind, can be also two or more.
As (methyl) acrylic monomer, can preferably list (methyl) acrylate, (methyl) acrylic acid.
As (methyl) acrylate, such as listing: (methyl) alkyl acrylate of the alkyl that carbon number is 1～30 (also comprising cycloalkyl), hydroxyl (methyl) acrylate etc.(methyl) acrylate can be only a kind, can be also two or more.
(methyl) alkyl acrylate of the alkyl that is 1～30 as carbon number (also comprising cycloalkyl), for example, can list: (methyl) methyl acrylate, (methyl) ethyl acrylate, (methyl) propyl acrylate, (methyl) isopropyl acrylate, (methyl) butyl acrylate, (methyl) isobutyl acrylate, (methyl) sec-butyl acrylate, (methyl) tert-butyl acrylate, (methyl) acrylic acid pentyl ester ((meth) acrylic acid pentyl), (methyl) acrylic acid pentyl ester ((meth) acrylic acid amyl), (methyl) Hexyl 2-propenoate, (methyl) cyclohexyl acrylate, (methyl) acrylic acid heptyl ester, (methyl) acrylic acid-2-ethyl caproite, (methyl) 2-ethyl hexyl acrylate, (methyl) Isooctyl acrylate monomer, (methyl) acrylic acid ester in the ninth of the ten Heavenly Stems, (methyl) acrylic acid ester in the different ninth of the ten Heavenly Stems, (methyl) decyl acrylate, (methyl) isodecyl acrylate, (methyl) acrylic acid undecyl ester, (methyl) dodecylacrylate, (methyl) tridecyl acrylate, (methyl) acrylic acid myristyl ester, (methyl) acrylic acid pentadecyl ester, (methyl) acrylic acid stearyl, (methyl) acrylic acid nonadecyl ester, (methyl) acrylic acid eicosyl ester, (methyl) alkyl acrylate of the alkyl that the carbon numbers such as (methyl) lauryl acrylate are 1～30 (also comprising cycloalkyl) etc.In the middle of these (methyl) acrylate, (methyl) alkyl acrylate of the alkyl (also comprising cycloalkyl) that preferably carbon number is 2～20, (methyl) alkyl acrylate of the alkyl that more preferably carbon number is 4～18 (also comprising cycloalkyl).
As hydroxyl (methyl) acrylate, such as listing: (methyl) 2-Hydroxy ethyl acrylate, (methyl) 2-hydroxypropyl acrylate, (methyl) acrylic acid-4-hydroxyl butyl ester etc.
In order fully to show the effect as adhesive, the monomer component that forms above-mentioned (methyl) acrylic acid series polymeric compounds preferably comprise be selected from hydroxyl monomer, containing at least a kind of carboxylic monomer.More preferably containing carboxylic monomer.In addition, in order fully to show the effect as adhesive, the monomer component that forms above-mentioned (methyl) acrylic acid series polymeric compounds can contain acrylonitrile.
As hydroxyl monomer, such as listing: (methyl) 2-Hydroxy ethyl acrylate, (methyl) 2-hydroxypropyl acrylate, (methyl) acrylic acid-4-hydroxyl butyl ester, allyl alcohol etc.Hydroxyl monomer can be only a kind, can be also two or more.
As containing carboxylic monomer, such as listing: (methyl) acrylic acid, (methyl) acrylic acid carboxylic ethyl ester, (methyl) acrylic acid carboxylic pentyl ester, crotonic acid, maleic acid, fumaric acid, itaconic acid etc.Containing carboxylic monomer, can be only a kind, can be also two or more.
When the monomer component that forms above-mentioned (methyl) acrylic acid series polymeric compounds contains hydroxyl monomer, the ratio that contains that forms the hydroxyl monomer in the monomer component of above-mentioned (methyl) acrylic acid series polymeric compounds is preferably 0.1 % by weight～20 % by weight, more preferably 0.1 % by weight～10 % by weight.When the monomer component that forms above-mentioned (methyl) acrylic acid series polymeric compounds contains containing carboxylic monomer, the ratio that contains containing carboxylic monomer forming in the monomer component of above-mentioned (methyl) acrylic acid series polymeric compounds is preferably 0.1 % by weight～20 % by weight, more preferably 0.1 % by weight～10 % by weight.Like this, by make to form the monomer component of above-mentioned (methyl) acrylic acid series polymeric compounds contain be selected from hydroxyl monomer, containing at least a kind of carboxylic monomer, in the situation that using crosslinking agent, the cross-linking reaction with this crosslinking agent can be more effectively there is, the effect as adhesive can be fully shown.And then, the ratio that contains containing carboxylic monomer that contains ratio, forms in the monomer component of above-mentioned (methyl) acrylic acid series polymeric compounds that consists of hydroxyl monomer in the monomer component of above-mentioned (methyl) acrylic acid series polymeric compounds adjusting makes it in above-mentioned scope, and in the time of can effectively preventing strip operation, adherend breaks.The ratio that contains containing carboxylic monomer that contains ratio, forms in the monomer component of above-mentioned (methyl) acrylic acid series polymeric compounds that forms hydroxyl monomer in the monomer component of above-mentioned (methyl) acrylic acid series polymeric compounds is compared above-mentioned scope when too much, it is excessive that bonding force becomes, the worry that has easy generation adhesion, in addition, there is the worry of breaking that easily produces adherend when strip operation.
Adhesive phase preferably comprises crosslinking agent.When adhesive phase comprises crosslinking agent, the ratio that contains of the crosslinking agent in adhesive phase can be according to object and suitably set, and with respect to main resinous principle (being preferably (methyl) acrylic acid series polymeric compounds), is preferably 0.1 % by weight～20 % by weight.By what make crosslinking agent in adhesive phase, contain ratio in above-mentioned scope, can produce appropriate cross-linking reaction, the breaking of the adherend in the time of can effectively preventing strip operation.
As crosslinking agent, such as listing: epoxy is that crosslinking agent, isocyanate-based crosslinking agent, melamine series crosslinking agent, peroxidating system crosslinking agent, metal alkoxide are that crosslinking agent, metal-chelating system crosslinking agent, slaine are that crosslinking agent, carbodiimide are that crosslinking agent, oxazoline are that crosslinking agent, aziridine are that crosslinking agent, amine are crosslinking agent etc.In the middle of these crosslinking agents, from can fully showing the aspect of effect of the present invention, preferably melamine series crosslinking agent, epoxy are crosslinking agent, isocyanate-based crosslinking agent.In addition, crosslinking agent can be selected as required and suitably, can be only a kind, can be also mixed system of more than two kinds.
Adhesive phase also can comprise plasticizer.When adhesive phase comprises plasticizer, the ratio that contains of the plasticizer in adhesive phase can be according to object and suitably set, and is preferably 0.1 % by weight～50 % by weight.By what make plasticizer in adhesive phase, contain ratio in above-mentioned scope, can more effectively show effect of the present invention.If the ratio that contains of the plasticizer in adhesive phase is greater than 50 % by weight, adhesive phase becomes too soft, the worry that has easy generation cull, adherend to pollute.
As above-mentioned plasticizer, for example can list: phthalic acid ester system, trimellitate system (DIC Corporation system, W-700, trioctyl trimellitate (TOTM) etc.), (the J-PLUS Co. of adipate ester system, Ltd system, D620, dioctyl adipate, diisononyl adipate etc.), phosphate system (tricresyl phosphate etc.), adipic acid is ester, citrate (citroflex A-4 etc.), sebacate, azelate, maleate, benzoic ether, polyethers is polyester, epoxy is polyester (epoxidised soybean oil, epoxidation linseed wet goods), polyester (the low molecular weight polycaprolactone ester being formed by carboxylic acid and glycol etc.) etc.In the present invention, preferably using ester is plasticizer.Plasticizer can be only a kind, can be also two or more.
In order to promote cross-linking reaction etc., adhesive phase can comprise suitable catalyst arbitrarily.When adhesive phase comprises catalyst, the ratio that contains of the catalyst in adhesive phase can be according to object and suitably set, and is preferably 0.01 % by weight～10 % by weight.By what make catalyst in adhesive phase, contain ratio in above-mentioned scope, can more effectively show effect of the present invention.
As this catalyst, such as listing: organo-metallic compounds such as tetraisopropyl titanate, tetra-n-butyl titanate, tin octoate, lead octoate, cobalt octoate, zinc octoate, calcium octoate, lead naphthenate, cobalt naphthenate, dibutyltin diacetate, two sad dibutyl tins, dibutyl tin laurate, two dioctyltin laurate, maleic acid dibutyl tins; The alkali compounds such as butylamine, dibutyl amine, hexylamine, tert-butylamine, ethylenediamine, IPD, imidazoles, lithium hydroxide, potassium hydroxide, sodium methoxide; The acid compounds such as the phosphate of p-methyl benzenesulfonic acid, trichloroacetic acid, phosphoric acid, single alkyl phosphonic acid, Acidic phosphates, senecioate-hydroxy methacrylate, monoalkyl phosphorous acid, dialkyl group phosphorous acid; Deng.Catalyst can be only a kind, can be also two or more.
In order further to show effect of the present invention, the SP value of adhesive phase is preferably 9.0 (cal/cm
3)
0.5～12.0 (cal/cm
3)
0.5, 9.5 (cal/cm more preferably
3)
0.5～11.0 (cal/cm
3)
0.5.SP value is the solubility parameter of calculating according to Small formula.The method that the calculating of SP value can utilize known document (for example, Journal of Applied Chemistry, 3,71,1953. etc.) to record is carried out.
In not damaging the scope of effect of the present invention, adhesive phase can comprise suitable additive arbitrarily.As such additive, such as listing: ultra-violet absorber, filler, age resistor, tackifier, pigment, dyestuff, silane coupler etc.
Adhesive tape of the present invention also can possess release liner on the surface of adhesive phase.
As release liner, can adopt suitable slider arbitrarily.As this release liner, such as listing: there is the base material that removers such as utilizing polysiloxane series, chain alkyl system, fluorine system, molybdenum sulfide carried out the peel plies such as surface-treated plastic film, paper; The low cementability base material being formed by fluorine based polymers such as polytetrafluoroethylene, polychlorotrifluoroethylene, poly-ethylene fluoride, Kynoar, tetrafluoroethene hexafluoropropylene copolymer, chlorine PVF vinylidene fluoride copolymers; The low cementability base material for example, being formed by nonpolarity polymer such as olefin-based resins (, polyethylene, polypropylene etc.); Deng.
Adhesive tape of the present invention can be for any suitable purposes.Adhesive tape of the present invention has adhesive tape film of the present invention, therefore as mentioned above, can effectively be suppressed at utilize negative-pressure adsorption be fixed on fixing when cut on base etc. appearance because of base heating etc. cause excessively closely sealed, in addition, can effectively suppress the adhesion under the form of web-like, fracture or damaged can not occur when the form debatching from web-like, and the amalgamation of this non-adhesive layer and this plastic film is good, to stretching, waits the tracing ability of distortion good.Therefore, can be aptly for the material of take by fragility, form and can there is the semiconductor machining that the semiconductor crystal wafer of the circuit pattern of fine exquisiteness is adherend.If adhesive tape of the present invention is used for to semiconductor machining, can effectively be suppressed at utilize negative-pressure adsorption be fixed on fixing when cut on base etc. appearance because of base heating etc. cause excessively closely sealed, therefore, can make to comprise that the semiconductor manufacturing process of cutting successfully carries out.In addition, if adhesive tape of the present invention is used for to semiconductor machining, can not produce accumulating of the deformation of thin membrane that in the past produced due to adhesion, ess-strain, therefore can follow exactly semiconductor crystal wafer fine exquisiteness circuit pattern fit, in addition, after fitting in semiconductor crystal wafer, there will not be the Spontaneous release of ess-strain, so can effectively prevent that semiconductor crystal wafer from breaking.Especially, because the wafer for LED is that the material being highly brittle by gallium nitride, GaAs, carborundum etc. forms, therefore adhesive tape of the present invention is particularly suitable for LED cutting etc.
Embodiment
Below, by embodiment, illustrate the present invention, but the present invention is not subject to any restriction of these embodiment.Part refers to weight portion.The amount of the reagent of supplying with the form of solution in addition, is with making solution evaporation and the amount (solid constituent conversion amount) of residual solid constituent represents.
< maximum elongation rate >
For maximum elongation rate, according to JIS-K-7127, utilize INSTRON type cupping machine (Shimadzu Seisakusho Ltd.'s manufacture, Autograph) to measure.Particularly, with chuck spacing 50mm, arrange after the sample of width 20mm * length 100mm, with the draw speed of 0.3m/ minute, stretch, the value while measuring fracture.
< elastic modulus G reatT.GreaT.GT
Modulus of elasticity is measured according to JIS-K-7127.
The observation > of the non-adhesive layer of <
(utilizing the observation of SEM)
After being processed into and can observing non-adhesive layer cross section, with transmission electron microscope (SEM), carry out morphologic observation.
(utilizing the observation of the infrared spectroscopy mensuration (ATR-IR) based on total reflection method)
Use infrared spectroscopy spectrometer (Perkinermer manufacture, Spectrum One), select total reflection determination method, in order to change the analysis depth of probe light, use 2 kinds of total reflections to measure with prism (ZnSe45 °, Ge45 °), the ATR-IR that carries out non-adhesive layer measures.
< arithmetic mean surface roughness Ra>
The confocal laser microscope " LEXT3000 " that uses OLYMPUS to manufacture, measures with 3D pattern with 20 times of object lens.Determining of the range of observation of 3D pattern carried out as follows: CF image (confocal images) becomes Top and the Bottom that complete black position is set as respectively range of observation when lens are moved up and down.
Image acquiring method under 3D pattern carries out image acquisition by Step mode with the spacing of 0.2 μ m.
The Ra of optional position is measured in the measurement of arithmetic mean surface roughness Ra by the roughness analysis of analytical model.Wherein, value is obtained by the mean value of n=5.
The mensuration > of the modulus of elasticity at obtained by atomic force microscope (AFM) 80 ℃ of the convex portion on the non-adhesive layer of < surface
For do not possess the adhesive tape of non-adhesive layer as comparative example 1, to measuring in the outermost surface of opposition side with adhesive phase.
By sample heat treated more than 37 hours at 120 ℃.Then, be fixed on the special-purpose sample fixed station of atomic force microscope (AFM), be arranged on the cooler heater annex of AFM special use, at 80 ℃, keep more than 30 minutes, then, use Asylum Technology Co., the cantilever " R150-NCL-10 (the radius of curvature 150nm of material Si, spring constant 48N/m, front end) " of the AFM " MFP-3D-SA-J " that Ltd. manufactures and NANOSENSORS manufacture is measured the shape image of AC pattern at 80 ℃.For the part of now observing as protuberance, under Contact pattern, measure force curve (at 80 ℃, the translational speed 2 μ m/s of cantilever, maximum indentation load 2 μ N).
By the Force-Ind curve obtaining from force curve, carry out the parsing based on Hertz theory subsidiary in the subsidiary software of AFM device " IgorPro6.22A MFP3D101010+1313 ", thereby obtain modulus of elasticity.It should be noted that, with Tip Geometry=Sphere, Radius=150nm, Select=Fused Silica, ν
tip=0.17, E
tip=74.9GPa, ν
sample=0.33, the High=90% of the Low=10% of Force label, Force label calculates, and with the mean value of n=5, obtains.
Adsorption test > under the < condition of high temperature
By adhesive tape with film or adhesive tape with the back side (in embodiment and comparative example, adhesive tape with in the situation of film for the face of non-adhesive layer side, in the situation of adhesive tape for and the face of adhesive phase in opposition side) become on the slide that surperficial mode is attached to 20mm (indulging) * 50mm (horizontal stroke).Then, under 80 ℃ of environment, for the above-mentioned slide that is pasted with band and slide (dull and stereotyped edging product, size: 65mm * 165mm * 1.35mm) as adherend, make the above-mentioned rear side of slide and the non-tin face side contacts of above-mentioned slide that is pasted with band, place after 15 minutes, thereby with 2kg roller, make a round trip slide and the above-mentioned back side laminating that is pasted with the slide of band, under 80 ℃ of environment, place 30 minutes.After placement, be cooled to normal temperature, then utilize INSTRON type cupping machine (Shimadzu Seisakusho Ltd.'s manufacture, Autograph), under draw speed 0.3m/ minute, carry out 0 ° and peel off.Measure peeling force (maximum) now, according to following benchmark, evaluate.
Zero: peeling force is lower than 5.0N.
△: peeling force is more than 5.0N and lower than 15.0N.
*: peeling force is more than 15.0N.
The non-adhesive test peeling force of < >
With reference to JIS-Z-0237, under 23 ℃ of preservations, adherend and the adhesive tape that comprises non-adhesive layer are kept more than 1 hour with film or adhesive tape, then, non-adhesive surface is crimped on to SUS430BA for 0.3m/ minute with linear pressure 8kg/m, crimping speed upper, the draw speed of 0.3m/ minute, 180 °, peels off the peeling force of lower mensuration after 30 minutes.
◎: lower than 0.5N/20mm.
Zero: more than 0.5N/20mm and lower than 1.0N/20mm.
*: more than 1.0N/20mm.
< adhesion test >
The adhesive aspect of adhesive tape is crimped on to the outmost surface (back layer) in opposition side with adhesive phase of same adhesive tape with linear pressure 8Kg/m, crimping speed for 0.3m/ minute, after crimping, with 50 ℃ * 48hr, preserves.After preservation, with draw speed 0.3m/ minute, according to 180 ° of disbonded tests of peeling off, peel off (according to JIS-Z-0237), measure the adhesion (peeling force) of adhesive aspect and back layer.
Be evaluated as the destruction (cohesional failure, fastening destruction cause cull) of the coming off of back layer while confirming to peel off, adhesive phase etc. when measuring peeling force, carry out overall merit.
Evaluation is according to following benchmark.
Zero: peeling force is lower than 3.0N/20mm, visually do not come off, the destruction of adhesive phase.
*: peeling force is that 3.0N/20mm is above or visual existence comes off, the destruction of adhesive phase.
< anchoring validation test >
(anchoring validation test A)
By draw speed 0.3m/ minute～3m/ minute, adhesive tape is stretched to 200% with film or adhesive tape, while stretching by visual valuation and after stretching, the deciduous of the outmost surface (back layer) in opposition side with adhesive phase of film or adhesive tape for adhesive tape.
(anchoring validation test B)
Carry out with the same stretching of anchoring validation test A after, " NO.31B " that Nitto Denko Corp is manufactured is as back side processing layer, crimping speed with 2Kg roller (25mm width) with 0.3m/ minute makes a round trip, then under 23 ℃ * 50%RH, take care of 1 minute, under the peeling rate of 0.3m/ minute～3m/ minute, carry out 90 ° and peel off, by the deciduous at the visual valuation back side.
(evaluation)
Comprehensive judgement is above to be evaluated, according to following benchmark evaluation anchoring.
◎: can with Visual Confirmation to coming off in anchoring validation test A and anchoring validation test B of the back side all do not occur.
Zero: can with Visual Confirmation to unconfirmed the arriving in anchoring validation test A that come off at the back side, in anchoring validation test B, confirm come off (the confirming as point-like) of pettiness.
*: in anchoring validation test A, confirm coming off of the back side, or confirm coming off of the back side in anchoring validation test B.
(Production Example 1): the manufacture of plastic film
The soft PVC film that utilizes rolling process manufacture to comprise DOP plasticizer (phthalic acid two (2-Octyl Nitrite), J-PLUS Co., Ltd manufactures) 27 weight portions with respect to polyvinyl chloride 100 weight portions of degree of polymerization P=1050.The thickness of this soft PVC film is 70 μ m, and the modulus of elasticity (MD) of measuring according to JIS-K-7127 is 250MPa, and the maximum elongation rate (MD) of measuring according to JIS-K-7127 is 400%.In addition, the surface roughness (arithmetic mean surface roughness Ra) after just manufacture is 0.1 μ m.
(embodiment 1)
Polyorganosiloxane resin (KS-723A, SHIN-ETSU HANTOTAI's chemical industry are manufactured) 60 weight portions, polyorganosiloxane resin (KS-723B, SHIN-ETSU HANTOTAI's chemical industry are manufactured) 40 weight portions, acrylic acid series copolymerized polymer (methyl methacrylate (MMA)/butyl acrylate (BA)/hydroxy-ethyl acrylate (HEA)=90/10/10) 50 weight portions, tin series catalysts (Cat-PS3, SHIN-ETSU HANTOTAI's chemical industry are manufactured) 10 weight portions are mixed with solution state, obtain mixed solution (1).Polysiloxanes in mixed solution (1) is counted polysiloxanes with the mixing ratio of (methyl) acrylic acid series polymeric compounds with weight ratio: (methyl) acrylic acid series polymeric compounds=2:1.In addition, the calculating Tg of acrylic acid series copolymerized polymer is 67.8 ℃, and SP value is 10.7 (cal/cm
3)
0.5.
The above-mentioned mixed solution of coated on one side (1) of the soft PVC film of manufacturing in Production Example 1, the non-adhesive layer of formation thickness 1.0 μ m, arithmetic mean surface roughness Ra=0.5 μ m.
So operation, obtains film for adhesive tape (1).
Various evaluation results are shown in to table 1.
In addition, while utilizing SEM to observe non-adhesive layer, as Fig. 1, Fig. 2, shown in Fig. 3, according to the depth of morphologic observation image, can confirm in air interface side different from the composition of plastic film side, formed to contain and comprised polysiloxanes more than the rich polysiloxanes phase of (methyl) acrylic acid series polymeric compounds and comprise (methyl) acrylic acid series polymeric compounds more than richness (methyl) the acrylic acid series polymeric compounds phase of polysiloxanes, and rich polysiloxanes phase and rich (methyl) acrylic acid series polymeric compounds be phase separation structure independently mutually mutually, observe rich polysiloxanes and be present in mutually air interface side (opposition side of plastic film), rich (methyl) acrylic acid series polymeric compounds is present in plastic film side mutually.
And then, when non-adhesive layer is carried out to the infrared spectroscopy mensuration (ATR-IR) based on total reflection method, measure from Si-CH
3800cm
-1near the 1725cm in source of the carbonyl in mutually with respect to (methyl) acrylic acid series polymeric compounds, peak
-1near the dulling luminosity ratio at peak, result, knownly compares with ZnSe45 °, while using the prism of Ge45 °, 800cm
-1it is large that near peak becomes.Therefore, knownly compare with base material side, the containing ratio of silicon is higher in air interface side.
In addition, in non-adhesive layer, rich polysiloxanes is present in mutually air interface side (opposition side of plastic film) and also can in FT-IR, confirms." the Spectrum One " that mensuration based on FT-IR is used Perkinermer to manufacture, measures air interface side by 2 kinds of different prisms of analysis depth direction (ZnSe45 °, Ge45 °) by ATR method.While confirming the chart of gained, can confirm: when using the prism of analysis depth direction shallow Ge45 °, relatively belong to the 1720cm from the C=O of (methyl) acrylic acid series polymeric compounds of non-adhesive layer
-1～1730cm
-1peak, from Si-CH
3800cm
-1it is large that near the dulling luminosity ratio at peak becomes.Thus, the concentration of provable polysiloxanes becomes higher in air interface side.
These observed results and the minimized principle of surface free energy are taken into account to the known 2 layers of structure in air interface side with rich polysiloxanes phase that formed in non-adhesive layer.
(embodiment 2)
In embodiment 1, the above-mentioned mixed solution of coated on one side (1) of the soft PVC film of manufacturing in Production Example 1, carries out similarly to Example 1, forms the non-adhesive layer of thickness 0.7 μ m, arithmetic mean surface roughness Ra=0.1 μ m.
So operation, obtains film for adhesive tape (2).
Various evaluation results are shown in to table 1.
(embodiment 3)
Preparation comprises the toluene solution by the adhesive of acrylic acid series copolymerized polymer 100 weight portions of butyl acrylate (BA)/acrylonitrile (AN)/acrylic acid (AA)=85/15/2.5 (weight ratio) formation, melamine series crosslinking agent (butylated melamine-formaldehvde resin, " SUPER BECKAMINE J-820-60N ", Japanese polyurethane manufacture) 10 weight portions, DOP plasticizer (phthalic acid two (2-Octyl Nitrite), J-PLUS Co., Ltd system) 60 weight portions.
This binder solution is coated on to the film for adhesive tape (1) that obtains in embodiment 1 with the face of non-adhesive layer in opposition side on, then with 130 ℃ * 90 seconds, be dried, soft PVC film with the face of non-adhesive layer in opposition side on form the adhesive phase of thickness 10 μ m.The SP value of the adhesive phase forming is 10.5.
So operation, obtains adhesive tape (3).
Various evaluation results are shown in to table 1.
(embodiment 4)
As non-adhesive layer, form the acrylic acid series copolymerized polymer of use, use acrylic acid series copolymerized polymer 50 weight portions of methyl methacrylate (MMA)/ethyl acrylate (EA)/hydroxy-ethyl acrylate (HEA)=90/10/10, carry out similarly to Example 1 in addition, obtain film for adhesive tape (4).Use this for adhesive tape film (4) replace film (1) for adhesive tape, carry out similarly to Example 3 in addition, obtain adhesive tape (4).
The calculating Tg of acrylic acid series copolymerized polymer is that 74.3 ℃, SP value are 10.3 (cal/cm
3)
0.5.
The thickness of non-adhesive layer is 1.0 μ m, arithmetic mean surface roughness Ra=0.5 μ m.
Various evaluation results are shown in to table 1.
(embodiment 5)
As non-adhesive layer, form the acrylic acid series copolymerized polymer of use, use acrylic acid series copolymerized polymer 50 weight portions of methyl methacrylate (MMA)/cyclohexyl acrylate (CHA)/hydroxy-ethyl acrylate (HEA)=90/10/10, carry out similarly to Example 1 in addition, obtain film for adhesive tape (5).Use this for adhesive tape film (5) replace film (1) for adhesive tape, carry out similarly to Example 3 in addition, obtain adhesive tape (5).
The calculating Tg of acrylic acid series copolymerized polymer is that 80.0 ℃, SP value are 10.4 (cal/cm
3)
0.5.
The thickness of non-adhesive layer is 1.0 μ m, arithmetic mean surface roughness Ra=0.5 μ m.
Various evaluation results are shown in to table 1.
(embodiment 6)
As non-adhesive layer, form the acrylic acid series copolymerized polymer of use, use acrylic acid series copolymerized polymer 50 weight portions of methyl methacrylate (MMA)/butyl acrylate (BA)/hydroxy-ethyl acrylate (HEA)=95/5/15, carry out similarly to Example 1 in addition, obtain film for adhesive tape (6).Use this for adhesive tape film (6) replace film (1) for adhesive tape, carry out similarly to Example 3 in addition, obtain adhesive tape (6).
The calculating Tg of acrylic acid series copolymerized polymer is that 73.0 ℃, SP value are 10.5 (cal/cm
3)
0.5.
The thickness of non-adhesive layer is 1.0 μ m, arithmetic mean surface roughness Ra=1.0 μ m.
Various evaluation results are shown in to table 1.
(embodiment 7)
As non-adhesive layer, form the acrylic acid series copolymerized polymer of use, use acrylic acid series copolymerized polymer 50 weight portions of methyl methacrylate (MMA)/butyl acrylate (BA)/hydroxy-ethyl acrylate (HEA)=80/20/10, carry out similarly to Example 1 in addition, obtain film for adhesive tape (7).Use this for adhesive tape film (7) replace film (1) for adhesive tape, carry out similarly to Example 3 in addition, obtain adhesive tape (7).
The calculating Tg of acrylic acid series copolymerized polymer is that 48.5 ℃, SP value are 10.1 (cal/cm
3)
0.5.
The thickness of non-adhesive layer is 1.0 μ m, arithmetic mean surface roughness Ra=0.2 μ m.
Various evaluation results are shown in to table 1.
(embodiment 8)
As non-adhesive layer, form the acrylic acid series copolymerized polymer of use, use acrylic acid series copolymerized polymer 50 weight portions of methyl methacrylate (MMA)/butyl acrylate (BA)/hydroxy-ethyl acrylate (HEA)=99/1/5, carry out similarly to Example 1 in addition, obtain film for adhesive tape (8).Use this for adhesive tape film (8) replace film (1) for adhesive tape, carry out similarly to Example 3 in addition, obtain adhesive tape (8).
The calculating Tg of acrylic acid series copolymerized polymer is that 94.3 ℃, SP value are 10.1 (cal/cm
3)
0.5.
The thickness of non-adhesive layer is 1.0 μ m, arithmetic mean surface roughness Ra=0.5 μ m.
Various evaluation results are shown in to table 1.
(embodiment 9)
The adhesive phase side of the adhesive tape obtaining in embodiment 5 (5) attaches the PET liner of the thickness 38 μ m that implemented Si processing as release liner, obtains adhesive tape (9).
The thickness of non-adhesive layer is 1.0 μ m, arithmetic mean surface roughness Ra=0.5 μ m.
Various evaluation results are shown in to table 1.
(embodiment 10)
As non-adhesive layer, form the acrylic acid series copolymerized polymer of use, use acrylic acid series copolymerized polymer 50 weight portions of methyl methacrylate (MMA)/butyl acrylate (BA)/hydroxy-ethyl acrylate (HEA)=95/5/10, carry out similarly to Example 1 in addition, obtain film for adhesive tape (10).Use this for adhesive tape film (10) replace film (1) for adhesive tape, carry out similarly to Example 3 in addition, obtain adhesive tape (10).
The calculating Tg of acrylic acid series copolymerized polymer is that 77.2 ℃, SP value are 10.3 (cal/cm
3)
0.5.
The thickness of non-adhesive layer is 1.0 μ m, arithmetic mean surface roughness Ra=0.7 μ m.
Various evaluation results are shown in to table 1.
(embodiment 11)
As non-adhesive layer, form the acrylic acid series copolymerized polymer of use, use methyl methacrylate (MMA)/butyl acrylate (BA)/hydroxy-ethyl acrylate (HEA)=70/30/10 acrylic acid series copolymerized polymer 50 weight portions, in addition, carry out similarly to Example 1, obtain film for adhesive tape (11).Use this for adhesive tape film (11) replace film (1) for adhesive tape, carry out similarly to Example 3 in addition, obtain adhesive tape (11).
The calculating Tg of acrylic acid series copolymerized polymer is that 31.2 ℃, SP value are 10.4 (cal/cm
3)
0.5.
The thickness of non-adhesive layer is 1.0 μ m, arithmetic mean surface roughness Ra=0.3 μ m.
Various evaluation results are shown in to table 1.
(comparative example 1)
In embodiment 3, do not form non-adhesive layer, carry out similarly to Example 3 in addition, obtain adhesive tape (C1).
Various evaluation results are shown in to table 1.
(comparative example 2)
As non-adhesive layer, form the acrylic acid series copolymerized polymer of use, use acrylic acid series copolymerized polymer 50 weight portions of methyl methacrylate (MMA)/butyl acrylate (BA)/hydroxy-ethyl acrylate (HEA)=55/45/10, carry out similarly to Example 1 in addition, obtain film for adhesive tape (C2).Use this for adhesive tape film (C2) replace film (1) for adhesive tape, carry out similarly to Example 3 in addition, obtain adhesive tape (C2).
The calculating Tg of acrylic acid series copolymerized polymer is that 8.6 ℃, SP value are 10.4 (cal/cm
3)
0.5.
The thickness of non-adhesive layer is 1.0 μ m, arithmetic mean surface roughness Ra=0.08 μ m.
Various evaluation results are shown in to table 1.
[table 1]
utilizability in industry
Adhesive tape of the present invention has adhesive tape film of the present invention, therefore as mentioned above, can effectively be suppressed at utilize negative-pressure adsorption be fixed on fixing when cut on base etc. appearance because of base heating etc. cause excessively closely sealed, in addition, can effectively suppress the adhesion under web-like form, fracture or damaged can not occur when the form debatching from web-like, and the amalgamation of this non-adhesive layer and this plastic film is good, to stretching, waits the tracing ability of distortion good.Therefore, can be aptly for the material of take by fragility, form and can there is the semiconductor machining that the semiconductor crystal wafer of the circuit pattern of fine exquisiteness is adherend.If adhesive tape of the present invention for semiconductor machining, can be suppressed to the absorption that utilizes negative pressure and occur fixedly time excessively closely sealedly, therefore, can make to comprise that the semiconductor manufacturing process of cutting successfully carries out.In addition, if adhesive tape of the present invention is used for to semiconductor machining, can not produce accumulating of the deformation of thin membrane that in the past produced due to adhesion, ess-strain, therefore can follow exactly semiconductor crystal wafer fine exquisiteness circuit pattern fit, in addition, after fitting in semiconductor crystal wafer, there will not be the Spontaneous release of ess-strain, so can effectively prevent that semiconductor crystal wafer from breaking.Especially, because the wafer for LED is that the material being highly brittle by gallium nitride, GaAs, carborundum etc. forms, therefore adhesive tape of the present invention is particularly suitable for LED cutting etc.
Claims (18)
1. an adhesive tape film, it is for possess the adhesive tape film of non-adhesive layer in the one side of plastic film,
The surface of this non-adhesive layer has concaveconvex structure,
Modulus of elasticity at obtained by atomic force microscope 80 ℃ of the surperficial convex portion of this non-adhesive layer is more than 0.2GPa.
2. adhesive tape film according to claim 1, wherein, the arithmetic mean surface roughness Ra of described non-adhesive layer is more than 0.1 μ m.
3. adhesive tape film according to claim 1 and 2, wherein, described non-adhesive layer is the mixed layer of polysiloxanes and (methyl) acrylic acid series polymeric compounds.
4. adhesive tape film according to claim 3, wherein, the calculating Tg of described (methyl) acrylic acid series polymeric compounds is more than 10 ℃.
5. according to the adhesive tape film described in claim 3 or 4, wherein, the SP value of described (methyl) acrylic acid series polymeric compounds is 9.0 (cal/cm
3)
0.5～12.0 (cal/cm
3)
0.5.
6. according to the adhesive tape film described in any one in claim 3～5, wherein, the polysiloxanes in described non-adhesive layer is counted polysiloxanes with the mixing ratio of (methyl) acrylic acid series polymeric compounds with weight ratio: (methyl) acrylic acid series polymeric compounds=1:50～50:1.
7. according to the adhesive tape film described in any one in claim 1～6, wherein, described non-adhesive layer has phase separation structure.
8. according to the adhesive tape film described in any one in claim 1～7, wherein, the non-adhesive test peeling force of described non-adhesive layer is less than 1.0N/20mm.
9. according to the adhesive tape film described in any one in claim 1～8, wherein, the thickness of described non-adhesive layer is 0.01 μ m～10 μ m.
10. according to the adhesive tape film described in any one in claim 1～9, wherein, the maximum elongation rate of measuring according to JIS-K-7127 of described plastic film is more than 100%.
11. according to the adhesive tape film described in any one in claim 1～10, wherein, the thickness of described plastic film is 20 μ m～200 μ m.
12. according to the adhesive tape film described in any one in claim 1～11, and wherein, described plastic film comprises polyvinyl chloride.
13. 1 kinds of adhesive tapes, its adhesive tape described in any one in claim 1～12 possesses adhesive phase with the face contrary with described non-adhesive layer of the described plastic film in film.
14. adhesive tapes according to claim 13, wherein, described adhesive phase comprises at least a kind of (methyl) acrylic acid series polymeric compounds.
15. according to the adhesive tape described in claim 13 or 14, and wherein, the SP value of described adhesive phase is 9.0 (cal/cm
3)
0.5～12.0 (cal/cm
3)
0.5.
16. according to the adhesive tape described in any one in claim 13～15, and its surface at described adhesive phase possesses release liner.
17. according to the adhesive tape described in any one in claim 13～16, and it is used to semiconductor machining.
18. according to the adhesive tape described in any one in claim 13～17, and it is used to LED cutting purposes.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012-041174 | 2012-02-28 | ||
| JP2012041174A JP6005952B2 (en) | 2012-02-28 | 2012-02-28 | Adhesive tape film and adhesive tape |
| PCT/JP2013/053001 WO2013129078A1 (en) | 2012-02-28 | 2013-02-08 | Adhesive tape film, and adhesive tape |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104137231A true CN104137231A (en) | 2014-11-05 |
| CN104137231B CN104137231B (en) | 2017-03-01 |
Family
ID=49082280
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201380011399.7A Active CN104137231B (en) | 2012-02-28 | 2013-02-08 | Adhesive tape thin film and adhesive tape |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6005952B2 (en) |
| CN (1) | CN104137231B (en) |
| TW (1) | TWI576405B (en) |
| WO (1) | WO2013129078A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104099032A (en) * | 2013-04-05 | 2014-10-15 | 日东电工株式会社 | Adhesive tape |
| CN110691825A (en) * | 2017-06-23 | 2020-01-14 | 陶氏东丽株式会社 | Release agent composition for silicone adhesive and release film |
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| JP5610642B2 (en) | 2012-02-28 | 2014-10-22 | 日東電工株式会社 | Adhesive tape film and adhesive tape |
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| JP7166728B2 (en) * | 2018-12-11 | 2022-11-08 | 株式会社ディスコ | Workpiece processing method |
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| CN108977099A (en) * | 2013-04-05 | 2018-12-11 | 日东电工株式会社 | Adhesive tape |
| CN104099032B (en) * | 2013-04-05 | 2019-04-05 | 日东电工株式会社 | Adhesive tape |
| CN108977099B (en) * | 2013-04-05 | 2021-02-23 | 日东电工株式会社 | Adhesive tape |
| CN110691825A (en) * | 2017-06-23 | 2020-01-14 | 陶氏东丽株式会社 | Release agent composition for silicone adhesive and release film |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104137231B (en) | 2017-03-01 |
| WO2013129078A1 (en) | 2013-09-06 |
| JP6005952B2 (en) | 2016-10-12 |
| JP2013179120A (en) | 2013-09-09 |
| TWI576405B (en) | 2017-04-01 |
| TW201343859A (en) | 2013-11-01 |
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